Fabrication of a n-ZnO/p-Si heterojunction diode by ultra-high vacuum magnetron sputtering

Heterojunction diodes of n-type ZnO were fabricated on a p-type Si(100) substrate using an ultra-high vacuum radio frequency magnetron sputtering method at room temperature. A short-time post-annealing process was performed to prevent inter-diffusion of Zn, dopants, and Si atoms. The post-annealing process at 600 °C enhanced the crystallinity of ZnO films and produced a high forward to reverse current ratio of the heterojunction diode with a barrier height of approximately 0.336 eV. A thin SiO_x layer at the interface of the ZnO film and Si substrate appeared distinctly at the 600 °C annealing, however the post-annealing at 700 °C showed an a-(Zn_2xSi_1 − xO₂) structure caused by diffusion of silicon into the ZnO film. In the n-ZnO/p-Si sample annealed at 700 °C, a rapid change in the barrier height was considered due to the effect of the dopant segregation from the substrate and deformation of the a-SiO_x structure.     

Deposition and post-deposition annealing of thin Y2O3 film on n-type Si in argon ambient

Thin (∼5.0 nm) Y₂O₃ films were deposited on n-type Si (1 0 0) substrate using RF magnetron sputtering. Detailed studies on the effects of post-deposition annealing (PDA) temperatures (400, 600, 800, and 1000 °C) in argon ambient on these films were performed by X-ray diffraction (XRD), Fourier transform infrared spectrometer (FTIR), field emission scanning electron microscopy, and atomic force microscopy. Interfacial layer (IL) of SiO₂ in between Y₂O₃ and the Si substrate for sample annealed from 400 to 800 °C had been suggested from the results of FTIR. As for sample annealed at 1000 °C, presence of IL might consist of both Y₂Si₂O₇ and/or SiO₂ through the detection of Y₂Si₂O₇ compound and Si–O chemical bonding from XRD and FTIR analysis, respectively. For as-deposited sample, no detectable chemical functional group at the IL was recorded. Electrical characteristics of the Y₂O₃ films were acquired by fabricating metal-oxide–semiconductor capacitor as test structure. An improvement in the breakdown voltage (V_B) and leakage current density (J) was perceived as the PDA temperature increased. Of the PDA samples, the attainment of the lowest effective oxide charge, interface trap density, total interface trap density, and the highest barrier height at 1000 °C had contributed to the acquisition of the highest V_B and lowest J.     

Grazing incidence X-ray study of Ge-nanoparticle formation in (Ge:SiO2)/SiO2 multilayers

We present the study of formation of Ge-nanoparticles (Ge-NP) in germanosilicate (Ge:SiO₂) multilayer (ML) films under thermal treatment. In anticipation of controllable formation of Ge-NP, ML films were prepared by magnetron deposition at room temperature as 20 bi-layer stacks, each bi-layer comprised of a 7 nm thick layer of (Ge + SiO₂) (molar ratio: 60:40) succeeded by a 7 nm thick layer of pure SiO₂, and then annealed for 1 h, up to T_a = 900 °C. Formation and morphology of Ge-NP were analyzed by combining the information obtained from the grazing incidence small angle X-ray scattering and X-ray diffraction. It was found that precipitation of Ge-NP starts at T_a = 600 °C, while high degree of in-plane confinement and lateral ordering of rather uniform precipitated particles is achieved at T_a =  700-800 °C range. At still higher annealing temperature T_a > 800 °C, volume fraction of precipitated Ge-NP in SiO₂ matrix diminishes due to the out-diffusion of Ge atoms from the film, while Ge-NP are no more well confined to (Ge + SiO₂) layers.     

