Molecular layer deposition of ZrO2-based organic-inorganic nanohybrid thin films for organic thin film transistors

Molecular layer deposition (MLD) technique can be used for preparation of various organic-inorganic nanohybrid superlattices at a gas-phase. The MLD method is a self-controlled layer-by-layer growth process under vacuum conditions, and is perfectly compatible with the atomic layer deposition (ALD) method. In this paper, we fabricated a new type organic-inorganic nanohybrid thin film using MLD method combined with ALD. A self-assembled organic layer (SAOL) was formed at 170 °C using MLD with repeated sequential adsorptions of CC terminated alkylsilane and zirconium hydroxyl with ozone activation. A ZrO₂ inorganic nanolayer was deposited at the same temperature using ALD with alternating surface-saturating reactions of Zr(OC(CH₃)₃)₄ and H₂O. The prepared SAOL-ZrO₂ organic-inorganic nanohybrid films exhibited good mechanical stability, excellent insulating properties, and relatively high dielectric constant k (~ 16). They were then used as a 23 nm-thick dielectric for low voltage pentacene-based thin film transistors, which showed a maximum field effect mobility of 0.63 cm²/V s, operating at − 1 V with an on/off current ratio of ~ 10³.     

Spectral narrowing of self-trapped exciton emission in anatase thin films

Self-trapped excition (STE) emission of TiO₂ (anatase) thin films grown by atomic layer deposition technique on single crystal α-Al₂O₃ (0 1 2) substrates were studied at temperatures 5–120 K. An in-plane preferential orientation of anatase crystallites was detected in the films by using the dependence of the emission polarisation on the observation angle. The STE emission recorded in the direction perpendicular to the film surface had a wide spectrum with the maximum at approximately 2.3 eV. The spectrum recorded from a cleaved edge in the direction nearly parallel to the film surface, showed two sharp peaks (spectral width as low as 0.03 eV) on the top of the broad STE emission band. The beam divergence determined at the wavelengths of these peaks was 6–10°. The effect was interpreted as a constructive interference of the emission leaving the film at the angle that is close to the angle of total internal reflection.     

Conformity and structure of titanium oxide films grown by atomic layer deposition on silicon substrates

Conformity and phase structure of atomic layer deposited TiO₂ thin films grown on silicon substrates were studied. The films were grown using TiCl₄ and Ti(OC₂H₅)₄ as titanium precursors in the temperature range from 125 to 500 °C. In all cases perfect conformal growth was achieved on patterned substrates with elliptical holes of 7.5 μm depth and aspect ratio of about 1:40. Conformal growth was achieved with process parameters similar to those optimized for the growth on planar wafers. The dominant crystalline phase in the as-grown films was anatase, with some contribution from rutile at relatively higher temperatures. Annealing in the oxygen ambient resulted in (re)crystallization whereas the effect of annealing depended markedly on the precursors used in the deposition process. Compared to films grown from TiCl₄, the films grown from Ti(OC₂H₅)₄ were transformed into rutile in somewhat greater extent, whereas in terms of step coverage the films grown from Ti(OC₂H₅)₄ remained somewhat inferior compared to the films grown from TiCl₄.     

Low temperature atomic layer deposition of titania thin films

This paper presents a comprehensive study of atomic layer deposition of TiO₂ films on silicon and polycarbonate substrates using TiCl₄ and H₂O as precursors at temperatures in the range 80-120 °C. An in-situ quartz crystal microbalance was used to monitor different processing conditions and the resultant films were characterised ex-situ using a suite of surface analytical tools. In addition, the contact angle and wettability of as-deposited and UV irradiated films were assessed. The latter was found to reduce the contact angle from ≥ 80° to < 10°. Finally, the effect of surface pre-treatment on film toughness and adhesion was investigated and the results show a significant improvement for the pre-treated films.     

Synchrotron X-ray reflectivity study of high dielectric constant alumina thin films prepared by atomic layer deposition

High dielectric constant (high-k) gate dielectric alumina films were prepared with nanoscale thicknesses on p-type silicon substrates by atomic layer deposition (ALD) with alternating pulses of trimethyl aluminum, nitrogen, ozone and nitrogen, and some of them were further thermally annealed. These high-k gate dielectric films were characterized by synchrotron X-ray reflectivity (XR), and the XR data were quantitatively analyzed, providing the following structural parameters of each gate dielectric film: the surface roughness and interfacial roughness, the electron density profile, the number of layers, and the thickness of individual layers. These structural characteristics were then analyzed in detail by considering the ALD processing conditions and post-thermal annealing history.     

