Substrate temperature effect on the SiC passivation layer synthesized by an RF magnetron sputtering method

This paper describes amorphous silicon carbide (a-SiC) film as an alternative material to silicon nitride (SiN) and silicon oxide (SiO₂) for the passivation layer of solar cells. We deposited the film on p-type silicon (100) wafers and glass substrates by RF magnetron sputtering using a SiC (99%) target. Structural and optical properties of the films were investigated according to the process temperature (room temperature, 300 °C, 400 °C, 500 °C and 600 °C). The structural properties were analyzed by Raman microscopy and XPS (X-ray Photoelectron Spectroscopy). The XPS showed that the content of SiC in the film is increased when the substrate temperature is higher. The optical properties of the films were examined by UV-visible spectroscopy and Ellipsometer. The optical characteristic measurement showed that the lowest refractive index of the film is 2.65. Also, using carrier lifetime measurement, we investigated the performance of SiC as the passivation layer. At the substrate temperature of 600 °C, we obtained a highest carrier lifetime of 7.5 μs.     

Internal oxidation of Mo-Ru coatings

The current experiment deposits Mo-Ru coatings with a Ti interlayer on silicon wafers by sputtering at 400 °C. The annealing treatments were conducted at 600 °C under atmospheres consisting of controlled oxygen contents with balanced nitrogen. After annealing in a 10 ppm O₂-N₂ atmosphere, surface roughness increased, apparently due to the formation of external island oxides. While annealing in a 220 ppm O₂-N₂ atmosphere, the relatively smooth surface was accompanied by the internal oxidation zone consisting of alternated oxygen rich and deficient layers.     

Surface passivation of multicrystalline silicon wafers by porous silicon combined with an ultrathin nanoparticles aluminum coating film

In this paper, we demonstrate that we may efficiently improve surface passivation of multi-crystalline silicon (mc-Si) while combining formation of porous silicon (PS) and deposition of ultrathin aluminum (Al) film. Aluminum Nanoparticles were deposited by thermal evaporation onto PS formed on mc-Si wafers. Optoelectronic properties of Al/PS/mc-Si and Al/mc-Si treated samples were investigated before and after annealing in the 400–700 °C temperature range. The surface passivation effectiveness was pointed out based on minority carrier lifetime and photoluminescence measurements. It was found that, at a minority carrier density Δn = 10¹⁵ cm^?3, the effective minority carrier lifetime increases from 1.5 μs (for the bare mc-Si wafer) to about 6 and 14 μs before and after thermal annealing, respectively. FTIR analyses show strong correlation between the minority carrier lifetime values and hydrogen and Al passivation. Major beneficial effect of the co-presence of Al and Al–O on the optoelectronic properties is also demonstrated. The reflectivity of Al/PS treated mc-Si decrease significantly at 500 nm as compared to untreated mc-Si (from 31 % for untreated mc-Si wafers to 8 % for Al/PS treated ones), which is due to the roughly ordered structure and to the Al nanoparticles.     

Annealing optimization of silicon nitride film for solar cell application

Hydrogenated films of silicon nitride (SiNx:H) is commonly used as an antireflection coating as well as passivation layer in crystalline silicon solar cell. SiNx:H films deposited at different conditions in Plasma Enhanced Chemical Vapor Deposition (PECVD) reactor were investigated by varying annealing condition in infrared (IR) heated belt furnace to find the optimized condition for the application in silicon solar cells. By varying the gases ratio (R = NH₃/SiH₄ + NH₃) during deposition, the SiNx:H films of refractive indices 1.85-2.45 were obtained. Despite the poor deposition rate, the silicon wafer with SiNx:H film deposited at 450 °C showed the best effective minority carrier lifetime. The film deposited with the gases ratio of 0.57 shows the best peak of carrier lifetime at the annealing temperature of 800 °C. The single crystalline silicon solar cells fabricated in conventional industrial production line applying the optimized film deposition and annealing conditions on large area substrates (125 mm × 125 mm) were found to have the conversion efficiencies as high as 17.05 %. Low cost and high efficiency single crystalline silicon solar cells fabrication sequence employed in this study has also been reported in this paper.     

