Investigation of Ga oxide films directly grown on n-type GaN by photoelectrochemical oxidation using He-Cd laser

By using a He-Cd laser in a chemical solution of H₃PO₄ with a pH value of 3.5, Ga oxide films were directly grown on n-type GaN. From the energy-dispersive spectrometer (EDS) measurement and x-ray diffraction (XRD) measurement, the grown Ga oxide film was identified as (104) α-Ga₂O₃ structure. A small amount of phosphors existed and bonded with oxygen on the grown films. The as-grown films were amorphous. From the XRD analysis, it is evident that annealing of the α-Ga₂O₃ films led to a change in the microstructure from an amorphous to a polycrystalline phase. In addition, the as-grown low-density films gradually became dense films during the annealing process. Furthermore, the surface roughness of the annealed films also gradually decreased. Hexagonal pinholes on the grown films were observed. The density of the hexagonal pinholes was similar to the defect density of the n-type GaN. From the cross-sectional transmission electron microscopy (TEM) micrographs, it is evident that the hexagonal pinholes originated from defects in the n-type GaN.     

Cu-In-Ga-Se nanoparticle colloids as spray deposition precursors for Cu(In, Ga)Se2 solar cell materials

The use of nanoparticle colloids for spray deposition of Cu(In,Ga)Se₂ (CIGS) precursor films and subsequent fabrication of CIGS solar cells has been investigated. According to this approach, amorphous Cu-In-Ga-Se nanoparticle colloids were first prepared by reacting a mixture of CuI, InI₃, and GaI₃ in pyridine with Na₂Se in methanol at reduced temperature. Purified colloid was sprayed onto heated molybdenum-coated sodalime glass substrates to form Cu-In-Ga-Se precursor films. After thermal processing of the precursor films under a selenium ambient, CIGS solar cells were fabricated. Cu-In-Ga-Se colloids and films were characterized by inductively coupled plasma atomic emission spectroscopy, thermogravimetric analysis, transmission electron microscopy, x-ray diffraction, scanning electron microscopy, and Auger electron spectroscopy. Standard current-voltage characterization was performed on the CIGS solar cell devices with the best film exhibiting a solar conversion efficiency of 4.6%.     

Molecular beam epitaxy of CdTe and Hg1-xCdxTe ON GaAs (100)

Using the molecular beam epitaxial (MBE) technique, CdTe and Hg_1-xCd_xTe have been grown on Cr-doped GaAs (100) sub-strates. A single effusion cell charged with polycrystal-line CdTe is used for the growth of CdTe films. The CdTe films grown at 200 °C with a growth rate of ~ 2 μm/hr show both streaked and “Kikuchi” patterns, indicating single crystalline CdTe films are smoothly grown on the GaAs sub-strates. A sharp emission peak is observed at near band-edge (7865 Å, 1.577 eV) in the photoluminescence spectrum at 77 K. For the growth of Hg_1-xCd_xTe films, separate sources of HgTe, Cd and Te are used. Hg_0.6Cd_0.4Te films are grown at 50 °C with a growth rate of 1.7 μm/hr. The surfaces are mirror-smooth and the interfaces between the films and the substrates are very flat and smooth. As-grown Hg_0.6Cd_0.4Te films are p-type and converted into n-type by annealing in Hg pressure. Carrier concentration and Hall mobility of an annealed Hg_0.6Cd_0.4Te film are 1 × 10¹⁷ cm^?3 and 1000 cm²/V-sec at 77 K, respectively.     

