（英）组分过冲对InP基InAlAs递变缓冲层的影响

通过在InP基InxAl1-xAs 递变缓冲层上生长In0.78Ga0.22As/In0.78Al0.22As量子阱和In0.84Ga0.16As探测器结构,研究了缓冲层中组分过冲对材料特性的影响。原子力显微镜结果表明,在InAlAs缓冲层中采用组分过冲可以使量子阱及探测器样品表面粗糙度都得到降低。对于相对较薄的量子阱结构,X射线衍射倒易空间扫描图和光致发光谱的测量表明,使用组分过冲可以增加弛豫度、减小剩余应力并改善光学性质。而对于较厚的探测器结构,X射线衍射和光致发光谱测试发现使用组分过冲后的材料性质没有明显的变化。量子阱和探测器结构的这些不同特性需要在器件设计应用中加以考虑。     

Reliability of metamorphic HEMTs on GaAs substrates

Metamorphic HEMT (MHEMT) technology enables the growth of high indium content channels on GaAs substrates, giving them the performance of InP HEMTs. MHEMT growth techniques use a graded alloy composition buffer layer structure, permitting channel indium contents exceeding 25% without strain. Potential applications include 40 Gb/s fiber optic receivers as well as LNAs for local multipoint distribution systems and satellite communications. Many such applications place stringent requirements on reliability with Belcore standards requiring 10⁶ h median time to failure (MTTF) at 125 °C for power devices. Satellite applications require a LNA projected failure-free service of 15-30 years, implying approximately 10⁷ h MTTF, at 85 °C. Naturally, one will ask “Is MHEMT technology reliable?” From the results of our ongoing work, we show that MHEMT reliability is similar to that of InP HEMTs with ∼10⁶ h MTTF at 125 °C.     

Metamorphic InAlAs/InGaAs HEMTs on GaAs substrates with a novelcomposite channels design

We report on fabrication and performance of novel 0.13 μm T-gate metamorphic InAlAs/InGaAs HEMTs on GaAs substrates with composite InGaAs channels, combining the superior transport properties of In_0.52Ga_0.48As with low-impact ionization in the In_0.32Ga_0.68As subchannel. These devices exhibit excellent DC characteristics, high drain currents of 750 mA/mm, extrinsic transconductances of 600 mS/mm, combined with still very low output conductance values of 20 mS/mm, and high channel and gate breakdown voltages. The use of a composite InGaAs channels leads to excellent cut-off frequencies: f_max of 350 GHz and an f_T 160 GHz at V_DS=1.5 V. These are the best microwave frequency results ever reported for any FET on GaAs substrate     

Electroabsorption modulation at 1.3 /spl mu/m on GaAs substrates using a step-graded low temperature grown InAlAs buffer

We have achieved quantum confined Stark effects (QCSE) on In/sub 0.38/Ga/sub 0.62/As-In/sub 0.38/Al/sub 0.62/As multiple-quantum-well (MQW) structures, operating at 1.3 /spl mu/m grown on GaAs substrates. A quantum confined Stark shift of the exciton absorption peak of 47 meV was obtained with an applied electric field of 190 KV/cm, measured on surface normal PIN diodes. The structure is grown by MBE on a novel three-stage, compositionally step graded, In/sub x/Al/sub 1-x/As buffer, doped with Si to 5/spl middot/10/sup 17//cm/sup 3/, on an n-type GaAs substrate. The total thickness of the buffer is 0.3-0.6 mm, which is considerably smaller than that of linearly graded buffer layers. This structure can be used in both waveguide modulators and surface normal F-P type modulators on GaAs substrates.     

Thermal characteristics of InP, InAlAs, and AlGaAsSb metamorphic buffer layers used in In0.52Al0.48As/In0.53Ga0.47As heterojunction bipolar transistors grown on GaAs substrates

In_0.52Al_0.48As/In_0.53Ga_0.47As heterojunction bipolar transistors (HBTs) were grown metamorphically on GaAs substrates by molecular beam epitaxy. In these growths, InAlAs, AlGaAsSb, and InP metamorphic buffer layers were investigated. The InAlAs and AlGaAsSb buffer layers had linear compositional grading while the InP buffer layer used direct binary deposition. The transistors grown on these three layers showed similar characteristics. Bulk thermal conductivities of 10.5, 8.4, and 16.1 W/m K were measured for the InAlAs, AlGaAsSb, and InP buffer layers, as compared to the 69 W/m K bulk thermal conductivity of bulk InP. Calculations of the resulting HBT junction temperature strongly suggest that InP metamorphic buffer layers should be employed for metamorphic HBTs operating at high power densities.     

