用RF同轴磁控溅射技术制作C轴择优取向ZnO薄膜

ZnO薄膜是一种性能优良的多功能电子材料,用途十分广泛。本文介绍了我所研制的RF同轴磁控溅射装置及成膜技术。用此设备已制作出c轴择优取向的ZnO薄膜,并经各种检测证明膜质优良。用这种技术溅射制作的ZnO薄膜彩电中频滤波器性能良好,完全满足器件要求。本装置制作的薄膜膜厚均匀区宽、膜质好,不仅适用于ZnO薄膜的小批量生产,也可用于溅射沉积其它各种介质膜和金属膜。     

光学干涉法同时测定二氧化硅薄膜折射率和厚度

本文利用二氧化硅薄膜的光学干涉效应和可变角度反射测量装置,给出了一种同时测定薄膜折射率和厚度的新方法.薄膜折射率和厚度的测量误差分别小于5%和6%.     

微波ECR等离子体溅射法沉积ZnO薄膜

低温沉积薄膜技术在制作先进的微电子学器件和集成多功能传感器方面非常重要。最近,应用微波电子回旋共振(ECR)等离子体溅射法沉积成高性能、高沉积速率和低基片温度的ZnO薄膜。本文叙述应用微波ECR等离子体溅射法沉积ZnO膜的制法及其性能。     

用激光干涉法对溅射ZnO薄膜的厚度进行实时监控

本文介绍了激光干涉法监控薄膜厚度的原理与装置.本方法具有简单、方便、稳定可靠、图形直观等优点.对溅射ZnO薄膜的厚度进行实时监控,当厚度为4微米时,精度可达2%.监控厚度可达几十微米.本方法另一个突出的优点是可在不启开钟罩的条件下.方便地研究溅射成膜的各种工艺参数与膜的沉积速率的关系.     

激光能量对脉冲激光沉积法制备ZnO薄膜性能的影响

脉冲激光沉积技术(PLD)易于获得高质量的氧化物薄膜已成为一种重要的制备ZnO薄膜的技术.采用脉冲激光沉积(PLD)(KrF准分子激光器:波长248 nm,频率5 Hz,脉冲宽度20 ns)方法在氧气气氛中以高纯Zn(99.999%)为靶材、在单晶硅和石英衬底表而成功生长了ZnO薄膜.通过X射线衍射仪、表面轮廓仪、荧光光谱仪、紫外可见分光光度计对合成薄膜材料的晶体结构、厚度、光学性质等进行了研究,分析了激光能量变化对其性能的影响.实验结果表明我们使用PLD法可以制备出(002)结晶取向和透过率高于75%的ZnO薄膜,激光能量为450 mJ的ZnO薄膜的发射性能较好,但激光能量的增加不能改善薄膜的透光率.     

脉冲激光沉积法制备ZnO基薄膜研究进展

作为一种新型的Ⅱ-Ⅵ半导体材料,ZnO具有优良的光学和电学性能,在紫外光发射器件、自旋功能器件、气体探测器、表面声波器件等领域有着广阔的应用前景.首先介绍了ZnO材料和脉冲激光溅射法的一些相关内容,然后从材料制备角度着重阐述了目前利用脉冲激光沉积法(PLD)制备ZnO基薄膜的若干重要研究方向,例如p型掺杂、p-n结的制备、Mg掺杂、Cd掺杂和磁性离子掺杂等.     

射频磁控溅射ZnO薄膜的光致发光

用射频磁控溅射法在硅衬底上沉积出具有良好的择优取向的多晶 Zn O薄膜 .在室温下进行光致发光测量 ,观察到明显的紫光发射 (波长为 4 0 2 nm )和弱的紫外光发射 (波长为 384 nm ) .紫光发射源于氧空位浅施主能级到价带顶的电子跃迁 ;紫外光发射则源于导带与价带之间的电子跃迁 .随着光激发强度的增加 ,紫光发射强度超线性增强 ,且稍有蓝移 ,而紫外光发光强度则近似线性增加 .在氧气中高温退火后 ,薄膜结晶质量明显提高 ,紫光发射强度变弱 ,紫外光发射相对增强 .     

