高速磨削对18CrNiM07-6表面完整性的影响研究

目的对试件表面粗糙度和残余应力进行分析,为研究高速磨削齿轮材料表面完整性提供试验依据,并对齿轮材料高速磨削工艺进行深入探讨。方法选择以平面磨削为主要研究方式,根据Salomon理论和高速磨削理论,提出以单因素法对齿轮材料18CrNiMo7-6进行高速磨削工艺试验,试验变量为砂轮线速度、磨削深度和工作台速度,以此得到了高速磨削工艺参数与表面完整性(主要为表面粗糙度和残余应力)之间的关系。结果齿轮材料18CrNiMo7-6的表面粗糙度随砂轮线速度的增大、磨削深度和工作台速度的降低而得以改善,用三维粗糙度表征法可以准确地评定工件表面形貌。试验得到砂轮线速度对残余应力的影响最大,磨削深度次之,工作台速度的影响较小。除V_s=160 m/s外,经高速磨削的渗碳淬火18CrNiMo7-6试件表面残余压应力值得到提升。结论通过分析高速磨削对表面完整性的影响,可得到该研究材料的最优磨削参数组合为:V_s=120 m/s,V_w=4 m/min,a_p=0.02 mm。在此磨削参数下,试件的残余压应力值最大,将有利于提高试件表面完整性。     

数控锥面砂轮磨齿机磨削锥形齿轮原理

在分析得到了锥面砂轮包络运动所形成的产形齿条基础上 ,对渐开线锥形齿轮与产形齿条之间的空间几何关系进行了研究。通过推导齿条、齿轮及机床调整参数关系的计算公式 ,提出了适合数控锥面砂轮磨齿机磨削锥形齿轮的原理和加工方法。理论和试验结果表明 ,利用数控锥面砂轮磨齿机可以实现渐开线锥形齿轮的正确磨削。     

齿轮成形磨削能耗与表面粗糙度研究

齿轮成形磨削的能耗研究对于高精度齿轮的低碳制造具有重要意义.从数控成形磨齿机床的部件层面出发,分析齿轮成形磨削的能耗组成部分;基于磨削功率和材料切除率,建立齿轮成形磨削的净能耗密度模型;通过齿轮成形磨削试验发现,增加磨削能耗,会使表面粗糙度减小,但随着磨削能耗的持续增加,表面粗糙度减小幅度有限.研究结果为齿轮成形磨削的能耗与加工质量协同优化控制奠定了理论基础.     

20Cr2Ni4钢渗碳淬火弧齿锥齿轮磨削烧伤的检测与分析

针对20Cr2Ni4钢弧齿锥齿轮渗碳淬火磨齿后出现的齿面裂纹,采用光学显微镜和显微硬度计分别对切割齿块的未开裂齿面(凹面)和开裂齿面(凸面)进行了检测分析。结果表明,在齿块未开裂齿面和开裂齿面远离裂纹的节圆处,有效硬化层深度和显微组织正常,无磨削烧伤特征;在齿根处均出现了不同程度的磨削烧伤特征,尤其在开裂齿面裂纹处呈现典型的月牙形白加黑磨削烧伤形貌,烧伤最深处约0.9 mm,并据此提出了改进磨齿工艺参数,避免发生磨削烧伤的措施。     

随机网格结构固结磨料磨盘平面磨削性能研究

针对超精密磨削加工过程对工件材料去除效率、表面质量、亚表面损伤等指标的复合需求,提出一种基于泰勒多边形设计的随机网格结构固结磨料磨盘（textured-fixed abrasive plate, T-FAP）,并以光固化树脂作为结合剂基体材料混合微米级氧化铝磨料制备磨盘,使用MATLAB图像分析和磨抛轨迹仿真方法研究磨盘磨削过程中表面磨损时变图案特征对其加工性能的影响,并通过铝制工件的平面磨削实验对磨盘磨削过程中的材料去除率及工件表面粗糙度进行分析。实验结果表明：相比传统固结磨料磨盘,采用随机网格结构磨盘加工的工件表面粗糙度为0.84μm,材料去除率为3.21μm/min,能够在保证材料去除率的同时获得较高的表面精度。     

