采用微处理机的镀层厚度自动控制装置

本镀层厚度自动控制装置,在电镀处理工艺中能控制予定的镀层厚度,同时显示并打印出其测量值     

复合镀层中颗粒含量的影响因素探讨

系统探讨了颗粒本性、阴阳极布置方式、镀液性质和电镀操作条件对电沉积复合镀层中颗粒含量的影响机理,总结得出:选取纳米尺度颗粒经解聚处理后添加至含适量添加剂的镀液中,电镀时水平正对布置阴阳极并施加低阴极电流密度和适宜强度超声搅拌,有利于制备出较高颗粒含量的复合镀层。     

化学沉积钴的磁滞及不归零飽和记彔特征

本文讨论了制取厚度从3,000A到56,000A的化学沉积钴带问题。钴带不归零饱和记录特性是镀层厚度的函数。钴带的磁滞特性、表面特性与记录特性已被测出。记录特性的测定是在封闭磁带环传输机构上用交替磁通量反转的方式(1010等等)完成的。记录特性主要依赖于镀层厚度和迴线形状。本文还讨论了与记录特性有关的自去磁磁场及记录磁头边缘磁场的作用。钴带的磁滞特性、饱和记录特征及表面特征在相同条件下与商用氧化物磁带作了比较。 磁滞特性,矫顽力,剩余磁通密度,矩形比,不归零饱和记录,运带机构,存贮密度,脉冲宽度,饱和电流,信号,记录磁头边缘磁场(Fringing Field),自去磁现象,各向异性,化学沉积。     

锡层厚度无模型自适应控制系统

武钢冷轧厂电镀锡线锡层厚度无模型自适应（FMA）控制系统是专门为了解决大滞后时变的非线性复杂系统控制难题而研制设计的。该控制系统采用了当今最先进的无模型自适应控制技术（FMA）来对镀锡板锡层厚度进行闭环控制。其突出特点是无需数学模型、鲁棒性强、抗滞后。系统投运以来,取得了良好的控制效果,也代表了电镀锡生产线锡层控制的最新发展方向,可广泛应用于各种行业的镀层或涂层生产线上。     

多功能电量累积控制器设计

本文给出了一种应用于电镀行业的电量累积与控制仪表的设计,该设计以单片机P89LPC931为核心,以AD7706为前端输入电路,支持75mY分流器、4～20mA电流变送器等多种电流传感器信号输入.系统采用数字校准技术,具有优于0.1%的电流采样精度.它提供多种电荷量累计功能,设计了掉电保护功能,支持电镀过程中添加荆的自动添加,支持镀层厚度控制.系统采用开关电源加LDO稳压的主电源方案,支持宽电源范围使用,并为系统提供高稳定电源.支持MODBUS协议,能够在现场总线控制系统中使用.     

亚甲基蓝对直流电镀纳米孪晶铜组织及力学性能的影响

纳米孪晶铜具有高强高导高韧的优异性能,使其成为近年来电子封装领域的研究热点.众所周知,添加剂在直流电镀过程中对镀层质量起着至关重要的作用.亚甲基蓝作为一种常用的染料型添加剂,在电镀铜行业中被广泛使用.该研究在直流电镀过程中,将不同浓度的亚甲基蓝添加到纳米孪晶铜电解液中,并进一步研究纳米孪晶铜的微观组织和力学性能与亚甲基...     

空气搅拌电沉积Ni-Al复合镀层的形貌与结构

复合电沉积过程中,持续施加空气搅拌,制备Ni-Al复合镀层。并借助工具测量显微镜、白光干涉仪和扫描电镜评价镀层形貌与结构,结果显示:电流密度对表面状况、三维形貌及微观结构均有明显影响,且采用低电流密度有利于获得表面平整、组织致密的Ni-Al复合镀层。     

NK—40可编程序控制器在电镀生产线的应用

一、工艺要求及系统组成该电镀线的工艺流程如图1所示。零件电镀质量指标要达到部标要求,铬层厚度≥0.35微米,防锈时间≥24小时。     

基于组件电源波形和电沉积关系研究系统开发

不同的电源波形会影响电沉积过程,它们之间的确切关系需要进行研究,但现有的电镀电源无法产生任意波形,也没有建立一个较完整的电镀指标数据库.针对这些问题,采用面向对象和组件的方法,设计和开发了一个能够对电镀电源波形和电沉积关系进行研究的系统,该系统提供一个可供用户设计各种电源波形的环境,运用决策树分类数据挖掘技术,来研究电源波形和电沉积之间的关系.阐述了构建决策树的基本思想和算法及使用组件技术开发系统的方法.     

