微测辐射热计的热隔离结构设计

推导了微测辐射热计热隔离结构的热量模型，对系统热响应时间和响应率之间的关系进行了分析，在满足系统响应要求下对热隔离结构的热量参数的确定进行了理论分析和探讨，热量参数曲线图提供了直观的参考，并结合实际提出了优化热量参数的方案。     

热释电红外探测器综合性能参数的测试

在分析了热释电探测器对阶跃辐射响应的理论之后，提出了一种红外探测器综合性能参数自动测试系统，并对热释电红外探测器的响应率、响应时间、平衡度进行了测试，得到探测器对于特定光源辐射的线性区间和饱和区间，为正确使用探测器提供了实验基础。     

场电离检测的Cs原子共振滤波

报道一种场电离检测的Ｃｓ原子共振滤波方案。理论预计：原子系统的固有线宽约为６０ＭＨｚ，响应时间为１ｎｓ，量子效率为９９％；初步实验测得（包括实验系统因素）响应时间为１２０ｎｓ，最小可探测光强为１０ｎＪ。     

日本纳美仕公司与中国三森公司产陶瓷电容器酚醛树脂包封料的对比分析

对比分析研究了日本纳美仕公司(Namics corporation, Japan)产的陶瓷电容器酚醛树脂包封料与中国江苏镇江三森电气有限公司(简称中国三森公司)产的陶瓷电容器酚醛树脂包封料的性能,利用SEM和XRD研究了这两种包封料的无机填料的形貌及其颗粒大小和物相组成,找到了日本纳美仕公司产的酚醛树脂包封料和中国三森公司产的酚醛树脂包封料性能不同的根本所在。结果表明:日本纳美仕公司产的酚醛树脂包封料的性能比中国三森公司产的要好,而它们的无机填料颗粒形貌及其尺寸大小和分布明显不同,它们的无机填料的物相组成几乎相同。     

机载热红外扫描仪机上定标系统研究

机上定标是定量遥感的最基本环节,本文在阐述红外扫描仪机上定标原理的基础上,结合实验详细分析了定标系统的几种影响因素:黑体的辐射率、测温精度和测温传感器的热响应时间,并给出了相应的实际解决方法及机上红外定标系统的设计原则.     

基于FPGA的数字包封开销信息处理技术

介绍了数字包封技术及数字包封开销信息在光传送网中的应用,其应用包括光通道操作、管理及维护,监测光通道性能等,为终端用户提供可靠的服务.在此理论基础上,针对如何实时提取、维护数字包封帧结构中的开销信息,提出了一种可行的基于FPGA的数字包封技术开销信息处理方案.阐述了整个处理方案的架构,并详细介绍了数据接入模块、数据处理...     

光电离检测的Cs原子共振滤波

本文报导一种新型的、使用光电离检测的Cs原子共振滤波方案.理论算得:原子系统固有的响应时间为10ns,线宽62MHz,量子效率86.6%,初步实验测得:响应时间(包括系统因素)130ns,量子效率大于10.1%,最小可探测光强3nJ.实验系统正在进一步改善,可以期望获得更好的实验值.     

液晶电视显示器响应时问的测量方法

讨论了液晶显示器响应时间的概念，详细介绍了液晶显示器响应时间的几种测量方法——软件加主观测试法和专业仪器客观测量法。     

陶瓷电容器用环氧–酚醛树脂包封料的研究

采用单因素变量法研究了组成对陶瓷电容器用环氧-酚醛树脂包封料性能的影响,得到了综合性能好的包封料,这种包封料干燥时间为8 h(低于20℃条件下),耐溶剂性时间为70 h(丙酮中36~38℃)。同时得到了各组分对包封料性能影响的规律,结果表明:加入六次甲基四胺的包封料干燥时间和耐溶剂性时间短,酚醛树脂多的包封料干燥时间和耐溶剂性时间都较长,无机填料CaCO3颗粒粗些能提高耐溶剂性,环氧树脂加入量w为1.4%时包封料的耐溶剂性最好。该研究为研制陶瓷电容器环氧-酚醛树脂包封料提供了依据。     

