MOCVD生长1．06μm InGaAs／GaAs量子阱LDs

用低压MOCVD生长应变InGaAs/GaAs量子阱,采用中断生长、应变缓冲层(SBL)、改变生长速度和调节Ⅴ/Ⅲ等方法改善InGaAs/GaAs量子阱的光致发光(PL)质量。PL结果表明,10s生长中断结合适当的SBL生长的量子阱PL谱较好。该量子阱应用于1.06μm激光器的制备,未镀膜的宽条激光器(100μm×1000μm)有低阈值电流密度(110A/cm2)和高的斜率效率(0.256W/A,per.facet)。     

用MOCVD方法生长940 nm应变多量子阱发光二极管

采用金属有机物化学气相淀积（MOCVD）方法设计并生长了应变多量子阱InGaAs/AlGaAs,并且对其进行了光致发光（PL）谱、双晶X射线衍射（DXRD）谱和电化学C－V等的测试。然后以InGaAs/AlGaAs作为有源层,以GaAs衬底作为透明衬底,p面金属电极AuBe合金作为镜面反射层,采用倒装技术制备了近红外发光二极管（LED）。在输入电流为20mA下的正向电压为1．2V左右,电致发光谱的峰值波长为938nm,10μA下的反向击穿电压为5－6V,在输入电流为50mA下得出输出功率3．5mW,对应电压为1．3V,在输入电流为300mA时得到最大输出功率为12mW。     

应变InGaAs/GaAs量子阱MOCVD生长优化及其在980 nm半导体激光器中的应用

使用低压MOCVD生长应变InGaAs/GaAs 980 nm量子阱.研究了生长温度、生长速度对量子阱光致发光谱(PL)的影响.并将优化后的量子阱生长条件应用于980 nm半导体激光器的研制中,获得了直流工作下,阈值电流为19 mA,未镀膜斜率效率为0.6 W/A,输出功率在100 mW的器件.     

MOCVD生长Al0.48Ga0.52N/Al0.54Ga0.36N多量子阱的结构和光学特性

采用金属有机物化学气相淀积(MOCVD)技术,在蓝宝石衬底上生长了Al0.48Ga0.52N/Al0.54Ga0.36N多量子阱(MQWs)结构。通过双晶X射线衍射(DCXRD)、原子力显微镜(AFM)和阴极荧光(CL)等测试技术,分别对样品的结构和光学特性进行了表征。在DCXRD图谱中,可以观察到明显的MQWs衍射卫星峰,通过拟和,MQWs结构中阱和垒的厚度分别为2.1和9.4nm,Al组分分别为0.48和0.54。在AFM表面形貌图上,可以观察到清晰的台阶流,表明MQWs获得了二维生长;与此同时,MQWs结构存在一些裂缝,主要原因为AlGaNMQWs结构和下层GaN层间存在很大的应力。CL测试表明,AlGaNMQWs结构的发光波长为295nm,处于深紫外波段,同时观察到处于蓝光、绿光波段的缺陷发光。     

MOCVD生长GaAs/AlGaAs量子阱研究

利用常压MOCVD技术在较低生长速率下生长出多种GaAs/AlGaAs多量子阱结构材料,利用低温PL谱和TEM对材料结构进行了表征。所得势阱和势垒结构厚度均匀平整,最窄阱宽为1.8nm。本研究表明,低速率(γ≤0.5nm/s)连续生长工艺能够避免杂质在界面富集,优于间断生长工艺,且在掺si n~+-GaAs衬底上所得量子阱发光强度高于掺Cr SI-GaAs衬底上的结果。     

应变层多量子阱InGaAs—GaAs的光电流谱研究

在10—300K温度范围,用光电流谱方法研究了未掺杂的x为0.1、0.15和0.2,InGaAs层厚度为8和15nm的In_xGa_(1-x)As—GaAs应变层多量子阱的能带结构。在1.240—1.550eV光子能量范围,除11H、11L和22H激子跃迁以及GaAs的基本带间跃迁外,还观察到束缚子带到连续带的跃迁。对样品In_(0.15)Ga_(0.85)As(8nm)-GaAs(15nm),观察到11H重空穴激子的2s及其它激发态跃迁,由此得到激子结合能的近似值,约为8meV。重空穴能带台阶Q_v=0.40±0.02。应变效应使得电子和重空穴束缚在InGaAs层,而轻空穴束缚在GaAs层。     