Characterization and ellipsometric investigation of high-quality ZnO and ZnO(Ga2O3) thin alloys by reactive electron-beam co-evaporation technique

High-quality ZnO(Ga₂O₃) thin films have been co-evaporated by reactive electron-beam evaporation in an oxygen environment. The effect of Ga₂O₃ on the structural and optical properties has been investigated. X-ray diffraction (XRD) measurements have shown that the ZnO(Ga₂O₃) alloys are c-axis-oriented. The alloy containing 28% of Ga₂O₃ showed the best crystallinity. Photoluminescence on ZnO(28%Ga₂O₃) reveals an enhancement of the ultraviolet near band edge emission at 380 nm while the intensity of the deep-level emissions weakens. A reduction of the oxygen vacancies as well as the reduction of the zinc interstitials with gallium may explain this effect. Thus, the possibility of transitions of electron in the conduction band to a deep acceptor level due to zinc interstitials may decrease. Finally, ellipsometric measurements show that the optimum weight concentration of gallium oxide in the alloys is 28%, thus correlating with the XRD and photoluminescence measurements.     

新型相变材料Al1.3Sb3Te使用CF4/Ar等离子体干法刻蚀

对使用CF4/Ar 混合气体刻蚀Al1.3Sb3Te的特性进行了研究。实验控制的参数是：气体流入刻蚀腔的速率,CF4/Ar 比例,O2的加入量,腔内压强以及加在底电极上的入射射频功率。总的气体流量是50sccm ,研究刻蚀速率与CF4/Ar的比例,O2加入量,腔内压强和入射射频功率的关系。最后刻蚀参数被优化。 使用优化的刻蚀参数CF4的浓度4%,功率300W,压强800mTorr,刻蚀速率达到70.8nm/min,刻蚀表面平整     

Growth and structure of wide-gap insulator films on SrTiO3

Wide-gap insulator films, CaZrO₃, CaHfO₃, LaGaO₃, and NdGaO₃, were grown on SrTiO₃(1 0 0) substrates with the aim of obtaining a gate insulator for epitaxial oxide devices. We show that CaZrO₃ and CaHfO₃ films were epitaxial and had a multi-domain in-plane structure due to their highly distorted perovskite structure. Most of the LaGaO₃ and NdGaO₃ films were polycrystalline, and therefore showed relatively high leak currents. CaHfO₃ had the best crystallinity among these four materials.     

磁控溅射法制备Bi2Te3热电薄膜的研究

Bi2Te3薄膜是室温下热电性能最好的热电材料,利用磁控溅射在长有一薄层SiO2的n型硅样品上制备Bi/Te多层复合薄膜,经后续退火处理生成Bi2Te3。通过分析Bi2Te3薄膜的生长和退火工艺,探讨Bi/Te中Te的原子数分数对薄膜热电性能的影响。采用XRD和SEM对薄膜的结构、形貌和成分进行分析,并测量不同条件下的Seebeck系数。薄膜Seebeck系数均为负数,表明所制备样品是n型半导体薄膜,且最大值达到-76.81μV.K-1;电阻率ρ随Te的原子数分数增大而增大,其趋势先缓慢后迅速。Bi2Te3薄膜的热电性能良好,Te的原子数分数是60.52%时,功率因子最大,为1.765×10-4W.K-2.m-1。     

铜含量变化对Cu(In,Ga)Se2薄膜微结构的影响

报道了不同的铜含量(Cu/(Ga+In)=0.748~0.982)对Cu(In,Ga)Se2 (CIGS)薄膜微结构的影响.文章中的CIGS薄膜采用磁控溅射金属预置层后硒化的方法制备, 其X射线衍射谱(XRD)中一系列黄铜矿结构CIGS(CH-CIGS)相的衍射峰确认了CH-CIGS相的存在.对CIGS薄膜拉曼光谱的分析表明, 随着铜含量的上升, CIGS薄膜经历了CH-CIGS和有序缺陷化合物(OVC)混合相、CH-CIGS单相、CH-CIGS和CuxSe混合相三种状态.进一步的分析显示, CIGS薄膜拉曼峰的半高宽随铜含量变化, 并在Cu/(Ga+In)=0.9附近时达到最小值, 这说明此时CIGS薄膜具有更好的结晶度和更少的无序性.此外还得到了CIGS薄膜拉曼峰半高宽与铜含量的经验关系公式.这些研究表明拉曼光谱能比XRD更加灵敏地探测CIGS薄膜的微结构, 可望作为一种无损和快速测量方法, 用于对CIGS薄膜晶相和铜含量的初步估计.     

