二类超晶格红外焦平面探测器的研究进展

近几年,二类超晶格红外探测器在材料生长、器件结构设计、器件制备上经历了快速的发展,使得二类超晶格成为除碲镉汞外最受关注的红外探测器材料。本文简要介绍了二类超晶格的优势,总结了国际上二类超晶格红外探测器研究进展,回顾了二类超晶格红外探测器的技术发展历程,并分析了国内二类超晶格材料与器件中存在的技术问题。     

Corrugated Quantum-Well Infrared Photodetector Focal Plane Arrays

Corrugated quantum-well infrared photodetectors (C-QWIPs) have been proposed for long-wavelength infrared detection. In this work, we optimize the detector structure and produce a number of large format focal plane arrays (FPAs). Specifically, we adopt one-corrugation-per-pixel geometry to increase the active detector volume and incorporate a composite cover layer to preserve the large sidewall reflectivity, which results in a large detector quantum efficiency. We also optimize the detector material structure such as the final state energy, the doping density, and the number of quantum well periods to improve the FPA operation under the existing readout electronics. As a result, high FPA sensitivity has been achieved, and their characteristics are in agreement with the detector model. Based on this model, we perform a systematic analysis on the FPA performance with a wide range of detector and system parameters. We find that C-QWIP FPAs are capable of high-speed imaging especially for those with longer cutoff wavelengths.     

固体浸没式红外超表面透镜设计

红外焦平面阵列在各类红外成像系统中发挥着巨大的作用。为提升红外焦平面的工作温度、量子效率和灵敏度,通常使用微透镜阵列作为红外焦平面的聚光器。当前微透镜阵列的制作材料通常与红外探测器材料不同,因此在集成装配时需要额外的工艺手段,工艺难度较大且效率较低。利用微纳光学超表面技术体系,可以在红外探测器衬底材料上直接制作平面式的固体浸没型微透镜阵列,实现前置微透镜与红外焦平面的单片集成。文中以红外探测领域最有潜力的锑化物Ⅱ类超晶格红外探测器为应用目标,设计了一种基于GaSb衬底的固体浸没式红外超表面透镜。设计的超表面透镜在中波红外波段工作,能适用于所有入射偏振。器件设计焦距为100 μm,理论上在目标波长下的最高聚焦效率达到70.7%,数值孔径(NA)达到1.15。该设计可以推动微透镜阵列向扁平、超薄、轻量的方向发展,简化微透镜阵列与红外焦平面阵列的集成工艺,有望提升红外焦平面的探测效率,并降低制造成本。     

256×1甚长波量子阱红外焦平面研究

GaAs/AlGaAs量子阱红外探测器由于其所依据的GaAs基材料较为成熟的材料生长和器件制备工艺,使其特别适合于高均匀性、大面积红外焦平面的应用。报道了甚长波256×1元GaAs/AlGaAs多量子阱红外焦平面器件的研制成果, 探测器的峰值波长为15 μm,响应带宽大于1.5 μm。在40 K工作温度下,器件的平均黑体响应率Rp=3.96×106 V/W, 平均黑体探测率为D*=1.37×109 cm·Hz1/2/W, 不均匀性为11.3%, 并应用研制的器件获得了物体的热像图。     

Design and development of multicolor MWIR/LWIR and LWIR/VLWIR detector arrays

Multicolor infrared (IR) focal planes are required for high-performance sensor applications. These sensors will require multicolor focal plane arrays (FPAs) that will cover various wavelengths of interest in mid wavelength infrared/long wavelength infrared (MWIR/LWIR) and long wavelength infrared/very long wavelength infrared (LWIR/VLWIR) bands. There has been significant progress in HgCdTe detector technology for multicolor MWIR/LWIR and LWIR/VLWIR FPAs.^1–3 Two-color IR FPAs eliminate the complexity of multiple single-color IR FPAs and provide a significant reduction of weight and power in simpler, reliable, and affordable systems. The complexity of a multicolor IR detector MWIR/LWIR makes the device optimization by trial and error not only impractical but also merely impossible. Too many different geometrical and physical variables need to be considered at the same time. Additionally, material characteristics are only relatively controllable and depend on the process repeatability. In this context, the ability of performing “simulation experiments” where only one or a few parameters are carefully controlled is paramount for a quantum improvement of a new generation of multicolor detectors for various applications.     

