共查询到19条相似文献,搜索用时 46 毫秒
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稀土改性的Sn-58Bi低温无铅钎料 总被引:1,自引:0,他引:1
研究了微量稀土对Sn-58Bi低温钎料的改性作用.试验添加质量分数为0.1 ?组混合稀土的无铅材料,并对比Sn-58Bi和Sn-58Bi0.5Ag合金.观察了钎料显微组织的变化并做了定量分析,采用DSC测试了钎料的熔化温度,同时测量了钎料的润湿性能、接头强度与硬度.结果表明,微量稀土添加细化了Sn-58Bi钎料合金的显微组织,对钎料的熔化温度几乎没有影响,能显著改善Sn-58Bi钎料的润湿性能和接头剪切强度,而且改善的程度优于添加微量Ag对Sn-58Bi钎料的作用. 相似文献
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Sn-Zn无铅焊料由于熔点接近Sn-Pb,价格低廉、无毒性、力学性能优良等特点,倍受人们的关注。然而由于Zn的表面活性高,在钎焊过程中焊料容易氧化,导致了润湿性能下降。本文综述合金元素对Sn-Zn无铅焊料氧化性能、润湿性的影响。并对Sn-Zn焊料今后的研究方向进行了简要分析。 相似文献
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Sn-9Zn合金无铅钎料用助焊剂研究 总被引:9,自引:1,他引:9
通过测量润湿面积和润湿角,研究不同助焊剂对Sn-9Zn焊料润湿性的影响。结果表明:助焊剂对Sn-9Zn焊料润湿性影响很大,由乳酸、聚乙二醇和SnCl2所构成的助焊剂与Sn-9Zn焊料有很好适应性;同时扫描电镜和能谱分析也表明焊料与Cu基体界面的IMC为Cu5Zn8相,比Sn-37Pb焊料具有更高的剪切强度。 相似文献
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N2保护对无铅波峰焊Sn-0.7Cu焊料的润湿性影响及其在焊接工艺中的应用 总被引:2,自引:0,他引:2
以Sn-0.7Cu焊料、免洗助焊剂为试验材料,采用SAT-5100可焊性测试仪对不同温度不同N2浓度条件下的润湿性进行测试。结果表明,实施N2保护大大改善焊料润湿性,分析润湿机理,阐明N2保护下润湿性改善的原因,指出N2保护的意义还在于拓宽生产工艺窗口,使得工艺参数可在更大范围内调整。 相似文献
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The morphology and growth kinetics of intermetallic compounds (IMCs) formed at the interfaces between liquid Sn-8Zn-3Bi solders
and nickel substrates in the temperature range from 225°C to 400°C are investigated for the applications in bonding recycled
sputtering targets to their backing plates. The results show that a continuous single layer of Ni5Zn21 IMC appears at temperatures below 325°C, while a double layer containing Ni5Zn21 and Ni35Zn22Sn43 IMCs is formed at temperatures above 325°C. In both cases, the growth kinetics of IMCs is interface-controlled. During the
growth of IMCs, their reaction fronts migrate in the direction of the solder much more rapidly than toward the nickel substrate,
and erosion of the Ni substrate is quite slight. 相似文献
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Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder 总被引:1,自引:0,他引:1
Chung-Hee Yu Kyung-Seob Kim Hyung-Il Kim Hyo-Joeng Jeon 《Journal of Electronic Materials》2005,34(2):161-167
The microstructure of Sn-37Pb and Sn-8Zn-3Bi solders and the full strength of these solders with an Au/Ni/Cu pad under isothermal
aging conditions were investigated. The full strengths tended to decrease as the aging temperature and time increased, regardless
of the properties of the solders. The Sn-8Zn-3Bi had higher full strength than Sn-37Pb. In the Sn-37Pb solder, Ni3Sn4 compounds and irregular-shaped Pb-rich phase were embedded in a β-Sn matrix. The Ni3Sn4 compounds were observed at the interface between the solder and pad. The microstructure of the as-reflowed Sn-8Zn-3Bi solder
mainly consists of the β-Sn matrix scattered with Zn-rich phase. Zinc first reacted with Au and then was transformed to the
AuZn compound. With aging, Ni5Zn21 compounds were formed at the Ni layer. Finally, a Ni5Zn21 phase, divided into three layers, was formed with column-shaped grains, and the thicknesses of the layers were changed. 相似文献
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The intermetallic compounds (IMCs) formed at the interface between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder alloy and unfluxed
Cu substrate have been investigated by x-ray diffraction, optical microscopy, scanning electron microscopy (SEM), and energy-dispersive
spectrometry (EDS). The melting point and melting range of the Sn-9Zn-1.5Ag-0.5Bi solder alloy are determined as 195.9°C and
10°C, respectively, by differential scanning calorimetry (DSC). Cu6Sn5 and Cu5Zn8 IMCs are formed between the Sn-9Zn-1.5Ag-0.5Bi/unfluxed Cu substrate wetted at 250°C for 10 sec. The interfacial adhesion