ZnO films deposited on GaAs substrates with a SiO2 thin buffer layer

Sputter deposition of ZnO films on GaAs substrates has been investigated. ZnO films were radio frequency (rf)-magnetron sputter deposited on GaAs substrates with or without SiO₂ thin buffer layers. Deposition parameters such as rf power, substrate-target distance, and gas composition/pressure were optimized to obtain highly c-axis oriented and highly resistive films. Deposited films were characterized by x-ray diffraction, scanning electron microscopy (SEM), capacitance, and resistivity measurements. Thermal stability of sputter-deposited ZnO films (0.5–2.0 μm thick) was tested with a post-deposition heat treatment at 430°C for 10 min, which is similar to a standard ohmic contact alloying condition for GaAs. The ZnO/SiO₂/GaAs films tolerated the heat treatment well while the ZnO/GaAs films disintegrated. The resistivity (10¹¹ Ω-cm) of the ZnO films on SiO₂-buffered GaAs substrates remained high during the heat treatment. The post-deposition anneal treatment also enhances c-axis orientation of the ZnO films dramatically and relieves intrinsic stress almost completely. These improvements are attributed to a reduction of grain boundaries and voids with the anneal treatment as supported by SEM and x-ray diffraction measurement results.     

Thermal resistance of metamorphic InP-based HBTs on GaAs substrates using a linearly graded In/sub x/Ga/sub 1-x/P metamorphic buffer

Thermal properties of metamorphic InP-InGaAs heterojunction bipolar transistors (HBTs) on GaAs substrates using a linearly graded InGaP buffer have been investigated. Compared to the widely used InAlAs metamorphic buffer, InGaP offers better thermal properties resulting in a much smaller thermal resistance for the metamorphic HBTs (MHBTs). Theoretical calculations of the thermal resistance of devices have been made based on a simple constant heat-spreading model, and the results are shown to be consistent with experimental results. It has been made clear that the smaller thermal resistance measured from the MHBTs using a linearly graded InGaP buffer is due to the small bowing parameters and high thermal conductivity of the binary endpoints. Although the use of InGaP as a buffer may slightly degrade the devices thermal properties compared to one using InP directly on GaAs substrate, it gives more freedom to the growth optimization of metamorphic buffer by using compositional grading. With regards to the thermal conductivity and flexible growth optimization, InGaP metamorphic buffer could be considered as an important alternative to the existing InAlAs and InP schemes.     

Heterostructures of metamorphic GaInAs photovoltaic converters fabricated by MOCVD on GaAs substrates

Heterostructures of metamorphic GaInAs photovoltaic converters (PVCs) are on GaAs substrates by the metal-organic chemical vapor deposition (MOCVD) method. It is shown that using a multilayer metamorphic buffer with a step of 2.5% in indium content and layer thicknesses of 120 nm provides the high quality of bulk layers subsequently grown on the buffer up to an indium content of 24%. PVCs with a long-wavelength photosensitivity edge up to 1300 nm and a quantum efficiency of ~80% in the spectral range 1050–1100 nm are fabricated. Analysis of the open-circuit voltage of the PVCs and diffusion lengths of minority carriers in the layers demonstrates that the density of misfit dislocations penetrating into the bulk layers increases at an indium content exceeding 10%.     

Study of the influence of strained superlattices introduced into a metamorphic buffer on the electrophysical properties and the atomic structure of InAlAs/InGaAs MHEMT heterostructures

The results of studying the influence of strained superlattices introduced into a metamorphic buffer on the electrophysical properties and atomic crystal structure of In_0.70Al_0.30As/In_0.76Ga_0.24As/In_0.70Al_0.30As metamorphic high-electron-mobility transistor (MHEMT) nanoheterostructures on GaAs substrates are presented. Two types of MHEMT structures are grown by molecular beam epitaxy, namely, one with a linear increase in x in the In _x Al_{1 ? x} As metamorphic buffer, and the second with two mismatched superlattices introduced inside the metamorphic buffer. The electrophysical and structural parameters of the grown samples are studied by the van der Pauw method, transmission electron microscopy (including scanning and high-resolution microscopy), atomic-force microscopy, and energy dispersive X-ray analysis. It is revealed that the introduction of superlattices into a metamorphic buffer substantially improves the electrophysical and structural characteristics of MHEMT structures.     