Properties of plasma enhanced chemical vapor deposited silicon nitride for the application in multicrystalline silicon solar cells

Hydrogenated films of silicon nitride (SiNx:H) were investigated by varying the deposition condition in plasma enhanced chemical vapor deposition (PECVD) reactor and annealing condition in infrared (IR) heated belt furnace to find the optimized condition for the application in multicrystalline silicon solar cells. By varying the gas ratio (ammonia to silane), the silicon nitride films of refractive indices 1.85-2.45 were obtained. Despite the poor deposition rate, silicon wafer with the film deposited at 450 °C showed the best minority carrier lifetime. The film deposited with the gases ratio of 0.57 showed the best peak of carrier lifetime at the annealing temperature of 800 °C. The performance parameters of cells fabricated by varying co-firing peak temperature also showed the best values at 800 °C. The multicrystalline silicon (mc-Si) solar cells fabricated in conventional industrial production line applying the optimized film deposition and annealing conditions on large area substrate (125 mm × 125 mm) was found to have the conversion efficiency of 15%.     

A comparison of nitrous oxide and hydrogen ECR plasma discharges for silicon solar cell passivation

The passivation of crystalline Si solar cells using nitrous oxide (N₂O) electron cyclotron resonance (ECR) plasma discharges has been studied and compared with ECR hydrogen passivation. The cells consisted of ECRCVD grown microcrystalline Si emitter layers on single crystal Si (sc-Si) and multicrystalline Si (mc-Si) substrates, without anti-reflective coatings or surface texturing. For cells on sc-Si substrates, hydrogen passivation is more effective at a substrate temperature of 300 °C and low microwave power (300 W). With increased power (500 W) H₂ is less effective than N₂O due to hydrogen plasma damage leading to a significant fall in the cell fill factor. In comparison with H₂, N₂O discharges lead to a significantly better (by > a factor of 2) improvement in the performance of cells on mc-Si substrates for treatment times of ≤15 min at a passivation temperature of 300 °C and 300 W microwave power. XPS measurements suggest that a surface oxide layer containing N and C atoms is formed by the N₂O plasma which, most likely, reduces the surface state density and, hence, carrier recombination.     

Thin films of tetragonal zirconia (3Y-TZ) deposited by reactive sputtering

Thin films of tetragonal zirconia (TZ), comprised of 3 mol% Y₂O₃ (3Y-TZ), were deposited onto silicon, oxide-coated silicon, slide glass and aluminum oxide substrates by reactive sputtering of metallic targets in mixtures of oxygen and argon. The texture of deposited films varied with oxygen-to-argon flow ratios with which the target surface altered between metal and oxide compound constituents. Thin films of TZP with (2 0 0) preferred orientation were obtained from sputter deposition in the metallic mode whereas (1 1 1) texture was obtained in the compound mode at ambient temperature. The film texture tends to align along the 〈1 1 1〉 direction while the substrate was heated to 300 °C during the deposition. The texture of all these films was stable upon annealing at 900 °C in air. The reasons for the texture development are discussed.     

Influence of annealing temperature on the structural, mechanical and wetting property of TiO2 films deposited by RF magnetron sputtering

TiO₂ films have been deposited on silicon substrates by radio frequency magnetron sputtering of a pure Ti target in Ar/O₂ plasma. The TiO₂ films deposited at room temperature were annealed for 1 h at different temperatures ranging from 400 °C to 800 °C. The structural, morphological, mechanical properties and the wetting behavior of the as deposited and annealed films were obtained using Raman spectroscopy, atomic force microscopy, transmission electron microscopy, nanoindentation and water contact angle (CA) measurements. The as deposited films were amorphous, and the Raman results showed that anatase phase crystallization was initiated at annealing temperature close to 400 °C. The film annealed at 400 °C showed higher hardness than the film annealed at 600 °C. In addition, the wettability of film surface was enhanced with an increase in annealing temperature from 400 °C to 800 °C, as revealed by a decrease in water CA from 87° to 50°. Moreover, the water CA of the films obtained before and after UV light irradiation revealed that the annealed films remained more hydrophilic than the as deposited film after irradiation.     

