Chemical bonding of a-Ge1−xCx:H films grown by RF reactive sputtering

Amorphous hydrogenated germanium-carbon (a-Ge_1−xC_x:H) films were deposited by RF reactive sputtering pure Ge (1 1 1) target at different flow rate ratios of CH₄/(CH₄+Ar) in a discharge Ar/CH₄, and their composition and chemical bonding were investigated using X-ray photoelectron spectroscopy (XPS), Raman spectroscopy, and Fourier transform infrared spectroscopy (FTIR). XPS and FTIR results showed the content of germanium in the films decreased with the increase of the flow rate ratio CH₄/(Ar+CH₄), and the Ge-C, Ge-H, C-H bonds were formed in the films. The fraction of Ge-C, Ge-H, and C-H bonds was strongly dependent on the flow rate ratio. Raman results indicated that the films also contain both Ge-Ge and C-C bonding. Based on the change of the chemical bonding of a-Ge_1−xC_x:H films with the flow rate ratio CH₄/(CH₄+Ar), an optimal experimental condition for the application of infrared windows was obtained.     

Multilayer antireflective and protective coatings comprising amorphous diamond and amorphous hydrogenated germanium carbide for ZnS optical elements

To effectively protect and improve the transmittance of ZnS optical elements in the far infrared band, combined amorphous diamond (a-D) and amorphous hydrogenated germanium carbide (a-Ge_1−xC_x:H) films have been developed. The optical interference coatings were designed according to the layer optics theory. The a-D films, of which refractive index and film thickness were controlled by changing substrate bias and deposition time respectively, were deposited by filtered cathodic vacuum arc technology. The a-Ge_1−xC_x:H films were prepared by radio frequency sputtering technology. During this process their refractive index was modulated by changing the gas flow rate ratio and their film thickness was controlled by the flow rate ratio and deposition time. It has been shown that the combined films are superexcellent antireflective and protective coatings for ZnS optical elements.     

Study on inverse spinel zinc stannate, Zn2SnO4, as transparent conductive films deposited by rf magnetron sputtering

Inverse spinel zinc stannate (Zn₂SnO₄, ZTO) films were deposited onto fused quartz glass substrates heated at 800 °C by rf magnetron sputtering using a ceramic ZTO target (Zn:Sn = 2:1). H₂ flow ratios [H₂/(Ar + H₂)] were controlled from 0 to 30% during the depositions. ZTO films deposited at 800 °C possessed a polycrystalline inverse spinel structure. The lowest resistivity of 1.1 × 10^− 2 Ω cm was obtained for a ZTO film deposited at 20% H₂ flow ratio. The transmittance of the ZTO film was approximately 80% in the visible region.     

Effect of hydrogen dilution in preparation of carbon nanowall by hot-wire CVD

Carbon nanowall films prepared on the stainless steel substrates by hot-wire chemical vapor deposition using CH₄ with different hydrogen dilution ratios and structure variation in the CNWs against hydrogen dilution have been studied. In the scanning electron microscope images, the wall height and width in the samples prepared with the hydrogen dilution ratio, H₂/(CH₄ + H₂), between 10% and 25% were larger than that prepared without hydrogen dilution. In the Raman spectra for the samples prepared with the H₂/(CH₄ + H₂) below 25%, the intensity ratio of the G peak to the D peak, I_G/I_D, increased with increasing the H₂/(CH₄ + H₂). In the samples prepared with the H₂/(CH₄ + H₂) over 25%, the wall size and the I_G/I_D decreased.     

Effects of duty cycle and water immersion on the composition and friction performance of diamond-like carbon films prepared by the pulsed-DC plasma technique

Diamond-like carbon (DLC) films were prepared in a pulsed-DC discharged CH₄/Ar plasma. Effects of duty cycle ([t_on/(t_on + t_off)] × 100%) on the composition and properties of DLC films were investigated. In general, the increased duty cycle led to an up-shift of the G peak position, an increase in the I_D/I_G and sp²/sp³ ratio, and a reduction of the number of C-H bonds and the film hardness, revealing a graphitization tendency with increasing duty cycle. Tribologically, ultralow and steady friction coefficients (0.005 and 0.008) in dry nitrogen atmosphere were obtained for the films prepared under a duty cycle of 50% and 65%. The unique mechanical property and chemical nature brought by the moderate sp²/sp³ ratio and the proper H content were considered to be responsible as the films deposited in this duty cycle range could simultaneously provide the high chemical inertness and the ultrasmooth sliding surfaces required for achieving ultralow friction. In addition, the structure was less vulnerable to water molecules in the case of stewing. The diamond-like nature and the ultralow friction performance were hardly affected even experiencing a 4-month immersion in water.     