High-temperature operation of 1.26 μm Fabry-Perot laser with InGaAs metamorphic buffer on GaAs substrate

Optoelectronic devices with a wide temperature operating range are required for metropolitan and access networks. The temperature sensitivity of the threshold current depends on the conduction band offset of the active layer. The design of optoelectronic devices is strictly limited by the lattice constant of the substrates. Conventional InP-based lasers with InGaAsP multiple quantum wells (MQWs) are sensitive to the ambient temperature and require additional temperature control devices. This is due to the small conduction band offset of the active layer.     

Dual junction GaInP/GaAs solar cells grown on metamorphic SiGe/Si substrates with high open circuit voltage

Dual junction GaInP/GaAs solar cells have been grown and fabricated on Si substrates using relaxed, compositionally graded SiGe buffer layers that provide a nearly lattice-matched low threading dislocation Ge surface for subsequent cell growth. The dual junction cells on SiGe/Si displayed high open circuit voltages in excess of 2.2 V, compared to 2.34 V for control cells on GaAs, that are consistent with maintaining the 1.8/spl times/10/sup 6/ cm/sup -2/ threading dislocation density throughout the cell structure. Even with total current output limited by large grid coverage and high reflectance, total area AM1.5G efficiency is 16.8%, with active area efficiency at 18.6%. The high V/sub oc/ establishes that SiGe metamorphic buffers are viable for integrating III-V multijunction cells on Si in a monolithic process.     

InP衬底上InAlAs异变缓冲层和高铟组分InGaAs的生长温度优化

利用气态源分子束外延技术在InP衬底上生长了包含InAlAs异变缓冲层的In0.83Ga0.17As外延层.使用不同生长温度方案生长的高铟InGaAs和InAlAs异变缓冲层的特性分别通过高分辨X射线衍射倒易空间图、原子力显微镜、光致发光和霍尔等测量手段进行了表征.结果表明, InAlAs异变缓冲层的生长温度越低, X射线衍射倒易空间图 (004) 反射面沿Qx方向的衍射峰半峰宽就越宽, 外延层和衬底之间的倾角就越大, 同时样品表面粗糙度越高.这意味着材料的缺陷增加, 弛豫不充分.对于生长在具有相同生长温度的InAlAs异变缓冲层上的In0.83Ga0.17As外延层, 采用较高的生长温度时, X射线衍射倒易空间图 (004) 反射面沿Qx方向的衍射峰半峰宽较小, 77K下有更强的光致发光, 但是表面粗糙度会有所增加.这说明生长温度提高后, 材料中的缺陷得到抑制.     

Electron properties of surface InGaAs/InAlAs quantum wells with inverted doping on InP substrates

The electron-transport and optical properties of heterostructures with a surface InGaAs/InAlAs quantum well in the cases of inverted δ doping with Si atoms (below the quantum well) and of standard δ doping (above the quantum well) are compared. It is shown that, in the case of inverted doping, the two-dimensional electron density in the quantum well is increased in comparison with the case of the standard arrangement of the doping layer at identical compositions and thicknesses of other heterostructure layers. The experimentally observed features of low-temperature electron transport (Shubnikov–de Haas oscillations, Hall effect) and the photoluminescence spectra of heterostructures are interpreted by simulating the band structure.     

Fluidic self-assembly for the integration of GaAs light-emittingdiodes on Si substrates

The integration of GaAs optoelectronic devices on Si VLSI is important for many high-bandwidth communication applications. In this paper we describe a novel technique for the quasi-monolithic integration of GaAs light-emitting diodes on Si substrates that utilizes fluid transport and shape differentiation for placement and orientation. GaAs light-emitting diodes fabricated into trapezoidal blocks are suspended in a carrier fluid and deposited over holes etched in Si for integration. Top-side ring contact and bottom electrical contact are fabricated on the blocks prior to integration     

Study of metamorphic InGaAs/GaAs quantum well laser materials grown on GaAs substrate by molecular beam epitaxy

The GaAs based InGaAs metamorphic structures and their growth by molecular beam epitaxy (MBE) are investigated. The controlling of the source temperature is improved to realize the linearly graded InGaAs metamorphic structure precisely. The threading dislocations are reduced. We also optimize the growth and annealing parameters of the InGaAs quantum well (QW). The 1.3-μm GaAs based metamorphic InGaAs QW is completed. A 1.3-μm GaAs based metamorphic laser is reported.     