Physical vapor deposition of GaAs on single crystal sapphire

The growth by physical vapor deposition of GaAs films on single crystal sapphire has been studied. A vacuum evaporation technique was used whereby Ga and As₂ vapors were supplied from a single crucible containing GaAs. In the substrate temperature range investigated, 200–600°C, only GaAs was observed; neither excess Ga nor As was detected. Reflection electron diffraction indicated the best films, grown at ~ 585°C, were single crystal with twinning. Films grown at lower temperatures were increasingly polycrystalline. Laue back-reflection x-ray diffraction generally indicated a larger degree of polycrystallinity or less well developed single crystallinity than did the reflection electron diffraction. Films grown on poorly polished substrates were consistently poorer in quality than those grown on scratch-free substrates. The films had resistivities > 1 × 10⁵ ohm-cm.     

Surface and Interface Properties of Metal-Organic Chemical Vapor Deposition Grown a -Plane Mg x Zn1– x O (0?≤ x ≤?0.3) Films

The a-plane Mg _x Zn_1−x O (0 ≤ x ≤ 0.3) films were grown on r-plane () sapphire substrates using metal-organic chemical vapor deposition (MOCVD). Growth was done at temperatures from 450°C to 500°C, with a typical growth rate of ∼500 nm/h. Field emission scanning electron microscopy (FESEM) images show that the films are smooth and dense. X-ray diffraction (XRD) scans confirm good crystallinity of the films. The interface of Mg _x Zn_1−x O films with r-sapphire was found to be semicoherent as characterized by high-resolution transmission electron microscopy (HRTEM). The Mg _x Zn_1−x O surfaces were characterized using scanning tunneling microscopy (STM) in ultrahigh vacuum (UHV). Low-energy electron diffraction (LEED) shows well-ordered and single-crystalline surfaces. The films have a characteristic wavelike surface morphology with needle-shaped domains running predominantly along the crystallographic c-direction. Photoluminescence (PL) measurements show a strong near-band-edge emission without observable deep level emission, indicating a low defect concentration. In-plane optical anisotropic transmission was observed by polarized transmission measurements.     

新型CIGS阻挡层多横向界面Mo的特性及对器件性能的影响

采用磁控溅射方法,在不锈钢箔上制备多横向界 面Mo(M-Mo,multi-transverse interface Mo)和单横向界面Mo(S-Mo)薄 膜,并利用共蒸发三步法分别在M-Mo和S-Mo薄膜上制备Cu(In,Ga)Se₂(CIGS)薄膜及 器件。通过二次离子质谱仪(SIMS)、X射线衍射仪(XRD)和扫描电子显微镜(SEM)研究了不同 结构的Mo薄膜对CIGS影响。通过I-V测试,表征M-Mo和S -Mo作为背电极的CIGS电池电学性能。XRD结果显示,M-Mo和S-Mo 薄膜均以(110)为择优取向。SEM结果显示,M-Mo薄膜相对 于S-Mo,薄膜晶粒 较小,粗糙度较大。J-V测试结果显示,M-Mo薄膜作为背 电极的电池的开路电压Voc、短路电流J sc和填充因子(FF)均有所提高。     

CIGS薄膜(InGa)2Se3-富Cu-富In(Ga)的演变

采用三步共蒸发工艺顺序沉积铜铟镓硒(CuInGaSe2,CIGS)薄膜.薄膜的厚度、组份、晶相结构分别由台阶仪、X射线荧光光谱仪(XRF)和X射线衍射仪(XRD)来表征.在(In,Ga)2Se3预制层-富Cu相的演变过程中,依次发生以下相变:Cu(In,Ga)5Se8、Cu(In,Ga)3Se5、Cu2(In,Ga)4Se7(或Cu(In,Ga)2Se3.5)、Cu(In,Ga)Se2(液相CuxSe).在富Cu相-富In(Ga)相的演变过程中,依次发生以下相变:Cu(In,Ga)Se2(液相CuxSe)、Cu2(In,Ga)4Se7(或Cu(In,Ga)2Se3.5)、Cu(In,Ga)3Se5、Cu(In,Ga)5Se8.对这两个演变过程中薄膜的生长机理和结构特性进行了讨论.     