Enhanced tunable dielectric properties of Ba0.5Sr0.5TiO3/Bi1.5Zn1.0Nb1.5O7 multilayer thin films by a sol-gel process

Ba_0.5Sr_0.5TiO₃(BST)/Bi_1.5Zn_1.0Nb_1.5O₇(BZN) multilayer thin films were prepared on Pt/Ti/SiO₂/Si substrates by a sol-gel method. The structures and morphologies of BST/BZN multilayer thin films were analyzed by X-ray diffraction (XRD) and field-emission scanning electron microscope. The XRD results showed that the perovskite BST and the cubic pyrochlore BZN phases can be observed in the multilayer thin films annealed at 700 °C and 750 °C. The surface of the multilayer thin films annealed at 750 °C was smooth and crack-free. The BST/BZN multilayer thin films annealed at 750 °C exhibited a medium dielectric constant of around 147, a low loss tangent of 0.0034, and a relative tunability of 12% measured with dc bias field of 580 kV/cm at 10 kHz.     

Structural and optical properties of Er-doped Y2Ti2O7 thin films by sol-gel method

Er³⁺-doped Y₂Ti₂O₇ and Er₂Ti₂O₇ thin films were fabricated by sol-gel spin-coating method. A well-defined pyrochlore phase Er_xY_2-xTi₂O₇ was observed while the annealing temperature exceeded 800 °C. The average transmittance of the Er_xY_2-xTi₂O₇ thin films annealed at 400 to 900 °C reduces from ∼ 87 to ∼ 77%. The refractive indices and optical band gaps of Er_xY_2-xTi₂O₇ (x = 0-2) annealed at 800 °C/1 h vary from 2.20 to 2.09 and 4.11 to 4.07 eV, respectively. The ∼ 1.53 μm photoluminescence spectrum of Er³⁺ (5 mol%)-doped Y₂Ti₂O₇ thin films annealed at 700 °C/1 h exhibits the maximum intensity and full-width at half maximum (∼ 60 nm).     

Effect of Cu dopant on microstructure and phase transformation of ZnTiO3 thin films prepared by radio frequency magnetron sputtering

Cu doped zinc titanate (ZnTiO₃) films were prepared using radio frequency magnetron sputtering. Subsequent annealing of the as-deposited films was performed at temperatures ranging from 600 to 900 °C. It was found that the as-deposited films were amorphous and contained 0.84 at.% Cu. This was further confirmed by the onset of crystallization that took place at annealing temperatures 600 °C. The phase transformation for the as-deposited films and annealed films was investigated in this study. The results showed that Zn₂Ti₃O₈, ZnTiO₃, and TiO₂ can coexist at 600 °C. When annealed at 700 °C, the results revealed that mainly the hexagonal ZnTiO₃ phase formed, accompanied by minority amounts of TiO₂ and Zn₂Ti₃O₈. Unlike pure zinc titanate films, this result showed that the Zn₂Ti₃O₈ phase can be stable at temperatures above 700 °C. Moreover, Cu addition in zinc titanate thin film could result in the decomposition of hexagonal (Zn,Cu) TiO₃ phase at 800 °C. When the Cu content was increased in zinc titanate thin films from 0.84 at.% to 2.12 at.%, there were only two phases; Zn₂Ti₃O₈ and ZnTiO₃, coexisting at temperatures between 700 and 800 °C. This result indicated that a greater presence of Cu dopants in zinc titanate thin films leads to the existence of the Zn₂Ti₃O₈ phase at higher temperatures.     

Characterization of anodic SiO2 films on P-type 4H-SiC

The physical and electronic properties of 100-120-nm thick anodic silicon dioxide film grown on p-type 4H-SiC wafer and annealed at different temperatures (500, 600, 700, and 800 °C) have been investigated and reported. Chemical bonding of the films has been analyzed by Fourier transform infra red spectroscopy. Smooth and defect-free film surface has been revealed under field emission scanning electron microscope. Atomic force microscope has been used to study topography and surface roughness of the films. Electronic properties of the film have been investigated by high frequency capacitance-voltage and current-voltage measurements. As the annealing temperature increased, refractive index, dielectric constant, film density, SiC surface roughness, effective oxide charge, and leakage current density have been reduced until 700 °C. An increment of these parameters has been observed after this temperature. However, a reversed trend has been demonstrated in porosity of the film and barrier height between conduction band edge of SiO₂ and SiC.     

