碳氮膜的沉积工艺及其结构研究

以氨气为反应气体,用真空阴极电弧沉积法制备了CNx膜,研究了工艺参数对膜层的沉积速率、化学成分的影响及膜层结合状态.结果表明:沉积速率随着氨气分压的提高而下降,当氨气分压达到6.7 Pa时将没有膜的沉积;CNx膜主要由碳和氮组成,降低真空系统的抽速、将反应气体导至靶面附近、提高氨气分压可以提高膜层中氮含量;氮是以化合态存在于膜层中.     

真空阴极电弧沉积TiN装饰膜工艺与应用研究

本文研究了真空阴极电弧沉积 TiN 装饰膜的工艺及其应用.利用 X 射线衍射、扫描电镜等方法,分析了膜层性能与沉积工艺之间的关系,结果表明:(1)适当增大气氛压力,可减少 Ti 液滴,从而提高了膜层的显微硬度和耐腐蚀性能;(2)膜层颜色与负偏压和氮分压有关.本文报导了工艺参数对膜层织构和品格畸变的影响.本文还对表壳、表带、餐具.陶瓷制品仿金镀等应用问题进行了讨论.     

工艺参数对Ti0.33Al0.67N梯度膜层形貌及性能的影响

研究基体负偏压、氮分压及合金靶电流等工艺参数对Ti0.33Al0.67N梯度膜层性能的影响。结果表明,Ti0.33Al0.67N梯度膜层随着各工艺参数的增大表面形貌得到改善、沉积率增大,当超过某一个值时,却随着参数的增加形貌恶劣、沉积率降低。工艺参数对膜层显微硬度影响的次序为:TiAl合金靶电流>基体负偏压>氮分压。对膜基结合力影响次序为:基体负偏压>氮分压>TiAl合金靶电流。在试验设计的参数水平范围内,在齿轮材料40Cr表面较优的镀覆工艺参数:基体负偏压150 V、TiAl靶电流60 A、氮分压0.5 Pa。     

包头市2个项目、19项科技成果、3名专家获奖

江西理工大学和崇义章源钨业股份有限公司合作，日前成功研制出含铈一钇的铝一钪一氮多元复合涂层。该涂层获得了国家专利，并将实现规模化生产。技术人员为降低普通涂层中大颗粒的数量和尺寸，提高涂层的抗剥落性、抗氧化温度和成膜速率，在钪一氮、铝一钪一氮涂层中沉积1层铈一钇，     

纳米锗颗粒膜的结构与拉曼散射

用直流磁控溅射方法制备的纳米Ge颗粒膜.通过XRD表征和LRS谱分析,发现沉积态颗粒膜主要为无定形态的Ge团簇,同时在溅射沉积过程中有少量Ge被氧化成非晶态的GeO.颗粒膜经过真空退火处理,形成纳米级的Ge晶和GeO晶体.退火态的膜层结构比沉积态的疏松.对于薄膜纳米颗粒的结构,提出Core-Shell结构模型,解释了Raman散射谱中新出现的150 cm-1和215 cm-1的Raman散射峰.     

RF-PCVD低温沉积无色透明类金刚石保护膜的工艺研究

采用磁约束增强射频辉光放电等离子体辅助化学气相沉积法(RF-PCVD)低温沉积出无色透明的类金刚石保护膜(DLC),主要研究了炉压P0、射频功率Pf、自生负偏压Uz、磁感应强度B、电极间距d、反应气体、镀膜时间t等工艺参数对成膜的影响.试验结果表明,外加磁场B制约了带电粒子逃逸出电极空间,提高了反应气体的离化率及等离子体浓度和活性,并使非独立变量Pf和Uz成为独立变量,有利于工艺调节.当极间距大时,需适当提高Pf,Uz和C-H流量才可得到无色、较硬的DLC膜.在比功率密度大于0.009 W.cm-2.Pa-1、C-H浓度即体积分数0.9%~1.4%及膜厚小于90nm的条件下,可沉积出无色透明、硬度较高的DLC膜.     