Influence of N2 flow rate on the mechanical properties of SiNx films deposited by microwave electron cyclotron resonance magnetron sputtering

Hydrogen-free amorphous silicon nitride (SiN_x) films were deposited at room temperature by microwave electron cyclotron resonance plasma-enhanced unbalance magnetron sputtering. Varying the N₂ flow rate, SiN_x films with different properties were obtained. Characterization by Fourier-transform infrared spectrometry revealed the presence of Si-N and Si-O bonds in the films. Growth rates from 1.0 to 4.8 nm/min were determined by surface profiler. Optical emission spectroscopy showed the N element in plasma mainly existed as N⁺ species and N₂⁺ species with 2 and 20 sccm N₂ flow rate, respectively. With these results, the chemical composition and the mechanical properties of SiN_x films strongly depended on the state of N element in plasma, which in turn was controlled by N₂ flow rate. Finally, the film deposited with 2 sccm N₂ flow rate showed no visible marks after immersed in etchant [6.7% Ce(NH₄)₂(NO₃)₆ and 93.3% H₂O by weight] for 22 h and wear test for 20 min, respectively.     

Optimization of sputtering parameters for deposition of Al-doped ZnO films by rf magnetron sputtering in Ar + H2 ambient at room temperature

The effects of sputtering pressure and power on structural and optical-electrical properties of Al-doped ZnO films were systemically investigated at substrate temperature of room temperature and H₂/(Ar + H₂) flow ratio of 5%. The results show that carrier concentration and mobility of the films show nonmonotone change due to the evolution of microstructure and lattice defect of the films caused by introduction of H₂ with increasing sputtering pressure and power. The transmittance of the films is also found to be related to the introduction of H₂ in addition to usually considered surface roughness and crystallinity. Finally, optimized sputtering pressure and power are 0.8 Pa and 100 W, respectively, and obtained minimum resistivity and highest transmittance are 1.43 × 10^− 3 Ω·cm and 90.5%, respectively. In addition, it is found that E_g of the films is mainly controlled by the carrier concentration, but crystallite size and stress should also be considered for the films deposited at different powers.     

Optimization of n nc-Si:H and a-SiNx:H layers for their application in nc-Si:H TFT

The n-type doped silicon thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) technique at high and low H₂ dilutions. High H₂ dilution resulted in n⁺ nanocrystalline silicon films (n⁺ nc-Si:H) with the lower resistivity (ρ ∼0.7 Ω cm) compared to that of doped amorphous silicon films (∼900 Ω cm) grown at low H₂ dilution. The change of the lateral ρ of n⁺ nc-Si:H films was measured by reducing the film thickness via gradual reactive ion etching. The ρ values rise below a critical film thickness, indicating the presence of the disordered and less conductive incubation layer. The 45 nm thick n⁺ nc-Si:H films were deposited in the nc-Si:H thin film transistor (TFT) at different RF powers, and the optimum RF power for the lowest resistivity (∼92 Ω cm) and incubation layer was determined. On the other hand, several deposition parameters of PECVD grown amorphous silicon nitride (a-SiN_x:H) thin films were changed to optimize low leakage current through the TFT gate dielectric. Increase in NH₃/SiH₄ gas flow ratio was found to improve the insulating property and to change the optical/structural characteristics of a-SiN_x:H film. Having lowest leakage currents, two a-SiN_x:H films with NH₃/SiH₄ ratios of ∼19 and ∼28 were used as a gate dielectric in nc-Si:H TFTs. The TFT deposited with the NH₃/SiH₄∼19 ratio showed higher device performance than the TFT containing a-SiN_x:H with the NH₃/SiH₄∼28 ratio. This was correlated with the N−H/Si−H bond concentration ratio optimized for the TFT application.     

