Long-term base current instability in AlGaAs/GaAs HBTs: physical mechanisms, modeling, and SPICE simulation

This paper provides an overview of the long-term base current instability in the AlGaAs/GaAs heterojunction bipolar transistor (HBT), which is a main mechanism governing the HBT long-term current gain drift and thus a major concern for the HBT reliability. Topics covered include: (1) types of base current instability and their underlying physical mechanisms; (2) leakage currents in the HBT and their relevance to the reliability; (3) electrothermal interaction and their impact on the HBT reliability; (4) analytic model for predicting the HBTs mean time to failure (MTTF); and (5) SPICE implementation and simulation of HBT circuit reliability. Measurements and device simulation results are also included in support of the modeling and analysis.     

InGaP/GaAs heterojunction bipolar transistor and RF power amplifier reliability

Electrothermal stress on advanced InGaP/GaAs heterojunction bipolar transistors (HBTs) was carried out experimentally. It showed a long-term stress-induced base current instability and a decrease in the DC current gain. A class-AB RF power amplifier (PA) was also considered to study the stress effect on the amplifier’s RF performance. The SPICE Gummel–Poon (SGP) model parameters were extracted from the pre- and post-stress HBT data and used in Cadence SpectreRF simulation. The amplifier’s post-stress RF characteristics, such as the output power and power-added efficiency (PAE), remained almost unchanged even though the post-stress HBT’s DC current gain had dropped to 73.6% of its initial value.     

A physics-based, analytical heterojunction bipolar transistormodel, including thermal and high-current effects

A detailed, analytical model for predicting the DC and high-frequency performance of AlGaAs/GaAs graded heterojunction bipolar transistors (HBTs) is presented. The model is developed based on the relevant device physics, such as current-induced base pushout and thermal effects. The current gain, cutoff frequency, and maximum frequency versus the collector current density, which is a function of the applied voltage as well as the corresponding temperature in the HBT, are calculated. The results suggest that the conventional HBT model, which assumes the HBT temperature is the same as that of the ambient, can overestimate the three figures of merit considerably when the collector current density is high. Furthermore, it is shown that the present model correctly explains such experimentally observed HBT high-current behavior as the rapid falloff of the current gain and cutoff frequency. The model predictions compare favorably with the results obtained from a model which solves numerically the Poisson and continuity equations coupled with the lattice heat equation     

Thermal reliability of VCO using InGaP/GaAs HBTs

Degradations of InGaP/GaAs heterojunction bipolar transistor (HBT) collector current and base current subjected to cumulative long-term junction temperature stress are examined experimentally. The aged SPICE model parameters as a function of stress time are extracted from the measurement data. The VCO phase noise, tuning range, and output amplitude are studied in circuit simulation. The phase noise increases, tuning range and output amplitude decrease with increasing junction temperature.     

Investigation of thermal effects on the single-finger heterojunction bipolar transistors

We will first derive a physics-based, analytical single-finger heterojunction bipolar transistor (HBT) model which takes into account the thermal effect. Next, the model is used to calculate the three figures of merit of HBT, i.e., current gain, cut-off frequency and maximum frequency. Their variation against the collector current density under the influence of thermal effect is presented and the calculation results are discussed.     

A unified model for single/multifinger HBTs including self-heatingeffects

This paper presents a unified analytical large-signal model that includes self-heating effects. The model is applied to a single-finger AlGaAs/GaAs heterojunction bipolar transistor (HBT) and a multifinger InGaAs/GaAs HBT. The self-heating effect in the HBT is simulated as a feedback from the collector current to the base-emitter voltage. The main advantage of the circuit presented here is that additional analysis of coupling between electrical and thermal circuits is not required, as is the case with the existing models. The small-signal HBT model is implemented based on the S-parameters at multiple frequencies measured at multiple bias points. This model is verified by comparing the measured and simulated S-parameters. The large-signal model is based on the forward Gummel plot and is built over the small-signal model. This model is verified by comparing the simulated and measured dc I-V characteristics     

Bias, frequency, and area dependencies of high frequency noise inAlGaAs/GaAs HBT's

The noise figure of the heterojunction bipolar transistor (HBT) in the microwave frequency range is studied, and an improved physical noise model is developed. Unlike the conventional high frequency noise model, which considers only the bias current dependence, the present model includes both the effects of voltage and current on the noise behavior. In addition, the frequency- and area-dependent natures of the HBT noise at very high frequencies are incorporated in the model. It is found that the voltage dependence of the high frequency noise in the HBT results from the self-heating effect, which gives rise to a higher HBT lattice temperature than the ambient temperature. Also, the free-carrier transport delay time must be considered to properly model the frequency dependence of noise since the inverse of this time is comparable with the frequency. Furthermore, the area dependence of noise is dominated by changes in the base resistance and emitter-base junction capacitance. Results for the minimum noise factor calculated from the model compare favorably with those obtained from measurements     