Properties of atomic layer deposited HfO2 thin films

The growth, composition and morphology of HfO₂ films that have been deposited by atomic layer deposition (ALD) are examined in this article. The films are deposited using two different ALD chemistries: i) tetrakis ethylmethyl amino hafnium and H₂O at 250° and ii) tetrakis dimethyl amino hafnium and H₂O at 275 °C. The growth rates are 1.2 Å/cycle and 1.0 Å/cycle respectively. The main impurities detected both by X-ray Photoelectron Spectroscopy and Fourier transform infrared spectroscopy (FTIR) are bonded carbon (~ 3 at.%) and both bulk and terminal OH species that are partially desorbed after high temperature inert anneals up to 900 °C. Atomic Force Microscopy reveals increasing surface roughness as a function of increasing film thickness. X-ray diffraction shows that the morphology of the as-deposited films is thickness dependent; films with thickness around 30 nm for both processes are amorphous while ~ 70 nm films show the existence of crystallites. These results are correlated with FTIR measurements in the far IR region where the HfO₂ peaks are found to provide an easy and reliable technique for the determination of the crystallinity of relatively thick HfO₂ films. The index of refraction for all films is very close to that for bulk crystalline HfO₂.     

Low-temperature atomic layer deposition of ZnO thin films: Control of crystallinity and orientation

Low-temperature atomic layer deposition (ALD) processes are intensely looked for to extend the usability of the technique to applications where sensitive substrates such as polymers or biological materials need to be coated by high-quality thin films. A preferred film orientation, on the other hand, is often required to enhance the desired film properties. Here we demonstrate that smooth, crystalline ZnO thin films can be deposited from diethylzinc and water by ALD even at room temperature. The depositions were carried out on Si(100) substrates in the temperature range from 23 to 140 °C. Highly c-axis-oriented films were realized at temperatures below ~ 80 °C. The film crystallinity could be further enhanced by post-deposition annealing under O₂ or N₂ atmosphere at 400-600 °C while keeping the original film orientation intact.     

Thermal properties of TiO2 films grown by atomic layer deposition

We study the thermal properties of amorphous TiO₂ thin films of various thicknesses t, grown by atomic layer deposition. The thermo-optic coefficient dn/dT and the temperature coefficient dρ/dT of film density ρ are determined from ellipsometric data in wavelength range 380 < λ < 1800 nm with the Cauchy model and the Lorentz-Lorenz relation. It is found that dn/dT exhibits negative values for films with t < 150 nm and positive values for thicker films, while no significant changes in the two coefficients take place if t < 200 nm. A qualitative physical explanation based on porosity of the thin films is suggested. Films with t = 60 nm are illustrated in detail at λ = 640 nm: the room-temperature values of the coefficients are found to be dn/dT = − 3.1 × 10^− 5 °C^− 1 and dρ/dT = − 4.8 × 10^− 5g cm^− 3° C^− 1.     

Atomic layer deposition of thin films of ZnSe—structural and optical characterization

Thin films of sphalerite-type ZnSe were grown by atomic layer deposition (ALD) from elemental Zn and Se precursors. These films, grown on various substrates, show bright blue ‘edge’ emission accompanied by donor-acceptor pair emissions in the blue, green and red spectral regions. Red, green and blue emissions mixed together give a white color, with a color temperature between 2400 and 4500 K depending on a layer thickness and temperature. ZnSe grown by ALD is in consequence a promising material for the fabrication of semiconductor-based white light emitting thin film electroluminescence displays.     

Characterizations of NbAlO thin films grown by atomic layer deposition

Niobium-aluminate (NbAlO) thin films have been prepared on silicon (100) with different Nb₂O₅:Al₂O₃ growth cycle ratio by atomic layer deposition (ALD) technology. The structural, chemical and optical properties of NbAlO thin films are investigated using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and spectroscopic ellipsometry (SE). The results show that all the obtained NbAlO films are amorphous and fully oxidized. It is also found that the proportion of components in the NbAlO film can be well-controlled by varying the ALD growth cycles of the independent oxides. Furthermore, the refraction index of the prepared films is observed to increase with an increase of the concentration of Nb in the mixtures.     

