快速热处理技术在集成电路制造上的应用

主要介绍快速热处理技术，包括在高速双极ＩＣ的快速热退火，Ｔｉ金属与Ｓｉ形成低阻的ＴｉＳｉ２接触同时，其上表面形成防止Ａｌ往Ｓｉ中渗透的阻挡层ＴｉＮ的ＲＴＰ，及ＥＥＰＲＯＭ隧道薄栅的快速热氧化和用Ｎ２Ｏ加固薄栅用的快速热氮化等方面的应用。     

高速双极集成电路中的快速热退火

本文介绍近年来发展较快的快速热退火(RTA)技术在高速双极IC(集成电路)的应用,文中给出RTA技术与普通热退火的比较,也给出了RTA技术在高速双极集成电路中应用的结果。     

超大规模集成电路的CVD薄膜淀积技术

介绍了在超大规模集成电路制造工艺中,用化学气相（ＣＶＤ）方法淀积各种薄膜的反应机理和特性,及这些薄膜在器件制造工艺中的应用。     

超大规模集成电路激光束加工技术的新进展

本文给出了近十年来各种波长的激光在超大规模集成电路(VLSI)的精细化加工中的应用领域,重点介绍了激光在VLSI制备中应用的新进展。包括激光金属平坦化,激光载带自动键合,激光多层布线和多芯片互连以及激光掩膜版和芯片图形缺陷的修复。     

硅超大规模集成电路技术和发展

本文介绍了国际上硅超大规模集成电路技术和产品的发展状况,阐述了硅超大规模集成电路关键技术和产品特点及其发展趋势,对我国集成电路同行将起借鉴作用。     

超大规模集成电路气体净化工艺

介绍超大规模集成电路生产所使用的主要气体的净化工艺和装置以及系统设计和安装中应 问题。     

超大规模集成电路和微组装技术

本文研究了在多层陶瓷基板上利用硅作为衬底的硅-硅包装技术。这种硅-硅和多层陶瓷基板的微组装技术,可以消除IC芯片与衬底之间的热失配。同时可充分利用硅IC技术进一步细线化。随着ASIC、BiCMOS、VLSIC的迅速发展,将使今后的封装及微组装向多腿及小问距方向发展。     

用离子束混合及快速热处理方法形成钽的硅化物

本文描述用离子束透过钽金属膜进行混合和快速热处理方法来形成钽的硅化物.用溅射方法在P型硅衬底上淀积一层金属钽,然后用砷离子束透过钽金属模进行混合,采用快速热处理后形成了平整的硅化钽薄层.使用厚度为500埃的钽金属膜,得到钽的硅化物薄层电阻为5.5Ω/□.研究了砷离子能量、剂量及钽膜厚度对钽的硅化物薄层电阻的影响.用透射电镜和台阶仪对所形成的硅化钽进行了分析和厚度测量.     

Design of Rapid Thermal Processing for Large Diameter Wafer

The relationship between the arrangement of tungsten-halogen lamps and the uniformity of irradiance received by the wafer is discussed, and a sort of axial-symmetrical lamps-array is designed to guarantee that the irradiation on the edge is approximately the same as the one on the center of the wafer. The magnitude of temperature on the wafer vs. the power of tungsten-halogen lamps is calculated numerically.     

GaAs VHSIC的离子注入和快速热退火的均匀性研究

研究了改变注入角、ｐ型埋层注入及红外快速热退火对ＧａＡｓＩＣ有源层均匀性的影响，得到了表面形貌好、大面积均匀性良好的注入掺杂有源层。在２英寸圆片上做出的场效应管无栅饱和电流相对偏差２．３％，器件阈值电压标准偏差９８ｍＶ。用该材料做出了６７２门ＧａＡｓ超高速门阵电路，还做出了工作频率为５ＧＨｚ的除二动态分频器。     

Solid-phase Crystallization of Amorphous Silicon Films by Rapid Thermal Annealing

The morphous silicon films prepared by PECVD at substrate temperatures of 30℃ have been crystallized by rapid thermal annealing method, the budget of time-temperature in the annealing process is 600℃ for 120s, 850℃ for 120s, and 950℃ for 120s. The results indicate the crystallization at 850℃ and 950℃ are better as shown in micro-Raman scattering and scanning electronic microscope.     

