Role of plasticity on interface crack initiation from a free edge and propagation in a nano-component

In order to elucidate the role of plasticity on interface crack initiation from a free edge and crack propagation in a nano-component, delamination experiments were conducted by a proposed nano-cantilever bend method using a specimen consisting of ductile Cu and brittle Si and by a modified four-point bend method. The stress fields along the Cu/Si interface at the critical loads of crack initiation and crack propagation were analyzed by the finite element method. The results reveal that intensified elastic stresses in the vicinity of the interface edge and the crack tip are very different, although the Cu/Si interface is identical in both experiments. The plasticity of Cu was then estimated on the basis of the nano-cantilever deflection measured by in situ transmission electron microscopy. The plasticity affects the stress fields; the normal stress near the interface edge is intensified while that near the crack tip is much reduced. Both the elasto-plastic stresses are close to each other in the region of about 10 nm. This suggests that the local interface fracture, namely, the crack initiation at the interface edge and the crack propagation along the interface, is governed by elasto-plastic normal stress on the order of 10 nm.     

Dominant stress region for crack initiation at interface edge of microdot on a substrate

In order to examine the mechanics of crack initiation at the free interface edge of a microcomponent on a substrate, delamination tests are carried out for two specimen shapes of Cr microdots on a SiO₂ substrate. The microdots of the first specimen are shaped like the frustum of a round cone. The Cr microdots are successfully delaminated from the SiO₂ substrate in a brittle manner and the critical load is measured by atomic force microscopy (AFM) with a lateral loading apparatus. Stress analysis reveals that a singular stress field exists near the interface edge and the strength for the crack initiation is governed by the intensified normal stress field. The critical stress intensity parameter is evaluated as K_σC ≈ 0.24 MPa m^0.39. Similar delamination tests are conducted for microdots shaped like the frustum of an oval cone. The stress distributions at the crack initiation of this specimen shape show a higher normal stress than the first specimen shape in the region near the interface edge of about x < 40 nm, while it is lower in the region of about x > 50 nm (x: distance from the edge). This suggests a limitation of conventional fracture mechanics: namely, the crack initiation in these specimens is not uniquely governed by the intensity of the singular field. It is found that the delamination crack is initiated when the averaged stress σ_ya in the region of 90-130 nm reaches 190-270 MPa, regardless of the specimen shape. This indicates that the dominant stress region of crack initiation is roughly estimated as 90-130 nm and the criterion is given in terms of the averaged stress in the region.     

Effect of residual stress on delamination from interface edge between nano-films

The focus in this study is on the effect of residual stress on the delamination crack initiation from the interface edge between thin films, Cu/TiN, where the stress is intensified by the free edge effect. The delamination tests, where the mechanical stress is applied on the interface, show that the specimen with the thinner Cu film has an apparently higher strength at the interface edge. The residual stress in the films is then evaluated by curvature measurement of film/substrate coupon and the influence on the delamination is analyzed. The residual stress increases with the increase of film thickness and remarkably intensifies the stress near the edge. By superimposing the contributions of the applied load and the residual stress, a good agreement is obtained in the normal stress intensity near the interface edge at the delamination independent of the Cu thickness. This signifies that the combination of intensified stresses due to the applied load and the residual stress governs the crack initiation at the interface edge, and the toughness at the interface edge is evaluated by the stress intensity factor on the basis of the fracture mechanics concept.     

Stress field near interface edge of elastic-creep bi-material

Stress fields on elastic-creep bi-material interfaces with different geometry of the interface edge are analyzed by finite element method. The results reveal that the stress highly concentrates near the interface edge at the loading instant and it gradually decreases as the creep-dominated zone expands from the small-scale creep to the large-scale creep. The stress singularity due to creep which resembles the HRR stress singularity appears near the interface edge in all cases. The stress intensity near the interface edge time-dependently decreases and becomes constant when the transition reaches the steady state. The magnitude is scarcely influenced by the edge shape of elastic material, though it depends on the edge shape of creep material. The stress intensity during the transition can be approximately predicted by the J-integral at the loading instant.     

Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components

Crack initiation and propagation along the Cu/Si interface in multilayered films (Si/Cu/SiN) with different thicknesses of the Cu layer (20 and 200 nm) are experimentally investigated using a nano-cantilever and millimeter-sized four-point bending specimens. To examine the cohesive zone model (CZM) criterion for interfacial delamination along the Cu/Si interface in nanoscale stress concentration, an exponential type of CZM is utilized to simulate the observed delamination processes using the finite element method. After the CZM parameters for the Cu/Si interface are calibrated by experiment, interface cracking in other experiments is predicted. This indicates that the CZM criterion is universally applicable for describing cracking along the interface regardless of specimen dimensions and film thickness which include the differences in plastic behavior and residual stress. The CZM criterion can also predict interfacial cracking along Cu/Si interfaces with different stress singularities.     

Characterization of the elevated temperature static load crack extension behavior of type 304 stainless steel

Creep crack extension rates in Type 304 stainless steel, obtained as a function of temperature over the range 650–800°C and as a function of specimen geometry at 750°C, are empirically correlated with both the net section stress and the apparent stress intensity factor. The results indicate that the stress intensity correlation is strongly dependent on specimen geometry, whereas the net section stress correlation appears to be generally valid. A direct correspondence between crack extension and local (crack tip) displacement is noted when creep crack extension rates at 750°C are compared with COD obtained from actual castings of the crack tip. By introducing the concept of a miniature creep specimen at the crack tip, a physical model for creep crack growth is developed, based on local stress relaxation and strain accumulation, that is consistent with both experimental observation and existing theories of steady state creep.     

Effect of interface layer consisting of nanosprings on stress field near interface edge

The purpose of this study is to investigate the effect of an interface layer consisting of discretely arrayed nano-sized elements on stress intensified fields. A material where an interface layer consisting of Ta₂O₅ helical nanoelements (nanosprings) is inserted between dissimilar components is prepared and two types of crack initiation experiments, which possess radically different stress conditions, are carried out. The finite element analyses indicate that the stress fields in the components with and without the interface layer are completely different, and it is experimentally clarified that the fracture mechanics concept cannot be applied to the crack initiation at the dissimilar interface edge with the interface layer. The stress distributions at the crack initiation reveal that the crack initiation is governed by the apparent stress of the nanospring, σ′, at the edge. This signifies that the interface layer eliminates the stress singular field at the interface edge. The criterion of the crack initiation is evaluated as .     

High-cycle fatigue characteristics of quasi-isotropic CFRP laminates over 10 cycles (Initiation and propagation of delamination considering interaction with transverse cracks)

High-cycle fatigue features of over 10⁸ cycles, particularly the initiation and propagation of edge delamination considering the effects of transverse cracks, were investigated using quasi-isotropic carbon-fiber-reinforced plastic (CFRP) laminates with a stacking sequence of [45/0/−45/90]_s in this study. In the relationship between a transverse crack density and initiation and growth of edge delamination, it was found that fatigue damage growth behavior varied depending on applied stress. It was observed that edge delamination initiated and grew at parts where transverse cracks were dense at ordinary applied stress, whereas it was observed that edge delamination grew before or simultaneously with transverse crack propagation at a low applied stress and high-cycle loading. In addition, the critical transverse crack density where delamination begins growing was calculated to evaluate the interaction between transverse crack and edge delamination growth.     