Atomic layer deposition and characterization of biocompatible hydroxyapatite thin films

Atomic layer deposition (ALD) was used to produce hydroxyapatite from Ca(thd)₂ (thd = 2,2,6,6-tetramethyl-3,5-heptanedionato) and (CH₃O)₃PO onto Si(100) and Corning (0211). Film crystallinity, stoichiometry, possible impurities and surface morphology were determined. The as-deposited films contained significant amounts of carbonate impurities however, annealing at moist N₂ flow reduced the carbonate content even at 400 °C. The as-deposited Ca-P-O films were amorphous but rapid thermal annealing promoted the formation of the hydroxyapatite phase. Mouse MC 3T3-E1 cells were used for the cell culture experiments. According to the bioactivity studies cell proliferation was enhanced on as-deposited ALD-grown Ca-P-O films and greatly enhanced on films annealed at 500 °C in comparison with reference cells on borosilicate glass or cell culture polystyrene.     

A new type of organic-inorganic multilayer: fabrication and photoelectric properties

Fabrication and photoelectric characteristics of a new type of organic-inorganic alternating multilayer are reported. The multilayers exhibit a strong photovoltaic response in spite of their weak absorbance. Electric field induced surface photovoltage spectroscopy (EFISPS) indicates obvious unilateral selectivity for the application of an external voltage on multilayers     

Electrical properties of quaternary HfAlTiO thin films grown by atomic layer deposition

Quaternary alloyed HfAlTiO thin (~ 4-5 nm) films in the wide range of Ti content have been grown on Si substrates by Atomic Layer Deposition technique, and the effect of both the film composition and the interfacial reactions on the electrical properties of HfAlTiO films is investigated. It is shown that depending on the Ti content, the permittivity and the leakage current density I_leak in HfAlTiO films vary in the range k = 18 ÷ 28 and 0.01-2.4 A cm^− 2, respectively. The incorporation of ultra thin SiN interlayer in Al/HfAlTiO/SiN/Si stack gives rise to the sharp (× 10³) decrease of the I_leak ~ 6 · 10^− 5 A/cm² at the expense of the rather low capacitance equivalent thickness ~ 0.9 nm.     

Growth of aluminum nitride thin films prepared by plasma-enhanced atomic layer deposition

Aluminum nitride (AlN) thin films were deposited by atomic layer deposition from aluminum chloride (AlCl₃) and an ammonia/hydrogen plasma. The most important role of the ammonia/hydrogen plasma was to act as a reducing agent to extract Cl from AlCl₃, and to form AlN subsequently. The growth rate was saturated at ∼0.042 nm/cycle, and the thickness was proportional to the number of reaction cycles. Repeating this reaction cycle led to precisely controlled growth. The film properties were analyzed using Auger electron spectroscopy, X-ray photoelectron spectroscopy, Rutherford backscattering spectroscopy and time-of-flight elastic recoil detection analysis. The concentration of chlorine and hydrogen impurities was 0.23 and 2.01 at.%, respectively. AlN films showed good anti-oxidation properties when O₂ was annealed at 650 °C for 30 min.     

ZnO thin films prepared by atomic layer deposition and rf sputtering as an active layer for thin film transistor

Recently, the application of ZnO thin films as an active channel layer of transparent thin film transistor (TFT) has become of great interest. In this study, we deposited ZnO thin films by atomic layer deposition (ALD) from diethyl Zn (DEZ) as a metal precursor and water as a reactant at growth temperatures between 100 and 250 °C. At typical growth conditions, pure ZnO thin films were obtained without any detectable carbon contamination. For comparison of key film properties including microstructure and chemical and electrical properties, ZnO films were also prepared by rf sputtering at room temperature. The microstructure analyses by X-ray diffraction have shown that both of the ALD and sputtered ZnO thin films have (002) preferred orientation. At low growth temperature T_s ≤ 125 °C, ALD ZnO films have high resistivity (> 10 Ω cm) with small mobility (< 3 cm²/V s), while the ones prepared at higher temperature have lower resistivity (< 0.02 Ω cm) with higher mobility (> 15 cm²/V s). Meanwhile, sputtered ZnO films have much higher resistivity than ALD ZnO at most of the growth conditions studied. Based upon the experimental results, the electrical properties of ZnO thin films depending on the growth conditions for application as an active channel layer of TFT were discussed focusing on the comparisons between ALD and sputtering.     

