纳米孔径垂直腔面发射激光器的制备及特性

在850 nm波长垂直腔面发射激光器的基础上制备了纳米孔径垂直腔面发射激光器.当小孔尺寸为400 nm×400 nm时,在25 mA驱动电流下,其最大输出光功率达到了0.3 mW,功率密度约为2 mW/μm2.文中介绍了纳米孔径垂直腔面发射激光器的制备工艺,并对它的光谱特性和寿命特性进行了分析.     

具有金属纳米颗粒结构的微小孔面发射激光器

在普通850nm垂直腔面发射激光器基础上制备出带有金属纳米颗粒结构的微小孔径垂直腔面发射激光器。当小孔和金属颗粒的直径分别为400nm和100nm时,其最大输出光功率达到0.5mW。介绍了该器件的制备工艺,从实验和理论两方面验证了金属纳米颗粒结构激发局域表面等离子体,从而使输出光功率得到提高。     

金属颗粒对微小孔激光器增强透射的研究

制备了带有金属纳米颗粒结构的微小孔径垂直腔面发射激光器(NA-VCSEL)。当小孔和金属颗粒的直径分别为400 nm和100 nm时,其最大输出光功率达到了0.5 mW,比400 nm单个小孔的最大输出光功率提高了0.2 mW。实验和理论验证了金属纳米颗粒结构对NA-VCSEL输出光功率的增强作用。     

微小孔阵列垂直腔面发射激光器的研究

在980nm波长的大功率垂直腔面发射激光器(VCSEL)的基础上制备了高输出功率的微小孔阵列半导体激光器,其最大输出光功率达到了1mW。介绍了针对微小孔阵垂直腔面发射激光器的特殊制备工艺,并对其特性进行了分析。     

底部出光纳米孔径面发射激光器的研究

在普通大功率垂直腔面发射激光器(VCSEL)基础上,制备出了底部出光纳米孔径VCSEL。利用聚焦离子束刻蚀技术完成纳米孔径的制作。当小孔直径为480nm×480nm时,测量得到器件的远场输出光功率为0.07mW。并分析了温度的变化对该器件远场输出光功率的影响。     

氧化限制型795 nm垂直腔面发射激光器

单模795 nm垂直腔面发射激光器作为铷原子钟的激光光源,一般采用氧化限制结构获得单模输出。对垂直腔面发射激光器外延结构以及氧化限制孔径进行了优化设计。基于有限元分析方法,利用光纤波导理论和热电耦合模型,对氧化孔径的光学和电学限制进行了模拟,计算分析了实现单模和良好热电特性所需的氧化孔径大小。实验制备了具有不同氧化孔径的器件,并进行了功率-电流以及光谱特性测试。当氧化孔径为1.9μm时,在3～7 mA注入电流下器件始终保持单模输出,边模抑制比大于35 dB;器件保持单模输出的最大氧化孔径为3.8μm,室温下阈值电流为1 mA,最大饱和输出功率为2 mW,斜率效率为0.3 W/A,3 mA注入电流下的出射波长为790 nm,边模抑制比大于30 dB。制备的室温下单模特性良好的790 nm垂直腔面发射激光器,为实现高温下795 nm偏振稳定单模输出提供了可能。     

980nm氧化物限制的垂直腔面发射激光器

采用低压金属有机化合物气相外延(LP-MOCVD),制备了顶端发射氧化物限制、内腔接触结构980nm的垂直腔面发射激光器.应用了选择氧化和自对准工艺来实现电流限制.在28mA脉冲电流驱动下,器件的输出功率为10.1mW,斜率效率为0.462mW/mA.脉冲工作下,最高输出功率为13.1mW.室温连续工作下,输出功率为7.1mW,发射波长为974nm,光谱半宽为0.6nm.研究了氧化孔径对阈值电流和微分电阻的影响,结果表明较小的氧化孔径可以获得低的阈值电流.     

980nm垂直腔面发射激光器的研制

采用低压金属有机化合物气相外延生长技术,应用AlAs/AlGaAs选择性湿氮氧化工艺实现光、电限制,制备出具有一定性能的980nm内腔接触式氧化物限制型顶发射980nm垂直腔面发射激光器(VCSEL).通过制备不同氧化孔径尺寸的VCSEL,分析了氧化孔径尺寸大小对器件的阈值电流和串联电阻的影响.获得的最小阈值电流为0.8mA,最大光输出功率达8mW.     

980nm垂直腔面发射激光器的研制

采用低压金属有机化合物气相外延生长技术,应用AlAs/AlGaAs选择性湿氮氧化工艺实现光、电限制,制备出具有一定性能的980nm内腔接触式氧化物限制型顶发射980nm垂直腔面发射激光器(VCSEL).通过制备不同氧化孔径尺寸的VCSEL,分析了氧化孔径尺寸大小对器件的阈值电流和串联电阻的影响.获得的最小阈值电流为0.8mA,最大光输出功率达8mW.     

980nm垂直腔面发射激光器的研制

采用低压金属有机化合物气相外延生长技术,应用AlAs/AlGaAs选择性湿氮氧化工艺实现光、电限制，制备出具有一定性能的980nm内腔接触式氧化物限制型顶发射980nm垂直腔面发射激光器(VCSEL). 通过制备不同氧化孔径尺寸的VCSEL，分析了氧化孔径尺寸大小对器件的阈值电流和串联电阻的影响. 获得的最小阈值电流为0.8mA，最大光输出功率达8mW.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.