双异质结双平面掺杂HEMT器件的电荷控制模型

利用泊松方程以及异质结能带理论,通过费米能级-二维电子气浓度的线性近似,推导了基于双异质结双平面掺杂的HEMT器件的电荷控制模型.计算分析了沟道顶部和底部平面掺杂浓度,栅金属与顶部平面掺杂层距离等材料结构尺寸和阈值电压、二维电子气浓度的关系.该模型为优化和预测双平面掺杂HEMT器件性能提供了一个有效手段.     

双平面掺杂和单平面掺杂PHEMT器件的性能比较

研制了Al0.24Ga0.76As/In0.22Ga0.78As单平面掺杂PHEMT器件(SH-PHEMT)和双平面掺杂PHEMT器件(DH-PHEMT),并对其特性进行了比较.由于采用了双异质结、双平面掺杂的设计,DH-PHEMT能将载流子更好地限制在沟道中,得到更大的二维电子气浓度和更均匀的二维电子气分布,这些都有利于提高器件的性能.因此,DH-PHEMT器件具有更好的线性度,在较大的栅压范围内具有高的跨导和更大的电流驱动能力.这说明DH-PHEMT器件更加适用于高线性度应用的微波功率器件.     

双平面掺杂和单平面掺杂PHEMT器件的性能比较

研制了Al0 .2 4 Ga0 .76 As/ In0 .2 2 Ga0 .78As单平面掺杂PHEMT器件(SH - PHEMT)和双平面掺杂PHEMT器件(DH- PHEMT) ,并对其特性进行了比较.由于采用了双异质结、双平面掺杂的设计,DH- PHEMT能将载流子更好地限制在沟道中,得到更大的二维电子气浓度和更均匀的二维电子气分布,这些都有利于提高器件的性能.因此,DH- PHEMT器件具有更好的线性度,在较大的栅压范围内具有高的跨导和更大的电流驱动能力.这说明DH-PHEMT器件更加适用于高线性度应用的微波功率器件.     

δ掺杂AlGaAs/GaAsHEMT的二维量子模型

本文我们首次建立了δ掺杂AlGaAs／GaAs高电子迁移串晶体管（HEMT）的二维量子模型，这种模型考虑了HEMT器件沟道中二维电子气的量子特性，根据这个模型，我们应用二维数值模拟方法和自治求解薛定谔方程和泊松方程获得了器件沟道中的二维电子浓度，同时也得到了器件沟道中的横向电场分布和横向电流密度．模拟结果表明二维电子气主要分布在异质结GaAs一侧量子附中．详细讨论了不同栅压和不同漏压下HEMT沟道中的二维电子浓度的分布及变化．     

AlGaN/GaN材料HEMT器件优化分析与I-V特性

在考虑AlGaN/GaN异质结中的压电极化和自发极化效应的基础上,自洽求解了垂直于沟道方向的薛定谔方程和泊松方程.通过模拟计算,研究了AlGaN/GaN HEMT器件掺杂层Al的组分、厚度、施主掺杂浓度以及栅偏压对二维电子气特性的影响.用准二维物理模型计算了AlGaN/GaN HEMT器件的输出特性,给出了相应的饱和电压和阈值电压,并对计算结果和AlGaN/GaN HEMT器件的结构优化进行了分析.     

AlGaN/GaN材料HEMT器件优化分析与I-V特性

在考虑Al Ga N / Ga N异质结中的压电极化和自发极化效应的基础上,自洽求解了垂直于沟道方向的薛定谔方程和泊松方程.通过模拟计算,研究了Al Ga N / Ga N HEMT器件掺杂层Al的组分、厚度、施主掺杂浓度以及栅偏压对二维电子气特性的影响.用准二维物理模型计算了Al Ga N/ Ga N HEMT器件的输出特性,给出了相应的饱和电压和阈值电压,并对计算结果和Al Ga N/ Ga N HEMT器件的结构优化进行了分析.     

AlN阻挡层对AlGaN/GaN HEMT器件的影响

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN异质结和AlGaN/AlN/GaN异质结二维电子气材料,采用相同器件工艺制造出了AlGaN/GaN HEMT器件和AlGaN/AlN/GaN HEMT器件.通过对两种不同器件的比较和讨论,研究了AlN阻挡层的增加对AlGaN/GaN HEMT器件性能的影响.     