Analysis and simulation of the grinding process. Part I: Generation of the grinding wheel surface

This paper is in three parts describing the analysis and simulation of the grinding process. This first part is concerned with the generation of the wheel surface by single point diamond dressing. In grinding, the grinding wheel has to be dressed periodically to restore wheel form and cutting efficiency. Understanding the process of generating the grinding wheel surface is important for the control of the grinding process. Generation of the wheel surface is simulated as a single diamond dressing process on a computer generated wheel. The wheel is simulated by grains randomly spaced in the wheel volume. The topography of the wheel cutting surface is generated by simulating the action of an ideal dressing tool as it dresses the wheel. The simulation of the wheel topography takes account of the motion of the dressing tool, grain size, grain spacing, grain fracture and grain break-out. The simulated cutting surface is used for further simulations of grinding. The simulation of grinding using the simulated grinding wheel surface is described in Sections 2 and 3 where a comparison is made of results predicted from simulation with results obtained from experiments. By matching simulated and experimental results, it is possible to explain the relative importance of dressing and grinding parameters.     

An experimental study of flat fixed abrasive grinding of silicon wafers using resin-bonded diamond pellets

The purpose of this paper is to investigate the effect of the diamond grain size, the wheel rotation speed, the table rotation speed, and the applied pressure in the vertical flat grinding on the surface roughness of silicon wafers using Taguchi orthogonal array design. Besides, the pits and resistivity on the wafers were studied as well. The experiment results showed that the diamond grain size and the wheel rotation speed of the vertical flat grinding for the roughness of wafers obtained are the relatively larger significant contribution. When the smaller diamond grit size, the faster wheel rotation speed, the faster table rotation speed, and the smaller applied pressure in the flat grinding are employed, the traces produced by the grains are denser and the chip thickness and the depth of cut were smaller, which cause the silicon wafer to produce the higher degree of the ductile grinding. This will lead the wafer surface to produce the smaller amount and size of the pits, thereby generating the lower surface roughness. In addition, the center site of the wafer obtained is the smaller amount and size of the pits than the outer of the wafer, which produces the better surface roughness and the lower resistivity.     

Predictive modeling of surface roughness in grinding

The surface roughness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system. This paper presents the prediction of the arithmetic mean surface roughness based on a probabilistic undeformed chip thickness model. The model expresses the ground finish as a function of the wheel microstructure, the process kinematic conditions, and the material properties. The analysis includes a geometrical analysis of the grooves left on the surface by ideal conic grains. The material properties and the wheel microstructure are considered in the surface roughness prediction through the chip thickness model. A simple expression that relates the surface roughness with the chip thickness was found, which was verified using experimental data from cylindrical grinding.     

Fine finishing of gears with high shape accuracy

Besides high demands on surface integrity machining of gears aims on very low surface roughness and high shape accuracy. These properties will have positive impacts on the lifetime of gears. In this context the challenges of profile grinding of cylindrical gears by using elastic bonded grinding wheels are addressed. For this new gear fine finishing approach, the very high potential of the process is revealed by analyzing the influence of the grinding wheel specification and the machining parameters on surface finish. Results show that gears with high shape accuracy and very good surface finish with almost optical quality can be achieved.     

用磨粒叶序排布砂轮磨削外圆生成的凹坑表面仿真

结构化凹坑表面能够有效降低零件表面的流体拖曳摩擦阻力,从而改善零件在流体中的运动性能。从生物学的叶序排布理论出发,设计了磨粒叶序排布的超硬材料砂轮,并应用该砂轮磨削外圆生成结构化的凹坑表面。利用Matlab软件对磨粒叶序排布砂轮的磨削过程进行运动学仿真,获得了磨粒叶序排布参数及磨削参数对磨削区域内结构化凹坑表面形貌的影响规律。仿真及实验结果表明:转速比影响凹坑的周向排布和凹坑尺寸,转速比越高,凹坑周向排布越密集,凹坑尺寸越小;叶序系数影响凹坑的轴向排布,叶序系数越小,凹坑轴向排布越密集;磨削深度影响凹坑尺寸,磨削深度越深,凹坑宽度和深度越大,毛刺隆起高度越高,约为磨削深度的一半。