A compact model for SiGe HBT on thin-film SOI

Heterojunction bipolar transistor (HBT) fabrication on thin-film silicon-on-insulator (SOI) has been recently demonstrated. Due to the space volume constraint (thin film) for the device fabrication, the HBT structure is different from bulk HBT. In fact, compared to a bulk device, the buried layer has been suppressed and a lateral collector contact configuration is introduced. This device features a vertical expansion followed by a lateral expansion of the base-collector space charge region. This nonconventional charge behavior induces a kink in the base-collector junction capacitance characteristics, and as a consequence a modified Early effect. Furthermore, the low current transit time is modified compared to a bulk HBT. In this paper, all these effects are analyzed and a compact model for SOI-HBT is proposed. The model is validated on real SOI-HBTs with different collector doping levels.     

Intermodulation in heterojunction bipolar transistors

The modeling of small-signal intermodulation distortion (IMD) in heterojunction bipolar transistors (HBTs) is examined. The authors show that IMD current generated in the exponential junction is partially canceled by IMD current generated in the junction capacitance, and that this phenomenon is largely responsible for the unusually good IMD performance of these devices. Thus, a nonlinear model of the HBT must characterize both nonlinearities accurately. Finally, the authors propose a nonlinear HBT model suitable for IDM calculations, show how to measure its parameters, and verify its accuracy experimentally     

SiGe HBT大信号扩散电容模型研究

基于SiGe HBT（异质结双极晶体管）大信号等效电路模型,建立了SiGe HBT大信号发射结扩散电容模型和集电结扩散电容模型．该模型从SiGe HBT正反向传输电流出发,研究晶体管内可动载流子所引起的存储电荷（包括正向存储电荷和反向存储电荷）的基础上,同时考虑了厄利效应对载流子输运的影响,其物理意义清晰,拓扑结构简单。将基于大信号扩散电容模型的SiGe HBT模型嵌入PSPICE软件中,实现对SiGe HBT器件与电路的模拟分析。对该模型进行了直流特性模拟分析,直流模拟分析结果与文献报道的结果符合得较好,瞬态特性分析结果表明响应度好。     

AlGaAs/GaAs HBT电压比较器

本文对异质结双极晶体管(HBT)电压比较器进行了理论分析,设计并制作了国内第一个AlGaAs/GaAs HBT电压比较器电路。首先,分析了HBT的基本工作原理;然后比较详细地分析了ECL电压比较器的工作原理并进行了设计。随后介绍了HBT的E-M模型,提取了模型参数,并对电路进行了模拟;最后全面介绍了AlGaAs/GaAs HBT电压比较器的制作过程。测试结果表明,HBT器件直流电流增益大于100,f_T为15.2GHz,f_(max)为14.8GHz;电路具有取样和锁存能力,并具有电压比较器的初步功能。     

Transient Monte Carlo analysis and application to heterojunctionbipolar transistor switching

A self-consistent simulation using the Monte Carlo ensemble particle technique for analysis of heterojunction bipolar transistor (HBT) transient behavior, such as switching performance, is presented. The transient Monte Carlo method has been applied to a self-consistent simulation of two HBT designs with improved collector structures for high-speed and high-frequency applications, and the results are compared with the characteristics of conventional HBTs. The simulation results indicate that the two new collector structures, the inverted field collector and the undoped collector, have better switching performance than the conventional HBT. The study of the switching characteristics' dependence on collector-base bias voltage and collector current suggests that the inverted field HBT is the best approach in terms of switching properties. The results are supported and explained by examining electron transport properties such as overshoot velocity and energy valley occupation, as well as band bending in the collector space-charge region at different current levels     

基区Ge组分分布对SiGe HBT热学特性的影响

建立了SiGe HBT热电反馈模型,对基区Ge组分矩形分布、三角形分布和梯形分布的SiGe HBT的热特性进行研究。结果表明,在Ge总量一定的前提下,Ge组分为三角形和梯形分布结构的SiGe HBT峰值温度较低、温差较小,温度分布的均匀性优于Ge组分矩形分布结构的SiGeHBT,具有更好的热特性。对不同Ge组分分布下器件增益与温度的依赖关系进行研究,发现当基区Ge组分为三角形和梯形分布时,随着温度升高,器件增益始终低于Ge组分矩形分布的器件,且增益变化较小,提高了器件的热学和电学稳定性,扩大了器件的应用范围。     

Analysis of non-uniform current and temperature distributions in the emitter finger of AlGaAs/GaAs heterojunction bipolar transistors

This paper develops a comprehensive and two-dimensional model for the AlGaAs/GaAs heterojunction bipolar transistor (HBT). The model takes into account the electrical-thermal interacting mechanism in both the width and length directions of the HBT emitter finger and thus is capable of describing the two-dimensional temperature and current distributions in the emitter finger of the HBT. Results produced from a three-dimensional device simulator are also included in support of the model.     