Influence of annealing temperature on the structural, mechanical and wetting property of TiO2 films deposited by RF magnetron sputtering

TiO₂ films have been deposited on silicon substrates by radio frequency magnetron sputtering of a pure Ti target in Ar/O₂ plasma. The TiO₂ films deposited at room temperature were annealed for 1 h at different temperatures ranging from 400 °C to 800 °C. The structural, morphological, mechanical properties and the wetting behavior of the as deposited and annealed films were obtained using Raman spectroscopy, atomic force microscopy, transmission electron microscopy, nanoindentation and water contact angle (CA) measurements. The as deposited films were amorphous, and the Raman results showed that anatase phase crystallization was initiated at annealing temperature close to 400 °C. The film annealed at 400 °C showed higher hardness than the film annealed at 600 °C. In addition, the wettability of film surface was enhanced with an increase in annealing temperature from 400 °C to 800 °C, as revealed by a decrease in water CA from 87° to 50°. Moreover, the water CA of the films obtained before and after UV light irradiation revealed that the annealed films remained more hydrophilic than the as deposited film after irradiation.     

Structural and electrical properties of thin Ho2O3 gate dielectrics

This paper describes the structural properties and electrical characteristics of thin Ho₂O₃ gate dielectrics deposited on silicon substrates by means of reactive sputtering. The structural and morphological features of these films after postdeposition annealing were studied by X-ray diffraction, atomic force microscopy, and X-ray photoelectron spectroscopy. It is found that Ho₂O₃ dielectrics annealed at 700 °C exhibit a thinner capacitance equivalent thickness and excellent electrical properties, including the interface trap density and the hysteresis in the capacitance-voltage curves. Under constant current stress, the Weibull slope of the charge-to-breakdown of the 700 °C-annealed films is about 1.7. These results are attributed to the formation of well-crystallized Ho₂O₃ structure and the reduction of the interfacial SiO₂ layer.     

Influence of annealing on humidity response of RF sputtered nanocrystalline MgFe2O4 thin films

Humidity response of Radio Frequency sputtered MgFe₂O₄ thin films onto alumina substrate, annealed at 400 °C, 600 °C and 800 °C has been investigated. Crystalline phase formation of thin films annealed at different temperature was analyzed by X-ray Diffraction. A particle/grain like microstructure in the grown thin films was observed by Scanning Electron Microscope and Atomic Force Microscope images. Film thickness for different samples was measured in the range 820-830 nm by stylus profiler. Log R (Ω) response measurement was taken for all thin films for 10-90% relative humidity (% RH) change at 25 °C. Resistance of the film increased from 5.9 × 10¹⁰ to 3 × 10¹² at 10% RH with increase in annealing temperature from 400 °C to 800 °C. A three-order magnitude, 10¹² Ω to 10⁹ Ω drop in resistance was observed for the change of 10 to 90% RH for 800 °C annealed thin film. A good linear humidity response, negligible humidity hysteresis and minimum response/recovery time of 4 s/6 s have been measured for 800 °C annealed thin film.     

Effects of annealing temperature on microstructure and electrical properties of Mn-Co-Ni-O thin films

Mn_1.85Co_0.3Ni_0.85O₄ (MCN) thin films were prepared on Al₂O₃ substrates by chemical solution deposition method at different annealing temperature (650, 700, 750 and 800 °C). Effects of annealing temperature on microstructure and electrical properties of MCN thin films were investigated. The MCN thin film annealed at 750 °C is of good crystallization and compact surface. It shows lower resistance (4.8 MΩ) and higher sensitivity (3720.6 K) than those of other prepared films. It also has small aging coefficient (3.7%) after aging at 150 °C for 360 h. The advantages of good properties make MCN thin film very promising for integrated devices.     