MBE生长InGaAs／GaAs应变层单量子阱激光器结构材料的研究

采用ＶａｒｉａｎＧｅｎⅡＭＢＥ生长系统研究了ＩｎＧａＡｓ／ＧａＡｓ应变层单量子阶（ＳＳＱＷ）激光器结构材料。通过ＭＢＥ生长实验，探索了Ｉｎ＿ｘＧａ＿（１－ｘ）ｔＡｓ／ＧａＡｓＳＳＱＷ激光器发射波长（λ）与Ｉｎ组分（ｘ）和阱宽（Ｌ＿ｚ）的关系，并与理论计算作了比较，两者符合得很好。还研究了材料生长参数对器件性能的影响，主要包括：Ⅴ／Ⅲ束流比，量子阱结构的生长温度Ｔ＿ｇ（ＱＷ），生长速率和掺杂浓度对激光器波长、阈值电流密度、微分量子效率和器件串联电阻的影响。以此为基础，通过优化器件结构和ＭＢＥ生长条件，获得了性能优异的Ｉｎ＿（０．２）Ｇａ＿（０．８）Ａｓ／ＧａＡｓ应变层单量子阱激光器：其次长为９６３ｎｍ，阈值电流密度为１３５Ａ／ｃｍ￣２，微分量子效率为３５．１％。     

生长停顿改善MOCVD生长InGaN/GaN多量子阱的特性

利用金属有机物化学气相淀积(MOCVD)生长了InGaN/GaN多量子阱(MQWs)结构,研究了生长停顿对InGaN/GaN MQWs特性的影响.结果表明,采用生长停顿,可以改善MQWs界面质量,提高MQWs的光致发光(PL)与电致发光(EL)强度;但生长停顿的时间过长,阱的厚度会变薄,界面质量变差,不仅In组分变低,富In的发光中心减少,而且会引入杂质,致使EL强度下降.     

Role of GaAs bounding layers in improving OMVPE growth and performance of strained-layer inGaAs/AIGaAs quantum-well diode lasers

In the growth of organometallic vapor phase epitaxy of InGaAs/AIGaAs single-quan-tum-well heterostructures for strained-layer diode lasers, the growth temperature is 100 to 200° C lower for the InGaAs quantum-well layer than for the AlGaAs cladding layers. Earlier studies showed that laser performance is greatly improved by sandwiching the InGaAs layer between lower and upper GaAs bounding layers that are grown during the times before and after InGaAs growth when the substrate temperature is decreased and increased, respectively. In this investigation, it has been found that laser performance is influenced mainly by the upper bounding layer rather than the lower one. By using Auger analysis in combination with Ar-ion sputtering to determine the composition depth profile of In_0.2Ga_0.8As/GaAs test structures layer without AlGaAs layers, it has been shown that the role of the upper bounding layer is to prevent the evaporation of In from the InGaAs quantum-well layer during the interval before the deposition of the upper AlGaAs cladding layer.     

大应变InGaAs/GaAs/AlGaAs微带超晶格中波红外QWIP的MOCVD生长

基于中波红外(峰值响应波长4.5μm)量子阱红外探测器QWIP进行了大应变In0.34Ga0.66As/GaAs/Al0.35Ga0.65As微带超晶格结构的MOCVD外延生长研究。通过对生长温度、生长速率、Ⅴ/Ⅲ比以及界面生长中断时间等生长参数的系统优化,获得了高质量的外延材料。     

ZnO nanotips grown on Si substrates by metal-organic chemical-vapor deposition

The ZnO nanotips are grown on silicon and silicon-on-sapphire (SOS) substrates using the metal-organic chemical-vapor deposition (MOCVD) technique. The ZnO nanotips are found to be single crystal and vertically aligned along the c-axis. In-situ Ga doping is carried out during the MOCVD growth. The ZnO nanotips display strong near-band edge photoluminescence (PL) emission with negligible deep-level emission. Free excitonic emission dominates the 77-K PL spectrum of the as-grown, undoped ZnO nanotips, indicating good optical properties and a low defect concentration of the nanotips. The increase of PL intensity from Ga doping is attributed to Ga-related impurity band emission. Photoluminescence quenching is also observed because of heavy Ga doping. ZnO nanotips grown on Si can be patterned through photolithography and etching processes, providing the potential for integrating ZnO nanotip arrays with Si devices.     

