A Wideband Low Noise Amplifier With 4 kV HBM ESD Protection in 65 nm RF CMOS

This study presents a wideband low noise amplifier (LNA) including electrostatic discharge (ESD) protection circuits using 65 nm CMOS with a gate oxide thickness of only ${sim}2$ nm. By co-designing the ESD blocks with the core circuit, the LNA shows almost no performance degradation compared to the reference design without ESD. Under a power consumption of only 6.8 mW, the silicon results show that the LNA can achieve a peak power gain of 13.8 dB. Within the 3 dB bandwidth from 2.6 GHz to 6.6 GHz, the noise figure (NF) is in a range of 4.0 dB to 6.5 dB and the input reflection coefficient $S_{11}$ is below ${-}13.0$ dB. Using the miniaturized Shallow-Trench-Isolation (STI) diode of ${sim}40$ fF capacitance and a robust gate-driven power clamp configuration, the proposed LNA demonstrates an excellent 4 kV human body mode (HBM) ESD performance, which has the highest voltage/capacitance ratio ( ${sim}100$ V/fF) among the published results for RF LNA applications.      

A Linearization Technique for RF Receiver Front-End Using Second-Order-Intermodulation Injection

A linearization technique is proposed in which low-frequency second-order-intermodulation $({rm IM}_{2})$ is generated and injected to suppress the third-order intermodulation $({rm IM}_{3})$. The proposed linearization technique is applied to both a low-noise amplifier (LNA) and a down-conversion mixer in an RF receiver front-end (RFE) working at 900 MHz. Fabricated in a 0.18$ mu{hbox{m}}$ CMOS process and operated at 1.5 V supply with a total current of 13.1 mA, the RFE delivers 22 dB gain with 5.3 dB noise figure (NF). The linearization technique achieves around 20 dB ${rm IM}_{3}$ suppression and improves the RFE's ${rm IIP}_{3}$ from $-$ 10.4 dBm to 0.2 dBm without gain reduction and noise penalty while requiring only an extra current of 0.1 mA.      

Q-Band pHEMT and mHEMT Subharmonic Gilbert Upconversion Mixers

This letter makes a comparison between Q-band 0.15 $mu{rm m}$ pseudomorphic high electron mobility transistor (pHEMT) and metamorphic high electron mobility transistor (mHEMT) stacked-LO subharmonic upconversion mixers in terms of gain, isolation and linearity. In general, a 0.15 $mu{rm m}$ mHEMT device has a higher transconductance and cutoff frequency than a 0.15 $mu{rm m}$ pHEMT does. Thus, the conversion gain of the mHEMT is higher than that of the pHEMT in the active Gilbert mixer design. The Q-band stacked-LO subharmonic upconversion mixers using the pHEMT and mHEMT technologies have conversion gain of $-$7.1 dB and $-$0.2 dB, respectively. The pHEMT upconversion mixer has an ${rm OIP}_{3}$ of $-$12 dBm and an ${rm OP}_{1 {rm dB}}$ of $-$24 dBm, while the mHEMT one shows a 4 dB improvement on linearity for the difference between the ${rm OIP}_{3}$ and ${rm OP}_{1 {rm dB}}$. Both the chip sizes are the same at 1.3 mm $times$ 0.9 mm.      

A 0.55 V 60 dB-DR Fourth-Order Analog Baseband Filter

A 0.55 V supply voltage fourth-order low-pass continuous-time filter is presented. The low-voltage operating point is achieved by an improved bias circuit that uses different opamp input and output common-mode voltages. The fourth-order filter architecture is composed by two Active- ${rm G}_{rm m}{-}{rm RC}$ biquadratic cells, which use a single opamp per-cell with a unity-gain-bandwidth comparable to the filter cut-off frequency. The $-$ 3 dB filter frequency is 12 MHz and this is higher than any other low-voltage continuous-time filter cut-off frequency. The $-$3 dB frequency can be adjusted by means of a digitally-controlled capacitance array. In a standard 0.13 $mu{rm m}$ CMOS technology with ${V}_{THN}approx 0.25 {rm V}$ and ${V}_{THP}approx 0.3 {rm V}$, the filter operates with a supply voltage as low as 0.55 V. The filter $({rm total} {rm area}=0.47 {rm mm}^{2})$ consumes 3.4 mW. A 8 dBm-in-band IIP3 and a 13.3 dBm-out-of-band IIP3 demonstrate the validity of the proposal.      