Characterization of asymmetric rhombohedral twin in epitaxial α-Cr2O3 thin films by X-ray and electron diffraction

Epitaxial chromium oxide (α-Cr₂O₃) films grown by atomic layer deposition at 375 °C from CrO₂Cl₂ and CH₃OH on (1 1¯ 0 2) oriented α-Al₂O₃ have been studied by reflection high-energy electron diffraction (RHEED), X-ray diffraction (XRD) and X-ray reflection (XRR). The thickness of the films ranged from 10 to 310 nm, and the average growth rate was 0.1 nm per deposition cycle. According to the XRD analysis, the orientation relationship in thinner films was (1 1¯ 0 2)[1 1 0]Cr₂O₃ || (1 1¯ 0 2)[1 1 0]Al₂O₃. Confirmed by the RHEED and XRD analyses, (1¯ 1 0 2) became the preferred growth plane at the thicknesses above 40 nm. This change has been interpreted as the appearance of an asymmetric rhombohedral twin with the orientation relationship between the layers (1¯ 1 0 2)[1 1 0]top || (1 1¯ 0 2)[1 1 0]bottom and (1¯ 1 0 2)[1 1¯ 1]top || (1 1¯ 0 2)[1¯ 1 1]bottom. The match of the anion and cation sublattices of both layers was characterized in terms of the structural model of the twin interface.     

The uniformity of Al distribution in aluminum-doped zinc oxide films grown by atomic layer deposition

We investigated the aluminum distribution in aluminum-doped zinc oxide films grown by atomic layer deposition. Surface morphology, structure, composition and electrical properties of obtained films were studied. For the aluminum content less than 2 at.%, a periodicity of Al distribution along the layer depth was observed. This periodicity diminished significantly after annealing the samples in nitrogen atmosphere at 300 °C. For the Al content higher than 2 at.%, its distribution in ZnO:Al films was uniform within the depth measurement accuracy of ∼5-10 nm.     

Growth of MgO thin films with subsequent fabrication of ZnO rods: Structural and photoluminescence properties

We have grown magnesium oxide (MgO) films by the simple evaporation of MgB₂ powders. The subsequent deposition of ZnO by using an atomic layer deposition (ALD) technique generated the ZnO rods on MgO films, realizing the first production of rod-like structures using ALD. We have employed X-ray diffraction, scanning electron microscopy, transmission electron microscopy and photoluminescence (PL) spectroscopy to characterize the samples. PL of MgO films exhibited two emission bands peaked in the blue and blue-green region, respectively. The deposition of ZnO rods changed the shape of the PL spectrum.     

Plasma-enhanced chemical vapor deposition of TiO2 thin films for dielectric applications

Amorphous TiO₂ thin films were formed by plasma-enhanced chemical vapor deposition (PECVD) from mixtures of titanium IV isopropoxide (Ti(O-i-C₃H₇)₄) and oxygen. The deposition rate was found to be weakly activated, with an apparent activation energy of 4.5 kJ/mol. The deposition rate increased with equivalence ratio and decreased with plasma power. This dependence on atomic oxygen density was consistent with behavior observed in other metal oxide PECVD systems. Metal-insulator-silicon devices were fabricated, and characterized using capacitance-voltage measurements. The apparent dielectric constant of the TiO₂ thin films increased from 15 to 82 with film thickness. The observed variations were consistent with the formation of an interfacial SiO₂ layer. Assuming that a TiO₂/SiO₂ bilayer behaves as two capacitors in series, an intrinsic TiO₂ dielectric constant of 82 ± 10 and an interfacial SiO₂ layer thickness of 3 ± 1 nm were extracted from electrical measurements.     

Titanium oxide thin films deposited by high-power impulse magnetron sputtering

Ionized physical vapor deposition processes are of great interest for surface modification because the flexibility of the thin film deposition process can be increased by ionizing the metallic vapor. Recently, high-power impulse magnetron discharges have been implemented to achieve high ionization rates.Thin films of titanium oxide have been deposited on glass and steel substrates using 450 × 150 mm rectangular titanium target in argon-oxygen atmosphere. The average power delivered to the plasma is ranging between 1.5 and 2 kW and peak current and voltage are respectively 200 A and 900 V.Films are characterized using Scanning Electron Microscopy, Grazing Incidence X-ray Diffraction and Optical Transmission Spectroscopy. One of the major findings is the presence of rutile deposited on steel substrate (even for 0 V bias grounded substrate) and the significant increase of the refractive index of the films deposited on glass compared to thin films deposited via conventional direct current bipolar pulsed magnetron sputtering. Films synthesized by high-power impulse magnetron sputtering are denser.