Structure investigation on Hg1−xCdxTe liquid phase epitaxial films grown by the meltetch technique

Hg_1−xCd_xTe films were grown by a modified meltetch liquid phase epitaxial (LPE) technique which includes both substrate and epilayer etchback steps. The crystal quality of epilayer has been investigated by means of transmission electron microscopy, scanning electron microscopy, and double crystal x-ray diffraction. It has been found that adequate meltetch of the substrate at the beginning of LPE provides a fresh and flat surface for epitaxial growth, while epilayer meltetch at the end of LPE may prevent spurious melt sticking.     

Electrical activity,mode of incorporation and distribution coefficient of group V elements in Hg1−xCdxTe grown from tellurium rich liquid phase epitxial growth solutions

Hg_1−xCd_xTe films were grown liquid phase epitaxially from tellurium rich solutions containing up to 10 at. % of the group V elements P, As, Sb, and Bi. Chemical analysis of the Te growth solutions and the films was carried out in conjunction with extensive Hall effect measurements on the films subsequent to various annealing treatments under Hg rich and Te rich conditions. Despite the presence of a large concentration of the group V elements in the Te source solution, the maximum concentration of these elements incorporated into the liquid phase epitaxially grown Hg_1-xCd_xTe appears to vary from <10¹⁵cm⁻³ for Bi up to 10¹⁷cm⁻³ for phosphorus and As implying a distribution coefficient varying from <10⁻⁵ for Bi up to 10⁻³ for P at growth temperature of ∼500° C. This low value of the distribution coefficient for group V elements for growths from Te rich solutions contrasts with the moderately high values reported in the literature to date for growth from Hg rich solutions as well as pseudobinary solutions (Bridgman growth). The widely differing distribution coefficients and hence the solubility of the group V elements for Hg rich and Te rich liquid phase epitaxial solutions is explained on the basis that the activity coefficient of the group V elements in Te rich solutions is probably orders of magnitude lower than it is in Hg rich solutions. Finally, the results of the anneals at 200° C under Hg saturated conditions with and without a 500° C Hg saturated preanneal have indicatedn top conversion in many of the films attesting to the amphoteric behavior of the group V elements in LPE grown Hg_1−xCd_xTe(s) similar to the previously reported behavior of P in bulk grown Hg_0.8Cd_0.2Te.     

溅射气压对氧化镓薄膜光学特性的影响

采用射频磁控溅射法在石英衬底上制备了氧化镓(Ga2O3)薄膜.利用X射线衍射仪和紫外-可见-红外分光光度计分别对Ga2O3薄膜的晶体结构和光学带隙进行了表征,并在室温下测量了 Ga2O3薄膜的光致发光(PL)谱.结果表明:制备的Ga2O3薄膜呈非晶态.吸收边随着溅射气压的增加先蓝移后红移,光学带隙值范围为5.06～5.37 eV,溅射气压为1 Pa时,制备的Ga2O3薄膜具有最大的光学带隙.在325 nm激光激发下,400 nm附近和525 nm附近处出现与缺陷能级相关的发光峰.     

Determination of the Origin of Crystal Orientation for Nanocrystalline Bismuth Telluride-Based Thin Films Prepared by Use of the Flash Evaporation Method