A 3–10 GHz CMOS UWB Low-Noise Amplifier With ESD Protection Circuits

A low-power fully integrated low-noise amplifier (LNA) with an on-chip electrostatic-static discharge (ESD) protection circuit for ultra-wide band (UWB) applications is presented. With the use of a common-gate scheme with a ${rm g}_{rm m}$ -boosted technique, a simple input matching network, low noise figure (NF), and low power consumption can be achieved. Through the combination of an input matching network, an ESD clamp circuit has been designed for the proposed LNA circuit to enhance system robustness. The measured results show that the fabricated LNA can be operated over the full UWB bandwidth of 3.0 to 10.35 GHz. The input return loss $({rm S}_{11})$ and output return loss $({rm S}_{22})$ are less than ${-}8.3$ dB and ${-}9$ dB, respectively. The measured power gain $({rm S}_{21})$ is $11 pm 1.5$ dB, and the measured minimum NF is 3.3 dB at 4 GHz. The dc power dissipation is 7.2 mW from a 1.2 V supply. The chip area, including testing pads, is 1.05 mm$,times,$ 0.73 mm.      

Integrated Quadrature Couplers and Their Application in Image-Reject Receivers

Several fully-integrated multi-stage lumped-element quadrature hybrids that enhance bandwidth, amplitude and phase accuracies, and robustness are presented, and a fully-integrated double-quadrature heterodyne receiver front-end that uses two-stage Lange/Lange couplers is described. The Lange/Lange cascade exploits the inherent wide bandwidth characteristic of the Lange hybrid and enables a robust design using a relatively low transformer coupling coefficient. The measured image-rejection ratio is $>$ 55 dB over a 200 MHz bandwidth centered around 5.25 $~$GHz without any tuning, trimming, or calibration; the front-end features 23.5 dB gain, $-$79 dBm sensitivity, 5.6 dB SSB NF, $-$7$~$ dBm IIP3, $-$18 dB $S_{11}$ and a 1 mm $times$ 2 mm die area in 0.18$ mu{hbox {m}}$ CMOS.      

Analysis and Design of a CMOS UWB LNA With Dual- -Branch Wideband Input Matching Network

A wideband low-noise amplifier (LNA) based on the current-reused cascade configuration is proposed. The wideband input-impedance matching was achieved by taking advantage of the resistive shunt–shunt feedback in conjunction with a parallel LC load to make the input network equivalent to two parallel $RLC$-branches, i.e., a second-order wideband bandpass filter. Besides, both the inductive series- and shunt-peaking techniques are used for bandwidth extension. Theoretical analysis shows that both the frequency response of input matching and noise figure (NF) can be described by second-order functions with quality factors as parameters. The CMOS ultra-wideband LNA dissipates 10.34-mW power and achieves ${ S}_{11}$ below $-$8.6 dB, ${ S}_{22}$ below $-$10 dB, ${ S}_{12}$ below $-$26 dB, flat ${ S}_{21}$ of 12.26 $pm$ 0.63 dB, and flat NF of 4.24 $ pm$ 0.5 dB over the 3.1–10.6-GHz band of interest. Besides, good phase linearity property (group-delay variation is only $pm$22 ps across the whole band) is also achieved. The analytical, simulated, and measured results agree well with one another.      

A 1 V 23 GHz Low-Noise Amplifier in 45 nm Planar Bulk-CMOS Technology With High-$Q$ Above-IC Inductors

A 23 GHz electrostatic discharge-protected low-noise amplifier (LNA) has been designed and implemented by 45 nm planar bulk-CMOS technology with high-$Q$ above-IC inductors. In the designed LNA, the structure of a one-stage cascode amplifier with source inductive degeneration is used. All high- $Q$ above-IC inductors have been implemented by thin-film wafer-level packaging technology. The fabricated LNA has a good linearity where the input 1 dB compression point $({rm IP}_{{-}1~{rm dB}})$ is ${- 9.5}~{rm dBm}$ and the input referred third-order intercept point $(P _{rm IIP3})$ is ${+ 2.25}~{rm dBm}$. It is operated with a 1 V power supply drawing a current of only 3.6 mA. The fabricated LNA has demonstrated a 4 dB noise figure and a 7.1 dB gain at the peak gain frequency of 23 GHz, and it has the highest figure-of-merit. The experimental results have proved the suitability of 45 nm gate length bulk-CMOS devices for RF ICs above 20 GHz.      