Ta/Au ohmic contacts to n-type ZnO

Ta/Au ohmic contacts are fabricated on n-type ZnO (∼1 × 10¹⁷ cm⁻³) epilayers, which were grown on R-plane sapphire substrates by metal organic chemical vapor deposition (MOCVD). After growth and metallization, the samples are annealed at 300°C and 500°C for 30 sec in nitrogen ambient. The specific contact resistance is measured to be 3.2×10⁻⁴ Ωcm² for the as-deposited samples. It reduces to 5.4×10⁻⁶ Ωcm² after annealing at 300°C for 30 sec without significant surface morphology degradation. When the sample is annealed at 500°C for 30 sec, the specific contact resistance increases to 3.3 × 10⁻⁵ Ωcm². The layer structures no longer exist due to strong Au and Ta in-diffusion and O out-diffusion. The contact surface becomes rough and textured.     

Material characterization of an ion-implantation process for p-type (InGa)As/GaAs quantum-well structures

We have performed a detailed study of the formation of Be⁺-implanted contacts to modulation-doped, p-channel, (InGa)As/GaAs, single-strained quantum wells. Photoluminescence at 4 K from these structures is shown to be an excellent monitor of implant and annealing effects, as corroborated by Hall-effect measurements. Rapid thermal annealing produced higher electrical activation of the Be implants than did arsine-over-pressure annealing at comparable temperatures, similar to the trend in bulk GaAs. In contrast to conventional, alloyed-contact technologies, the rapid-annealed, implanted structures provided ohmic contact to the quantum well even at 4 K.     

Surface photoabsorption monitoring of the growth of GaAs and InGaAs at 650°C by MOCVD

By monitoring the cyclic behavior of surface photoabsorption (SPA) reflectance changes during the growth of GaAs at 650°C and with sufficient H₂ purging time between the supply of trimethylgallium and AsH₃, we have been able to achieve controlled growth of GaAs down to a monolayer. Our results show, as confirmed by photoluminescence (PL) measurements, the possibility of growing highly accurate quantum well heterostructures by metalorganic chemical vapor deposition at conventional growth temperatures. We also present our PL measurements on the InGaAs single quantum wells grown at this temperature by monitoring the SPA signal.     

Realization of in-situ sub two-dimensional quantum structures by strained layer growth phenomena in the InxGa1- xAs/GaAs system

We confirm that as the misfit strain in pseudomorphic epitaxial layer increases, surface thermodynamics controlled growth modes can change from a layer-by-layer to a three-dimensional (3-D) island mode. Both in-situ reflection high energy electron diffraction studies and in-situ scanning tunneling microscopy studies are utilized to demonstrate this transition to 3-D growth. This concept allows one to grow GaAs/In_xGa_1-xAs/GaAs heterostructures where the electrons in In_xGa_1-xAs are possibly confined in lower dimensions.     

Electron microscope studies of InxGav1−xAs/GaAs/Si grown by metalorganic chemical vapor deposition

The microstructure of In_xGa_1−xAs/GaAs (5 nm/5 nm, x < 0 to 1.0), as grown by a metalorganic chemical vapor deposition two-step growth technique on Si(100) at 450‡C, and subsequently annealed at 750‡C, is investigated using plan-view and cross-sectional transmission electron microscopy. The variations in resultant island morphology and strain as a function of the In content were examined through the comparison of the misfit dislocation arrays and moirés observed. The results are discussed in relation to the ways in which the island relaxation process changes for high In content.     

SiC衬底AlN缓冲层的应变对GaN外延层质量的影响

在3英寸(1英寸=2.54 cm)SiC衬底上采用金属有机物化学气相沉积(MOCVD)法生长GaN外延材料。研究了AlN缓冲层的应变状态对GaN外延层应变状态和质量的影响。使用原子力显微镜和高分辨率X射线双晶衍射仪观察样品表面形貌,表征外延材料质量的变化,使用高分辨喇曼光谱仪观察外延材料应力的变化,提出了基于外延生长的应变变化模型。实验表明,GaN外延层的张应变随着AlN缓冲层应变状态的由压变张逐渐减小,随着GaN张应力的逐渐减小,GaN位错密度也大大减少,表面形貌也逐渐变好。