难熔金属硅化物的喇曼散射

用电子束蒸发方法在10~(-7)托真空中使单晶硅上蒸上一层Ti膜后,于N_2中进行从500-1000℃10秒钟的快速热退火,由激光喇曼光谱结合薄层电阻测量和转靶X射线衍射研究分析了TiSi_2的形成.退火温度高于680℃时,观察到207和244cm~(-1)波数处的两个TiSi_2的特征喇曼峰,当退火温度为580℃时,只有270,297和3ncm~(-1)的三个喇曼峰,这些可能是钛的氧化物和不包括TiSi的钛硅化物.     

卤素灯快速退火在硅浅结器件中的应用

用卤素灯快速退火工艺代替原始的炉退火工艺,使全离子注入的硅双极浅结器件的杂质浓度更高、结深更浅,从而有效地改善了器件的电参数性能。用这种新工艺制做的分频器,工作频率由原来的1300MHz提高到了1600MHz。该工艺操作方便,节省能源,均匀性、重复性、可控性都大大地优于原始炉退火工艺。     

Rapid thermal annealing of si implanted gaas

Rapid thermal annealing (RTA) technology offers potential advantages for GaAs MESFET device technology such as reducing dopant diffusion and minimizing the redistribution of background impurities. LEC semi-insulating GaAs substrates were implanted with Si at energies from 100 to 400 keV to doses from 1 × 10¹² to 1 × 10¹⁴/cm². The wafers were encapsulated with Si₃N₄ and then annealed at temperatures from 850-1000° C in a commercial RTA system. Wafers were also annealed using a conventional furnace cycle at 850° C to provide a comparison with the RTA wafers. These implanted layers were evaluated using capacitance-voltage and Hall effect measurements. In addition, FET’s were fabricated using selective implants that were annealed with either RTA or furnace cycles. The effects of anneal temperature and anneal time were determined. For a dose of 4 × 10¹²/cm² at 150 keV with anneal times of 5 seconds at 850, 900, 950 and 1000° C the activation steadily increased in the peak of the implant with overlapping profiles in the tail of the profiles, showing that no significant diffusion occurs. In addition, the same activation could be obtained by adjusting the anneal times. A plot of the equivalent anneal times versus 1/T gives an activation energy of 2.3 eV. At a higher dose of 3 × 10¹³ an activation energy of 1.7 eV was obtained. For a dose of 4 × 10¹² at 150 keV both the RTA and furnace annealing give similar activations with mobilities between 4700 and 5000 cm²/V-s. Mobilities decrease to 4000 at a dose of 1 × 10¹³ and to 2500 cm²/V-s at 1 × 10¹⁴/cm². At doses above 1 × 10¹³ the RTA cycles gave better activation than furnace annealed wafers. The MESFET parameters for both RTA and furnace annealed wafers were nearly identical. The average gain and noise figure at 8 GHz were 7.5 and 2.0, respectively, for packaged die from either RTA or furnace annealed materials.     

砷预非晶制作结深小于0.25μm的浅结

本文报道了As预非晶制作浅P~+n结,对As预非晶的能量和剂量的选择作了研究,并对常规炉退火(950℃,N_2,30m)和快速热退火(RTA,1050℃,10_s)作了比较。结果表明,A_s预非晶可有效地抑制B~+注入沟道效应,阻止B~+增强扩散,在常规条件下可以实现x_j<0.25μm,R_□<100Ω/□的源漏浅结,并已应用于1M位DRAM生产。     

Rapid thermal alloyed ohmic contact on inp

The results of a study of the electrical and metallurgical properties of thin metallic layers deposited on InP for use as an ohmic contact are presented. A rapid thermal annealing system was used to alloy AuGe/Ni/Au contacts ton-type ion implanted InP. Rutherford backscattering and contact resistivity measurement were used to evaluate the structural and electrical characteristics of these rapid thermal alloyed thin films. Varying degrees of mixing between the metals and the semiconductor were found depending on the temperature and temperature-time cycle. These results were compared to furnace and graphite strip-heater alloying techniques. A correlation between the interface structure and the contact resistance was found. Temperatures between 430 and 450° C and alloying time of 2 sec have produced the best electrical results, with specific contact resistance as low as 2*10^?7 Ω cm² on semi-insulating InP which was Siimplanted with a peak concentration about 2*10¹⁸ cm^?3. The optimum alloy temperature is marked by the onset of substantial wrinkling of the contact surface, whereas essentially smooth surfaces are obtained at temperatures below optimum. The depth of the alloyed ohmic contact is controlled by the time of heating and could be less than 1000Å.     

离子注入快速热退火制造类视见函数光电探测器

采用离子注入,红外快速热退火方法制造硅探则器,由喇曼散射方法检测损伤消除效果,确定快速热退火的温度,借助本征吸除等工艺技术,可以方便地得到性能优良的类视见函数光电探测器。