无镀铜桶装焊丝在机器人焊接中的应用

采用烟尘测定装置检测了无镀铜桶装焊丝的发尘量,采用波形测定仪检测了无镀铜桶装焊丝的电弧稳定性和送丝性能,采用焊丝测力器检测了无镀铜桶装焊丝的送丝阻力。结果表明,无镀铜桶装焊丝在焊接时发尘量少,电弧稳定,送丝阻力小,焊接飞溅小,焊道成形美观。同时通过观察发现,无镀铜焊丝在机器人焊接中容易出现断弧、跳丝以及送丝不顺的现象,分析了产生这些问题的原因以及应对措施。     

表面活性剂辅助制备Cu-Ti3SiC2包覆粉末的电化学机理和化学镀特性

为提高Cu-(Ti3SiC 2)p复合材料中铜与陶瓷的界面结合强度,以环境友好型抗坏血酸为还原剂,D-葡萄糖酸钠为络合剂,制备了Cu-Ti3SiC 2包覆粉末。研究了Ti3SiC 2粉末表面化学镀铜及其电化学性能,以及十二烷基硫酸钠(SDS)结合聚山梨酯80(Tween-80)表面活性剂对化学镀铜的改性效果。采用线性扫描伏安法和开路电位-时间法确定了该体系的电化学机理并进行参数优化。结果表明,提高反应温度,增加Cu(II)和抗坏血酸的浓度,可以提高极化电流密度,有利于加速化学镀。铜镀层新核从依附在(Ti3SiC 2)p粒子表面的银催化活化中心开始形成,表面具有较多Ag催化活性中心的微球会促进涂层的形成。采用复配改性剂SDS(6~22 g/L)+Tween-80 (8~12mL/L)对化学镀铜表面涂覆的效果优于单一改性剂。采用SM4 (SDS+Tween-80)改性剂达到最佳涂层效果的Cu与Ti3SiC 2的总摩尔比为1:0.54。静电效应和空间位阻效应对铜在(Ti3SiC 2)p表面的生长起着至关重要的协同控制作用。     

超声波在表面工程和电化学中的应用

近年来，超声波在表面工程和电化学领域的应用得到了广泛地发展。本文通过介绍超声波在电镀、化学镀、有机电化学合成方面的应用，得出随着超声波在表面工程和电化学领域中的应用范围的扩大，必将对传统的电化学产生深远的影响。     

表面活性剂在陶瓷化学镀铜工艺中的作用

通过研究在镀液中添加十六烷基三甲基溴化铵(CTAB)、十二烷基硫酸钠(SDS)和吐温-80三种表面活性剂对化学镀铜沉积速率和镀液稳定性的影响,确定出三种添加剂的最优添加浓度。通过扫描电镜、能谱分析仪和X射线衍射仪,对镀层表面形貌、组成成分以及晶体结构分别进行研究。并通过线性伏安扫描法,研究了添加不同表面活性剂镀液的电化学行为。结果表明:表面活性剂可以提高化学镀铜的沉积速率和镀液稳定性。CTAB、SDS和吐温-80的最优添加浓度分别为1mg/L、20mg/L和5mg/L。加入SDS后,由于沉积速率过大,使得镀层颗粒变大。加入CTAB和吐温-80可以细化镀层的颗粒且更加致密。添加不同的表面活性剂后,镀层的晶粒尺寸没有太大改变,含铜量均为100%且镀层的晶粒呈现面心立方晶体结构。表面活性剂主要通过影响甲醛的氧化反应影响化学镀铜过程。     

固态去耦合器在解决阀室阴保漏电问题中的应用

干线埋地管道均为强制电流+外防腐层联合保护方式,这就要求被保护管道有良好的绝缘性能。阀室内管道与电气之间采用绝缘卡套进行绝缘,放空管与阀室内管道间也存在绝缘接头。基于电气安全考虑,阀室电气设备均有接地,如果管道与接地网搭接或绝缘失效,将会造成阀室管道电位偏正,阴保处于欠保护状态。因此针对运行的阀室,做好绝缘排查,消除阴保电流流失,确保阀室埋地管道处于良好的阴极保护状态尤为重要。本文通过对某输油线某阀室阴保漏电进行原因排查并采用了固态去耦合器解决了阀室阴极保护漏电,对解决阀室阴极保护漏电提供了一种全新的思路和方法。     

工艺路线在ERP系统中的应用

本文论述了在PDM/CAPP/ERP系统集成环境下工艺路线的应用和发展,探讨产品零件的加工路线和在各个工序中的标准工时如何在ERP系统中信息集成,保证产品数据的一致性、完整性、唯一性和共享性。     