AlN阻挡层对AlGaN/GaNHEMT器件的影响

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN异质结和AlGaN/AlN/GaN异质结二维电子气材料,采用相同器件工艺制造出了AlGaN/GaN HEMT器件和AlGaN/AlN/GaN HEMT器件.通过对两种不同器件的比较和讨论,研究了AlN阻挡层的增加对AlGaN/GaN HEMT器件性能的影响.     

HEMT及其界面态效应的二维数值模拟

本文提出了一个调制掺杂异质结界面态模型,并首次将界面态效应引入到HEMT的二维数值模型中.本文用基于异质结漂移-扩散模型建立的 HEMT二维数值模型对常规结构的 AlGaAs/GaAs HEMT进行了模拟,讨论了 HEMT的内部工作机制,特别是异质结效应.本文着重模拟分析了HEMT中界面态对器件性能的影响。模拟结果表明界面态对HEMT的特性有显著的影响.     

非掺杂AlGaN/GaN微波功率HEMT

Ga N有较 Ga As更宽的禁带、更高的击穿场强、更高的电子饱和速度和更高的热导率 ,Al Ga N/Ga N异质结构不仅具有较 Ga As PHEMT中Al Ga As/In Ga As异质结构更大的导带偏移 ,而且在异质界面附近有很强的自发极化和压电极化 ,极化电场在电子势阱中形成高密度的二维电子气 ,这种二维电子气可以由不掺杂势垒层中的电子转移来产生。理论上 Al Ga N/Ga N HEMT单位毫米栅宽输出功率可达到几十瓦 ,而且其宽禁带特点决定它可以承受更高的工作结温 ,作为新一代的微波功率器件 ,Al Ga N/Ga N HEMT将成为微波大功率器件发展的方向。采…     

增强型AlGaN/GaN/AlGaN双异质结槽栅HEMT研究

为了在获得高击穿电压的同时实现增强型器件,对AlGaN/GaN/AlGaN双异质结HEMT进行了栅槽刻蚀,得到阈值电压为0.6 V的增强型HEMT。对器件特性的变化机理进行了分析,发现刻蚀引入的陷阱态使器件的击穿性能降低。采用变频电导法,定量研究了反应离子刻蚀在AlGaN/GaN/AlGaN双异质结HEMT中引入的陷阱态。研究表明,刻蚀工艺在双异质结HEMT中引入了大量的浅能级陷阱,这些陷阱的能级主要分布在0.36~0.40 eV。     

22 nm In0.75Ga0.25As channel-based HEMTs on InP/GaAs substrates for future THz applications

In this work, the performance of L_g=22 nm In_0.75Ga_0.25As channel-based high electron mobility transistor (HEMT) on InP substrate is compared with metamorphic high electron mobility transistor (MHEMT) on GaAs substrate. The devices features heavily doped In_0.6Ga_0.4As source/drain (S/D) regions, Si double δ-doping planar sheets on either side of the In_0.75Ga_0.25As channel layer to enhance the transconductance, and buried Pt metal gate technology for reducing short channel effects. The TCAD simulation results show that the InP HEMT performance is superior to GaAs MHEMT in terms of f_T, f_max and transconductance (g_{m_max}). The 22 nm InP HEMT shows an f_T of 733 GHz and an f_max of 1340 GHz where as in GaAs MHEMT it is 644 GHz and 924 GHz, respectively. InGaAs channel-based HEMTs on InP/GaAs substrates are suitable for future sub-millimeter and millimeter wave applications.     

An analytical model for discretized doped InAlAs/InGaAs heterojunction HEMT for higher cut-off frequency and reliability

In the proposed work the model has been formulated for discretized doped HEMT, where the conventional uniformly doped, pulsed doped and delta doped structure are the special cases. An expression for sheet carrier density has been formulated considering the effect of doping-thickness product and has been extended to calculate drain current, transconductance, capacitance and cut-off frequency of the device. The model also takes into account the non-linear relationship between sheet carrier density and quasi Fermi energy level to validate it from subthreshold region to high conduction region. The results so obtained have been compared with pulsed doped structure to validate the model. The analysis concentrates on the distance of doping from the heterojunction and gate electrode. Different design criteria have been given to dope the carriers (amount and distance) in different regions to optimize the performance for higher sheet carrier density/parallel conduction voltage/effective parallel conduction voltage (V_c−V_off) to increase the transconductance, cut-off frequency and reliability of the device.     