Sensitivity analysis of creep crack growth prediction using the statistical distribution of uniaxial data

Due to the variables and unknowns in both material properties and predictive models in creep crack growth (CCG) rates, it is difficult to predict failure of a component precisely. A failure strain constraint based transient and steady state CCG model (called NSW) modified using probabilistic techniques, has been employed to predict CCG using uniaxial data as basic material property. In this paper the influence of scatter in the creep uniaxial properties, the parameter C* and creep crack initiation and growth rate have been examined using probabilistic methods. Using uniaxial and CCG properties of C‐Mn steel at 360 °C, a method is developed which takes into account the scatter of the data and its sensitivity to the correlating parameters employed. It is shown that for an improved prediction method in components containing cracks the NSW crack growth model employed would benefit from a probabilistic analysis. This should be performed by considering the experimental scatter in failure strain, the creep stress index and in estimating the C* parameter.     

Stress intensity factors in two bonded elastic layers containing cracks perpendicular to and on the interface—I. Analysis

In this paper the basic crack problem which is essential for the study of subcritical crack propagation and fracture of layered structural materials is considered. Because of the apparent analytical difficulties, the problem is idealized as one of plane strain or plane stress. An additional simplifying assumption is made by restricting the formulation of the problem to crack geometries and loading conditions which have a plane of symmetry perpendicular to the interface. The general problem is formulated in terms of a coupled system of four integral equations. For each relevant crack configuration of practical interest the singular behavior of the solution near and at the ends and points of intersection of the cracks is investigated and the related characteristic equations are obtained. The edge crack terminating at and crossing the interface, the T-shaped crack consisting of a broken layer and a delamination crack, the cross-shaped crack which consists of delamination crack intersecting a crack which is perpendicular to the interface and a delamination crack initiating from a stress-free boundary of the bonded layers are some of the practical crack geometries considered as examples. The formulation of the problem is given in Part I of the paper. Part II deals with the solution of the integral equations and presentation of the results.     

Numerical prediction of creep crack growth in different geometries using simplified multiaxial void growth model

Abstract

This paper considers the prediction of creep crack growth (CCG) in different fracture mechanics geometries using finite element (FE) analysis based on a material independent simplified multiaxial failure strain model at the crack tip. The comparison is first made by modelling C(T) specimen tests under plane stress and plane strain conditions using creep properties of a C–Mn steel at 360°C. In addition, in order to examine CCG due to different geometries, a single edge notch specimen (SENT), centre cracked tension specimen (CCT) and three-point bending (3PB) specimen have been modelled and analysed. In all cases, it is found, depending on the geometry, that for this steel at low creep temperatures the applied load develops a high reference stress/yield stress (σ_ref/σ_y) ratio, which helps reduce constraint at the crack tip. The predictions are analysed under plane stress/plane strain loading conditions identifying the effects of geometry on cracking rates and the implications for predicting long term test or component failure times exceeding where the applied σ_ref/σ_y<<1.     

Intersonic delamination in curved thick composite laminates under quasi-static loading

Dynamic delamination in curved composite laminates is investigated experimentally and numerically. The laminate is 12-ply graphite/epoxy woven fabric L-shaped laminate subject to quasi-static loading perpendicular to one arm. Delamination initiation and propagation are observed using high speed camera and load–displacement data is recorded. The quasi-static shear loading initiates delamination at the curved region which propagates faster than the shear wave speed of the material, leading to intersonic delamination in the arms. In the numerical part, the experiments are simulated with finite element analysis and a bilinear cohesive zone model. Cohesive interface elements are used between all plies with the interface properties obtained from tests. The simulations predict a single delamination initiating at the corner under pure mode-I stress field propagating to the arms under pure mode-II stress field. The crack tip speeds transition from sub-Rayleigh to intersonic in conjunction with mode change. In addition to intersonic mode-II delamination, shear Mach waves emanating from the crack tips in the arms are observed. The simulations and experiments are found to be in good agreement at the macro-scale, in terms of load-displacement behavior and failure load, and at the meso-scale, in terms of delamination initiation location and crack propagation speeds. Finally, a mode dependent crack tip definition is proposed and observation of vibrations during delamination is presented. This paper presents the first conclusive evidence of intersonic delamination in composite laminates triggered under quasi-static loading.     