A Fully Integrated 5 GHz Low-Voltage LNA Using Forward Body Bias Technology

A fully integrated 5 GHz low-voltage and low-power low noise amplifier (LNA) using forward body bias technology, implemented through a 0.18 $mu{rm m}$ RF CMOS technology, is demonstrated. By employing the current-reused and forward body bias technique, the proposed LNA can operate at a reduced supply voltage and power consumption. The proposed LNA delivers a power gain (S21) of 10.23 dB with a noise figure of 4.1 dB at 5 GHz, while consuming only 0.8 mW dc power with a low supply voltage of 0.6 V. The power consumption figure of merit $(FOM_{1})$ and the tuning-range figure of merit $(FOM_{2})$ are optimal at 12.79 dB/mW and 2.6 ${rm mW}^{-1}$, respectively. The chip area is 0.89 $,times,$0.89 ${rm mm}^{2}$.      

$S$ - and $C$ -Band Ultra-Compact Phase Shifters Based on All-Pass Networks

Ultra-compact phase shifters are presented. The proposed phase-shifting circuits utilize the lumped element all-pass networks. The transition frequency of the all-pass network, which determines the size of the circuit, is set to be much higher than the operating frequency. This results in a significantly small chip size of the phase shifter. To verify this methodology, 5-bit phase shifters have been fabricated in the $S$ - and $C$ -band. The $S$ -band phase shifter, with a chip size of 1.87 mm $,times,$0.87 mm (1.63 mm $^{2}$), has achieved an insertion loss of ${hbox{6.1 dB}} pm {hbox{0.6 dB}}$ and rms phase-shift error of less than 2.8$^{circ}$ in 10% bandwidth. The $C$ -band phase shifter, with a chip size of 1.72 mm $,times,$0.81 mm (1.37 mm $^{2}$), has demonstrated an insertion loss of 5.7 dB $pm$ 0.8 dB and rms phase-shift error of less than 2.3 $^{circ}$ in 10% bandwidth.      

17 GHz RF Front-Ends for Low-Power Wireless Sensor Networks

A 17 GHz low-power radio transceiver front-end implemented in a 0.25 $mu{hbox {m}}$ SiGe:C BiCMOS technology is described. Operating at data rates up to 10 Mbit/s with a reduced transceiver turn-on time of 2 $mu{hbox {s}}$, gives an overall energy consumption of 1.75 nJ/bit for the receiver and 1.6 nJ/bit for the transmitter. The measured conversion gain of the receiver chain is 25–30 dB into a 50 $Omega$ load at 10 MHz IF, and noise figure is 12 $pm$0.5 dB across the band from 10 to 200 MHz. The 1-dB compression point at the receiver input is $-$37 dBm and ${hbox{IIP}}_{3}$ is $-$25 dBm. The maximum saturated output power from the on-chip transmit amplifier is $-$1.4 dBm. Power consumption is 17.5 mW in receiver mode, and 16 mW in transmit mode, both operating from a 2.5 V supply. In standby, the transceiver supply current is less than 1 $mu{hbox {A}}$.      

A $Q$ -Band Four-Element Phased-Array Front-End Receiver With Integrated Wilkinson Power Combiners in 0.18-$mu{{hbox{m}}}$ SiGe BiCMOS Technology

