共查询到19条相似文献,搜索用时 156 毫秒
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为了适应人们对绿色环境的渴求和市场的发展,本文主要从阻燃剂的改进这一角度来研究绿色环保塑封料(EMC)。重点是从传统阻燃剂的阻燃机理到新型环保阻燃剂的阻燃机理,对绿色环保塑封料(EMC)进行探讨。同时也介绍了适用于无铅焊料工艺中对EMC的性能要求。 相似文献
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环氧塑封料(Epoxy Molding Compound)是一种半导体封装用电子材料,主要应用于半导体器件和集成电路芯片的封装。文章主要是通过对环氧塑封料的发展历程、典型技术和制造工艺,以及国内外发展状况和市场应用等方面的研究,对全球的环氧塑封料的发展状况进行浅析。文章特别提到有关绿色环保塑封料的应用情况。 相似文献
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材料是微电子工业和技术发展的粮食,随着IC封装技术的发展,对材料特性的要求也愈来愈严格,也顺势带动封装材料发展。环氧塑封料(Epoxy Molding Compound,简称EMC)是IC后道封装三大主材料(塑封料、金丝、引线框架)之一,用环氧塑封料封装超大规模集成电路(VLSI)在国内外已成为主流,目前95%以上的微电子器件都是塑封器件。本文将简要介绍EMC配方组成、反应机理、性能之间关系及其发展趋势。 相似文献
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Epoxy molding compound (EMC) has been widely used as a main material for encapsulation and protection of semiconductor packages because of its low cost, high moisture resistance, high heat resistance, and good mechanical performance. Due to the extensive application of lead-free solder in place of Sn-Pb, soldering temperature is higher than before; this demands that EMC, which is usually used for lead-free solder, should have extremely low thermal stress and excellent stability at elevated temperatures. In this work, 1,3-propanediol bis(4-aminobenzoate) (PBA) was added to an EMC product to form a novel epoxy molding compound (FEMC). PBA had very limited effect on the process feasibility of EMC, and caused reduction of the storage modulus by 40% to 50% at high temperatures and reduction of the glass-transition temperature by more than 10°C, which are very helpful to reduce thermal stress buildup during high-temperature soldering processes. The increases of the tab pull force of copper- and silver-plated lead frames within EMC due to PBA were up to 58% and 117%, respectively. With increasing PBA content in the EMC, water absorption increased in a linear fashion, so the amount of PBA added to the EMC should be limited, preferably to not more than 1%. 相似文献
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Adhesion strength of leadframe/EMC interfaces 总被引:1,自引:0,他引:1
Cu-based leadframe sheets were oxidized in alkaline solutions to produce brown and/or black oxide on the surfaces, and molded
with epoxy molding compound (EMC). The adhesion strength of leadframe/EMC interface was measured using sandwiched double-cantilever
beam (SDCB) specimens and pull-out specimens. Results showed that the adhesion strength of leadframe/EMC interface was inherently
very poor but could be increased drastically with the nucleation of acicular CuO precipitates. The presence of smooth-faceted
Cu2O on the surface of the leadframe gave close to zero fracture toughness (GC) and suitable pull strength (PS). A direct correlation between GC and PS showed that PS can be a measure of GC only in a limited range. 相似文献
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扇出型封装在塑封过程中会出现芯片偏移及翘曲等缺陷,详细了解环氧塑封材料(EMC)的特性能够准确预测封装材料、结构、塑封工艺对塑封效果的影响。针对用于扇出型封装的EMC材料采用动态机械分析仪、差示扫描量热仪、流变仪测试其动态力学性能、固化动力学性能、流变学性能和热容,并建立可用于有限元分析的材料特性数学模型。结果表明,EMC在150℃等温固化60 min后具有最少残余固化;100℃环境下黏度随温度增加速率最快;时温等效原理可预测实验频率以外的力学行为。模型曲线与实验数据的拟合优度均大于0.982,材料表征模型满足准确性与适用性的要求。 相似文献
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The reliability and the solderability of thin small outline package (TSOP) are significantly affected by the warpage that is generated after epoxy molding compound (EMC) molding process. This warpage problem mainly results from the mismatch of material properties such as Young's modulus, Poisson's ratio and coefficient of thermal expansion (CTE) and the geometric structure of each component for TSOP. The optimization of both material properties and geometric structures using the numerical analysis is necessary to reduce the warpage of TSOP. However, there are still some limitations for the numerical analysis to obtain proper results consistent with the practical warpage values. In this paper, the numerical analysis is performed under the assumption of elastic behavior for EMC. Furthermore, to solve the limitations, the material properties at the molding temperature and the degree of reaction rate at the end of the molding process of EMC are considered together for the analysis. This numerical analysis gives the higher warpage values than the measured ones, and is applicable to the practical design of the reliable electronic package. 相似文献
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Shyang-Jye Chang Sheng-Jye Hwang 《Electronics Packaging Manufacturing, IEEE Transactions on》2003,26(4):281-285
In integrated circuit (IC) packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. One can also use this instrument to determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface. 相似文献