技术转让

技术转让高效化学镀镍液及施镀新工艺利用化学反应将镍离子还原并沉积到材料或器件的活性表面，便可得到一层厚度可控，且均匀、组织致密的镀层。根据服役环境和工况，调节镀层的磷含量及热处理工艺使镀层具有耐腐蚀、耐磨损或兼备两种性能。无论金属（钢铁、铝、铜合金）...     

脉冲涡流多层厚度检测与时频特征量提取

脉冲涡流检测是现代无损检测技术的重要方法之一.由于其具有频谱宽、信号穿透能力强以及精度高等特点,目前已广泛应用于金属测厚等领域.基于Ansoft Maxwell软件,建立了脉冲涡流多层金属测厚系统,对不同电导率的金属材料进行了测厚仿真的分析研究,通过改变被测体厚度,分析了检测线圈上的电压随被测体厚度的变化规律,并对脉冲涡流厚度检测信号进行快速傅立叶变换(FFT),分别从时域和频域进行了特征值的提取,分析了针对不同电导率层,给出了相应较适合的特征值.     

Uniformity study of nickel thin-film microstructure deposited by electroplating

The thickness uniformity and the cross-sectional profiles of electroplated individual nickel microstructures were investigated in given electroplating conditions. The main factors influencing the thickness uniformity of microstructures were discussed. An effective method to overcome the burning problem by increasing the sacrifice seed layer structure is proposed. It is shown that the thickness uniformity and the cross-sectional profiles of the microstructures can be controlled by changing the process conditions. The current crowding observed in patterned specimens is responsible for the saddle shape profile of individual microstructures, while the combination of the current crowding and the cathodic polarizability are believed to be responsible for the abnormal cap-like profile of individual microstructures. A uniform thickness distribution and microstructures with flat profiles were obtained at optimal plating conditions of 8.05 mA/cm² and 20°C.     

Adaptive electrodeposition process control through Zakai filtering

The stochastic evolutionary process inspired by the electrodeposition of metal ions on an electrode surface is considered in one dimension. The process is fixed on one boundary and is observed-controlled on the other boundary where the process is additionally influenced by unmodelled side reactions – their effect on the boundary is considered as a random process applied to the controls and measurements. The electrodeposition process is given by a diffusion process model, whose main parameters are unknown – the diffusivity of species and the thickness of the diffusion layer are unknown and no knowledge is available about the current losses in the plating bath or the throwing power of the electrolyte. Furthermore the side reactions have an unknown systematic component. Even so this paper verifies that the electrodeposition process can be boundary controlled using feed-forward and feedback controls adapted with the parameters estimated by Zakai filtering. The consistency of the estimates as well as the stabilising property of the adaptive controls is validated by simulations.     

基于单片机的石英晶片镀膜测控系统设计

本文阐述了石英晶片真空蒸发镀膜测控的基本原理和镀膜过程中石英晶片谐振频率变化与镀膜厚度之间的关系。主要研究了以W77E516单片机为核心,配合其它相关芯片完成石英晶片真空蒸发镀膜过程测控系统的工作原理和实现方案,重点阐述了该系统的硬件设计和软件设计方法。     

Alternative resist adhesion and electroplating layers for LIGA process

 The fabrication of high aspect ratio microstructures using the X-ray lithography and electroplating step of the LIGA process requires, that the metal layer on the substrate (plating base) enables a flawless resist adhesion and provides a high conductivity for the following electroplating process. In addition, a flawless metal adhesion after electroplating has to be ensured. Typically metal layers of titanium, but also of copper and gold are used. In case of higher structures, fluorescence radiation generated in the metal layer during exposure reduces the bond strength between the resist and the adhesion layer [7]. Since the fluorescence probability decreases with a decreasing atomic number, the suitability of conductive carbon as the plating base was investigated and compared to results achieved with titanium. The resist adhesion was increased tremendously on the carbon layer but the metal adhesion is insufficient. Therefore, platinum islands were deposited on the conductive carbon to facilitate good metal adhesion. The resulting resist adhesion was still superior compared to titanium. In addition, metal adhesion was achieved on these layers.     