基于多层薄膜的长波红外InAs/GaSb II类超晶格焦平面光响应调控研究

本文基于长波InAs/GaSb Ⅱ类超晶格红外焦平面阵列(Focal Plane Array,FPA)设计和生长了由ZnS和Ge组成的多层薄膜结构。与没有多层薄膜的FPA相比,多层薄膜使其响应峰位置从8.7μm和10.3μm分别移动到9.8μm和11.7μm,50%响应截止波长从11.6μm移动至12.3μm,并且在波长为12μm处的响应强度增加了69%。总之,优化的多层薄膜可以调控FPA的响应波长,这为实现更高灵敏度和更高成像能力的长波红外探测提供了更好的平台。     

多维度红外光电探测器

红外光电探测器可以获取目标反射和自发的红外辐射,具有抗干扰性强、全天候观测、探测距离远、分辨率高等优点,在国防、通信、遥感、航天等领域中扮演着不可替代的角色.从20世纪40年代第一代低像素探测器的应用到90年代末第三代SWaP3概念的提出,红外光电探测器正经历着变革性发展.专注于阵列规模、灵敏度、分辨率等性能指标提高的...     

Van der Waals Integration Based on Two-Dimensional Materials for High-Performance Infrared Photodetectors

Infrared photodetectors have been widely applied in various fields, including thermal imaging, biomedical imaging, and communication. Van der Waals (vdW) integration based on 2D materials provides a new solution for high-performance infrared photodetectors due to the versatile device configurations and excellent photoelectric properties. In recent years, great progress has been made in infrared photodetectors based on vdW integration. In this review, recent progress in vdW integration-based infrared photodetectors is presented. First, the working mechanisms and advantages of photodetectors with different structures and band alignments are presented. Then, the recent progress of vdW integration-based infrared photodetectors is reviewed, focusing on 2D/nD (n  =  0, 1, 2, 3) vdW integration, and the band engineering as well as the performance of the photodetectors are discussed in detail. Finally, a summary is delivered, and the challenges and future directions of vdW integration-based infrared photodetectors are provided.     

短波红外InGaAs焦平面噪声特性

为研究铟镓砷焦平面的噪声特性,设计了两种不同吸收层掺杂浓度的InGaAs外延材料,采用标准工艺制备了平面型160×128元光敏芯片,并与相同结构的读出电路倒焊耦合形成160×128元焦平面,采用改变积分时间和改变器件温度的方法,测试焦平面的信号与噪声.通过研究不同材料参数、器件性能与焦平面噪声的关系,定量分析了短波红外InGaAs焦平面的噪声特性.结果表明,焦平面噪声主要来源于焦平面耦合噪声和探测器噪声,降低InGaAs外延材料吸收层的掺杂浓度,可以有效降低探测器电容,从而降低焦平面的耦合噪声;而探测器噪声由探测器暗电流和工作温度影响,该噪声在长积分时间下决定了焦平面的总噪声水平.实现低暗电流、低电容特性的光敏芯片是降低焦平面噪声的有效途径.     

HgCdTe focal plane arrays for dual-color mid- and long-wavelength infrared detection

Raytheon Vision Systems (RVS, Goleta, CA) in collaboration with HRL Laboratories (Malibu, CA) is contributing to the maturation and manufacturing readiness of third-generation, dual-color, HgCdTe infrared staring focal plane arrays (FPAs). This paper will highlight data from the routine growth and fabrication of 256×256 30-μm unit-cell staring FPAs that provide dual-color detection in the mid-wavelength infrared (MWIR) and long wavelength infrared (LWIR) spectral regions. The FPAs configured for MWIR/MWIR, MWIR/LWIR, and LWIR/LWIR detection are used for target identification, signature recognition, and clutter rejection in a wide variety of space and ground-based applications. Optimized triple-layer heterojunction (TLHJ) device designs and molecular beam epitaxy (MBE) growth using in-situ controls has contributed to individual bands in all dual-color FPA configurations exhibiting high operability (>99%) and both performance and FPA functionality comparable to state-of-the-art, single-color technology. The measured spectral cross talk from out-of-band radiation for either band is also typically less than 10%. An FPA architecture based on a single-mesa, single-indium bump, and sequential-mode operation leverages current single-color processes in production while also providing compatibility with existing second-generation technologies.     