化学镀Ni-P合金与热处理复合工艺在铸模中的应用

简述了化学镀Ni-P合金和热处理复合工艺的理论依据,电解液组成和工艺条件;详细地研究了Ni-P镀层和复合涂层的耐腐蚀、耐磨性能和结构以及在铸模中的应用效果。     

1.10-菲啰啉在以HCHO为还原剂的化学镀铜体系中的作用

通过实时分析镀液中HCHO含量,结合极化曲线、电化学阻抗谱及扫描Kelvin探针技术,研究了1.10-菲啰啉对化学镀铜液中HCHO利用率及镀层沉积行为的影响;采用SEM,XRD分析铜镀层微观形貌及结构。结果表明：1.10-菲啰啉能够加速HCHO的氧化,提高HCHO利用率;化学镀铜液中加入1.10-菲啰啉,能够明显降低镀液阻抗,提高混合电位下的自腐蚀电流密度,降低Cu在镀液中的表面电势,提高镀层沉积速率。镀液中加入1.5 mgL^-1 1.10-菲啰啉可使HCHO利用率从28%提高到39%,镀速增加50%;1.10-菲啰啉的加入可以提高Cu(111) 晶面的择优取向程度,获得细致均匀的铜镀层。     

GE FANUC PAC输入模拟器在教学应用中的改造

在基于GE FANUC PAC Systems RX3i设计教学型自动化生产线控制系统的过程中,由于PAC Systems RX3i输入模拟器模块IC694ACC300无法连接外部输入信号,因此从节约成本、避免增加设备投资的角度出发,对该输入模拟器模块进行了电路分析与改造,自行开发了具有电气安全隔离性能的接口电路板,在不影响该输入模拟器原有功能的同时实现了外部传感器0～24 V直流电压信号和按键开关量信号向PAC Systems的高速传输。实践证明,取得了令人满意的控制性能和教学效果。     

剥离涂层下的X80钢在鹰潭土壤模拟溶液中的腐蚀行为

构建了埋地管线钢在鹰潭土壤模拟溶液中的矩形缝隙剥离涂层模型,采用原位电化学测量方法对剥离区的X80钢进行电化学交流阻抗谱(EIS)表征,并对其腐蚀行为进行了研究.结果表明.腐蚀初期剥离区各位置的电化学反应特征相同、EIS由高频容抗弧和低频感抗弧组成.随着腐蚀反应进行,高频容抗弧半径增大.低频感抗弧消失.距漏点不同距离的X80钢试样的腐蚀程度有所区别:漏点处和剥离区底部的腐蚀最严重.为吸氧腐蚀和阳极溶解所致;剥离区中部腐蚀较弱,去除腐蚀产物的X80钢表面出现明显的点蚀坑,点蚀倾向加重,腐蚀类型由全面腐蚀向局部腐蚀转变.根据EIS规律和实验结果.剥离区的腐蚀进程可分为氧耗尽、阴离子迁移和腐蚀扩展3个阶段.     

Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass

Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy （FESEM） and atomic force microscopy （AFM）. The results indicate that the copper films have a （111） texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs-Sondheimer （F-S）, Mayadas-Shatzkes （M-S） theory and a combined model, the grain boundary reflection coefficient （R） is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.     

碳纳米管的化学镀铜

碳纳米管因其优异的力学、物理性能, 是一种理想的复合材料增强体, 但其与基体金属的润湿性较差.通过化学镀在碳纳米管表面镀上一层连续的铜镀层, 以改善碳纳米管与金属基体的润湿性, 增强界面结合力.通过TEM观察表明: 由于碳纳米管长径比大, 反应活性低, 表面曲率大, 直径细和镀层薄(50～100nm), 使碳纳米管很难得到完整的镀层.通过对镀前处理工艺(氧化、敏化、活化)的优化以增加活化点, 对传统镀液配方的调整使镀速尽可能低, 成功地在碳纳米管上镀覆一层铜, 为碳纳米管复合材料制备打下了良好的基础.     

化学镀镍作为钢酸性镀铜前处理工艺的应用研究

为了防止钢表面酸性电镀铜出现置换铜,采取在电镀铜前增加化学镀镍工序,研究了化学镀镍工艺对酸性电镀铜的影响。结果表明,化学镀镍时间超过6 min时(镍层厚度>2.5～3μm),工件在酸性镀铜液中浸泡10 min,无置换铜出现。化学镀镍层对后续的酸性镀铜层的表面形貌和附着力均无明显影响,表明化学镀镍可作为钢酸性镀铜的底层。     

Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

Molybdenum powders with a diameter of approximately 3 μm were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃.The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature.The optimized values of pH and temperature were found to be 12.5 and 60℃,respectively,which attributes to the bright maroon color of the coating with an increase in weight of 46%.The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope (SEM) and the phases were analyzed using X-ray diffraction (XRD).An attempt was made to understand the growth mechanism of the coating.The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.     

