Influence of magnesium doping on the structural and optical properties of tin (II) oxide thin films deposited by electron beam evaporation

Single-phase polycrystalline magnesium-doped tin oxide (Mg_xSn_1?xO; x=0, 0.04, and 0.08) thin films were deposited by electron beam evaporation on the glass substrate. X-ray diffraction analysis showed that the peaks intensity of the polycrystalline α-SnO thin films increased along with the increasing Mg content. The crystallite size calculated from X-ray diffraction data decreased by increasing the Mg doping concentration, which was also confirmed by atomic force microscopy. The stoichiometry and thickness of the thin films were determined by Rutherford backscattering spectroscopy. An increase in both the optical transmission (57–95%) and band gap (2.5–2.82 eV) of the Mg_xSn_1?xO thin films were observed which were investigated by UV–vis spectroscopy. Photoluminescence of Mg_xSn_1?xO thin films revealed that there were two extra peaks at 482 nm and 550 nm due to the crystal defects introduced by the Mg doping and these peaks become weaker and shifted to longer wavelength by increasing the Mg doping concentration.     

Energy band alignment and interface states in AlGaN/4H–SiC vertical heterojunction diodes

The effects of Al_xGa_1−xN aluminum fraction x and SiC surface pre-treatment on AlGaN/4H–SiC heterojunction interfaces are experimentally investigated. From capacitance vs. voltage measurements, the conduction band offsets are found to be ΔE_C ≈ 0.30 for x ≈ 0.3 and ΔE_C ≈ 0.56 for x ≈ 0.5. Forward bias ideality factors are reasonable at 3.3 for Al_0.3Ga_0.7N diodes, but >9 for Al_0.5Ga_0.5N diodes, suggesting a higher level of interface charge related to the higher aluminum fraction. Reverse bias leakage is acceptably low, with breakdown occurring at V_A > 200 V reverse bias for all tested devices. The effect of 1500 °C hydrogen etching of the SiC substrate prior to Al_xGa_1−xN growth is also investigated, and found to have little effect for x = 0.3 but a beneficial effect for x = 0.5.     

Vibrational and morphological properties of Sn-doped CdS films deposited by ultrasonic spray pyrolysis method

Cd_1?xSn_xS films (x=0.0, 0.1 and 0.2) were prepared by the ultrasonic spray pyrolysis (USP) method on the glass substrate at 300 °C. Effect of Sn doping on the vibrational and morphological properties of CdS films has been investigated by scanning electron microscopy (SEM), atomic force microscopy (AFM), FT-IR and Raman spectroscopy. The SEM and AFM measurements showed that the surface morphology of the films was affected by the tin incorporation. The Raman (200–700 cm^?1) and FT-IR (400–4000 cm^?1) spectra of Cd_1?xSn_xS were recorded. The Raman spectrum for Cd_1?xSn_xS films is dominated by an intense band at 300 cm^?1, assigned to the first-order longitudinal optic phonon and the second-order phonon peak 599 cm^?1. The absorption peaks in the FT-IR spectra of Cd_1?xSn_xS located at 540–700 and 1004–1045 cm^?1 can be assigned to the Cd–S and C–O stretching frequencies, respectively. Raman and FT-IR spectra shows decrease in the peak intensity with increasing Sn concentration.     

Effects of ammonia concentration on property of Cd1−xZnxS films by chemical bath deposition

Cd_1−xZn_xS thin films were grown on soda–lime glass substrates by chemical-bath deposition (CBD) at 80 °C with stirring. All the samples were annealed at 200 °C for 60 min in the air. The crystal structure, surface morphology, thickness and optical properties of the films were studied with transmission electron microscopy (TEM), X-ray diffraction (XRD), scanning electron microscopy (SEM), step height measurement instrument and spectrophotometer respectively. The results revealed that Cd_1−xZn_xS thin films had cubic crystal structure and the intensity of the diffraction peak increased gradually as ammonia concentration rose and the grain size varied from 5.1 to 8.3 nm. All of Cd_1−xZn_xS thin films had a granular surface with some smaller pores and the average granule sizes increased from 92 to 163 nm with an increase in ammonia concentration. The Cd_1−xZn_xS thin films had the highest transmittance with ammonia concentration of 0.5 M L⁻¹, whose thickness was 50 nm and band gap was 2.62 eV.     