The electrical and optical properties of indium zinc tin oxide thin films with different Sn/Zn ratio

Indium zinc tin oxide (IZTO) thin films with two different chemical compositions, i.e. IZTO15 and IZTO25, where In content was fixed at 60 at.% and Sn content was 15 and 25 at.%, respectively, were deposited onto alkaline-free glass substrate at temperature from 37 °C to 600 °C. The deposition process was carried out in argon using an RF magnetron sputter. After deposition, the films were annealed in argon atmosphere at 450 °C for 30 min. The effect of substrate temperature and annealing treatment was investigated, and the minimum resistivity value of 3.44 × 10^− 4Ω.cm was obtained from the film deposited at 400 °C using IZTO25 target followed by rapid thermal annealing at 450 °C for 30 min. The average optical transmittance was kept fairly high over 80%. It was proven that both substrate temperature and thermal annealing were important parameters in lowering the electrical resistivity without deteriorating optical properties.     

Sol-gel derived aluminum doped zinc oxide for application as anti-reflection coating in terrestrial silicon solar cells

Sol-gel grown polycrystalline Al doped zinc oxide (AZO) thin films have been deposited on Si wafers, microscopy slide glass and fluorine doped tin oxide coated glass substrates using the spin coating technique. The atomic ratio of Al:Zn in the films is 0.2. From the X-ray diffraction investigations it is found that the preferential growth of (100) reflection peak has taken place in the 450, 550 and 600 °C annealed films. Scanning electron microscopic study has shown that the films contain well-defined grains arranged in a closely packed array. The resistivity of the 500 °C annealed film is measured to be 5 × 10^− 1 Ω cm. The films have exhibited excellent optical transmittance (~ 90%) in the 400-1100 nm wavelength range. Refractive indices (n = 1.9-1.95) of the films on Si wafer are independent of the annealing temperature. Thickness of the films produced at 4000 rpm is in the range of 58-62 nm. The refractive index and thickness of these films are nearly appropriate to cause destructive interference after reflection from front emitters of solar cells. These films have demonstrated a reflectivity value of about 3% at a wavelength of 700 nm. The AZO coated silicon solar cells possess V_oc and I_sc values of 573 mV and 237 mA, respectively.     

Effect of annealing temperature on ZnO:Al/p-Si heterojunctions

Al-doped, zinc oxide (ZnO:Al) films with a 1.2 at.% Al concentration were deposited on p-type silicon wafers using a sol-gel dip coating technique to produce a ZnO:Al/p-Si heterojunction. Following deposition and subsequent drying processes, the films were annealed in vacuum at five different temperatures between 550 and 900 °C for 1 h. The resistivity of the films decreased with increasing annealing temperature, and an annealing temperature of 700 °C provided controlled current flow through the ZnO:Al/p-Si heterojunction up to 20 V. The ZnO:Al film deposited on a p-type silicon wafer with 1.2 at.% Al concentration was concluded to have the potential for use in electronic devices as a diode after annealing at 700 °C.     

Synthesis and luminescence characterization of manganese-activated willemite gel films

Manganese-activated willemite (α-Zn_2 − xMn_xSiO₄; x = 0.05-0.20) phosphor thin films with bright green light emission were deposited on silicon wafers by a sol-gel process. Zinc chloride, tetraethylorthosilicate, and manganese chloride were employed as precursors. The sol-gel transition, crystallization process and photoluminescence of processed films were investigated. The level of manganese doping did not greatly affect the crystallinity, but did affect the gelation rate and luminescence of films. X-ray diffraction and infrared spectrum studies revealed that single-phase willemite started to crystallize at around 600 °C. After thermal annealing at 600°-1200 °C, the crystallinity of films increased with increasing heating temperature and thickness of films. The emission intensity of the film was strongly related to the crystallinity and deposition conditions. Controlling the dopant content, number of coating layers and annealing temperature could significantly enhance the brightness of the green emission. The luminescence properties of α-Zn₂SiO₄:Mn films are characterized by fluorescence spectra and decay lifetime measurements.     