射频磁控溅射ZnO薄膜的光致发光

用射频磁控溅射法在硅衬底上沉积出具有良好的择优取向的多晶ZnO薄膜.在室温下进行光致发光测量,观察到明显的紫光发射(波长为402nm)和弱的紫外光发射 (波长为384nm).紫光发射源于氧空位浅施主能级到价带顶的电子跃迁;紫外光发射则源于导带与价带之间的电子跃迁.随着光激发强度的增加,紫光发射强度超线性增强,且稍有蓝移,而紫外光发光强度则近似线性增加.在氧气中高温退火后,薄膜结晶质量明显提高,紫光发射强度变弱,紫外光发射相对增强.     

Au薄膜溅射功率对ZnO/Au复合薄膜质量的影响

在ZnO薄膜上采用不同溅射功率制作了Au薄膜,研究不同溅射功率对Au膜成膜速率、结晶质量和结合力的影响,表明在本实验中100 W功率下Au膜的成膜质量比较好。同时对ZnO薄膜电阻的影响进行了研究,结果表明溅射功率越高,ZnO导通的可能性越大,通过实验,溅射工艺在100 W下制备的Au薄膜对ZnO电阻影响最小。     

ZnO和ZAO薄膜磁控溅射等离子体发射光谱

采用在线测试等离子体发射光谱的方法,研究了ZnO薄膜和ZAO薄膜磁控溅射生长等离子体的状态,分析了ZAO薄膜生长过程中的工作压强、溅射功率和衬底温度这几个重要参数对等离子体状态影响的规律。结果表明:主要是等离子体中粒子的密度随实验参数发生规律性变化,其变化规律与实验参数对薄膜生长质量影响的规律基本一致,可以定性地解释影响薄膜结晶质量的直接原因。最佳参数为:压强0.2Pa,功率80W和温度450℃。     

硫化的激光器腔面上溅射ZnS钝化膜的研究

提出了一种新的激光器腔面钝化方法.先用(NH4)2S溶液硫化解理后的激光器腔面,然后使用磁控溅射方法对激光器的前腔面镀ZnS钝化膜、后腔面镀Si/SiO2高反射膜.ZnS钝化层光学厚度为λ/4,在中心波长为808 nm处透过率可达95.5%.钝化前激光器的光学灾变损伤(COD)阈值为1.6 W,钝化后为2.0 W,提高了25%倍;未镀膜的激光器阈值电流为0.25 A,经硫化再镀ZnS后阈值电流为0.20 A,降低了20%.实验结果表明,经硫化后溅射ZnS对激光器腔面具有良好的钝化和增透效果.     

用磁控溅射技术制备氮化铝薄膜

报道了用磁控溅射制备氮化铝薄膜的工艺过程和实验结果.给出了氮化铝薄膜的光学常数与氩气、氮气压强之间的关系.结果表明,氮化铝薄膜的光学性质,很大程度上取决于氮气和氩气之间的压强比.     

The effects of thickness on properties of B and Ga co-doped ZnO films grown by magnetron sputtering

We investigated the effects of thickness on the electrical, optical, structural and morphological properties of B and Ga co-doped ZnO (BGZO) films grown by radio frequency (RF) magnetron sputtering. All the prepared BGZO films showed preferentially c-axis orientation and structure of hexagonal wurtzite. The results also indicated that with an increase in film thickness, the crystallite sizes of the films were increased and the optical band gap (E_g) was decreased. Below a critical thickness of about 210 nm, the thickness of the BGZO films significantly affected the electrical properties of the films. The average transmittance for all the grown films did not change obviously with the thickness.     

Annealing effects on the formation of semiconducting Mg2Si film using magnetron sputtering deposition

Semiconducting Mg2Si films were synthesized on silicon (11 1) substrates by magnetron sputtering deposition and subsequent annealing in an annealing furnace filled with argon gas,and the effects of heat treatment on the formation and microstructure of Mg2Si films were investigated.The structural and morphological properties were investigated by X-ray diffraction (XRD) and scanning electron microscopy (SEM),respectively.The results show that the crystal quality of Mg2Si films depends strongly on the annealing temperature,the annealing time and the deposited magnesium film thickness.Annealing at 400 ℃ for 5 h is optimal for the preparation of Mg2Si film.XRD and SEM results show that magnesium silicide film with various orientations is formed on the silicon surface because of the interdiffusion and reaction of magnesium with substrate silicon atoms,and the evolution of surface features on growing films is very dependent on the annealing temperature and time.     