Device characteristics of AlGaN/GaN MIS–HEMTs with high-k HfxZr1−xO2 (x = 0.66, 0.47, 0.15) insulator layer

This study investigates the characteristics of AlGaN/GaN MIS–HEMTs with Hf_xZr_1−xO₂ (x = 0.66, 0.47, and 0.15) high-k films as gate dielectrics. Sputtered Hf_xZr_1−xO₂ with a dielectric constant of 20–30 and a bandgap of 5.2–5.71 eV was produced. By increasing the Zr content of HfZrO₂, the V_TH shifted from −1.8 V to −1.1 V. The highest Hf content at this study reduced the gate leakage by approximately one order of magnitude below that of those Zr-dominated HFETs. The maximum I_DS currents were 474 mA/mm, 542 mA/mm, and 330 mA/mm for Hf content of 66%, 47%, 15% at V_GS = 3 V, respectively.     

Storage moduli,loss moduli and damping factor of GaAs and Ga1−xMnxAs thin films using DMA 2980

The spin injector part of spintronic FET and diodes suffers from fatigue due to rising heat on the depletion layer. In this study the stiffness of Ga_1−xMn_xAs spin injector in terms of storage modulus with respect to a varying temperature, 45 °C≤T≤70 °C was determined. It was observed that the storage modulus for MDLs (Manganese Doping Levels) of 0%, 1% and 10% decreased with increase in temperature while that with MDLs of 20% and 50% increase with increase in temperature. MDLs of 20% and 50% appear not to allow for damping but MDLs ≤20% allow damping at temperature range of 45 °C≤T≤70 °C. The magnitude of storage moduli of GaAs is smaller than that for ferromagnetic Ga_1−xMn_xAs systems. The loss moduli for GaAs were found to reduce with increase in temperature. Its magnitude of reducing gradient is smaller than Ga_1−xMn_xAs systems. The two temperature extremes show a general reduction in loss moduli for different MDLs at the study temperature range. From damping factor analysis, damping factors for ferromagnetic Ga_1−xMn_xAs was found to increase with decrease in MDLs contrary to GaAs which recorded the largest damping factor at 45 °C≤T≤70 °C. Hence, MDL of 20% shows little damping followed by 50% while MDL of 0% has the most damping in an increasing trend with temperature.     

Improvement in negative differential conductance characteristics of hole resonant-tunneling diodes with high Ge fraction Si/strained Si1−xGex/Si(1 0 0) heterostructure

Hole resonant-tunneling diodes (RTD) with Si/strained Si_1?xGe_x heterostructures epitaxially grown on Si(1 0 0) have been fabricated and improvement in negative differential conductance (NDC) characteristics for high Ge fraction such as x = 0.5 was investigated. It is clearly shown that SiH₄ exposure at low temperatures of 400–450 °C just after Si_1?xGe_x epitaxial growth is effective to suppress surface roughness in atomic order. In the case of the RTD with x = 0.48, NDC characteristics for 1.4-nm thick Si barriers were observed at higher temperatures around 270 K than that for 2.4-nm thick Si barriers. By increasing the Ge fraction to x = 0.58, NDC characteristics were also observed at higher temperatures around 290 K than that with x = 0.48.     