RF-PCVD低温沉积无色透明类金刚石保护膜的工艺研究

采用磁约束增强射频辉光放电等离子体辅助化学气相沉积法(RF-PCVD)低温沉积出无色透明的类金刚石保护膜(DLC),主要研究了炉压P0、射频功率Pf、自生负偏压Uz、磁感应强度B、电极间距d、反应气体、镀膜时间t等工艺参数对成膜的影响.试验结果表明,外加磁场B制约了带电粒子逃逸出电极空间,提高了反应气体的离化率及等离子体浓度和活性,并使非独立变量Pf和Uz成为独立变量,有利于工艺调节.当极间距大时,需适当提高Pf,Uz和C-H流量才可得到无色、较硬的DLC膜.在比功率密度大于0.009 W·cm-2·Pa-1、C-H浓度即体积分数0.9%～1.4%及膜厚小于90nm的条件下,可沉积出无色透明、硬度较高的DLC膜.     

纳米锗颗粒膜的结构与拉曼散射

用直流磁控溅射方法制备的纳米Ge颗粒膜．通过XRD表征和LRS谱分析，发现沉积态颗粒膜主要为无定形态的Ge团簇，同时在溅射沉积过程中有少量Ge被氧化成非晶态的GeO．颗粒膜经过真空退火处理，形成纳米级的Ge晶和GeO晶体．退火态的膜层结构比沉积态的疏松．对于薄膜纳米颗粒的结构，提出Core—Shell结构模型。解释了Raman散射谱中新出现的150cm^-1和215cm^-1的Raman散射峰．     

升温速率及水蒸气分压改变对煤焦气化反应性的影响

用非等温热重法考察了神华煤焦、平朔煤焦及潞安煤焦的水蒸气气化反应性,分析了升温速率、水蒸气分压改变对煤焦气化反应性的影响,即水蒸气分压越大,煤焦的气化反应速率越快;随升温速率的提高,热失重曲线向高温区偏移,最大失重速率相应增大。利用最大反应速率法和半衰期法评价了所选样品的气化反应性。试验结果表明,在相同的气化反应条件下,随着变质程度的提高,煤焦的气化反应性逐渐减小,其气化反应性顺序为神华煤焦>平朔煤焦>潞安煤焦。     

氮分压对Ti_(0.33)Al_(0.67)N陶瓷膜层形貌与性能的影响

应用多弧离子镀技术在不同的氮气分压条件下制备Ti_(0.33)Al_(0.67)N陶瓷膜层,分析氮气分压对膜层形貌的影响和对膜层厚度、结合力及显微硬度等性能的影响。结果表明,氮气分压参数设计范围内存在一个最佳值,可以获得膜层最优性能。     

高钴硬质合金基体上生长金刚石薄膜组织结构及成分的研究

采用XRD, SEM, Raman 光谱仪等分析检测手段, 研究了YG₁₅ 硬质合金基体经表面二步法浸蚀后, 在其表面用热丝法沉积出的金刚石薄膜的晶体结构、组织及化学纯度等。结果表明:硬质合金基体表面一定深度范围内Co 含量的变化, 对金刚石薄膜的晶体结构取向、组织形态及化学纯度等有很大影响。CVD 沉积温度从900 ℃降至800 ℃, 后一温度下的金刚石薄膜的晶粒尺寸是前一温度下的1/5 。沉积温度降低至700 ℃左右时, 薄膜的金刚石纯度大大降低。     

Fabrication and electrochemical properties study of LiSiPON electrolyte films

The LiSiPON electrolyte films were prepared by magnetron sputtering method with different N2working pressure. The structure, morphology, composition and the relationship between ionic conductivity and N content were studied in detail. The result showed that N content in the films depended on N2partial pressure. With the N2 partial pressure increasing, N content increased firstly and gained a maximum values then decreased. N content in the LiSiPON films affected the ionic conductivity of the films.The ionic conductivity of the films increased with the N content increasing, and could reach a maximum value 10. 4× 10-6S/cm.     

Fabrication and electrochemical properties study of LiSiPON electrolyte films

The LiSiPON electrolyte films were prepared by magnetron sputtering method with different N2working pressure. The structure, morphology, composition and the relationship between ionic conductivity and N content were studied in detail. The result showed that N content in the films depended on N2partial pressure. With the N2 partial pressure increasing, N content increased firstly and gained a maximum values then decreased. N content in the LiSiPON films affected the ionic conductivity of the films.The ionic conductivity of the films increased with the N content increasing, and could reach a maximum value 10. 4× 10-6S/cm.     