磁控溅射法制备高性能ZnO薄膜晶体管

研究了磁控溅射法制备的ZnO薄膜晶体管(TFT)。以NH3处理的热生长SiO2作为绝缘层,控制好Ar-O2比等条件溅射合适厚度的ZnO作为器件的有源层。实验表明,与普通条件下热生长的SiO2绝缘层硅片相比,NH3处理的高性能SiO2绝缘层Si片器件的载流子迁移率至少要高1个数量级以上;溅射条件在Ar-O2比25∶1情况下制作的器件性能最好;ZnO薄膜厚度也对ZnO-TFT性能有很大的影响。实验中,采用了4种膜厚,测试表明,其中25nm厚的ZnO薄膜迁移率最大。     

The significant effect of film thickness on the properties of chalcopyrite thin absorbing films deposited by RF magnetron sputtering

In this paper, thickness dependent structural, surface morphological, optical and electrical properties of RF magnetron sputtered CuIn_0.8Ga_0.2Se₂ (CIGS) thin films were studied using X-ray diffraction (XRD), Transmission electron microscopy (TEM), Field emission scanning electron microscopy (FE-SEM), Atomic force microscopy (AFM), UV–vis–NIR spectrophotometer and Keithley electrical measurement unit. The peak intensity along (112) plane as well as crystallite size was found to increase with thickness. However, for higher film thickness >1.16 μm, crystallinity reduced due to higher % of Cu content. TEM analysis confirmed pollycrysallinity as well as chalcopyrite phase of deposited films. The band gap was found to decrease with increase in thickness yielding a minimum value of 1.12 eV for film thickness 1.70 μm. The I–V characteristics showed the ohmic behavior of metal semiconductor contact with higher conductivity for film thickness 1.16 μm.     

射频溅射制备钛酸铅薄膜

采用射频磁控溅射方法制备钙钛矿型钛酸铅铁电薄膜。通过各种不同溅射工艺条件研究,在适宜的溅射条件和基片温度下,溅射获得的PbTiO3薄膜表面晶粒大小均匀,膜层致密性好,经XRD分析证实,薄膜为钙钛矿型结构PbTiO3。外加Pt电极对薄膜进行测试表明,溅射得到的PbTiO3薄膜具有较好的电滞回线特性。     

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering

We investigated in this study structural and nanomechanical properties of zinc oxide (ZnO) thin films deposited onto Langasite substrates at 200 °C through radio frequency magnetron sputtering with an radio frequency power at 200 W in an O₂/Ar gas mixture for different deposition time at 1, 2, and 3 h. Surface morphologies and crystalline structural characteristics were examined using X-ray diffraction, scanning electron microscopy, and atomic force microscopy. The deposited film featured a polycrystalline nature, with (1 0 0), (0 0 2), and (1 0 1) peaks of hexagonal zinc oxide at 31.75°, 34.35°, and 36.31°. As the deposition time increased, the ZnO film became predominantly oriented along the c-axis (0 0 2) and the surface roughness decreased. Through Berkovich nanoindentation following a continuous stiffness measurement technique, the hardness and Young’s modulus of ZnO thin films increased as the deposition time increased, with the best results being obtained for the deposition time of 3 h. In addition, surface acoustic wave properties of ZnO thin films were also presented.     

退火对磁控溅射法制备半导体Mg2Si薄膜的影响

通过磁控溅射和氩气氛围退火,在Si(111)衬底上制备环境友好半导体Mg2Si薄膜,并采用XRD和SEM研究了退火对Mg2Si薄膜形成和微结构的影响。结果表明Mg2Si薄膜的质量取决于退火温度、退火时间和沉积的薄膜厚度。制备Mg2Si薄膜,400℃退火5h是最优退火条件。XRD和SEM结构表明Mg2Si是通过沉积的Mg和Si衬底原子的相互扩散形成的。退火减少薄膜缺陷,也影响薄膜的表明粗糙度。