Thermal stability of lead-free CH3NH3SnxI3 systems (0.9 ≤ x ≤ 1.1) for photovoltaics

Methylammonium-tin-iodide (MASn_xI₃, 0.9 ≤ x ≤ 1.1) systems were prepared by precipitation process in aqueous solutions. The “as prepared” MASn_xI₃ systems exhibited a tetragonal crystalline phase (space group I4cm) with polyhedral crystallites (length 50–400 µm). The as prepared samples were annealed at T = 150 °C for t = 8 h under nitrogen and synthetic air. Under nitrogen, the CH₃NH₃Sn_xI₃ systems adopt nearly-cubic tetragonal structure (space group P4mm) with crystallites of 2–4 µm length whereas a degradation process with formation of non-crystalline phases occurred in air. The differential thermal analysis (DTA) profile in nitrogen revealed events at T = 247 °C, T = 297 °C (decomposition of CH₃NH₃Sn_xI₃ systems into methylamine (CH₃NH₂), hydroiodic acid (HI) and SnI₂), and in the range T = 342–373 °C (melting of SnI₂) respectively. The thermal profile in air showed endothermic events at T = 139 °C and T = 259 °C with additional events at onset temperatures of T = 337 °C and T = 423 °C respectively which correspond to the formation of Sn(IV)-O binds and to the decomposition of methylamine. Static thermogravimetry analysis (TG), performed at T = 85 °C and T = 150 °C for t = 2 h, revealed a linear weight loss as a function of the time. The optical absorption spectra displayed absorbance edges in near infrared range, at 1107.0 nm (x = 0.9), 1098.6 nm (x = 1.0) and 1073.2 nm (x = 1.1) respectively.     

Influence of substrate type on the structural,optical and electrical properties of CdxZn1−xS MSM thin films prepared by Spray Pyrolysis method

0.25 μm Cd_xZn_1−xS thin films were deposited on Si and glass substrates by using a chemical Spray Pyrolysis technique (CSP). Measurements of the absorption spectrum of the film were carried out. The values of band gaps (E_g) are calculated from the absorption spectrum. X-ray diffraction (XRD) of the Cd_xZn_1−xS thin films on Si and glass substrates was carried out. The full width at half-maximum (FWHM)) of diffraction peak was calculated to be about 0.640, which showed that it is a polycrystalline thin film. A Cd_xZn_1−xS Metal–Semiconductor–Metal (MSM) photodetector with nickel (Ni) contact electrodes was then fabricated. The electrical property of the Ni/Cd_xZn_1−xS/Si and Ni/Cd_xZn_1−xS/glass detectors was investigated using the current–voltage (I–V) measurements. The barrier heights ϕ_Β of Ni/Cd_xZn_1−xS/Ni MSM on Si and glass substrates were 0.551 eV and 0.593 eV, respectively with an applied bias voltage of 3 V.     

Structural characterization of Zn1−xCdxO (0≤x≤0.20) microrods grown by spray pyrolysis

Zn_1−xCd_xO (x= 0.00, 0.05, 0.10, 0.15 and 0.20) thin films were obtained by spray pyrolysis and characterized by XRD, SEM, EDAX and optical measurements. The Zn_1−xCd_xO microrods are in the wurtzite crystallographic phase with (0 0 2) preferred orientation. A narrowing of the fundamental band gap from 3.30 to 3.10 eV was observed with the increasing nominal Cd content up to 20 at% due to the direct modulation of the band gap caused by Cd substitution. The undoped ZnO film showed two emission bands in the spectra: one sharp UV luminescence at ∼382 nm and one broad visible emission ranging from 430 to 600 nm. The sharp peak at ∼382 nm is split into two at 376 and 400 nm upon Cd doping at levels of 5 and 10 at%. However this splitting is not observed in the doped ZnO samples containing 15 at% Cd and more. It should also be mentioned that the broad peak at the range of 430–600 nm has almost disappeared in the films containing 5, 10 and 15 at% Cd.     