溅射ZnO薄膜钝化GaAs表面性能的研究

为了改善GaAs(110)与自身 氧化物界面由于高表面态密度而引起的费米能级钉扎(pinning)问题 ,提出采用射频磁控溅射技 术在GaAs(110)衬底上沉积一定厚度 ZnO薄膜作为钝化层,并利用光 致发光(PL)光谱和X射线光电子能谱(XPS) 等方法对ZnO薄膜的光学特性及钝化性能进行表征。实验结果表明,经ZnO薄膜钝化后的 GaAs样品,其本征PL峰强度提高112.5%,杂质峰强度下降82.4%。XPS光谱分析表明,Ga和As原子的比值从1.47降低 到0.94,ZnO钝化层能 够抑制Ga和As的氧化物形成。因此,在GaAs表面沉积ZnO薄膜是一种可行的GaAs表面钝化 方法。     

Ion-implantation and activation behavior of Si in MBE-Grown GaAs on Si substrates for GaAs MESFET's

The suitability of MBE-grown GaAs layers on Si substrates has been studied for ion-implanted GaAs MESFET technology. The undoped as-grown GaAs layers had a carrier concentration below 10¹⁴cm^-3. Uniform Si ion implants into 4-µm-thick GaAs layers on Si were annealed at 900°C for 10 s, using a rapid-thermal-annealing (RTA) system. Both the activation and the doping profile were similar to those obtained in bulk semi-insulating GaAs under similar conditions. The SIMS profiles of Si and As atoms near the GaAs/Si heterointerface were identical before and after the RTA process, indicating negigible interdiffusion during the implant activation. Dual implants of a shallow n+ layer and an n-channel layer were used to fabricate GaAs MESFET's with a recess-gate technology. Selective oxygen ion implantation was used for device isolation. The maximum transconductance obtained was 135 mS/ mm compared to typical values of 150-180 mS/mm obtained in our laboratory on GaAs substrates in similar device structures.     

Picosecond GaAs photoconductors on silicon substrates for localintegration with silicon devices and circuits

A fabrication procedure for local integration of GaAs photoconductive devices with processed silicon circuits is discussed. The process allows isolated regions of GaAs to be epitaxially grown by MBE at temperatures which are compatible with already processed silicon circuits with first-level metallization. GaAs photoconductors with 15-μm gap lengths fabricated on silicon substrates have exhibited >16-mA sampling-oscilloscope-limited responses, with electrical pulse widths less than 20 ps as determined by autocorrelation measurements     

Self-limiting OMCVD growth of GaAs on V-grooved substrates with application to InGaAs/GaAs quantum wires

We demonstrate that the formation of GaAs quantum wires on self-limiting AlGaAs grown on V grooves occurs via a transient increase of the growth rates in a set of different nanofacets. Upon growth of sufficiently thick layers on AlGaAs, the GaAs surface reaches a self-limiting profile as well, through an equalization of the relative growth rates on these facets. Atomic force microscopy studies show that the step density in the facets along the groove evolves with GaAs thickness in the same way as the facets extension, thus suggesting a role of the step distribution in the establishment of the self-limiting profiles. The self-limiting GaAs groove profile is much broader than the AlGaAs one at corresponding growth temperatures; however, it can be sharpened down to a radius of curvature of 5 nm for T = 550°C. Under these conditions, GaAs was successfully used as a barrier material for growing vertical arrays of self-ordered InGaAs wires.     

Realization of tensile strain on GaAs substrates for polarizationindependent optical modulation

The quantum-confined Stark effect of tensile-strained GaAs-InAlAs quantum wells grown on top of a related nonpseudomorphic InAlAs grid layer on GaAs substrates was studied. It was demonstrated by waveguide absorption measurements that polarization-independent optical modulation in tensile-strained GaAs wells is possible in a wavelength range of around 870 nm