Plasma surface interaction in PACVD and PVD systems during TiAlBN nanocomposite hard thin films deposition

In a PACVD system, titanium alloys were exposed to inductive radio-frequency (RF) plasmas of H₂ + N₂ and Ar + BCl₃+H₂ + N₂ gas mixtures for their nitriding and boron nitride respectively. Hard nanocomposite thin films of TiAlN and TiAlBN were formed on Ti-6Al-4V alloys in an inductive RF plasma of Ar + H₂ + N₂ and Ar + 3.5 vol.% of BCl₃ + H₂ + N₂, respectively. The substrates were grounded, i.e., self-biased, during plasma thin film formation for 30 min each. TiAlBN was deposited by sputtering in a reactive PVD system. A quadrupole mass spectrometer (QMS) sampled the plasma at a constant distance of 0.5 cm from the sample surface in real time. The mass species (m/e) at 0.5 cm were recorded during the deposition process. To separate the particles reaching the substrate surface from those leaving it, the nanocomposite thin films coated samples of Ti alloys were introduced in an RF plasma of Ar + H₂ mixture without the presence of N₂ and BCl₃ and negatively biased up to V_b = − 350 V. The QMS at 0.5 cm measures the etched and sputtered species from the surface of the coated samples. Comparing the QMS results between the grounded samples with the monomers in the RF plasma and the negatively biased voltage samples without monomers in the Ar + H₂ plasma the net plasma surface interactions (PSI) were evaluated. The behavior of the coating process of nanocomposite thin films of TiAlN and TiAlBN on the Ti alloy samples is strongly dependent on the plasma surface phenomena.     

Forbidden energy band gap in diluted a-Ge1 − xSix:N films

By means of electron gun evaporation Ge_1 − xSi_x:N thin films, in the entire range 0 ≤ x ≤ 1, were prepared on Si (100) and glass substrates. The initial vacuum reached was 6.6 × 10^− 4 Pa, then a pressure of 2.7 × 10^− 2 Pa of high purity N₂ was introduced into the chamber. The deposition time was 4 min. Crucible-substrate distance was 18 cm. X-ray diffraction patterns indicate that all the films were amorphous (a-Ge_1 − xSi_x:N). The nitrogen concentration was of the order of 1 at% for all the films. From optical absorption spectra data and by using the Tauc method the energy band gap (E_g) was calculated. The Raman spectra only reveal the presence of SiSi, GeGe, and SiGe bonds. Nevertheless, infrared spectra demonstrate the existence of SiN and GeN bonds. The forbidden energy band gap (E_g) as a function of x in the entire range 0 ≤ x ≤ 1 shows two well defined regions: 0 ≤ x ≤ 0.67 and 0.67 ≤ x ≤ 1, due to two different behaviors of the band gap, where for x > 0.67 exists an abruptly change of E_g(x). In this case E_g(x) versus x is different to the variation of E_g in a-Ge_1 − xSi_x and a-Ge_1 − xSi_x:H. This fact can be related to the formation of Ge₃N₄ and GeSi₂N₄ when x ≤ 0.67, and to the formation of Si₃N₄ and GeSi₂N₄ for 0.67 ≤ x.     

Growth and thermal annealing of amorphous germanium carbide obtained by X-ray chemical vapor deposition

The growth of amorphous hydrogenated germanium carbide (a-GeCx:H) alloys was performed with high deposition rates by radiolysis chemical vapor deposition (X-ray) of germane/allene (GeH₄/C₃H₄, 70/30 %) mixtures at different irradiation times. The experimental deposition parameters were correlated to the composition, the structural features, and the optical coefficients of the films, as studied by different spectroscopic techniques, namely, IR, Raman, and UV–Vis. It was observed that the increase of irradiation time yields a more hydrogenated and more disordered material, with abundant formation of sp³ CH₂ groups, characterized by high band-gap values. In addition, we report the effects of thermal annealing on bonding structures and optical properties of the amorphous germanium carbon alloys. The decrease of hydrogen extent, together with the enhancement of sp² C bonds present and amorphous-to-crystalline germanium phase transition, contribute to a larger structural order of the material and to the reduction of the optical gap at higher temperatures.     

Influence of hydrogen introduction on structure and properties of ZnO thin films during sputtering and post-annealing

ZnO thin films were prepared in Ar and Ar + H₂ atmospheres by rf magnetron sputtering, and then they were annealed in vacuum and Ar + H₂ atmosphere, respectively. The structure and optical-electrical properties of the films were investigated by X-ray diffraction, transmittance spectra, and resistivity measurement, and their dependences on deposition atmosphere, annealing treatment, and aging were studied. The results showed that adding H₂ in deposition atmosphere improved the crystallinity of the films, decreased lattice constant, increased band gap, decreased the resistivity by the order of 10⁴ Ω cm, but exhibited poor conductive stability with aging. After Ar + H₂ and vacuum annealing, crystallinity of the films deposited in Ar and Ar + H₂ was further improved; their resistivity was decreased by the order of 10⁵ and 10¹ Ω cm, respectively, and exhibited high conductive stability with aging. We suggest that the formed main defect is V_O and H_i when H₂ is introduced during deposition, which decreases the resistivity but cannot improve the conductive stability; hydrogen would remove negatively charged oxygen species near grain boundaries during Ar + H₂ annealing to decrease the resistivity, and grain boundaries are passivated by formation of a number of V_O-H complex (H_O) to improve the conductive stability at the same time. Under vacuum annealing, the hydrogen that is introduced non-intentionally from deposition chamber maybe plays an important role; it exists as H_O in the films to improve the conductive stability of the films.     