Atomic Vapor Depositions of Ti-Ta-O thin films for Metal-Insulator-Metal applications

Atomic Vapor Deposition technique was applied for the depositions of Ti-Ta-O oxide films for Metal-Insulator-Metal capacitors used in back-end of line for Radio Frequency applications. Composition, crystallinity, thermal stability and electrical properties were studied. Ti-Ta-O films, with the ratio of Ta/Ti ~ 1.5, deposited at 400 °C on TiN electrodes, were amorphous and possessed a dielectric constant of 50 with low voltage linearity coefficients and leakage currents densities as low as 10^− 7 A/cm² at 1 V. The films, deposited on Si wafers, were amorphous up to the annealing temperature of 700 °C and crystallized in orthorhombic Ta₂O₅ phase at higher temperatures.     

Dye-sensitized solar cells with TiO2 nanocrystalline films prepared by conventional and rapid thermal annealing processes

Titanium oxide (TiO₂) thin films are prepared by the sol-gel method and annealed at 600 °C by conventional (CTA) and rapid thermal annealing (RTA) processes on fluorine-doped tin oxide -coated glass substrates for application as the work electrode for the dye-sensitized solar cells (DSSC). TiO₂ thin films are crystallized using a conventional furnace and the proposed RTA process at annealing rates of 5 °Cmin⁻¹ and 600 °Cmin⁻¹, respectively. The TiO₂ thin films are characterized by X-ray diffraction, scanning electron microscopy and Brunauer-Emmett-Teller analysis. Based on the results, the TiO₂ films crystallized by RTA show better crystallization, higher porosity and larger surface area than those of CTA. The short-circuit photocurrent and open-circuit voltage values increased from 5.2 mAcm⁻² and 0.6 V for the DSSC with the CTA-derived TiO₂ films to 8.3 mAcm⁻² and 0.68 V, respectively, for the DSSC containing RTA-derived TiO₂ films.     

Anomalous behavior in ZnMgO thin films deposited by sol-gel method

The magnesium doped zinc oxide is a promising optical material to enhance the luminescence for possible application in solid state lighting. Magnesium doped zinc oxide thin films (Zn_0.85Mg_0.15O) were deposited by sol-gel route on p-type silicon and annealed at different temperatures in oxygen environment for an hour. The doping of magnesium in zinc oxide was confirmed by X-Ray diffraction and the samples were found to have wurtzite crystal structure with (002) preferred orientation. The films were characterized by Hall-effect, atomic force microscopy, UV-VIS spectroscopy, photoluminescence (PL) and work function measurements. The different studies exhibited an anomalous behavior for the film annealed at 900 °C. The Hall effect, work function measurements and UV-VIS spectroscopy indicated that the resistivity, work function and optical band gap increased as a function of annealing temperature (from 300 °C to 700 °C) however these parameters were found to decrease for the films annealed above 700 °C. The particle size increased with the annealing but for the samples annealed at 900 °C, the shape of the grains changed and became elongated like fibers as observed by the atomic force microscopy. The PL measurements displayed the existence of oxygen vacancies defects for the samples annealed at and above 600 °C. The possible mechanism for this anomaly has been discussed in this work.     

Annealing effects on microstructure and mechanical properties of sputtered multilayer Cr(1 − x)AlxN films

Multilayer Cr_(1 − x)Al_xN films with a total thickness of 2 μm were deposited on high-speed steel by medium frequency magnetron sputtering from Cr and Al-Cr (70 at.% Al) targets. The samples were annealed in air at 400 °C, 600 °C, 800 °C and 1000 °C for 1 hour. Films were characterized by cross-sectional scanning electron microscopy and X-ray diffraction analysis. The grain size of the as-deposited multilayer films is about 10 nm, increasing with the annealing temperature up to 100 nm. Interfacial reactions have clearly changed at elevated annealing temperatures. As-deposited films' hardness measured by nanoindentation is 22.6 GPa, which increases to 26.7 GPa when the annealing temperature goes up to 400 and 600 °C, but hardness decreases to 21.2 GPa with further annealing temperature increase from 600 to 1000 °C. The multilayer film adhesion was measured by means of the scratch test combined with acoustic emission for detecting the fracture load. The critical normal load decreased from 49.7 N for the as-deposited films to 21.2 N for the films annealed at 1000 °C.     