Sigmoid-growth curve of lattice-constant against annealing-temperature of Cd1−xZnxTe thin films and its structural,optical and morphological characteristics

Stacked CdTe/Zn/CdTe layers were deposited on glass substrates. The vacuum-evaporated thin films were subsequently annealed in vacuum ambience at various temperatures. Change in lattice-constant of major Cd_1−xZn_xTe planes against temperature was plotted from the XRD results. The graphs followed sigmoid-growth model and were regressed well by standard Boltzmann and Logistic functions. Lattice-constant varied maximum in between 375–400 °C and 425–450 °C, giving two separate growth trends. Optical studies suggested that presence of charge impurities and defects reduced the transmittance and band-gap values of the samples. Such reduction occurred, despite of greater formation of Cd_1−xZn_xTe. Decreasing granularity was however associated with increasing band-gap for samples annealed at 425 and 450 °C. SEM micrographs showed that granularity decreased significantly for samples annealed at higher temperatures. EDX results were further used to co-relate the compositional characteristics with structural and optical features.     

Valence band anticrossing model for GaSb1−xBix and GaP1−xBix using k.p method

The reduction in band gap as well as the increase in spin–orbit splitting energy in GaSb_1−xBi_x and GaP_1−xBi_x are explained by the Valence Band Anticrossing (VBAC) model. This restructuring of the valence band is due to the interaction of the Bi related impurity levels with the extended states of the valence band of the host semiconductor. The band gap reduction in GaSb_1−xBi_x and GaP_1−xBi_x calculated using VBAC model are respectively 40.2 meV and 206 meV/at% Bi. A comparison of the theoretical and experimentally obtained values of band gap in GaSbBi shows good agreement. Valence band structure for GaPBi is obtained by the extrapolation of the parameters used for modeling of the GaSbBi system. The upward movement of the spin–orbit split-off E₊ energy level in GaSbBi by 19.2 meV/at% Bi is also responsible for the suppression of Auger recombination processes making it a potential candidate for near and mid-infrared optoelectronic applications.     

Routes for the integration of high and low dielectric constant oxides on InP

Dielectric and ferroelectric oxides with dielectric constant in the range κ≈4–500 have been deposited by pulsed laser deposition on (1 0 0)InP single crystal. Crystalline and textured CeO₂, Y-stabilised zirconia (YSZ), SrTiO₃ and ZnO layers can be deposited using an incubation method to avoid InP degradation. On the first three, textured Pb_1−1.5xLa_xTiO₃ can be deposited. Surface topography studies show that diffusion on the surface is responsible of the low YSZ roughness (σ<0.2% of thickness); while for ZnO two growth regimes are observed: hexagonal columns formed by shadowing and diffusion limited by step edge barriers determining the column top morphology.     

Electrical characteristics of electroless gold contacts on p-type Hg1−xCdxTe

High contact resistance of the order of 10⁻³ Ω cm² observed in p-type HgCdTe is one of the practical problems in the production of fine pitch high operating temperature and avalanche photodiode detector array. Electrical and compositional measurements on Au/p-HgCdTe are reported to understand the difficulties in reducing the contact resistance in HgCdTe detectors. Characterization of Au contacts on p-type Hg_1−xCd_xTe (x=0.3) formed by electrode-less (electroless) process and current transport mechanism are discussed. SIMS depth profiling of interfacial layer formed by the reaction of gold chloride with HgCdTe have been analyzed. Extent of the interfacial layer containing Au, Te, O and Cl is found to increase with increasing deposition time. Effect of annealing on the migration of Au across the contact region and electrical characteristics are presented. Heavily doped HgCdTe region with N_A=10¹⁷ cm⁻³ is produced beneath the contact regions after annealing at 80 °C leading to an order of magnitude improvement in the specific contact resistance. These results are useful for the creation of Au/p-HgCdTe contacts in a controlled and reproducible manner.     