碲镉汞红外光电探测器局域场表征研究进展（特邀）

碲镉汞材料 (HgCdTe) 是第三代红外探测系统中使用的重要探测材料,其发展水平能基本反映当前红外探测器最优性能指标。近年来,天文、遥感和民用设备对探测器性能提出了更高的要求,这对HgCdTe红外探测器的设计和制备提出了新的挑战。HgCdTe红外探测器更精细的设计和加工技术为提高HgCdTe红外探测器性能提供解决思路。抑制器件的有害局域场、调控器件的有益局域场可以实现器件性能进一步的突破。但是,如何对HgCdTe光电器件局域场进行表征与分析,澄清HgCdTe光电器件中局域场相关的噪声及暗电流起源,是推动器件性能突破需解决的重要关键科学与技术问题。文中将总结HgCdTe红外光电探测器局域场表征与分析的研究进展,为新一代HgCdTe红外光电探测器发展提供基础支撑。     

256×256 focal plane array midwavelength infrared camera based on InAs/GaSb short-period superlattices

An infrared camera based on a 256×256 focal plane array (FPA) for the second atmospheric window (3–5 μm) has been realized for the first time with InAs/GaSb short period superlattices (SLs). The SL detector structure with a broken gap type-II band alignment was grown by molecular beam epitaxy on GaSb substrates. Effective bandgap and strain in the superlattice were adjusted by varying the thickness of the InAs and GaSb layers and the controlled formation of InSb-like bonds at the interfaces. The FPAs were processed in a full wafer process using optical lithography, chemical-assisted ion beam etching, and conventional metallization technology. The FPAs were flip-chip bonded using indium solder bumps with a read-out integrated circuit and mounted into an integrated detector cooler assembly. The FPAs with a cut-off wavelength of 5.4 μm exhibit quantum efficiencies of 30% and detectivity values exceeding 10¹³ Jones at T=77 K. A noise equivalent temperature difference (NETD) of 11.1 mK was measured for an integration time of 5 ms using f/2 optics. The NETD scales inversely proportional to the square root of the integration time between 5 ms and 1 ms, revealing background limited performance. Excellent thermal images with low NETD values and a very good modulation transfer function demonstrate the high potential of this material system for the fabrication of future thermal imaging systems.     

15-μm 128×128 GaAs/AlxGa1-xAsquantum well infrared photodetector focal plane array camera

In this paper, we discuss the development of very sensitive, very long wavelength infrared GaAs/Al_xGa_1-xAs quantum well infrared photodetectors (QWIPs) based on bound-to-quasi-bound intersubband transition, fabrication of random reflectors for efficient light coupling, and the demonstration of a 15-μm cutoff 128×128 focal plane array imaging camera. Excellent imagery, with a noise equivalent differential temperature (NEΔT) of 30 mK has been achieved     

Ⅱ类超晶格甚长波红外探测器的发展

由Ⅲ-Ⅴ族半导体材料InAs/GaSb或InAs/Ga1-xInxSb构成的Ⅱ类超晶格(T2SL)光电探测器近年来在理论结构设计及试验器件实现方面进展显著.带隙工程和能带结构工程使得T2SL比碲镉汞材料具有某些优势,特别是很小的窄带隙方面.这些特有的性质,例如较大的有效电子质量、重空穴带和轻空穴带之间的较大间距可以抑制...     

640×486 long-wavelength two-color GaAs/AlGaAs quantum wellinfrared photodetector (QWIP) focal plane array camera

We have designed and fabricated an optimized long-wavelength/very-long wavelength two-color quantum well infrared photodetector (QWIP) device structure. The device structure was grown on a 3-in semi-insulating GaAs substrate by molecular beam epitaxy (MBE). The wafer was processed into several 640×486 format monolithically integrated 8-9 and 14-15 μm two-color (or dual wavelength) QWIP focal plane arrays (FPAs). These FPAs were then hybridized to 640×486 silicon CMOS readout multiplexers. A thinned (i.e., substrate removed) FPA hybrid was integrated into a liquid helium cooled dewar for electrical and optical characterization and to demonstrate simultaneous two-color imagery. The 8-9 μm detectors in the FPA have shown background limited performance (BLIP) at 70 K operating temperature for 300 K background with f/2 cold stop. The 14-15 μm detectors of the FPA reaches BLIP at 40 K operating temperature under the same background conditions. In this paper we discuss the performance of this long-wavelength dualband QWIP FPA in terms of quantum efficiency, detectivity, noise equivalent temperature difference (NEΔT), uniformity, and operability     