Characterization and optoelectronic properties of sol-gel-derived CuFeO2 thin films

In this study, CuFeO₂ thin films were deposited onto quartz substrates using a sol-gel and a two-step annealing process. The sol-gel-derived films were annealed at 500 °C for 1 h in air and then annealed at 600 to 800 °C for 2 h in N₂. X-ray diffraction patterns showed that the annealed sol-gel-derived films were CuO and CuFe₂O₄ phases in air annealing. When the films were annealed at 600 °C in N₂, an additional CuFeO₂ phase was detected. As the annealing temperature increased above 650 °C in N₂, a single CuFeO₂ phase was obtained. The binding energies of Cu-2p_3/2, Fe-2p_3/2, and O-1s were 932.5 ± 0.1 eV, 710.3 ± 0.2 eV and 530.0 ± 0.1 eV for CuFeO₂ thin films. The chemical composition of CuFeO₂ thin films was close to its stoichiometry, which was determined by X-ray photoelectron spectroscopy. Thermodynamic calculations can explain the formation of the CuFeO₂ phase in this study. The optical bandgap of the CuFeO₂ thin films was 3.05 eV, which is invariant with the annealing temperature in N₂. The p-type characteristics of CuFeO₂ thin films were confirmed by positive Hall coefficients and Seebeck coefficients. The electrical conductivities of CuFeO₂ thin films were 0.28 S cm^− 1 and 0.36 S cm^− 1 during annealing at 650 °C and 700 °C, respectively, in N₂. The corresponding carrier concentrations were 1.2 × 10¹⁸ cm^− 3 (650 °C) and 5.3 × 10¹⁸ cm^− 3 (700 °C). The activation energies for hole conduction were 140 meV (650 °C) and 110 meV (700 °C). These results demonstrate that sol-gel processing is a feasible preparation method for delafossite CuFeO₂ thin films.     

The effect of annealing on the photoluminescence of layered perovskite H1.77[Sr0.8Bi0.21Ta2O7] powders

The microstructural and luminescent properties of H_1.77[Sr_0.8Bi_0.21Ta₂O₇] powders under different dehydrating conditions were investigated. The powders were obtained by protonating Bi₂SrTa₂O₉ powders in 3 M aqueous HCl solution, and were dehydrated by a post-annealing in air from 250 to 700 °C. The photoluminescence was enhanced for all dehydrated powders, especially for the sample annealed at 400 °C. The thermogravimetric analysis showed that there is an obvious dehydration temperature range from 200 to 400 °C, which was corresponding to the changing of the microstructure and photoluminescence in the same temperature range. The mechanism behind the experimental results was discussed.     

Enhancement on effective piezoelectric coefficient of Bi3.25Eu0.75Ti3O12 ferroelectric thin films under moderate annealing temperature

Bi_3.25Eu_0.75Ti₃O₁₂ (BET) thin films were deposited on Pt/Ti/SiO₂/Si(111) substrates by a metal-organic decomposition method. The effects of annealing temperatures 600-800 °C on microstructure, ferroelectric, dielectric and piezoelectric properties of BET thin films were studied in detail. The spontaneous polarization (87.4 × 10^− 6 C/cm² under 300 kV/cm), remnant polarization (65.7 × 10^− 6 C/cm² under 300 kV/cm), the dielectric constant (992.9 at 100 kHz) and the effective piezoelectric coefficient d₃₃ (67.3 pm/V under 260 kV/cm) of BET thin film annealed at 700 °C are better than those of the others. The mechanisms concerning the dependence of the enhancement d₃₃ are discussed according to the phenomenological equation, and the improved piezoelectric performance could make the BET thin film a promising candidate for piezoelectric thin film devices.     

The influence of annealing temperatures on the properties of Bi2VO5.5/LaNiO3/Si thin films

Bi₂VO_5.5 ferroelectric thin films were fabricated on LaNiO₃/Si(100) substrate via chemical solution deposition. Ferroelectric and dielectric properties of the thin films annealed at 500-700 °C were studied. The thin film annealed at 700 °C exhibited more favorable ferroelectric and dielectric properties than those annealed at lower temperatures. The values of remnant polarization 2P_r and coercive field E_c for the film annealed at 700 °C are 10.62 µC/cm² and 106.3 kV/cm, respectively. The leakage current of the film is about 1.92 × 10^− 8 A/cm² at 6 V. The possible mechanism of the dependence of electrical properties of the films on the annealing temperature was discussed.     