Deep blue/ultraviolet microcavity OLEDs based on solution-processed PVK:CBP blends

There is an increasing need to develop stable, high-intensity, efficient OLEDs in the deep blue and UV. Applications include blue pixels for displays and tunable narrow solid-state UV sources for sensing, diagnostics, and development of a wide band spectrometer-on-a-chip. With the aim of developing such OLEDs we demonstrate an array of deep blue to near UV tunable microcavity (μc) OLEDs (λ ∼373–469 nm) using, in a unique approach, a mixed emitting layer (EML) of poly(N-vinyl carbazole) (PVK) and 4,4′-bis(9-carbazolyl)-biphenyl (CBP), whose ITO-based devices show a broad electroluminescence (EL) in the wavelength range of interest. This 373–469 nm band expands the 493–640 nm range previously attained with μcOLEDs into the desired deep blue-to-near UV range. Moreover, the current work highlights interesting characteristics of the complexity of mixed EML emission in combinatorial 2-d μcOLED arrays of the structure 40 nm Ag/x  nm MoO_x/∼30 nm PVK:CBP (3:1 weight ratio)/y  nm 4,7-diphenyl-1,10-phenanthroline (BPhen)/1 nm LiF/100 nm Al, where x = 5, 10, 15, and 20 nm and y = 10, 15, 20, and 30 nm. In the short wavelength μc devices, only CBP emission was observed, while in the long wavelength μc devices the emission from both PVK and CBP was evident. To understand this behavior simulations based on the scattering matrix method, were performed. The source profile of the EML was extracted from the measured EL of ITO-based devices. The calculated μc spectra indeed indicated that in the thinner, short wavelength devices the emission is primarily from CBP; in the thicker devices both CBP and PVK contribute to the EL. This situation is due to the effect of the optical cavity length on the relative contributions of PVK and CBP EL through a change in the wavelength-dependent emission rate, which was not suggested previously. Structural analysis of the EML and the preceding MoO_x layer complemented the data analysis.     

Magnetic,optical, microscopic and electrical behavior of Ca2−xYxCo2O5 prepared by a molten flux method

In this present study, we have reported the preparation of yttrium doped polycrystalline Ca_2−xY_xCo₂O₅ (x=0.0–1.0) material by a molten flux method and its various properties like electrical, optical, dielectric and magnetic behaviors. Characterization techniques have been adopted to confirm its physical nature and properties. X-ray diffraction results confirmed the crystal structure of prepared Ca_2−xY_xCo₂O₅ as orthorhombic and the scanning electron microscope pictured the presence of platelet-shaped particles with the dimensions of 150–300 nm. It also reveals the state of higher concentration of yttrium (Y³⁺) controls the grain size of Ca_2−xY_xCo₂O₅ ceramics. Further, we find out that the higher concentration of yttrium (Y³⁺) increases the optical band gap due to the occurrence of metal–insulator transition and also the same in electrical resistivity from 0.2 mΩ cm to 0.5 mΩ cm, which is due to the replacement of holes by Y³⁺ ions. The result of dielectric studies proves that the conduction mechanism of yttrium doped calcium cobalt oxide is due to space charge polarization. The magnetic saturation behavior shows the decreasing area in the hysteresis curve while the Y³⁺ concentration is increased, which is due to the phase transition of ferromagnetic to paramagnetic.     

Characteristics of high Al content AlxGa1−xN grown by metalorganic chemical vapor deposition

The epitaxial growth of Al_xGa_1−xN film with high Al content by metalorganic chemical vapor deposition (MOCVD) has been accomplished. The resulting Al content was determined to be 54% by high resolution X-ray diffraction (HRXRD) and Vegard's law. The full width at half maximum (FWHM) of the AlGaN (0002) HRXRD rocking curve was about 597 arcsec. Atomic force microscopy (AFM) image showed a relatively rough surface with grain-like islands, mainly coming from the low surface mobility of adsorbed Al-species. From transmittance measurement, the cut-off wavelength was around 280 nm and Fabry–Perot fringes were clearly visible in the transmission region. Cathodoluminescence (CL) measurement indicated that there existed a uniformity in the growth direction and a non-uniformity in the lateral direction.     