基于等离激元纳米结构非对称集成的二维材料自驱动光响应增强的研究进展（特邀）

金属-二维材料-金属是最常见的二维材料光探测器件的结构。由于结构简单、易于集成,该类器件受到最广泛的关注和研究。其自驱动光探测的模式具有很低的暗电流,有望成为高性能红外探测的新途径。然而金属-二维材料-金属的自驱动光探测存在两个瓶颈问题:（1）反对称的金属-二维材料结区引起的泛光照射下光响应的抵消;（2）二维材料有限光吸收导致的低响应率。文中介绍了利用等离激元纳米结构的非对称集成引入非对称的光耦合,从而打破泛光照射下二维材料与两端电极接触区域产生的光电流的对称性,实现净的自驱动光响应;同时利用等离激元纳米结构产生的局域强光场提高二维材料光吸收率和光响应率的一系列研究进展。在石墨烯等离激元纳米谐振腔复合结构中,实现两个电极附近的光响应对比度超过100倍,突破了对称光耦合导致的光响应抵消的难题。由于具有将入射光耦合成局域模式的优越能力,等离激元纳米谐振腔比亚波长金属光栅更有效地提高石墨烯响应率一个数量级以上。     

Dual-band infrared detectors

IntroductionMulticolor capabilities are highly desirable foradvance infrared(IR) systems.Systems that gatherdata in separate IR spectral bands can discriminateboth absolute temperature and unique signatures ofobjects in the scene.By providing this new dimensionof contrast,multiband detection also enables ad-vanced color processing algorithms to further im-prove sensitivity above that of single- color devices.This is extremely important for the process of identi-fying temperature difference b…     

High-Performance M/LWIR Dual-Band HgCdTe/Si Focal-Plane Arrays

Mercury cadmium telluride (HgCdTe) grown on large-area silicon (Si) substrates allows for larger array formats and potentially reduced focal-plane array (FPA) cost compared with smaller, more expensive cadmium zinc telluride (CdZnTe) substrates. In this work, the use of HgCdTe/Si for mid- wavelength/long-wavelength infrared (M/LWIR) dual-band FPAs is evaluated for tactical applications. A number of M/LWIR dual-band HgCdTe triple-layer n-P-n heterojunction device structures were grown by molecular-beam epitaxy (MBE) on 100-mm (211)Si substrates. Wafers exhibited low macrodefect densities (< 300 cm^?2). Die from these wafers were mated to dual-band readout integrated circuits to produce FPAs. The measured 81-K cutoff wavelengths were 5.1 μm for band 1 (MWIR) and 9.6 μm for band 2 (LWIR). The FPAs exhibited high pixel operability in each band with noise-equivalent differential temperature operability of 99.98% for the MWIR band and 98.7% for the LWIR band at 81 K. The results from this series are compared with M/LWIR FPAs from 2009 to address possible methods for improvement. Results obtained in this work suggest that MBE growth defects and dislocations present in devices are not the limiting factor for detector operability, with regards to infrared detection for tactical applications.     

160×128元多量子阱长波红外焦平面探测器件研制

报道了新研制出的160×128元GaAs/AlGaAs多量子阱长波红外焦平面器件。使用MBE的方法在半绝缘的GaAs衬底上生长器件结构；开发了用普通光刻技术和离子束刻蚀法制备2D光栅技术，以及探测器芯片与读出电路互联技术。在77 K时测试，器件的平均峰值探测率Dλ*=1.28×1010 cmW-1Hz1/2，峰值波长为λp=8.1 μm，截止波长为λc=8.47 μm。器件的非盲元率≥98.8％，不均匀性10％。     

InGaAs短波红外探测器研究进展

InxGa1-xAs材料属于Ⅲ-Ⅴ族化合物半导体合金材料,随In组分含量的不同,其光谱响应的截止波长可在0.87～3.5μm范围内变化,并具有高量子效率,加之成熟的MBE和MOVCD材料生长方式,很容易获得大面积高质量的外延材料,InGaAs材料因此成为一种重要的短波红外探测材料。InGaAs探测器可以在室温或近室温下工作,且具有较高的灵敏度和探测率,是小型化、低成本和高可靠性的短波红外探测系统的最佳选择,因此InGaAs短波红外探测器获得了飞速的发展和广泛的应用。同时对国内外InGaAs焦平面探测器发展状况和趋势进行了介绍。