Discrete and continuous deformation during nanoindentation of thin films

This paper describes nanoindentation experiments on thin films of polycrystalline Al of known texture and different thicknesses, and of single crystal Al of different crystallographic orientations. Both single-crystalline and polycrystalline films, 400–1000 nm in thickness, are found to exhibit multiple bursts of indenter penetration displacement, h, at approximately constant indentation loads, P. Recent results from the nanoindentation studies of Suresh et al. (Suresh, S., Nieh T.-G. and Choi, B.W., Scripta mater., 1999, 41, 951) along with new microscopy observations of thin films of polycrystalline Cu on Si substrates are also examined in an attempt to extract some general trends on the discrete and continuous deformation processes. The onset of the first displacement burst, which is essentially independent of film thickness, appears to occur when the computed maximum shear stress at the indenter tip approaches the theoretical shear strength of the metal films for all the cases examined. It is reasoned that these displacement bursts are triggered by the nucleation of dislocations in the thin films. A simple model to estimate the size of the prismatic dislocation loops is presented along with observations of deformation using transmission electron microscopy and atomic force microscopy. It is demonstrated that the response of the nanoindented film is composed of purely elastic behavior with intermittent microplasticity. The overall plastic response of the metal films, as determined from nanoindentation, is shown to scale with film thickness, in qualitative agreement with the trends seen in wafer curvature or X-ray diffraction measurements.     

Synchrotron X-ray microdiffraction reveals rotational plastic deformation mechanisms in polycrystalline thin films

Understanding the mechanical response of polycrystalline materials on the mesoscopic scale remains a challenge as it is largely determined by grain-to-grain interactions and the discrete underlying microstructure. We conducted in situ synchrotron Laue microdiffraction experiments to map local strain tensors and orientations over polycrystalline thin gold films for different applied biaxial strain states. The experimental results demonstrate stress relaxation to be accompanied by cooperative transport of dislocation density leading to rotational plastic deformation heterogeneities. We propose a disclination model of closed dislocation walls and consider the geometry of transformations corresponding to a Burgers circuit enclosing the multipole disclination configuration. The observed stress-driven rotational deformation of the grain is shown to be described by the change in rotational closure failure associated with a Burgers circuit around the multipole disclination configuration. This concept is further advanced in a non-Euclidian geometry to demonstrate that the observed microrotation is captured by higher-order gradients in a micropolar continuum theory.     

加载速率对Al膜纳米压入蠕变性能的影响

纳米压入仪对Si片上晶Al膜进行的压入蠕变实验表明,加载方式对Al膜的蠕变性能有明显影响.随加载速率和载荷的增大, Al膜的总蠕变量和应力指数均有较大升高 且蠕变初期可能存在异常高蠕变率.分析认为这与是加载过程中未及发生的塑性变形的持续释放有关.对于确定的薄膜材荆及组织结构,加载过程中积攒的塑性变形量及其释放速率将影响不同加载条件下的总蠕变量和应力指数.     

基于滑移/孪生耦合模型的镁合金多晶体塑性成形分析

镁合金的各向异性是由滑移和孪生共同作用产生,而孪生是协调镁合金塑性变形的重要机制。尤其在低温变形条件下,滑移和孪生相互协调并影响其成形性能。为准确描述镁合金成形过程的变形机制,文章建立了一种基于滑移和孪生相互耦合的多晶体塑性模型,并引入到有限元分析过程中。其中金属塑性流动,由每个晶粒内滑移面上沿滑移方向产生的剪切变形及孪生面上的孪生变形共同组成,进而采用率无关晶体塑性模型模拟了AZ31镁合金压缩过程,并给出了孪晶体积分数随时间的变化曲线。研究表明,孪晶体积分数随变形应力产生相应变化,并且基面滑移和孪生是影响镁合金室温成形性能及加工硬化的主要因素。     

纳米多晶金刚石微结构及塑性形变机制的研究进展

纳米多晶金刚石是指晶粒尺寸小于100 nm的金刚石晶粒直接结合而形成的多晶材料。石墨经高温高压直接转变合成的纳米多晶金刚石的硬度达120~145 GPa,洋葱碳直接转变合成的金刚石晶粒内含高密度孪晶,此纳米孪晶金刚石硬度达200 GPa,远超单晶金刚石的硬度。材料优良的性能源于其微观结构,揭示其塑性形变机制将利于更高性能纳米超硬材料的设计与合成。本文概述了纳米多晶金刚石微观结构及其塑性形变机制的国内外研究现状,重点介绍和评价了纳米多晶金刚石塑性形变机制的实验及理论研究,为纳米多晶金刚石材料的进一步研究和应用提供参考。      

晶粒尺寸与保载载荷对Cu膜纳米压入蠕变性能的影响

利用纳米压入仪对Si片上的多晶Cu膜进行压入蠕变研究．实验结果显示晶粒尺寸大于200nm时，应力指数对晶粒尺寸不敏感．当晶粒尺寸小于200nm时，因压头底部更多的晶粒参与变形，应力指数随晶粒尺寸的降低而增大．认为薄膜材料存在一个对应力指数不敏感的最小If缶界晶粒尺寸ιc，Cu膜的应力指数随保载载荷增大而增大，其主要原因在于高载荷下位错强化机制使蠕变率降低。     