Growth temperature dependent dielectric properties of BiFeO3 thin films deposited on silica glass substrates

We have studied the dependence of dielectric properties on the deposition temperature of BiFeO₃ thin films grown by the pulsed laser deposition technique. Thin films have been grown onto amorphous silica glass substrates with pre-patterned Au in-plane capacitor structures. It is shown that on the amorphous glass substrate, BiFeO₃ films with a near-bulk permittivity of 26 and coercive field of 80 kV/cm may be grown at a deposition temperature of about 600 °C and 1 Pa oxygen pressure. Low permittivity and higher coercive field of the films grown at the temperatures below and above 600 °C are associated with an increased amount of secondary phases. It is also shown that the deposition of BiFeO₃ at low temperature (i.e. 500 °C) and post deposition ex-situ annealing at elevated temperature (700 °C) increases the permittivity of a film. The applied bias and time dependence of capacitance of the films deposited at 700 °C and ex-situ annealed films are explained by the de-pinning of the ferroelectric domain-walls.     

Influence of annealing treatments for ZnO-doped Zr0.8Sn0.2TiO4 thin films by RF magnetron sputtering

Zirconium tin titanium oxide doped 1 wt.% ZnO thin films on n-type Si substrate were deposited by rf magnetron sputtering at a fixed rf power of 300 W, a substrate temperature of 450 °C, a deposition pressure of 5 mTorr and an Ar/O₂ ratio of 100/0 with various annealing temperatures and annealing times. Electrical properties and microstructures of 1 wt.% ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films prepared by rf magnetron sputtering on n-type Si(100) substrates at different annealing temperatures (500 °C-700 °C) and annealing times (2 h-6 h) have been investigated. The structural and morphological characteristics analyzed by X-ray diffraction (XRD) and atomic force microscope (AFM) were sensitive to the treatment conditions such as annealing temperature and annealing time. At an annealing temperature of 600 °C and an annealing time of 6 h, the ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films possess a dielectric constant of 46 (at f = 10 MHz), a dissipation factor of 0.059 (at f = 10 MHz), and a low leakage current density of 3.8 × 10^− 9 A/cm² at an electrical field of 1 kV/cm.     

CexAlyOz/TiN stack analysis for Metal-Insulator-Metal applications: Effect of annealing and the metal electrode deposition method

Ce_xAl_yO_z thin films were deposited on TiN metal electrode by metalorganic chemical vapour deposition method at 400 °C. The detailed physical characterization on Ce_xAl_yO_z/TiN stack upon annealing at different temperatures (600 °C and 850 °C) and for different deposition methods (Atomic vapour deposition (AVD) and Physical vapour deposition (PVD)) of electrode material were done for possible Metal-Insulator-Metal applications. X-ray diffraction results exhibited that the dielectric and TiN(AVD) are amorphous while TiN(PVD) is crystalline for the as deposited stacks. Annealing on Ce_xAl_yO_z/TiN(AVD) at 600 °C, initiates CeO₂ crystallization in the dielectric with composition of Ce:Al = 0.5 as obtained by X-ray photoelectron spectroscopy. In Ce_xAl_yO_z/TiN(PVD) stack, the dielectric remains in its amorphous state until 850 °C. However, TiO₂ crystallization is formed at 600 °C in Ce_xAl_yO_z/TiN(PVD). Time of flight secondary ion mass spectroscopy depth profiling data proves that the annealing at 600 °C caused the oxidation of both the metal electrodes and the inter-diffusion of Ti from the bottom metal electrode through the dielectric layer.     

Self-forming AlOx layer as Cu diffusion barrier on porous low-k film

The copper diffusion barrier properties of an ultrathin self-forming AlO_x layer on a porous low-k film have been investigated. Cu-3 at.% Al alloy films were directly deposited onto porous low-k films by co-sputtering, followed by annealing at various temperatures. Transmission electron microscopy micrographs showed that a ∼ 5 nm layer self-formed at the interface after annealing. X-ray photoelectron spectroscopy analysis showed that this self-formed layer was Al₂O₃. Sharp declines of the Cu and Si concentrations at the interface indicated a lack of interdiffusion between Cu and the porous low-k film for annealing up to 600 °C for 30 min. The leakage currents from Cu(Al)/porous low-k/Si structures were similar to as-deposited films even after a 700 °C, 5 min anneal while a Cu sample without Al doping failed at lower temperatures. Adding small amounts of Al to bulk Cu is an effective way to self-form copper diffusion layer for advanced copper interconnects.