Oxidative annealing of ZnSe/GaAs heterostructures

We annealed ZnSe/GaAs heterostructures in the oxygen atmosphere and investigated structural and optical properties of the forming films using X-ray diffraction and photoluminescence. While highly textured ZnO films were synthesized via low-temperature processing (~ 500 °C), high temperature processing (~ 800 °C) promoted reaction at the film/substrate interface and Zn loss from the film surface resulting in the polycrystalline ZnGa₂O₄ and ZnO₂.     

Preparation, dielectric and ferroelectric properties of Pb5Ge3O11 and Pb5Ge2.85Si0.15O11 thin films fabricated by sol-gel process

Lead germanate-silicate (Pb₅Ge_2.85Si_0.15O₁₁) ferroelectric thin films were successfully fabricated on Pt/Ti/SiO₂/(100)Si substrates by the sol-gel process. The thin films were fabricated by multi-coating at preheating temperatures of 350 and 450 °C. After annealing the thin films at 600 °C, the films exhibited c-axis preferred orientation. The degree of c-axis preferred orientation of the thin films preheated at 350 °C was higher than that of films preheated at 450 °C. Grain growth was influenced by the annealing time. The thin films exhibited a well-saturated ferroelectric P-E hysteresis loop when preheated at 350 °C and annealed at 600 °C for 1.5 h. The values of the remanent polarization (Pr) and the coercive field (Ec) were approximately 2.1 μC/cm² and 100 kV/cm, respectively.     

Microstructure evolution and oxidation behaviour of Tif/TiAl3 composites

In this paper, Ti_f/TiAl₃ composites were fabricated by infiltration–in situ reaction method and its oxidation behaviours were investigated by cyclic oxidation testing at 700 °C, 800 °C and 900 °C. The microstructure evolution and oxidation of Ti_f/TiAl₃ composites were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive X-ray diffraction (EDX). The reaction between Ti₃Al particles and Al was more violent than that of Ti fibres and Al. Ti₃Al/Al reaction consumed a large amount of Al and inhibited the reaction of Ti fibres indirectly. Reactant of Ti fibres was TiAl₃ at 700 °C, and four reaction layers surrounding Ti fibre (Ti₃Al, TiAl, TiAl₂ and TiAl₃ from inner to outside) were observed above 800 °C. The thickness of the total reaction layers increased little with temperature and time, while the thickness of inner reaction layers increased remarkably. A model corresponding to the microstructure evolution process was drawn schematically. Oxidation resistance of Ti_f/TiAl₃ composites decreased with increasing of temperature, and changed from cubic law at 700 °C to parabolic law at 900 °C. The oxidation weight gain of Ti_f/TiAl₃ composite was dominated by the exposed Ti fibres. Due to outward diffusion of Ti and Al element, the oxide of Ti fibre at 900 °C changed to mushroom-shape. Fortunately, when TiAl₃ was oxidized, a thin and continuous Al₂O₃ layer was formed, protecting matrix from further oxidation.     

A novel method for preparation of pure Bi2SiO5 crystals

Pure Bi₂SiO₅ crystals were firstly prepared by a novel method of melt-cooling process with Bi₂O₃ and SiO₂ as starting materials. In this study, the preparation and properties of the samples were characterized by thermo gravimetric (TG), differential scanning calorimeter (DSC), field-emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD). The results showed several endothermic valleys at 579.6 °C, 744.3 °C, 829.3 °C and 879.2 °C during heating process; and a distinct exothermic peak at 805.3 °C during the melt cooling process. XRD and SEM images revealed highly-ordered lamellar pure Bi₂SiO₅ crystals with coarse grains can be achieved by 2 h heating at 805.3 °C.