Magnetic and electric properties of BFO–NFO nanocomposites

Multiferroic nanocomposites of (1−x)BiFeO₃–xNiFe₂O₄ for x=0.2, 0.4, and 0.6 were prepared by a sol gel technique. The synthesized nanocomposites were characterized by X-ray diffraction (XRD). XRD confirmed, they being nanocomposites having desired phase with crystallite size ranging from 14.0 nm to 3.6 nm. The morphological analysis was done with the help of Transmission electron microscopy (TEM), which revealed the particle size to be in the range of 10–7 nm. Polarization–electric field (P–E) loop tracer was used to determine the ferroelectric properties of the nanocomposites. The dielectric constant at room temperature was analyzed upto 1 MHz frequency and was found to increase with increasing concentration. In order to investigate the magnetic behavior, a superconducting quantum interference device (SQUID) was used. The nanocomposites were analyzed by increasing the magnetic field up to 25 kOe and the magnetization was found to increase from 6 emu/g for x=0.2–10 emu/g for x=0.6, which was found to be optimum for the technological applications. The appropriate combination of two phases gave rise to higher magnetization.     

Effects of thermal annealing on the morphology of the AlxGa(1−x)N films

Effects of thermal annealing on the morphology of the Al_xGa_(1−x)N films with two different high Al-contents (x=0.43 and 0.52) have been investigated by atomic force microscopy (AFM). The annealing treatments were performed in a nitrogen (N₂) gas ambient as short-time (4 min) and long-time (30 min). Firstly, the films were annealed as short-time in the range of 800–950 °C in steps of 50–100 °C. The surface root-mean-square (rms) roughness of the films reduced with increasing temperature at short-time annealing (up to 900 °C), while their surface morphologies were not changed. At the same time, the degradation appeared on the surface of the film with lower Al-content after 950 °C. Secondly, the Al_0.43Ga_0.57N film was annealed as long-time in the range of 1000–1200 °C in steps of 50 °C. The surface morphology and rms roughness of the film with increasing temperature up to 1150 °C did not significantly change. Above those temperatures, the surface morphology changed from step-flow to grain-like and the rms roughness significantly increased.     

Electrochemical growth of tin(II) oxide films: Application in photocatalytic degradation of methylene blue

We have investigated the semiconducting and photoelectrochemical properties of SnO films grown potentiostatically on tin substrate. The oxide is characterized by X-ray diffraction, scanning electron microscopy and Raman spectroscopy. The anodic process corresponds to the formation of SnO·nH₂O pre-passive layer that is removed upon increasing potential due to surface etching at the metal/oxide interface. SnO films deposited for long durations (>50 mn) are uniform and well adhered; they thicken up to ~50 nm by diffusion-controlled process and the growth follows a direct logarithmic law. The thickness is determined by coulometry and the X-ray diffraction indicates the tetragonal SnO phase (SG: P4/mmm) with a crystallite size of 32 nm. The Mott–Schottky plot is characteristic of n type conductivity with an electrons density of 5.72×10¹⁸ cm⁻³, a flat band potential of −0.09 V_SCE and a depletion width of ~10 nm. The valence band, located at 5.91 eV below, vacuum is made up of hybridized O²⁻:2p Sn²⁺:5s while the conduction band (4.45 eV) derives from Sn²⁺:5p orbital. The electrochemical impedance spectroscopy (EIS) measured in the range (10⁻²–10⁵ Hz) shows the contribution of the bulk and grain boundaries. The energy band diagram predicts the photodegradation of methylene blue on SnO films. 67% of the initial concentration (10 mg L⁻¹) disappears after 3 h of exposure to visible light (9 mW cm⁻²) with a quantum yield of 0.072.