Polycrystalline Si1-x Ge x thin film deposition by rapid thermal chemical vapor deposition

Polycrystalline silicon germanium (poly-Si_1−xGe_x) thin films on a-Si film have been deposited by rapid thermal chemical vapor deposition (RTCVD) with SiH₄–GeH₄–H₂. Effect of GeH₄/SiH₄ and deposition temperature on stoichiometry (x), Si-Ge binding character, composition, hydrogen configuration, crystallinity, preferred orientation, grain size, and surface roughness of poly-Si_1−xGe_x films has been investigated. Poly-Si_1−xGe_x deposited on the substrate with amorphous silicon buffer layer on oxide shows better crystallinity and contains the less amount of oxygen than the one deposited directly on the oxide surface. At low temperature region, the Ge–H bond with the small amount of Si–H₂ bond is dominant but all hydrogen bonds are desorbed at high temperature. All films have polycrystalline phase and the grain size and (111) orientation increased with increasing deposition temperature in which Ge content also increases at the fixed gas flow rate of GeH₄ to total source gas. Poly-Si_1−xGe_x/Si thin film transistors (TFT) are fabricated and hydrogen during post-hydrogenation process preferentially is attached to Ge dangling bond and the TFT characteristics could be improved.     

Spectroscopic ellipsometry characterization of amorphous carbon and amorphous, graphitic and fullerene-like carbon nitride thin films

Carbon nitride (CN_x) and amorphous carbon (a-C) thin films are deposited by reactive magnetron sputtering onto silicon (001) wafers under controlled conditions to achieve amorphous, graphitic and fullerene-like microstructures. As-deposited films are analyzed by Spectroscopic Ellipsometry in the UV-VIS-NIR and IR spectral ranges in order to get further insight into the bonding structure of the material. Additional characterization is performed by High Resolution Transmission Electron Microscopy, X-ray Photoelectron Spectroscopy, and Atomic Force Microscopy. Between eight and eleven resonances are observed and modeled in the ellipsometrically determined optical spectra of the films. The largest or the second largest resonance for all films is a feature associated with C-N or C-C modes. This feature is generally associated with sp³ C-N or sp³ C-C bonds, which for the nitrogen-containing films instead should be identified as a three-fold or two-fold sp² hybridization of N, either substituted in a graphite site or in a pyridine-like configuration, respectively. The π→π? electronic transition associated with sp² C bonds in carbon films and with sp² N bonds (as N bonded in pyridine-like manner) in CN_x films is also present, but not as strong. Another feature present in all CN_x films is a resonance associated with nitrile often observed in carbon nitrides. Additional resonances are identified and discussed and moreover, several new, unidentified resonances are observed in the ellipsometric spectra.     

Importance of H2 gas for growth of hot-wire CVD nanocrystalline 3C-SiC from SiH4/CH4/H2

Silicon carbide (SiC) thin films were prepared by hot-wire chemical vapor deposition from SiH₄/CH₄/H₂ and the influence of H₂ gas flow rate (F(H₂)) on the film properties was investigated. The SiH₄ gas flow rate was 1 sccm. At the CH₄ gas flow rate (F(CH₄)) of 1 sccm, nanocrystalline cubic SiC (nc-3C-SiC) grew even without H₂. On the other hand, at F(CH₄) = 2 sccm, amorphous SiC grew without H₂ and nc-3C-SiC grew above F(H₂) = 50 sccm. As F(H₂) was increased, the crystallinity improved both at F(CH₄) = 1 and 2 sccm. However, the mean crystallite size decreased at F(CH₄) = 1 sccm and increased at F(CH₄) = 2 sccm. We discuss growth mechanisms of nc-3C-SiC.     