陶瓷电容器用环氧–酚醛树脂包封料的研究

采用单因素变量法研究了组成对陶瓷电容器用环氧-酚醛树脂包封料性能的影响,得到了综合性能好的包封料,这种包封料干燥时间为8 h(低于20℃条件下),耐溶剂性时间为70 h(丙酮中36~38℃)。同时得到了各组分对包封料性能影响的规律,结果表明:加入六次甲基四胺的包封料干燥时间和耐溶剂性时间短,酚醛树脂多的包封料干燥时间和耐溶剂性时间都较长,无机填料CaCO3颗粒粗些能提高耐溶剂性,环氧树脂加入量w为1.4%时包封料的耐溶剂性最好。该研究为研制陶瓷电容器环氧-酚醛树脂包封料提供了依据。     

Adhesion evaluation on low-cost alternatives to thermosetting epoxy encapsulants

The thermosetting epoxy curing systems have been widely used as encapsulants in the electronic packaging industry. With the continual evolving of electronic product markets, material suppliers have been challenged to provide more options to meet the requirements of advanced, yet cost effective, packaging solutions. In this paper, two low-cost alternative materials have been investigated experimentally regarding their adhesion and reliability performance, and these have then been compared with the thermosetting epoxy systems. One of the materials is thermoplastic bisphenol A epoxy/phenoxy resin, and the other is an interpenetrating polymer network composed of an epoxy curing component and a free radical polymerizable component. Some formulations of the materials being studied could exhibit excellent adhesion, durability and application reliability. While reworkability is expected for these materials, they are promising as cost effective encapsulants for electronic packaging, and may be applied with appropriate processing techniques.     

Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging

Underfill process is a very important step in the flip-chip packaging because of its great impact on the reliability of electronic devices. In the control of the underfill dispensing in flip-chip packaging, an analytical model for the underfill flow behavior is required to perform the control action. Traditionally, the Washburn model is used for predicting the viscous flow behavior in the flip-chip underfill process driven by capillary forces. Unfortunately, some studies in the literature have shown that the model does not match the measured results well due to the neglect of the characteristics such as solder bump resistance and non-Newtonian behavior of underfills. Although some underfill flow models have been developed for considering these characteristics, there is no sufficient account for such a mismatch from the literature. In this article, we present an experimental investigation aimed to understand the possible causes responsible for the observed mismatch with the Washburn model. The experimental investigation confirmed that the underfill fluid used in flip-chip packaging shows a complex non-Newtonian behavior and that the Washburn model is, indeed, only applicable to the Newtonian fluid in this setting. Another contribution of the work reported in this article is the provision of measured data on a test bed which was built upon using the off-the-shelf components; as such the data can be used by other researchers to validate their theoretical findings.     

电子封装用高导热金属基复合材料的研究

高导热金属基复合材料具有优异的热物理性能,且密度较低,是非常理想的电子封装材料。但是由于其本身高的脆性和硬度,使得该材料很难通过二次机械加工成所需要的形状,严重制约了该材料的应用。本文总结了本实验室在第三代SiCp/Al电子封装材料以及第四代金刚石/Cu（或Al）电子封装材料的近净成形制备方面所取得的一些突破性成果,并就相关的关键工艺进行了讨论,论文最后对电子封装用高导热金属基复合材料未来的发展做出了展望。     

Point contact rectifier theory

Point contact rectifiers have long been reputed to be unsusceptible to analysis. Although some features of their behavior are still poorly understood, there are a number of aspects which probably can be described quantitatively. In these cases, the difficulties are due to the complexity of the mathematical analysis rather than a lack of basic understanding. The approaches used in the theoretical analysis of two aspects of point contacts are discussed: the forward characteristics at moderately high currents, and the breakdown in the reverse direction. For the former, a theoretical solution is obtained for a hemispherical p-n junction. The computed curves agree qualitatively with experimental ones; a quantitative check is complicated by the need to compute curves for many different parameters. The breakdown properties of a point contact diode are compared with the theory for avalanche breakdown in a junction where heating occurs. Again, quantitative comparisons have not yet been made, but qualitative agreement encourages one to use the theory for obtaining design criteria in developmental work.     