Thermalelectro-feedback model for multi-emitter finger power heterojunction bipolar transistor. Part I: Temperature profile

Poor thermal conductivity of GaAs, a self-heating phenomenon which results in the rapid rise of device temperature, is the major factor that limits and even degrades the electrical performance of GaAs-based heterojunction bipolar transistor (HBT) operated at high power densities. On the basis of this consideration, a numerical model is presented to study the interaction mechanism between the thermal and electrical behavior of AlGaAs/GaAs HBT with multiple-emitter fingers. The model mainly comprises a numerical model applicable for multi-finger HBT that solves the three-dimensional heat transfer equation. The device design parameters that influence the temperature profile and current distribution of the device are identified, and optimization concerning the device performance is made.     

Consistent modeling of capacitances and transit times of GaAs-based HBTs

This paper investigates how time delays and capacitances observed under small-signal conditions can be consistently accounted for in heterojunction bipolar transistor (HBT) large-signal models. The approach starts at the circuit level by mapping the large-signal equivalent circuit (which consists of charge and current sources) to the well-known small-signal circuit (which consists of capacitances, transit-time, and resistances). It is shown that and how bias dependent charge sources at either pn-junction impact transit-time, base-collector capacitance, and their mutual dependence. It is demonstrated for the example of a GaAs-based HBT that the interrelation of the elements is observed in measurements as predicted. The results of the investigation enhance understanding of HBT model characteristics and provide a criterion to check model consistency.     

基区重掺杂对SiGe HBT热学性能的影响

相对于同质结晶体管,异质结双极晶体管(HBT)由于异质结的存在,电流增益不再主要由发射区和基区掺杂浓度比来决定,因此可以通过增加基区掺杂浓度来降低基区电阻,提高频率响应,降低噪声系数,但基区掺杂浓度对器件热特性影响的研究却很少。以多指SiGeHBT的热电反馈模型为基础,利用自洽迭代法分析了基区重掺杂对器件集电极电流密度和发射极指温度的影响。通过研究发现,随着基区浓度的增加,SiGe HBT将发生禁带宽度变窄,基区反向注入发射区的空穴电流增大;同时,基区少子俄歇复合增强,这些都将减小集电极电流密度,降低发射极指温度,从而抑制发射极指热电正反馈,提高器件的热稳定性。     

The DC characteristics of GaAs/AlGaAs heterojunction bipolartransistors with application to device modeling

A complete DC model for the heterojunction bipolar transistor (HBT) is presented. The DC characteristics of the HBT are compared with the Ebers-Moll (EM) model used by conventional bipolar junction transistors (BJTs) and implemented in simulation and modeling programs. It is shown that although the details of HBT operation can differ markedly from those of a BJT, a model and a parameter extraction technique can be developed which have physical meaning and are exactly compatible with the EM models widely used for BJTs. Device I- V measurements at 77 and 300 K are used to analyze the HBT physical device performance in the context of an EM model. A technique is developed to extract the device base, emitter, and collector series resistances directly from the measured I-V data without requiring an ideal exp(qV_be/kT) base current as reference. Accuracies of the extracted series resistances are assessed. AC parameters of HBT are calculated numerically from the physical device structure. For modeling purposes, these parameters are shown to be comparable with those of conventional BJTs     

DC modeling and characterization of AlGaAs/GaAs heterojunctionbipolar transistors for high-temperature applications

The large signal dc characteristics of AlGaAs/GaAs heterojunction bipolar transistors (HBT) at high temperatures (27°-300°C) are reported. A high-temperature SPICE model is developed which includes the recombination-generation current components and avalanche multiplication which become extremely important at high temperatures. The effect of avalanche breakdown is also included to model the current due to thermal generation of electron/hole pairs causing breakdown at high temperatures. A parameter extraction program is developed and used to extract the model parameters of HBT's at different temperatures. Fitting functions for the model parameters as a function of temperature are developed. These parameters are then used in the SPICE Ebers-Moll model for the dc characterization of the HBT at any temperature between (27°-300°C)     

全部耗尽SOI SiGe HBT集电结渡越时间模型研究

研究了与CMOS兼容的SOI SiGe HBT结构。首先,分析了SOI SiGe HBT与传统SiGe HBT在结构上的不同之处。然后,针对新结构的全部耗尽工作模式,建立了考虑电流效应的集电结渡越时间模型。最后,讨论了渡越时间与集电区掺杂浓度、集电结电压、传输电流的关系,并与传统器件的渡越时间进行了比较。该渡越时间模型的建立为SOI SiGe HBT特征频率的设计与优化提供了理论基础。