石蜡油对三元乙丙橡胶硫化特性和力学性能的影响

考察了石蜡油用量对三元乙丙橡胶硫化特性和力学性能的影响.结果表明,与未充油EPDM胶料相比,充油胶料最小扭矩与最大扭矩下降.随着石蜡油用量的增大,这一趋势更加明显.随着石蜡油用量的增大,充油EPDM胶料中填料分散性变好,硫化胶拉伸强度和硬度均明显下降;老化后拉伸强度增大,石蜡油用量多于7份时,拉伸强度减小,硬度增大.     

石蜡油对三元乙丙橡胶硫化特性和交联密度的影响

用橡胶加工分析仪及无转子硫化仪研究了石蜡油用量、硫化温度对过氧化物硫化的三元乙丙橡胶（EPDM）的硫化特性及交联密度的影响。结果表明,填充了石蜡油的胶料与未充油胶料相比,最小转矩和最大转矩均有不同程度的降低,而焦烧时间和正硫化时间均有所延长;且随着石蜡油用量的增加,这一趋势更加明显。相同硫化温度下,胶料的交联密度随石蜡油用量的增大而降低;相同石蜡油用量下,交联密度随硫化温度的升高而降低。     

石蜡油对过氧化物和硫黄硫化EPDM交联密度的影响

研究了石蜡油对过氧化物硫化及硫黄硫化EPDM交联密度的影响。采用无转子硫化仪MDR测试,结果表明,两种硫化体系得到的硫化胶交联密度随着石蜡油用量的增加而减小,过氧化物硫化胶交联密度下降程度较大,交联效率随着石蜡油用量的增加而减小。     

EPDM的性能研究

研究了炭黑N330、石蜡油及硫黄用量对EPDM硫化胶力学性能的影响。结果表明，随着炭黑N330用量的增大，EPDM硫化胶的硬度和拉伸强度都增大；随着石蜡油用量的增加，EPDM硫化胶的硬度和拉伸强度都下降；随着硫黄用量的增加，EPDM硫化胶的硬度增大，拉伸强度出现先减小后增大的规律。应用3变量中心复合设计法，通过回归分析，可考察不同用量炭黑、石蜡油和硫黄对EPDM硫化胶力学性能的影响。     

EPDM的性能研究

本文应用简化了的三变量中心复合设计法，运用回归分析，考察了炭黑N330、石蜡油及硫磺用量对三元乙丙橡胶(EPDM)硫化胶力学性能的影响。结果表明，随着炭黑N330用量的增大，EPDM硫化胶的硬度和拉伸强度均增大；随着石蜡油用量的增加，EPDM硫化胶的硬度和拉伸强度均下降。随着硫磺用量的增加，EPDM硫化胶的硬度增大，拉伸强度出现先减小后增大的规律。     

EPDM发泡材料低压缩永久变形的研究

主要研究了EPDM牌号、炭黑品种、石蜡油用量、硫化剂品种及用量、防老剂品种及用量、后处理工艺等因素对EPDM发泡材料压缩永久变形的影响。结果表明:硫磺硫化的EPDM3960发泡胶料,可获得最小的的压缩永久变形,且硫磺硫化的EPDM4045发泡胶料随着后处理时间的延长和后处理温度增大,硫化胶压缩永久变形均呈现减小的趋势。硫磺硫化的EPDM硫化胶压缩永久变形先随硫化剂用量的增加而降低,然后达到一个平台期;DCP硫化的EPDM硫化胶压缩永久变形随硫化剂用量而呈现减小趋势。     

充油对过氧化物硫化乙丙橡胶的影响

采用橡胶加工分析仪(RPA),研究了软化剂对EPDM硫化性能的影响。结果表明,与未充油的胶料相比,充油胶料的硫化性能有一定的改变,最大最小扭矩、扭矩差、硫化速率、正硫化时间,均有不同程度的减小或缩短,焦烧时间有所延长;随着软化剂用量的增加,交联密度和交联效率降低。     