TiN/ZrN抗冲蚀多层膜制备及其性能研究

采用多靶位真空阴极电弧离子镀技术在1 Cr17 Ni2不锈钢表面沉积抗冲蚀 TiN/ZrN 多层膜,利用扫描电镜、显微硬度计、划痕仪、冲刷试验机和中性盐雾试验机等对多层膜的结构及性能进行研究.结果表明：所制备的TiN/ZrN多层膜厚度为5.24μm,膜层与基体结合力为55 N,显微硬度为HK2026.6;多层膜对不锈钢基体起到了良好的防护作用,耐90°攻角冲刷砂量为50 g,耐中性盐雾腐蚀96 h 无腐蚀,336 h抗腐蚀性能大于9级.     

真空阴极电弧沉积TiB2薄膜的组织结构及其摩擦学性能的研究

用TiB2作阴极靶，采用优化的真空阴极电弧沉积工艺制备的TiB2薄膜是由TiB2，Ti2B5,TiB和Ti组成的多相结构。薄膜的摩擦磨损试验表明：TiB2薄膜的摩擦系数为0.139，膜层寿命超过60min，是TiN和（Ti,Al)N膜层的2倍。     

减压膜蒸馏法处理石煤提钒高浓度氨氮废水实验研究

利用减压膜蒸馏设备处理石煤提钒高浓度氨氮废水, 考察了料液pH值、进料温度、进料流量、渗透侧真空度等操作条件对脱氨效率的影响。试验表明, 随着pH值的升高脱氨效率明显增大, 当pH值为11.0时, 脱氨效率达到93.73%。提高料液温度或料液流量都可以提高脱氨效率。在一定范围内提高减压侧真空度, 可以提高脱氨效率, 但当真空度高于0.08 MPa以后, 提高真空度对脱氨效率的影响不明显。在相同条件下, 处理高盐度的石煤提钒废水比处理同等氨氮浓度的水溶液的脱氨效率高1.79%。     

A kinetic and electrochemical study of the ammonia cyanide process for leaching gold in solutions containing copper

One of the biggest challenges for the gold industry in the 21st century is the presence of copper in gold containing ore bodies. This is because copper consumes large quantities of cyanide. In addition, copper cyanide species are more stable than free cyanide, and hence are problematic in events of tailings spillage. One of the methods which has been suggested for treating copper containing ores is to leach with an ammonia cyanide solution. The effect of copper and ammonia addition on gold leaching kinetics was studied in the present paper. It will be shown that when the solutions do not contain copper, the addition of ammonia decreases the rate of gold leaching. When copper is added to solution, the leach rate does decrease due to the formation of the copper cyanide complexes. However it will be shown that under conditions of zero free cyanide, gold does leach readily via the Cu(CN)₃²⁻ complex. It was found that the addition of ammonia had little effect on the leaching of gold by Cu(CN)₃²⁻, but did increase the leaching kinetics when the major cyanide species present is Cu(CN)₂⁻. Under these conditions, leaching in the absence of ammonia is very slow. The effect of copper(II) addition was also studied, and it was found that in the absence of free cyanide the presence of copper(II) increases the leach rate, provided there is enough ammonia to stabilise it against reaction with the copper(I) cyanide complexes.     

氧化铜矿石的选矿技术现状与展望

概述了氧化铜矿石资源的特点及矿石性质。分别从浮选工艺、化学浸出工艺和选冶联合工艺3方面总结了氧化铜矿石的选矿工艺研究现状,从直接浮选、硫化浮选、水热硫化浮选、微细粒真空微泡浮选、脱泥浮选等方面详述了浮选工艺的研究进展;介绍了化学浸出工艺（包括酸浸和氨浸两方面）、集常规浮选和浸出工艺各自优点于一身的选冶联合工艺以及氧化铜矿石的微生物浸出、焙烧-氨浸和离析-浮选等新工艺的研究情况。最后指出：提高氧化铜矿石的选矿技术水平必须认真做好矿石的工艺矿物学研究;要加强高效浮选新药剂的研发力度;在确定矿石的处理工艺时,要在充分认识各选矿方法优缺点的基础上进行必要的优化组合,实现各选矿方法的优势互补。