温度对金刚石粉体表面镀铜的影响

在金刚石粉体表面通过化学沉积得到铜金属镀层,通过X射线衍射(XRD)、扫描电镜(SEM)等测试手段研究了镀液温度对镀速、镀层组织及形貌的影响。结果表明:当镀液温度低于30℃时,镀速为零,反应不能发生;温度在30~45℃时,随着温度的升高,铜的衍射峰逐渐增强;45℃时,基体完全被覆盖,镀层致密均匀;温度在45~50℃时,衍射峰进一步增强,镀层晶粒明显变大,致密度降低,表层有脱落现象;随着温度进一步增大,铜的衍射峰强度开始降低,60℃时,镀层有明显的脱落,翻边起皮现象。     

Development of copper coatings on molybdenum powders by electroless plating technique

Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique. The effect of the solution composition and plating conditions on the electroless copper plating was studied. The uncoated and coated powders were subjected to the microstructural studies by SEM and the phases were analyzed by XRD. The results indicate that the Mo powders are coated with copper, at （he same time, Mo-Cu composite powders with Cu content ranging from 15% to 85% （mass fraction） can be obtained. The optimal values of pH, HCHO concentration and temperature are in the ranges of 12-13, 22-26 ml/L and 60-65℃, respectively. The diffusion-shrinkage autocatalytic model is suggested for the growth mechanism of electroless coating over the surface.     

金刚石化学镀铜及还原处理研究

为改善金刚石和金属基体的润湿性,采用两种不同还原剂的配方在金刚石颗粒上进行化学镀铜,并在氢气气氛中对镀铜膜的金刚石进行还原处理。通过扫描电镜和X射线衍射仪研究了不同还原剂和不同还原温度对镀铜膜的微观形貌和成分的影响。结果表明:采用硼氢化钾比甲醛做还原剂化学镀铜效果好,用硼氢化钾做还原剂镀的铜膜晶粒为纳米微晶结构;在氢气氛中还原温度为300℃时氧化亚铜被还原成铜,在该温度下还原的铜膜表面平整均匀,晶粒无长大现象,对薄膜形貌影响较小;还原的镀铜金刚石呈紫红色,随还原温度的升高其外表由光亮逐渐变的暗淡,铜膜晶粒逐渐长大,薄膜的粗糙度也随之变大。     

Role of additives in electroless copper plating using hypophosphite as reducing agent

In electroless copper plating baths using hypophosphite as the reducing agent, nickel ions was used to catalyze hypophosphite oxidation. However, the color of the copper deposits was dark or brown and the electrical resistivity was much higher than that obtained from formaldehyde baths. Polyethylene glycol (PEG) and K₄Fe(CN)₆ were used to improve the microstructure and properties of copper deposits obtained from electroless copper plating bath using hypophosphite as the reducing agent. The effects of PEG concentration on the deposition rate, the microstructure, morphology and electrical resistivity of the copper deposits, and the electrochemical reactions of hypophosphite (oxidation) and cupric ion (reduction) were investigated. The traces of hydrogen escaping from the deposits surface disappeared and the color of the copper deposits changed from dark-brown to dark red when the PEG concentration was 1.67 × 10^− 5 M or more. The deposition rate increased and the electrical resistivity of the copper deposits decreased slightly with the addition of PEG to the plating solution. The electrical resistivity of copper deposits decreased to 2.85 μΩ cm with 1.67 × 10^− 5 M PEG and 4.70 × 10^− 6 M K₄Fe(CN)₆ in the bath. Larger grain size and higher (220) plane orientation were obtained with the increase of PEG concentration in the bath. The electrochemical current–voltage results showed that PEG accelerated the catalytic oxidation of hypophosphite at active nickel sites and had little effect on the reduction reaction of cupric ions on the deposit surface by adsorption on the electrode.     

镁合金微弧氧化涂层上化学镀铜层的显微组织和导电性（英文）

为了赋予镁合金微弧氧化(MAO)涂层以导电特性,对MAO涂层进行化学镀铜处理。通过测试镀层的显微组织、耐蚀性和导电性,研究镀覆温度和络合剂浓度对化学镀铜层性能的影响。结果表明,最优镀覆温度为60℃,最佳络合剂浓度为30 g/L。在此条件下,可获得完整、致密的镀层。分析镀层在镁合金MAO涂层上的形成机制,提出镀覆过程的三阶段模型。镀后试样的表面方阻在经历第三阶段后降低至0.03Ω/。通过化学镀铜,MAO样品在未明显降低耐蚀性的同时获得了良好的导电性。     

Progress of electroplating and electroless plating on magnesium alloy

The current research processes of electroplating and electroless Ni-P alloy plating on magnesium alloys were reviewed. Theoretically, the reason for difficulties in electroplating and electroless plating on magnesium alloys was given. The zinc immersion, copper immersion, direct electroless Ni-P alloy plating and electroplating and electroless plating on magnesium alloys prepared by chemical conversion coating were presented in detail. Especially, the research development of magnesium alloy AZ91 and AZ31 was discussed briefly. Based on the analysis, the existing problems and future research directions were then given.