提高深腔零件镀镍耐蚀性的工艺研究

为提高深腔钢件镀镍层耐蚀性能(主要是湿热实验),从影响镀镍工艺深镀能力和均镀能力的因素出发,结合化学镀镍的应用,开展了一系列的工艺实验研究。结果表明:改善电镀双层镍深镀和均镀能力的工艺措施,对深腔零件耐蚀性实际影响有限,还需结合化学镀镍和电镀镍的工艺特点,更有助于提高深腔零件镀镍层深镀和均镀能力,提高零件耐蚀性。     

高速化学镀镍

以次亚磷钠为还原剂的酸性化学镀镍工艺所得到的镀层具有耐蚀性好、厚度均匀、硬度高、耐磨性好等特点,使其成为发展最快的表面处理手段之一［１］。目前国内酸性化学镀镍溶液的镀速一般在１３～１７μｍｈ之间,镀速超过２０μｍｈ则称为高速化学镀镍［２］。为了降低成本,提高效率,人们不断地探索高速化学镀镍新工艺。但是镀速的提高使镀镍过程中亚磷酸镍副产物急剧增加,极易引发镀液自分解。因此,对于高速化学镀镍工艺来说,行之有效的镀液配制、调整、维护与再生方法是至关重要的。我们开发了一种镀速在２５μｍｈ左右的高速…     

符合RoHS、ELV欧盟指令的环保化学镀镍工艺

为了顺应RoHS、ELV指令的要求,开发了无铅/镉化学镀镍工艺。从镀层合金成分、中性盐雾实验、硬度、耐磨性、整平性、内应力、微观形貌、镀速、镀液稳定性和含磷量等方面与中磷化学镀镍工艺进行了比较。结果表明,无铅/镉化学镀镍工艺镀液更稳定,所得的镍镀层内应力稍高;硬度、耐蚀性、可焊性、附着力等性能相当;而耐磨性、耐污性、沉积速度和含磷量均高于中磷化学镀镍工艺,尤其是镀层亮度、微观结构和整平效应表现更优。     

化学镀镍磷的镀前准备及镀液种类选取的研究

化学镀镍磷作为一种表面强化技术可以提高金属的使用性能，已经越来越广泛的被应用。针对不同金属在化学镀镍磷时的不同反应，对化学镀镍磷的镀前准备工艺进行了研究，包括镀前处理、镀液种类和组分的研究，主要分析研究了镀前工艺对化学镀镍磷的作用和影响。     

硬铝合金化学镀镍耐蚀机理

通过对铝合金组织，化学镀镍各溶液成分，化学镀镍镀层性质，铝合金化学镀镍工艺的分析，找出了影响铝合金化学镀镍耐蚀性的关键因素是镀层厚度和孔隙率，铝合金基体状态，前处理工艺，化学镀镍工艺参数，溶液成分，镀后处理等均会影响镀层的孔隙率，所以对铝合金化学镀镍耐蚀性等级要求高的行业在使用该工艺时要控制全过程工艺要点，否则就达不到预期的目的。     

铜合金化学镀镍工艺

本发明是一种铜合金化学镀镍工艺,包括以下步骤：合金表面经过酸洗,将其表面之油脂清洗干净,再将该合金进行预电镀,最后,再以化学镀镍方式施镀。本发明工艺过程简单,维护简单,去除了活化过程,节省了成本,使化学镀镍可以在铜合金表面进行,而且预电镀及化学镀镍的镀液的操作温度低,pH接近中性,此工艺由于没有活化过程,避免了以前工艺对于化学镀镍液的影响,镀液使用周期加长。     

陶瓷金属化化学镀镍原理和生产工艺综述

化学镀镍适合多品种、少批量产品镀镍,生产非常灵活,中小企业多采用化镀生产工艺,本文介绍了化学镀镍原理、镀液配制和化镀生产工艺,为企业加强工艺控制,提高产品质量提供参考。     

镁合金化学镀镍的研究进展

从镀前处理、施镀过程、镀后处理、退镀等方面综述了镁合金化学镀镍工艺的研究现状,指出了其存在的主要问题,探讨了镁合金化学镀镍的发展趋势。     

玻璃保温瓶胆化学镀镍机理及工艺研究

探讨了玻璃保温瓶胆化学镀镍基本原理和施镀工艺,并概述了碱性除油、化学粗化、敏化、活化、还原等预镀工艺及酸性次磷酸钠化学镀镍浴配方、工艺条件和配液原则.     

塑料电镀工艺及其日常维护

介绍了适用于电镀的塑料种类,提出了一种塑料电镀的工艺,其流程主要包括:化学除油,粗化,中和,预浸,钯活化,解胶,化学镀镍,镀焦铜或者镀镍,镀酸铜,镀半光镍,镀高硫镍,镀全光镍,镍封和镀铬.给出了各工序的溶液组成及工艺参数.分析了漏镀、结合力不良、挂具上镀、麻点等故障的产生原因,并给出了解决方法.     