A four-element phased-array front-end receiver based on 4-bit RF phase shifters is demonstrated in a standard 0.18- $mu{{hbox{m}}}$ SiGe BiCMOS technology for $Q$-band (30–50 GHz) satellite communications and radar applications. The phased-array receiver uses a corporate-feed approach with on-chip Wilkinson power combiners, and shows a power gain of 10.4 dB with an ${rm IIP}_{3}$ of $-$13.8 dBm per element at 38.5 GHz and a 3-dB gain bandwidth of 32.8–44 GHz. The rms gain and phase errors are $leq$1.2 dB and $leq {hbox{8.7}}^{circ}$ for all 4-bit phase states at 30–50 GHz. The beamformer also results in $leq$ 0.4 dB of rms gain mismatch and $leq {hbox{2}}^{circ}$ of rms phase mismatch between the four channels. The channel-to-channel isolation is better than $-$35 dB at 30–50 GHz. The chip consumes 118 mA from a 5-V supply voltage and overall chip size is ${hbox{1.4}}times {hbox{1.7}} {{hbox{mm}}}^{2}$ including all pads and CMOS control electronics.      

W-Band Active Down-Conversion Mixer in Bulk CMOS

A W-band (76–77 GHz) active down-conversion mixer has been demonstrated using low leakage (higher ${rm V}_{{rm T}}$) NMOS transistors of a 65-nm digital CMOS process with 6 metal levels. It achieves conversion gain of ${-}8$ dB at 76 GHz with a local oscillation power of 4 dBm (${sim-}2$ dBm after de-embedding the on-chip balun loss), and 3 dB bandwidth of 3 GHz. The SSB noise figures are 17.8–20 dB (11.3–13.5 dB after de-embedding on-chip input balun loss) between 76 and 77 GHz. ${rm IP}_{1{rm dB}}$ is ${-}6.5$ dBm and IIP3 is 2.5 dBm (${sim-}13$ and ${sim}-4$ dBm after de-embedding the on-chip balun loss). The mixer consumes 5 mA from a 1.2 V supply.      

A Single-Ended Fully Integrated SiGe 77/79 GHz Receiver for Automotive Radar

A single-ended 77/79 GHz monolithic microwave integrated circuit (MMIC) receiver has been developed in SiGe HBT technology for frequency-modulated continuous-wave (FMCW) automotive radars. The single-ended receiver chip consists of the first reported SiGe 77/79 GHz single-ended cascode low noise amplifier (LNA), the improved single-ended RF double-balanced down-conversion 77/79 GHz micromixer, and the modified differential Colpitts 77/79 GHz voltage controlled oscillator (VCO). The LNA presents 20/21.7 dB gain and mixer has 13.4/7 dB gain at 77/79 GHz, and the VCO oscillates from 79 to 82 GHz before it is tuned by cutting the transmission line ladder, and it centres around 77 GHz with a tuning range of 3.8 GHz for the whole ambient temperature variation range from $- hbox{40},^{circ}{hbox{C}}$ to $+ hbox{125},^{circ}{hbox{C}}$ after we cut the lines by tungsten-carbide needles. Phase noise is $-$90 dBc/Hz@1 MHz offset. Differential output power delivered by the VCO is 5 dBm, which is an optimum level to drive the mixer. The receiver occupies 0.5 ${hbox{mm}}^{2}$ without pads and 1.26 ${hbox{mm}}^{2}$ with pads, and consumes 595 mW. The measurement of the whole receiver at 79 GHz shows 20–26 dB gain in the linear region with stable IF output signal. The input ${rm P}_{rm 1dB}$ of the receiver is $-$35 dBm.      

Design of a Beam Switching/Steering Butler Matrix for Phased Array System

A compact broadband 8-way Butler matrix integrated with tunable phase shifters is proposed to provide full beam switching/steering capability. The newly designed multilayer stripline Butler matrix exhibits an average insertion loss of 1.1 dB with amplitude variation less than $pm$2.2 dB and an average phase imbalance of less than 20.7$^{circ}$ from 1.6 GHz to 2.8 GHz. The circuit size is only $160times 100 {rm mm}^{2}$, which corresponds to an 85% size reduction compared with a comparable conventional microstrip 8-way Butler matrix. The stripline tunable phase shifter is designed based on the asymmetric reflection-type configuration, where a Chebyshev matching network is utilized to convert the port impedance from 50 $Omega$ to 25 $Omega$ so that a phase tuning range in excess of 120$^{circ}$ can be obtained from 1.6 GHz to 2.8 GHz. To demonstrate the beam switching/steering functionality, the proposed tunable Butler matrix is applied to a 1 $times$ 8 antenna array system. The measured radiation patterns show that the beam can be fully steered within a spatial range of 108 $^{circ}$.      