硫黄硫化体系对三元乙丙橡胶硫化特性及硫化胶性能的影响

研究了促进剂与硫黄的质量比(A/S)对硫黄硫化体系三元乙丙橡胶(EPDM)的硫化特性、交联网络结构、动态力学性能以及物理机械性能的影响。结果表明,随着有效硫含量的增加,EPDM混炼胶的焦烧时间和正硫化时间缩短;在有效硫含量相同时,焦烧时间随着促进剂用量的增加而逐渐减小,硫化程度无明显差别。随A/S值增大,EPDM硫化胶的交联密度增大,相应地力学性能得以改善;但促进剂用量较高时交联密度反而下降,A/S为3.7时交联密度达到最佳。动态力学性能分析结果显示,随着单硫和双硫键含量的升高,储能模量下降得越发明显,损耗因子对应变的依赖性越大。     

填充油用量对硫黄硫化EPDM的影响

采用橡胶加工分析仪,研究了填充油用量对硫黄硫化EPDM硫化特性和硫化胶交联网络结构的影响。结果表明,当填充油用量一定时,EPDM硫化胶的总交联密度与硫黄用量呈线性关系;当硫黄用量一定时,随着填充油用量的增加,EPDM混炼胶的最低扭矩和硫化程度不断降低,硫化速率减慢;EPDM硫化胶的物理缠结密度随填充油用量的增加而线性下降,填充油用量较大时,填充油对胶料的稀释作用在硫黄硫化EPDM总交联密度的降低中占主导地位。     

三元乙丙橡胶/聚丙烯体系动态硫化速率及热塑性弹性体定伸应力的影响因素

采用转矩流变仪制备了动态硫化三元乙丙橡胶（EPDM）/聚丙烯（PP）热塑性弹性体（TPV）,考察了EPDM/PP共混物的硫化速率及TPV定伸应力的影响因素。结果表明,提高混炼温度、转速及减少EPDM充油量可以提高硫化速率,当混炼温度为195℃、转速为50 r/min、充油质量分数为30%时,TPV的定伸应力达到最大值;随着低双键含量的EPDM（LEPDM）含量的增加,EPDM/PP共混物的硫化速率和TPV的定伸应力逐渐减小,当LEPDM质量分数达到60%时,硫化速率和定伸应力趋于稳定。     

Dielectric spectroscopy of anaerobic adhesive cure

Dielectric spectroscopy (DS) is shown to be a most useful tool for the study of the surface initiated redox cure in model anaerobic acrylic adhesives. These models are deliberately designed to exhibit different levels of cure heterogeneity. The cure is initiated by the surfaces of two substrates on either side of a bondline. The heterogeneous cure situation is referred to as low cure through volume (CTV). Poor CTV is an undesirable feature that leads to mechanical weakness in an adhesive bond. Thus, experimental techniques based on DS are developed to investigate the cure characteristics and in particular the CTV phenomenon in the model anaerobic adhesives.     

硫化体系的变更对白炭黑填充橡胶性能的影响

文章通过对白炭黑填充橡胶的硫化体系的变更,探讨了加入MBTS（苯并噻唑）对橡胶物性及轮胎性能的影响。结果表明,在白炭黑填充的橡胶中加入MBTS,大大提高硫化速率,缩短硫化时间,橡胶物理特性差异很小,轮胎评价达到试验要求。     

辐射固化胶粘剂的应用与研究

近年来,辐射固化胶粘剂由于其快速固化及优异的性能发展很快,广泛应用于各行各业。文章介绍了它的特性及应用领域,并对它近年的研究进展简要地做了介绍。     

改性双马来酰亚胺树脂的固化工艺研究

本文用ＤＳＣ法研究改性双马来酰亚胺树脂的固化动力学参数和固化工艺,固化度和红外光谱确定了后处理工艺。研究所得的固化工艺条件中１４０℃／ｈ、１９０℃／２ｈ,２４０℃／４ｈ能达到完全固化。     

橡胶固化的流变学研究

本文的目的是得到一种快速、可重复的方法来反映并量化两种不同橡胶产品在固化温度下结构的形成,从控制应力屈服测试和蠕变测试结果我们发现流变学方法可以用来很好的表征橡胶的固化。     

天然橡胶抗返原硫化体系的研究

研究了普通(CV)、有效(EV)、半有效(SEV)和平衡(EC)四种硫化体系对NR抗硫化返原和硫化胶物理机械性能的影响。结果表明：有效和平衡硫化体系的抗硫化返原性最好；在不同的硫化体系中加入抗返原剂Si69之后，都能有效地提高硫化天然胶的抗硫化返原性和物理机械性能。综合使用性能和抗硫化返原性，以半有效硫化体系较好。     