Deformation behavior of thin copper films on deformable substrates

The role of strain hardening for the deformation of thin Cu films was investigated quantitatively by conducting specialized tensile testing allowing the simultaneous characterization of the film stress and the dislocation density as a function of plastic strain. The stress–strain behavior was studied as a function of microstructural parameters of the films, such as film thickness (0.4–3.2 μm), grain size and texture. It was found that the stress–strain behavior can be divided into three regimes, i.e. elastic, plastic with strong strain hardening and plastic with weak hardening. The flow stresses and the hardening rate increase with decreasing film thickness and/or grain size, and are about two times higher in (111)-grains compared to the (100)-grains. These effects will be discussed in the light of existing models for plastic deformation of thin films or fine grained metals.     

Changes in the misfit stresses in an Al/SiCp metal matrix composite under plastic strain

Results are presented from neutron diffraction measurement of the strains in each phase, matrix and reinforcement, of a metal matrix composite bar before and after deformation beyond the elastic limit by four-point bending. The strains in each phase have been converted to stress. A stress separation technique was then applied, and the contributing mechanisms separated and identified. In this way the changes in the different contributions owing to plastic deformation have been determined. It is found that, initially, the average phase stresses can be explained in terms of a combination of essentially hydrostatic phase average thermal misfit stresses in the matrix (tension) and particles (compression) combined with a parabolic macrostress from quenching. After plastic bending the change in axial macrostress is as expected for that for a monolithic bar, but unexpectedly the misfit stresses had relaxed to approximately zero in both the tensile and compressive plastically strained regions of the bar.     

Restoration of face-centered cubic metals subjected to kinetic spraying

Deformation mode and restoration of face-centered cubic (FCC) metal (Al, Ni, and Cu) particles subjected to kinetic spraying (KS) were investigated. The FCC metal particles were accelerated to supersonic velocity by high pressure process gas, and collided with substrates or previously deposited coating layer. The high velocity impact of in-flight particles and their successive deposition leads to severe plastic deformation at ultra-high strain rate and the dissipation of heat energy from the plasticity. Accordingly, highly strained interface undergoes restoration to stabilize strained area during KS. Although Al, Ni, and Cu have equivalent slip systems {111} 〈110〉, the different physical and metallurgical properties of the FCC metals differentiate the deformation mode and lead to variations in static recovery and recrystallization rates. The deformation and restoration behavior of KS FCC metals are discussed, taking into account the physical and metallurgical factors such as stacking fault energy, dislocation mobility, diffusivity, and melting point.     

In-situ TEM tensile testing of DC magnetron sputtered and pulsed laser deposited Ni thin films

Two nanocrystalline Ni thin films, one prepared via DC Magnetron Sputtering and the other prepared via Pulsed Laser Deposition, were strained in-situ in the Transmission Electron Microscope. Although the grain sizes were similar, the two films behaved quite differently in tension. The sputtered material was found to behave in a brittle manner, with failure occurring via rapid coalescence of intergranular cracks. Conversely, the laser deposited film behaved in a ductile manner, with failure occurring by slow ductile crack growth. The difference in failure mechanism was attributed to the presence of grain boundary porosity in the sputtered thin film. Both films exhibited pervasive dislocation motion before failure, and showed no conclusive evidence of a change in deformation mode.     

A study of surface roughening in fcc metals using direct numerical simulation

Grain-scale surface roughening due to plastic straining in polycrystalline aluminum is studied with the aid of a three-dimensional finite-element crystal-plasticity model. An improved understanding of the origin of surface roughening profiles in plastically strained aluminum is sought. Large-scale, Direct Numerical Simulation enables the computation of full-field solutions and the explicit consideration of the deformation of individual crystals as well as of their crystalline texture evolution and interaction with neighboring grains. Simulations are conducted on idealized flat sheet polycrystalline aluminum samples under uniaxial and biaxial loading conditions. The results obtained show that the ensuing surface profiles are controlled by several factors: applied boundary conditions, Taylor factor and shear tendency of the individual grains and the spatial distribution of grain neighborhood orientations. The conditions leading to different ridging profiles, e.g., corrugated and ribbed surface profiles, are discussed.     

纯钛压缩变形下的晶体塑性有限元分析

考虑滑移和孪晶变形机制,建立描述密排六方结构(HCP)金属力学行为的晶体塑性模型。利用该模型对纯钛在室温下的单向压缩试验进行模拟,模拟结果和实验结果吻合,证明模型具有可靠性;揭示了孪晶体积分数的变化规律、饱和的原因、参数对其的影响,以及速率敏感系数对结果的影响规律。     

Metal particle deposition stimulation by surface abrasive treatment in gas dynamic spraying

Processes of supersonic blasting for producing thin metal coatings and of cold spray for producing thick coatings by solid metal particle jets are based on the particle plastic deformation. Extensive plastic deformation of accelerated metal particles at the surface roughness was observed. The possibility of stimulation of metal particle deposition by the substrate and coating blasting by ceramic particles was experimentally confirmed. The process of thick coating creation by the mixed metal-ceramic powder supersonic jet is presented.     