We have investigated the origin of crystal orientation for nanocrystalline bismuth telluride-based thin films. Thin films of p-type bismuth telluride antimony (Bi–Te–Sb) and n-type bismuth telluride selenide (Bi–Te–Se) were fabricated by a flash evaporation method, with exactly the same deposition conditions except for the elemental composition of the starting powders. For p-type Bi–Te–Sb thin films the main x-ray diffraction (XRD) peaks were from the c-axis (Σ{00l}/Σ{hkl} = 0.88) whereas n-type Bi–Te–Se thin films were randomly oriented (Σ{00l}/Σ{hkl} = 0.40). Crystal orientation, crystallinity, and crystallite size were improved for both types of thin film by sintering. For p-type Bi–Te–Sb thin films, especially, high-quality structures were obtained compared with those of n-type Bi–Te–Se thin films. We also estimated the thermoelectric properties of the as-grown and sintered thin films. The power factor was enhanced by sintering; maximum values were 34.9 μW/cm K² for p-type Bi–Te–Sb thin films at a sintering temperature of 300°C and 23.9 μW/cm K² for n-type Bi–Te–Se thin films at a sintering temperature of 350°C. The exact mechanisms of film growth are not yet clear but we deduce the crystal orientation originates from the size of nano-clusters generated on the tungsten boat during flash evaporation.     

Thermal stress effects of Ge2Sb2Te5 phase change material: Irreversible modification with Ti adhesion layers and segregation of Te

This paper reviews material properties of chalcogenide phase change material Ge₂Sb₂Te₅ under thermal anneal treatments. Stress evolutions of pure Ge₂Sb₂Te₅ films and stacks of Ge₂Sb₂Te₅ integrating with Ti adhesion layers are investigated. Segregation of Te atoms in the Ge₂Sb₂Te₅ film to the interface drives an interaction between Ti and Te atoms and formation of Ti-Te binary phases. The irreversible phase segregation and modification of Ge₂Sb₂Te₅ change the crystallization process, completely suppress the final transformation into otherwise stable hcp phase, and thus impact the ultimate life-cycle of such a phase change based memory cell. Since the adhesion layer is required in cell applications, the optimization of adhesion layer material and thickness may improve the life-cycles and reliability of devices.     

Si基氨化ZnO／Ga2O3薄膜制备GaN纳米线

利用射频磁控溅射法在Si(111)衬底上溅射ZnO中间层和Ga2O3薄膜，然后在管式炉中常压下通氨气对ZnO/Ga2O3薄膜进行氨化，高温下ZnO层在氨气气氛中挥发，而Ga2O3薄膜和氨气反应合成出GaN纳米线．X射线衍射测量结果表明利用该方法制备的GaN纳米线具有沿c轴方向择优生长的六角纤锌矿结构．利用扫描电子显微镜、透射电子显微镜、傅里叶红外透射谱、能量弥散谱及选区电子衍射观测并分析了样品的形貌、成分和晶格结构．研究发现ZnO层的挥发有利于Ga2O3和NH3反应合成GaN纳米线．     

Preparation and gas-sensing properties of α-Fe2O3 thin films

Haematite (α-Fe₂O₃) thin films are prepared by two different chemical vapor deposition (CVD) processes: the atmospheric pressure CVD (APCVD) and the plasma enhanced CVD (PECVD). The films are analyzed by x-ray diffraction and scanning electron microscopy; their gas-sensing properties are also investigated. Experimental results show that APCVD α-Fe₂O₃ films are highly sensitive and selective to smoke while PECVD films are highly sensitive and selective to alcohol. A certain amount of quadrivalent metal in the films has an effect on their sensitivity and selectivity to gases. It is found that the films will “break down” under certain conditions.     

Growth and properties of Hg1-x Cdx Te epitaxial layers

The growth of epitaxial layers of mercury-cadmium-telluride (Hg_1-xCd_xTe) with relatively low x (0.2-0.3) from Te-rich solutions in an open tube sliding system is studied. The development of a semiclosed slider system with unique features permits the growth of low x material at atmospheric pressure. The quality of the films is improved by the use of Cd_1-yZ_yTe and Hg_1-xCd_xTe substrates instead of CdTe. The substrate effects and the growth procedure are discussed and a solidus line at a relatively low temperature is reported. The asgrown epitaxial layers are p-type with hole concentration of the order of 1·10¹⁷ cm⁻³, hole mobility of about 300 cm²·V⁻¹ sec⁻¹ and excess minority carrier life-time of 3 nsec, at 77 K.