新型酚醛树脂固化反应动力学及固化机理研究

采用DSC热分析对S酚醛树脂的固化过程进行了动力学研究,得出了该树脂的固化工艺温度及固化动力学参数,其凝胶化温度、固化温度和后处理温度分别为360.7K、421.6K和463.4K;反应级数n=0.912、表观活化能E=76.14kJ·mol^-1,反应频率因子A=4.704×10^8min^-1。采用红外光谱分析初步探讨了该树脂的固化机理,结果表明其固化反应主要是苄羟基与苯环邻位上活泼氢产生交联缩合反应,少量为苄羟基之间的缩合反应。     

Dielectric cure determination of a thermosetting epoxy composite prepreg

Evaluation of degree of cure (DoC) of a glass reinforced epoxy composite prepreg used for manufacturing of printed circuit board (PCB) is an intensive issue because of its practical importance and cost reduction in industry. Typical techniques such as differential scanning calorimetry (DSC) and fourier transform infrared spectroscopy (FTIR) are destructive and require curing a material during a chosen time, quenching the sample to stop cure before performing analysis. Thus, it is necessary to remove the temperature influence on the determination of DoC. In this study, the feasibility of nondestructive dielectric sensing method as an in situ DoC measuring technique through cure monitoring of prepreg is presented, where a vacuum packing configuration has been established so as for the prepreg to evaluate accurately the DoC in a quenched state at an ambient temperature. The optimal curing condition to get the fully cured state of a prepreg material is determined by the dielectric cure monitoring based on the behavior of ion viscosity. The temperature effect compensated DoC of prepreg is correlated and compared with that evaluated by DSC and FTIR. The correlated DoC with ion viscosity has identified the curing behavior of prepreg by determining cure kinetic parameters. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44707.     

LED光源对PCB油墨革命性的影响

PCB油墨是指印制电路板(Printed Circuit Board,简称为PCB)所采用的油墨,光引发剂是PCB油墨的重要组分之一,目前常用引发剂最敏感的吸收波长在365nm左右,与高压汞灯(PCB油墨常用的固化光源)发出的最强波长一致;LED光源发出的光波长是395nm,基于光引发剂的吸收光谱与光源的发射光谱相匹配的原则,随着UVLED曝光机的出现,要求对传统PCB油墨中光引发剂的最大吸收波长做出相应的改变,光引发剂的改变将会给PCB油墨带来革命性的影响。     

Preparation,characterization, and thermal properties of controllable metal–imidazole complex curing agents for epoxy resins

A series of complexes incorporating the epoxy–imidazole adduct of phenyl glycidyl ether with 2‐ethyl‐4‐methylimidazole (PGE‐EMI), has been prepared with the acetato and chloro transition metal salts of Mn, Co, Ni, Cu, Zn, and Ag. These complexes have been characterized using spectroscopic methods (IR, UV‐Vis, ¹H‐ and ¹³C‐NMR, where appropriate) and their thermal stabilities have been determined using elevated temperature NMR techniques. These high‐temperature NMR results indicated that the chloro complexes studied (of Mn²⁺, Co²⁺, Ni²⁺, Cu²⁺, and Zn²⁺) exist in equilibrium (i.e., they dissociate reversibly in a solution of dimethylsulphoxide, DMSO, at elevated temperatures), while the corresponding acetato complexes dissociate irreversibly. For the silver complexes, thermogravimetric analysis (TGA) was used to monitor the dissociation, showing that the weight loss recorded was consistent with the dissociation of the metal salt to liberate the PGE–imidazole ligand. The thermal stabilities of the metal complexes were influenced by changing both the transition metal (e.g., from Mn to Zn) and varying the anion (e.g., from acetate to chloride). From ¹H‐NMR analysis, a decrease of ca. 10°C was observed in the thermal dissociation of the acetato complexes when compared with the chloro complexes, showing that the series of PGE‐EMI complexes with acetate anions is less thermally stable than the corresponding chlorides. This finding suggests that these PGE‐EMI complexes may be modified to accommodate their use in a variety of different curing schedules when used to cure epoxy resins. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 201–217, 2000