板材脉冲激光微冲击成形技术及研究现状

激光微冲击成形是利用脉冲激光作用于材料时引起的等离体爆轰波的冲击作用,使超薄板材产生塑性变形的新技术,可以用于微弯曲、微拉深、微胀形等。文章介绍了脉冲激光微冲击成形技术的原理和特点,概括了激光微冲击成形的影响因素和有限元模拟关键技术,从激光诱导冲击波、板材变形机制、冲击后材料力学性能和微观组织变化等方面,综述了激光微冲击成形技术的研究进展,并对其发展趋势进行展望。     

Influence of process parameters on hybrid forming of aluminum sheet

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Molecular dynamics simulation on mechanisms of plastic anisotropy in nanotwinned polycrystalline copper with {111} texture during tensile deformation

Based on molecular dynamics (MD) simulation, the mechanisms of plastic anisotropy in nanotwinned polycrystalline copper with {111} texture during tensile deformation were systematically studied from the aspects of Schmid factor of the dominant slip system and the dislocation mechanism. The results show that the Schmid factor of dominated slip system is altered by changing the inclining angle of the twin boundaries (TBs), while the yield stress or flow stress does not strictly follow the Schmid law. There exist hard and soft orientations involving different dislocation mechanisms during the tensile deformation. The strengthening mechanism of hard orientation lies in the fact that there exist interactions between the dislocations and the TBs during plastic deformation, which leads to the dislocation blocking and reactions. The softening mechanism of soft orientation lies in the fact that there is no interaction between the dislocations and the TBs because only the slip systems parallel to the TBs are activated and the dislocations slip on the planes parallel to the TBs. It is concluded that the plastic anisotropy in the nanotwinned polycrystalline copper with {111} texture is aroused by the combination effect of the Schmid factor of dominated slip system and the dislocation mechanism.     

超声滚压剧烈塑性变形诱导金属材料结构演变的研究进展

首先,对表面完整性的基本概念和内涵进行了概述,同时简要介绍了超声实现滚压技术的基本原理及其优点。随后,对比分析了不同剧烈塑性变形方法的特点和局限性,引出了实现表面完整性的相关剧烈塑性变形协调机制。在此基础上,随后结合其他剧烈塑性变形强化工艺,重点总结了超声滚压剧烈塑性变形对金属材料表面微观结构演变的影响。具体探讨了剧烈塑性变形诱导晶粒细化机制、晶粒生长机制以及合金元素偏聚机制等,主要分别论述了不同层错能的面心立方、体心立方以及密排六方等不同金属晶体结构的晶粒细化机制(以位错滑移、变形孪晶为主导)、晶粒长大机制(以晶界迁移、晶粒旋转为主要)与合金元素偏聚机制(晶界偏聚、位错核心偏聚)等。最后,对以上内容进行了综合总结,并针对超声滚压技术研究中存在的问题给出进一步研究和发展的建议,从而为实现超声滚压金属材料的表面完整性的主动精准控制及提高其服役寿命与可靠性提供一定的参考。     

Transformations of grain boundary dislocation pile-ups in nano- and polycrystalline materials

A theoretical model is suggested which describes several types of transformations of grain boundary dislocation pile-ups at triple junctions of grain boundaries in (super) plastically deformed nanocrystalline and polycrystalline materials. Ranges of parameters of defect configurations are revealed at which the transformations considered are energetically favourable. The role of transformations of grain boundary dislocation pile-ups at triple junctions of grain boundaries in plastic deformation processes in nanocrystalline and polycrystalline materials is discussed with special attention being paid to the influence of such transformations on competition between different deformation mechanisms in nanocrystalline materials.     

多晶沉积薄膜生长过程中织构演变的模拟研究

将织构组态熵的概念应用于沉积多晶薄膜织构演变的模拟研究,考虑膜沉积过程中晶体表面能各向异性及应变能各向异性的变化,建立了沉积薄膜晶体择优生长的定量模型;模拟了Ａｌ多晶薄膜沉积过程中晶体的生长规律,分析了织构演变的主要微观物理因素。     

Platinum colloid catalyzed etchingless gold electroless plating with strong adhesion to polymers

Echingless electroless plating (ELP) process that can produce gold thin film with strong adhesion to various polymer films has been developed. We have found that platinum (Pt) colloidal nanoparticles have excellent catalytic activity for ELP. The Pt colloidal nanoparticles can be immobilized via electrostatic interactions on a substrate simply by dipping it into a Pt colloid. Owing to the excellent catalytic property of the Pt nanoparticles, continuous gold thin films can be produced at room temperature using a simple cyanide-free gold electroless plating solution composed of chloroauric acid and hydrogen peroxide. The process requires no surface modifications for the immobilization of the catalyst, and by simple post-annealing the adhesion of the plated films to various polymer films can be improved by three orders of magnitude in comparison to that of “as-deposited” film. The process developed in this work is expected to be an environment-friendly thin metal film deposition process without the use of toxic and hazardous substances.