strength changes from 10.27±0.68 MPa to 8.58±0.59 MPa when soldering time varies from 10 sec to 30 sec at 250°C. 相似文献
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W.H. Lin Albert T. Wu S.Z. Lin T.H. Chuang K.N. Tu 《Journal of Electronic Materials》2007,36(7):753-759
Electromigration in Sn-8Zn-3Bi flip chip solder bumps on Cu pads has been studied at 120°C with an average current density
of 4 × 103 A/cm2 and 4.5 × 104 A/cm2. Due to the polarity effect, the thickness of the intermetallic compound Cu-Zn (γ-phase) formed at the anode is much greater than that at the cathode. The solder joint fails after 117 h of stressing at 4.5 × 104 A/cm2, and void formation at the cathode can clearly be seen after polishing. However, it is the melting at the edge of the bump
that causes the solder joint to fail. A simulation of the current density distribution indicates that the current density
is not distributed uniformly, and current crowding occurs inside the bump. The results indicate that the increase of current
density associated with Joule heating has affected melting and enhanced damage in the solder joint during electromigration. 相似文献
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Lijuan Liu 《Microelectronics Reliability》2010,50(2):251-257
Electromigration behavior in a one-dimensional Cu/Sn-8Zn-3Bi/Cu solder joint structure was investigated in ambient with a current density of 3.5 × 104 A/cm2 at 60 °C. Due to the compressive stress induced by volume expansion resulting from Cu-Zn intermetallic compound (IMC) growth, Cu5Zn8 IMC layers were squeezed out continuously along IMC/Cu interfaces at both the anode and the cathode with increasing the current stressing time, which was not only driven by the concentration gradient, but also accelerated by the electromigration. And a few voids propagated and formed at the anode and the cathode solder/IMC interfaces during electromigration. Additionally, Sn hillocks occurred in the bulk solder, and Sn hillocks formed at the anode side were larger than those at the cathode side. 相似文献
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Encapsulation of lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance 总被引:2,自引:0,他引:2
Tomohiro Iwasaki Jeong Hwan Kim Shohei Mizuhashi Munetake Satoh 《Journal of Electronic Materials》2005,34(5):647-654
An encapsulation treatment of lead-free Sn/Zn/Bi solder powder was investigated for improving the oxidation resistance. Sn-8mass%Zn-3mass%Bi
alloy particles were coated with a wax (12-hydroxystearic acid) powder by means of a dry mechanical treatment method using
a ball mill. In order to determine the optimum operating conditions of the ball mill in the wax-coating treatments, the compressive
energy required for deforming a single Sn/Zn/Bi alloy particle was measured with an unconfined compression tester and the
mechanical energy applied to the alloy particles in the ball mill was estimated using the results of the compression test.
The optimum operating conditions were determined based on both the applied energy and the flowability of solder pastes, and
the wax-coated alloy particles maintaining the spherical shape were obtained under the conditions. The wettability test and
the solder balling test for the solder pastes containing the wax-coated alloy particles stored at room temperature in air
were carried out to evaluate the oxidation resistance performance. The wax-coated alloy particles had an excellent wettability
compared with the original alloy particles, and the oxidation resistance of the Sn/Zn/Bi solder powder was improved by the
encapsulation treatment. 相似文献
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