0.5 mu m gate length InP/In/sub 0.75/Ga/sub 0.25/As/InP pseudomorphic HEMT with high DC and RF performance

High performance InP/In/sub 0.75/Ga/sub 0.25/As/InP pseudomorphic double heterojunction (DH) HEMTs with a gate length of 0.5 mu m are reported. Both DC and RF characteristics of this new type of Al-free HEMT demonstrate its suitability for microwave applications.<>     

Si/Si_(1-x)Ge_x HEMT异质结层的结构与二维电子气密度的关系

从晶格匹配及能带阶跃角度讨论了设计一个 n沟 Si/Si1-x Gex HEMT异质结层的原理及方法 ,对 K.Ismail器件进行了分析和计算 ,所得 2 DEG的 ns与实验结果基本相符 ,并利用该设计理论对 K. Ismail器件的异质结结构进行了优化改进 ,提高了器件 2 DEG的 ns。     

Recessed-gate AlGaAs-InGaAs-GaAs pseudomorphic HEMT withSi-planar-doped etch stop layer

An improved slot etch technique based on an Si planar doped layer has been applied to gate recessing in the fabrication of AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistors (HEMTs). The devices exhibited comparable g_m with much better breakdown and leakage behaviour than conventional pseudomorphic HEMT devices     

A technique for modelling S-parameters for HEMT structuresas a function of gate bias

A physically based technique for modeling HEMT structure S-parameters is presented. The core of the model is directly dependent on the HEMT wafer structure and the physical gate length. The model accurately predicts the device's S-parameters as a function of the applied gate bias. The physical basis facilitates the modeling of different types of HEMT structures. Measured S-parameters and simulation results over a frequency range of 1 to 25 GHz are presented for three different HEMT structures: uniformly doped, GaAs channel; pulse-doped, GaAs channel; and uniformly doped, strained InGaAs channel     

A microwave power double-heterojunction high electron mobility transistor

A microwave power high electron mobility transistor (HEMT) has been developed and tested in theK-band frequency range. The HEMT has a unique configuration of a selectively low-doped (AlGa)As/GaAs/(AlGa)As double heterojunction resulting in both capability of high-current density and high gate breakdown voltage. The structure showed electron mobility of 6800 cm²/V.s and two-dimensional (2-D) electron density as high as 1.2 × 10¹²cm^-2at room temperature. An output power of 660 mW (550 mW/mm) with 3.2-dB gain and 19.3-percent power added efficiency was achieved at 20 GHz with 1-µm gate length and 1.2-mm gate periphery. A similar device with 2.4-mm gate width produced an output power of 1 W with 3-dB gain and 15.5-percent efficiency. These results offer microwave high power capability in a double-heterojunction HEMT (DH-HEMT).     

Performance potential of high-frequency heterojunction transistors

Assuming a state-of-the-art microwave planar geometry, the maximum frequency of oscillation has been calculated for GaAs-Ge heterojunction transistors utilizing either doped or high-resistivity space-charge-limited emitters. This is compared with a Ge homojunction transistor of the same geometry. A detailed equivalent circuit is used which accounts for the parasitics of the chip. It is shown that if chip parasitics are neglected, GaA-Ge devices should outperform Ge devices by about 4 to 1 in power gain. In the geometry assumed, however both heterojunction and homojunction transistors are limited by wafer parasitics, particularly base contact resistance. The calculated figures of merit of the two types of devices are therefore quite similar.     

Two-dimensional numerical model for the high electron mobility transistor

A two-dimensional numerical drift-diffusion model for the High Electron Mobility Transistor (HEMT) is presented. Special attention is paid to the modeling of the current flow over the heterojunction. A finite difference scheme is used to solve the equations, and a variable mesh spacing was implemented to cope with the strong variations of functions near the heterojunction. Simulation results are compared to experimental data for a 0.7 μm gate length device. Small-signal transconductances and cut-off frequency obtained from the 2-D model agree well with the experimental values from S-parameter measurements. It is shown that the numerical models give good insight into device behaviour, including important parasitic effects such as electron injection into the bulk GaAs.