Optimization of functionally graded metallic foam insulation under transient heat transfer conditions

The problem of minimizing the maximum temperature of a structure insulated by a functionally graded metal foam insulation under transient heat conduction is studied. First, the performance of insulation designed for steady-state conditions is compared with uniform solidity insulation. It is found that the optimum steady-state insulation performs poorly under transient conditions. Then, the maximum structural temperature of a two-layer insulation with constant solidity for each layer is minimized by varying the solidity profile for a given total thickness and mass. It is found that the cooler inner layer of the optimal design has high solidity, while the hotter outer layer has low solidity. This is in contrast to the steady-state optimum, where the solidity profile is the reverse.     

Fabrication of high hardness Ni mold with electroless nickel–boron thin layer

The nickel electroforming method using a high-concentration nickel sulfamate bath is commonly used to fabricate micro metal molds in the LIGA process; however, this method does not produce micro metal molds of sufficient hardness. One means of improving the hardness of micro metal molds made using the nickel electroforming method is to include additives in the nickel plating solution. Another method is nickel alloy plating or a similar technique. In this research, we used a nickel–boron (Ni–B) electroless alloy plating method to obtain a hard nickel plated film having hardness of 832 Hv. It was also ascertained that Ni–B electroless alloy plated film retains its high hardness even during heat treatment in conditions of 250°C for 1 h. To deal with the high stresses developed in high-hardness plated films, we proposed double-layer nickel electroforming. This method is covered and used on conventional nickel electroforming layer by high hardness micro mold. High hardness micro metal mold using double-layer was fabricated by nickel electroforming and Ni–B electroless alloy plating method.     

Megasonic agitation for enhanced electrodeposition of copper

In this paper we propose an agitation method based on megasonic acoustic streaming to overcome the limitations in plating rate and uniformity of the metal deposits during the electroplating process. Megasonic agitation at a frequency of 1 MHz allows the reduction of the thickness of the Nernst diffusion layer to less than 600 nm. Two applications that demonstrate the benefits of megasonic acoustic streaming are presented: the formation of uniform ultra-fine pitch flip-chip bumps and the metallisation of high aspect ratio microvias. For the latter application, a multi-physics based numerical simulation is implemented to describe the hydrodynamics introduced by the acoustic waves as they travel inside the deep microvias.     

金属电极的腐蚀特性研究

对金属电极的腐蚀特性进行了研究。实验中设计了多种不同的金属电极,通过改变电极材料、电极厚度、电极层数、腐蚀液成分及温度等条件,研究了金属电极的腐蚀特性。通过研究发现,电极的腐蚀特性跟电极材料、电极厚度、电极层数、电极的缺陷及应力、腐蚀液成分及温度等条件有关。最后设计了一种打底层金属材料为Tiw,层厚20 nm,上层金属为Au,层厚度为200 nm的金属电极,在覆盖一层光刻胶,并对光刻胶进行后烘坚膜的情况下,在常温下,用HF溶液腐蚀1 h后,SOIMEMS微结构完全释放,金属电极还十分完好。     

MEMS milliactuator for hard-disk-drive tracking servo

This paper describes the design, fabrication, and operational characteristics of a MEMS milliactuator designed for servo tracking in a hard-disk drive (HDD). The actuator is designed to increase the bandwidth of an HDD tracking servo and pack more recording tracks on a disk. An Invar (low thermal expansion metal) electrode position process was developed to meet the thermal stability requirement. The electroplated Invar's thermal coefficient of expansion is as low as 6.3×10^-6/K, which is almost half of that of pure nickel. For the plating mold pattern definition, a high-aspect-ratio polymer etching technique was developed. A high-aspect-ratio structure line-and-gap definition is required to achieve both a high directional stiffness ratio and electrode efficiency for the actuator. The etching technique described can etch through a thick (<40 μm) polymer layer with an aspect ratio of 16:1 at an etch rate of <2 μm/min. Low-cost/high-volume manufacturing is achievable by this batch fabrication technique. A milliactuator was fabricated and assembled with a suspension and a slider weighted at around 2 mg. The slider was successfully driven by the milliactuator while the slider was flying on a spinning disk. The operational characteristics (frequency response) of the in-flight milliactuator were measured, and the results indicate that the actuator is suitable for high-bandwidth HDD servo-tracking applications