Silicon optical modulators at 1.3-μm based on free-carrierabsorption

Silicon optical waveguide modulators, appropriate for operation in the 1.3-1.55 μm wavelength region, have been fabricated and their performance characterized at the wavelength of 1.3 μm. The modulator structures consist of p-i-n diodes integrated with silicon waveguides; device operation is based on free-carrier absorption. Modulation depths of -6.2 dB and response times less than 50 ns have been measured. Experimental results are compared with the p-i-n diode theory. It is argued that the device is suitable for integration with silicon electronics and silicon optoelectronic devices. The response times measured for the current devices may be improved by reducing the transverse dimensions of the p-i-n structure     

扇出型晶圆级封装中圆片翘曲研究

在扇出型晶圆级封装工艺中,由于芯片材料与塑封料之间的热膨胀系数差异,晶圆塑封过程中必然会形成一定的翘曲.如何准确预测晶圆的翘曲并对翘曲进行控制是扇出型晶圆级封装技术面临的挑战之一.在讨论圆片翘曲问题时引入双层圆形板弯曲理论与复合材料等效方法,提出一套扇出型晶圆级封装圆片翘曲理论模型,并通过有限元仿真与试验测试验证了该翘...     

Ti：Al_2O_3可调谐激光器模式研究

从高斯光束的理论出发，研究了Ｔｉ：Ａｌ_２Ｏ_３激光器中各参数间的相互关系，引入了Ｋｅｒｒ非线性透镜效应的影响。根据理论分析的结果，设计可调谐谐振腔，获得了最大可调谐输出能量７７．３ｍＪ，波长可调谐范围６５０～１０３９ｎｍ，光束发散角约为１ｍｒａｄ的ＴＥＭ_００模激光输出。     

蓝宝石片的皮秒激光划片工艺研究

由于具有硬度高、热导低及脆性大的特点,蓝宝石材料的精细加工较为困难。对皮秒脉冲激光用于蓝宝石片划片的特点进行了分析和讨论。在此基础上,对用于红外焦平面组件封装的蓝宝石片的皮秒激光划片参数进行了研究,并得到了一系列优化参数。对于红外焦平面阵列封装中常用的厚度为0.4 mm的蓝宝石过渡电极板,在组合划片参数为P(100) X(0.01/20) Y&Z(12) Z(0.1/3)时达到了最佳划片效果。分析了激光功率参数变化对划片的影响,并对实际划片操作中的一些问题进行了探讨。     

Diffraction Efficiencies for Infinite Perfectly Conducting Gratings of Arbitrary Profile

Integral equations are obtained for the currents induced on an infinite perfectly conducting grating by a plane wave. The integral equations are approximated by matrix equations which are readily solved for the currents. Once the currents are known one can obtain the strengths of the grating modes. Numerical results are obtained for specific cases which have been considered previously in some optical experiments by Madden and Strong. The theoretical results are consistent with the conservation of energy. However, there are discrepancies with the experimental results. An equivalent problem of reflections in a terminated waveguide is also considered and good agreement between theory and experiment is obtained. The technique is extendible to dielectric gratings.     

Analysis of thermomechanical interactions in a miniature solder system under cyclic fatigue loading

This paper discusses the possible thermomechanical interaction (coupling) phenomena of a miniature solder system in electronic packaging application similar to those which have been identified for some metallic material systems in aerospace and nuclear structures under cyclic fatigue loads at different frequencies. The main objective is to investigate the heat generated by the viscoplastic deformations, and vice versa, especially on the thermal transient and the gradient induced viscoplastic ratchetting response of cyclic creep. A literature review was conducted to focus on the temperature-dependent, strain rate-sensitive stress-strain response of the eutectic or near-eutectic lead-tin (Pb37-Sn63 or Pb40-Sn60) solder alloys. The result was used to develop and apply a simple overstress constitutive theory for modeling the coupled, isotropic thermoviscoplasticity of the eutectic lead-tin solder alloy. A fully coupled heat transfer and mechanical finite element model is used to simulate possible thermal-mechanical interactions of temperature rise and viscoplastic ratchetting of the miniature solder systems in a C4/BGA chip scale package (CSP) under cyclic fatigue loads at different frequencies. The results of analysis are discussed to compare between a coupled thermomechanical model and that of a pure mechanical model.