Finite element analysis of creep fracture initiation in a model superalloy material

Detailed finite element analyses were performed for a single edge-cracked specimen geometry under both plane stress and plane strain constraint for a superalloy material that obeys a power-law creep relationship. The objectives of these analyses were to elucidate the stationary creep crack-tip fields and to provide guidance for the experimental measurement of crack-tip deformations. New results demonstrate that, for both plane stress and plane strain, the angular variations in the creep strain fields do not agree with HRR-type predictions, although the radial variations are in agreement with HRR-type creep strain field predictions in a zone very near the crack tip. Thus, the use of experimental measurement of surface displacement and/or strain data for the location of HRR-type fields may not be possible, unless modifications to the existing HRR-type theory are made. It is also noted that the size of the stress-based HRR-dominance zone is only a fraction of the creep zone size in plane stress, and is very small (especially along =0°) compared to the creep zone size in plane strain. Furthermore, the dominance of the singular strain fields are at least two orders of magnitude smaller than the corresponding stress dominance zones. As such, unless the microstructural features of the material are smaller than the dimensions of the dominance zones, the basis for using stress or strain-based fracture parameters derived from the HRR-type fields for prediction of creep fracture initiation is unclear.     

Increase of stress intensity near interface edge of elastic-creep Bi-material under a sustained load

The transition from small-scale creep to large-scale creep ahead of a crack tip or an interface edge with strong elastic stress singularity at the loading instant causes stress relaxation and the decrease of stress intensity in general. However, this study shows that the stress near the interface edge of bi-material with no or weak elastic stress singularity increases after the loading instant and brings about the stress concentration during the transition. In addition, the creep strain distribution of this bi-material after the loading instant is different from that occurred in the transition of an interface edge with strong elastic stress singularity or a crack tip (notch root). The criterion for the increase or decrease of stress intensity near the interface edge proved by the finite element method is proposed in this study. The stress intensity near the interface edge increases when the elastic stress singularity is lower than the creep stress singularity (λ^el < λ^cr) and vice versa.     

The effect of material combinations and relative crack size to the stress intensity factors at the crack tip of a bi-material bonded strip

Several types of singular stress fields may appear at the corner where an interface between two bonded materials intersects a traction-free edge depending on the material combinations. Since the failure of the multi-layer systems often originates at the free-edge corner, the analysis of the edge interface crack is the most fundamental to simulate crack extension. In this study, the stress intensity factors for an edge interfacial crack in a bi-material bonded strip subjected to longitudinal tensile stress are evaluated for various combinations of materials using the finite element method. Then, the stress intensity factors are calculated systematically with varying the relative crack sizes from shallow to very deep cracks. Finally, the variations of stress intensity factors of a bi-material bonded strip are discussed with varying the relative crack size and material combinations. This investigation may contribute to a better understanding of the initiation and propagation of the interfacial cracks.     

Crack initiation at free edge of interface between thin films in advanced LSI

Since electronic devices are made of multi-layered sub-micron films, delamination along the interface is one of the major failure mechanisms. This paper aims to develop a method for evaluating the mechanical criterion of interface cracking between thin films on a substrate. The focus is put on crack initiation from the free edge of the interface where the stress concentrates due to the mismatch of elastic deformation. In the evaluation, it is important to exclude plastic deformation and fracture of the thin metal film, because they bring about ambiguity on the measured magnitude of interface strength. In this study, an experimental method is proposed on the basis of fracture mechanics concepts, and the validity is examined by tests on Cu (conductor metal)/TaN (barrier metal) interface in a large-scale integrated circuit. The critical stress intensity at delamination crack initiation is successfully analyzed by the boundary element method.     