化学镀镍-铜-磷三元合金工艺的研究

为提高化学镀镍－磷合金镀层的性能及获得多种性能的合金镀层以拓宽其应用范围。在化学镀镍－磷合金液中加入硫酸铜制得镍－铜－磷三元合金。研究了镀液中硫酸镍、次磷酸钠、柠檬酸钠、硫酸铜、稳定剂、光亮剂的含量以及pH值和温度等因素对合金镀层的外观、沉积速度及铜含量的影响。通过5％氯化钠溶液和10％硫酸溶液浸泡试验比较了所得镍－铜－磷合金镀层与镍－磷合金镀层以及前人制得的镍－磷合金镀层的耐蚀性，同时比较了上述镀层的其它性能。结果表明，所得镍－铜－磷合金镀层的耐蚀性、外观、结合力、孔隙率、沉积速度、硬度和耐磨性等性能优于镍－磷合金及前人制得的镍－铜－磷合金镀层。     

中温化学镀镍工艺研究

通过正交试验优选出一种较佳的中温化学镀镍工艺。研究了镀液主要成分及操作条件对沉积速度和镀层质量的影响。利用Ｘ射线衍射法测定了镀层组成和晶体结构,并测量了其耐蚀性。结果获得含磷１０．６ｗｔ％的非晶态镀层,耐蚀性优于光亮镀镍层。     

镁合金化学镀工艺研究

向镀液中加入氰化物，采用硫酸镍代替碳酸镍作为镍源，开发出一种镁合金化学镀镍新工艺。测定了该镀层中的磷含量及其耐蚀性、显微硬度、结合力，并用扫描电镜对其表面形貌进行了观察结果表明，该镀层结合力合格，硬度远高于镁合金基体，且与普通化学镀层相当；该镀层属高磷镀层，耐蚀性较好，但与普通基体材料上的化学镀层相比要差一些。该工艺使镁合金化学镀成本大大降低，工艺得到简化。     

ZY—03型高磷化学镀镍工艺的研究

采用正交设计试验方法研究了ＺＹ－０３型高磷化学镀镍工艺配方，并对镀层的各项性能进行了测试，结果表明该工艺具有沉积速度快，镀液稳定，镀层硬度高，耐蚀性优异及成本低等优点。     

Gold wire bondability of electroless gold plating using disulfiteaurate complex

Generally, contact or terminal areas are coated with nickel as a barrier layer; subsequently, gold plating is performed to maintain reliability of electrical interconnection. Treatment using dilute solutions of palladium ions have been applied to initiate electroless nickel plating on copper substrates because copper has no catalytic action for the oxidation of hypophosphite. However, trace amounts of palladium ions may remain on the unwanted areas and extraneous nickel deposits are often observed. We confirmed that nickel films without extraneous deposits can be formed using the activation solutions containing dimethyl amine borane (DMAB). Bondability on the electrolessly deposited gold was greatly influenced by the phosphorus contents of the deposited nickel films as the underlayer. Bonding strength after electroless gold plating was increased with increasing phosphorus contents in the nickel films. Stabilizers in the electroless gold plating also influenced the bonding strength. Baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. Gold deposits having strong orientation with Au(220) and Au(311) indicated high bond strength.     

水合肼和次磷酸钠为还原剂的化学镀Ni-P合金研究

铜上化学镀Ni-P合金通常需要用钯催化剂或其它无钯催化剂催化后才能施镀,研究了利用水合肼为引发剂,以水合肼和次磷酸钠为还原剂的化学镀Ni-P合金液,在铜箔上直接施镀,铜箔无须镀前催化。利用扫描电镜和X-射线衍射仪研究了镀层的表面形貌,利用能谱仪测定了镀层中P含量,同时研究了水合肼和次磷酸钠的浓度对镀速和P含量的影响,探讨了无催化铜箔化学镀Ni-P合金的反应机理。     

Electroless Nickel Plating – A Review

The operating process, versatility and the increasing research interest in optimising the process and products technology in the electroless plating method of metal coating, particularly, the electroless nickel plating of metallic substrates such as mild steel, necessitates the writing of this review. It is also aimed at providing more literature information, both of the past and the present published research in this field. In this paper, electroless nickel plating is introduced. The various nickel plating solutions and baths’ operating parameters; main types of electroless nickel plating; the mechanism involved in the plating process; application of the nickel plating process to iron powders; advantages and disadvantages and the process’s other applications are reviewed. Electroless nickel plating produces an amorphous deposit in the as-plated condition. The deposit is not dependent on current distribution and hence it is almost uniform in thickness. Electroless nickel plating is far more difficult to remove chemically than conventional nickel deposits due to its superior corrosion resistance. The deposit has a good wettability and is generally hard. However, its bath control is more complex than with electroplating. The bath also has lower efficiency and higher operating costs, even without the use of electricity.     

Influence of nickel ions for electroless Ni–P plating on polyester fabric

Properties of electroless Ni–P plated polyester fabric mainly depend on the plating bath constituents/conditions. The effects of NiSO₄ concentration of the plating bath on the deposition rate, phosphorus content, surface morphology, and crystal structure of the electroless Ni–P plated polyester fabric were investigated. The study revealed that phosphorus content in the deposits decreased at higher NiSO₄ concentration. SEM micrographs showed that nodule size of the Ni–P deposits increased. All the Ni–P deposits had an amorphous structure. The electromagnetic interference (EMI) shielding effectiveness (SE) of electroless Ni–P plated polyester fabric was evaluated. With the rise of nickel ion in the solution, the EMI SE of the Ni–P plated polyester fabric increased.