Effect of heating on the behaviors of hydrogen in C-TiC films with auger electron spectroscopy and secondary ion mass spectroscopy analyses

C-TiC films with a content of 75% TiC were prepared with magnetron sputtering deposition followed by Ar⁺ ion bombardment. Effect of heating on the behaviors of hydrogen in C-TiC films before and after heating was studied with Auger Electron Spectroscopy and Secondary Ion Mass Spectroscopy (SIMS) analyses. SIMS depth profiles of hydrogen after H⁺ ion implantation and thermal treatment show different hydrogen concentrations in C-TiC coatings and stainless steel. SIMS measurements show the existence of TiH, TiH₂, CH₃, CH₄, C₂H₂ bonds in the films after H⁺ ion irradiation and the changes in the Ti LMM, Ti LMV and C KLL Auger line shape reveal that they have a good hydrogen retention ability after heating up to the temperature 393 K. All the results show that C-TiC coatings can be used as a hydrogen retainer or hydrogen permeable barrier on stainless steel to protect it from hydrogen brittleness.     

Structure of diamond and diamond like carbon thin films grown by hot-filament chemical vapour deposition technique

Micro-crystalline diamond (MCD) and diamond like carbon (DLC) thin films were deposited on silicon (100) substrates by hot-filament CVD process using a mixture of CH₄ and H₂ gases at substrate temperature between 400–800°C. The microstructure of the films were studied by X-ray diffraction and scanning electron microscopy. The low temperature deposited films were found to have a mixture of amorphous and crystalline phases. At high temperatures (> 750°C) only crystalline diamond phase was obtained. Scanning electron micrographs showed faceted microcrystals of sizes up to 2μm with fairly uniform size distribution. The structure of DLC films was studied by spectroscopic ellipsometry technique. An estimate of the amount of carbon bonds existing insp ² andsp ³ form was obtained by a specially developed modelling technique. The typical values ofsp ³/sp ² ratio in our films are between 1·88–8·02. Paper presented at the poster session of MRSI AGM VI, Kharagpur, 1995     

Field emission characteristics of fast grown nanocrystalline diamond/amorphous carbon composite films by microwave plasma-enhanced chemical deposition method

This study synthesized the nanocrystalline diamond/amorphous carbon (NCD/a-C) composite films by the microwave plasma-enhanced chemical vapor deposition (MPCVD) system with Ar/CH₄/N₂ mixtures. A localized rectangular-type jet-electrode with high density plasma was used to enhance the formation of NCD/a-C films, and a maximum growth rate of 105.6 µm/h was achieved. The content variations of sp² and sp³ phases via varying nitrogen gas flow rates were investigated by using Raman spectroscopy. The NCD/a-C film which synthesized with 6% nitrogen concentration and no hydrogen plasma etching treatment possessed a low turn-on electric field of 3.1 V/µm at the emission current of 0.01 µA.     

Mechanical and environmental properties of Ge1−xCx thin film

Ge_1−xC_x thin film was prepared by plasma-enhanced chemical vapor deposition (PECVD) using GeH₄ and CH₄ as precursors and its mechanical and environmental properties were investigated. The samples were measured by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), Raman spectrum, FT-IR spectrometer, WS-92 testing apparatus of adhesion and FY-03E testing apparatus of salt and fog. The results show that the infrared refractive index of Ge_1−xC_x thin film varies from 2 to 4 with different x values. The adhesion increases with increasing gas flow ratio of GeH₄/CH₄ and decreases with increasing film thickness. The nanoindentation hardness number decreases with increasing germanium content. Three series films exhibit the best anti-corrosion property when the RF power is about 80 W, or substrate temperature is about 150 °C, or DC bias is about −100 V. Furthermore, increasing the gas flow ratio of GeH₄/CH₄ improves the anti-corrosion property of these films.     

Investigation of optical and compositional properties of thin SiNx:H films with an enhanced growth rate by high frequency PECVD method

Hydrogenated thin silicon nitride (SiN_x:H) films were deposited by high frequency plasma enhanced chemical vapor deposition techniques at various NH₃ and SiH₄ gas flow ratios [R = NH₃/(SiH₄ + NH₃)], where the flow rate of NH₃ was varied by keeping the constant flow (150 sccm) of SiH₄. The deposition rate of the films was found to be 7.1, 7.3, 9 and 11 Å/s for the variation of R as 0.5, 0.67, 0.75 and 0.83, respectively. The films were optically and compositionally characterized by reflectance, photoluminescence, infrared absorption and X-ray photoelectron spectroscopy. The films were amorphous in nature and the refractive indices of the films were varied between 2.46 and 1.90 by changing the gas flow ratio during the deposition. The PL peak energy was increased and the linear band tails become broad with the increase in R. The incorporation of nitrogen takes place with the increase in R.