Improved Microwave Noise Performance by SiN Passivation in AlGaN/GaN HEMTs on Si

Effects of silicon nitride (SiN) surface passivation by plasma enhanced chemical vapor deposition (PECVD) on microwave noise characteristics of AlGaN/GaN HEMTs on high-resistivity silicon (HR-Si) substrate have been investigated. About 25% improvement in the minimum noise figure $(NF_{min})$ (0.52 dB, from 2.03 dB to 1.51 dB) and 10% in the associate gain $(G_{rm a})$ (1.0 dB, from 10.3 dB to 11.3 dB) were observed after passivation. The equivalent circuit parameters and noise source parameters (including channel noise coefficient $(P)$, gate noise coefficient $(R)$, and their correlation coefficient $(C)$ ) were extracted. $P$ , $R$ and $C$ all increased after passivation and the increase of C contributes to the decrease of the noise figure. It was found that the improved microwave small signal and noise performance is mainly due to the increase of the intrinsic transconductance $(g_{{rm m}0})$ and the decrease of the extrinsic source resistance $(R_{rm s})$.      

10-GHz and 20-GHz Channel Spacing High-Resolution AWGs on InP

This letter reports on 10-GHz and 20-GHz channel-spacing arrayed waveguide gratings (AWGs) based on InP technology. The dimensions of the AWGs are 6.8$,times,$8.2 mm$^{2}$ and 5.0$,times,$6.0 mm$^{2}$, respectively, and the devices show crosstalk levels of $-$12 dB for the 10-GHz and $-$17 dB for the 20-GHz AWG without any compensation for the phase errors in the arrayed waveguides. The root-mean-square phase errors for the center arrayed waveguides were characterized by using an optical vector network analyzer, and are 18 $^{circ}$ for the 10-GHz AWG and 28$^{circ}$ for the 10-GHz AWG.      

Injection Locking and Switching Operations of a Novel Retro-Reflector-Cavity-Based Semiconductor Micro-Ring Laser

Injection locking and switching characteristics are investigated in the novel retro-reflector-cavitiy-based semiconductor ring laser with equivalent circular radius of 26 $mu$ m. The allowed detuning range is up to ${sim}$3 GHz wide and the highest side mode suppression ratio of ${sim}$ 43.7 dB can be achieved. A fast response speed of ${sim}$70 ps to the cavity is achieved, which indicates that this device can be utilized as an all optical switch at a data rate of 10 Gb/s or higher.      

Bending and Strain Sensitivities in a Helicoidal Long-Period Fiber Gratings

In this letter, we report bending and strain sensitivities of helicoidal long-period fiber gratings fabricated by twisting single-mode fibers during $hbox{CO}_{2}$ laser irradiation. Linear spectral shifts of the resonant wavelengths under the bending and tensile strain were observed with the sensitivities of $-$11.7 nm/m$^{-1}$ and $-$1.1 $hbox{pm}/muvarepsilon$, respectively. The corresponding transmission power variations at the resonance wavelength were 4.1 $hbox{dB/m}^{-1}$ and $2.2times 10^{-4} hbox{dB}/muvarepsilon$, respectively. Detailed measurement techniques and sensor applications are discussed.      

A Silicon-Germanium Receiver for X-Band Transmit/Receive Radar Modules

This work investigates the potential of commercially-available silicon-germanium (SiGe) BiCMOS technology for X-band transmit/receive (T/R) radar modules, focusing on the receiver section of the module. A 5-bit receiver operating from 8 to 10.7 GHz is presented, demonstrating a gain of 11 dB, and average noise figure of 4.1 dB, and an input-referred third-order intercept point $({hbox{IIP}}_{3})$ of $-$13 dBm, while only dissipating 33 mW of power. The receiver is capable of providing 32 distinct phase states from 0 to 360$^{circ}$ , with an rms phase error $≪ !{hbox{9}}^{circ}$ and an rms gain error $≪ ,$0.6 dB. This level of circuit performance and integration capability demonstrates the benefits of SiGe BiCMOS technology for emerging radar applications, making it an excellent candidate for integrated X-band phased-array radar transmit/receive modules.