Crack propagation during steady state creep

A model is proposed tor the steady propagation of a creep crack under steady state creep conditions. Creep is envisaged to take place everywhere in the solid, though higher creep rates at the crick tip lead to a local concentration of the creep strain. A critical local strain criterion is used to describe the condition for crack advance. Local damage is envisaged to accumulate at the crack tip as a result of, or in parallel with the creep strain. The model correctly predicts a dependence of crack propagation rate with the nett section stress varied to the power m, where m is the exponent of stress in the creep equation, for large values of m. An approximate dependence of propagation rate on the elastic stress intensity factor is also shown. Tnese predictions are in accord with experimental work.     

Time-dependent creep fracture using singular boundary elements

 This paper presents a procedure for modelling singular crack tip regions of creeping, cracked structural components using singular boundary elements. These special boundary elements correctly simulate the time-dependent singular behaviour of stress and strain fields at the crack tip of creeping materials. The investigated structural components are considered to undergo time-dependent, two-dimensional creep deformation and to be subjected to remote loading conditions. The deformation of the components is assumed to be described by the elastic power law creep model. Examples of various crack problems are investigated to illustrate the efficiency of the proposed singular boundary elements for analysing creep stress and strain distribution problems and for determining some important creep fracture parameters. The effectiveness of the proposed approach is demonstrated and its accuracy is compared with the results obtained by finite element solutions for different creep conditions. Received: 27 February 2002 / Accepted: 28 May 2002 The authors are grateful to Professor D.E. Beskos for encouragement and helpful discussions during the course of this work.     

Interface strength of structured nanocolumns grown by glancing angle deposition

In order to investigate the mechanics of interfacial fracture in structured nano-elements grown by glancing angle deposition (GLAD), fracture experiments were conducted on oblique Ti nanocolumns grown on a Si substrate using a micro-brick specimen. Two types of specimens, a Forward specimen (loading with the column tilt direction) and a Reverse specimen (loading against the column tilt), were prepared to clarify the effect of an asymmetric nanostructure on the interface strength. The specimens fractured at the interface or near the interface between the Ti nanocolumns and the Si substrate for both specimens. The critical force and displacement at fracture in the Forward specimens were about 2.0 times and 1.6 times as large as those in the Reverse specimens, respectively, showing clear anisotropy in the interface strength. The local stress distribution along the interface in the single nanocolumn at fracture was analyzed by finite element analysis. While the stress singularity in the Reverse specimen was greater than that in the Forward specimen, the normal stresses in a region 1–3 nm near the interface edge were almost identical regardless of the loading direction, suggesting that intensified stress in the nanoscale region dominated fracture.     

Computer Simulation of the Indentation Creep Tests on Particle-Reinforced Composites

A systematical simulation has been carried out on the indentation creep test on particle-reinforced composites.The deformation ,failure mechanisms and life are analyzed by three reasonable models.The following five factors have been considered simultaneously:creep property of the particle,creep property of the matrix,the shape of the particle, the volume faction of the particle and the size(relative size to the particle )of the indentation indenter.For all the cases,the power law respecting to the applied stress can be used to model the steady indentation creep depth rate of the indenter,and the detail expressions have been presented.The computer simulation is analyzed by the two-phase model and the three-phase model.Two places of the stress concentration are found in the composites.One is ahead of the indentation indenter, where the high stress state is deduced by the edge of theindenter and will decrease rapidly near to a steady value with the creep time The other one is at the interface,where the high stress state is deduced by the misfit of material properties between the particles and matrix.It has been found that the creep dissipation energy density other than a stress parameter can be used to be the criterion to model the debonding of the interfaces.With the criterion of the critical creep dissipation energy density, a power law to the applied stress with negative exponent can be used to model the failure life deduced by the debonding of interfaces.The influences of the shape of the particles and the matching of creep properties of particle and matrix can be discussed for the failure.With a crack model,the further growthe of interface crack is analyzed, and some important experimental phenomena can be predicted.The failure mechanism which the particle will be punched into matrix has been also discussed.The critical differences between the creep properties of the particles and matrix have been calculated, after a parameter has been defined.In the view of competition of failure mechanisms, the best matching of the creep properties of the two phases and the best shape of the particles are discussed for the composite design.