基于USB2.0的高速图像传输系统设计

针对油气井视频检测高速图像采集传输的要求,设计并完成了一套基于通用串行总线（USB）2.0协议的高速图像采集系统。对数字信号处理器（DSP）的主机接口（HPI）、USB芯片的通用可编程接口（GPIF）和端点以及USB固件程序和PC主机应用程序进行了介绍。该系统使用TI公司的C6437高性能DSP芯片作为系统核心,并经由USB接口芯片与PC主机相连接,实现图像采集系统与PC主机之间的高速数据传输。DSP高速图像采集系统应用于油气勘探领域中,实现了井下视频检测。     

计算机USB接口技术研究

通用串行总线USB是一种新型的计算机通信标准,本文利用USB2.0总线接口高速高带宽的优点,介绍了一种能够实现高速数据传输的USB2.0接口系统的设计,为雷达信号从外部向主机的高速传输创造了条件.     

基于STM32F103的USB主机接口设计

嵌入式USB主机系统在数据存储和交换领域具有很好的应用前景.为了存储和处理嵌入式系统中的大量数据,一种方法是让嵌入式系统具有USB设备接口,以通讯的方式向上位机不断转储RAM中的数据;另一种方法就是让嵌入式系统具有USB主机接口,使嵌入式系统可以直接读写U盘或SD卡之类的移动存储设备,再通过移动存储设备将数据转储到上位机中,不需要嵌入式系统与上位机之间有直接的通讯连接.使用USB控制芯片CH376设计了一个基于STM32F103的USB主机接口,并应用于嵌入式系统中.     

基于MSP430与uPD720200的高速温度采集系统的设计

文章研究与设计了一套基于MSP430和u PD720200的USB3.0高速温度采集系统。此系统采用ADS7886为A/D转换芯片,高速MSP430单片机为主控CPU,u PD720200为USB3.0主机接口芯片,能实现高速实时温度数据采集。     

对多路数据采集存储的设计实现

随着嵌入式系统对数据采集存储的要求更高,以STM32F103芯片作为系统主机,采用多通道模数转换芯片AD7793实现多路数据采集,并在LCD屏上显示出采集数据。同时使用USB控制芯片CH376设计USB主机接口,仅依靠收发串口指令来控制数据的读写,直接存储到移动存储设备,解决了单片机管脚资源少的问题。     

无线激光通信系统USB接口的设计与调试

提出一种无线激光通信系统USB接口的设计方案。该方案采用Cypress公司EZ-USB系列的AN2131Q芯片为核心作为USB外围设备,AN2131Q芯片在USB外围设备上电加载后运行其固件程序,负责管理USB外围设备及其与主机的通信。论述了如何利用该公司的EZ-USB开发板和配套软件调试系统。     

基于USB总线的车轮踏面擦伤数据传输系统设计

针对车轮踏面擦伤采集的数据到PC机的传输问题,设计一种基于USB总线技术的数据通信系统。该系统利用FPGA实现采集数据流的收发时序,通过USB 2.0接口芯片CY7C68013与主机进行通信。详细介绍该数据传输系统的硬件结构、软件设计、USB芯片固件设计和工作流程,该数据传输系统相对于传统的PCI数据传输系统,具有简便灵活、支持热拔插技术,在便携式车轮踏面擦伤检测中可以广泛的运用。     

USB2.0设备接口芯片从模式设计与实现

为了使USB接口能适应多样化的外围设备,以USB高速设备接口芯片的SoC模型为基础,设计并实现了一种从属结构的数据传输模式,详细分析了从模式传输原理、端点工作机制、固件程序设计、仿真平台设计及仿真结果。以Verilog硬件描述语言设计了仿真平台,包括例化Design Ware库中的USB主机验证IP核作为数据发送接收的主机端,外部数据存储器作为外设数据的中转站,并通过比较主机端的发送和回读数据验证了设计的正确性。结果表明,外部控制器可控制处于从模式的USB设备接口芯片,实现数据在主机与设备之间的交互,此模式下能够有效地提高数据的传输速率,改善数据传输系统的工作效率。     

基于FT2232H的USB2.0数据采集系统设计

基于FTDI的USB2.0通信芯片FT2232H和FPGA设计了一种高速、稳定的数据采集系统。采用时分多路复用的方法采集前端的模拟信号,FPGA作为系统的主控核心,FT2232H是USB通信模块的控制芯片,两块单口RAM组成数据的缓存区,结合A/D采样模块组成了数据采集系统。数据的采集、缓存以及传输等操作在 FPGA中并行执行,通信速度达到6.8 Mbyte/s,满足高速的数据采集和传输要求。经实验证明,基于FT2232H的采集系统能够实现稳定、高速的通信。     

基于USB的铁精粉在线监测数据通信实现方法

探讨了铁精粉铁品位在线监测的测试原理,给出了基于USB的铁品位在线监测通信系统的实现方案,设计了以STM32F103为核心控制芯片的单片机系统硬件电路,针对不同的传输要求,分别利用USB接口技术、RS485-USB接口技术以及无线USB技术,进行高速、低成本、距离可选的数据传输通信。基于USB2.0版本协议,进行了USB固件编程、驱动程序以及应用程序的开发,采用Visual C#进行计算机控制处理软件的编程及调试,实现了对设备的设置和控制、数据的读写、显示等功能。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.