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1.
针对超音速火焰喷涂WC-17Co高硬涂层的加工难题,对WC-17Co涂层进行了高速/超高速磨削试验。通过考察不同金刚石砂轮和磨削工艺参数对磨削力、磨削温度和表面残余应力、表面/亚表面微观形貌和表面粗糙度的影响,讨论了最大未变形切屑厚度与比磨削能的内在关系,分析了磨削温度对表面残余应力的作用规律,探讨了法向磨削力对涂层亚表面损伤的作用规律。结果表明:WC-17Co涂层磨削去除是脆性和延性去除并存;提高砂轮线速度将使磨削力先快速减小后缓慢增大,磨削温度持续升高,涂层磨削从脆性去除转为延性去除的趋势也逐渐增强,表面残余应力由压应力逐渐转变为拉应力,而磨削高温引起涂层热塑性变形是表面残余应力状态转变的根本原因。涂层亚表面磨削损伤层平均深度随法向磨削力的增大而变大。提高砂轮线速度、降低工作台速度和减小磨削深度均能增大涂层磨削塑性去除的比例。  相似文献   

2.
磨削速度对碳化硅陶瓷磨削损伤影响机制研究   总被引:1,自引:0,他引:1  
碳化硅陶瓷高速磨削过程中,磨粒对工件材料强力冲击,应变率剧增、复杂显微结构对应力波传送响应转变,材料力学行为发生变化,目前高速磨削对材料去除机制影响的物理本质认识还不清楚。为此,开展磨削速度对SiC陶瓷磨削裂纹损伤影响机制研究。通过单颗磨粒磨削SiC陶瓷试验,分析了磨削速度对SiC陶瓷磨削表面形貌、磨削亚表面裂纹损伤深度、磨削力和磨削比能的影响规律。试验结果表明,当SiC陶瓷材料以脆性方式去除时,磨削速度对裂纹损伤影响最为显著,随着磨削速度从20 m/s增加到160 m/s,磨削亚表面裂纹损伤深度从12.1μm快速降低到6μm。采用Voronoi法建立了金刚石磨削多晶SiC陶瓷有限元仿真模型,当磨粒切厚为0.3μm,磨削亚表面损伤以微裂纹为主;当磨粒切厚为1μm时,随着磨削速度增加,磨削亚表面裂纹损伤深度从14.7μm降低到4.6μm,磨削亚表面宏观沿晶裂纹逐渐变为微观裂纹。基于位错理论和冲击动力学理论,揭示了高速磨削过程中位错密度的增加和晶界反射应力波对应力场削弱作用是高速磨削SiC陶瓷裂纹损伤“趋肤效应”产生的机理。  相似文献   

3.
用电镀金刚石砂轮对SiC颗粒增强铝基复合材料2024Al/SiCp进行了端面磨削实验研究。结果表明,端面磨削能获得高质量加工表面;已加工表面残余应力为压应力;磨削参数对切向和法向磨削力影响较小,但对轴向磨削力影响较大,且轴向磨削力随着磨削深度的增加而明显增大。  相似文献   

4.
采用树脂结合剂金刚石砂轮对C/SiC复合材料与SiC陶瓷进行了平面磨削加工试验,通过对比两种材料的磨削力及磨削加工表面质量,分析了C/SiC复合材料组织与其磨削加工特性的 关系。研究结果表明,C/SiC复合材料中碳纤维及SiC基体皆以脆性断裂方式实现材料去除;与SiC陶瓷的加工表面(其表面粗糙度值Ra为0.2~0.3μm)相比,C/SiC复合材料磨削时由于碳纤维层状断裂、拔出及其与SiC非同步去除现象导致其加工表面粗糙度值较高, Ra为0.8~1.0μm;C/SiC复合材料磨削力较小,是相同工艺参数下SiC陶瓷材料磨削力的35%~76%。  相似文献   

5.
为研究不同磨削速度下超声振动作用对SiC陶瓷磨削过程中材料去除机理的影响,采用钎焊单颗金刚石磨粒工具,基于连续变磨削深度试验方法,在SiC陶瓷抛光表面开展了超声辅助磨削与普通磨削对比试验。结果表明,随着单颗磨粒磨削深度的逐渐增大,SiC陶瓷超声辅助磨削与普通磨削时的材料去除机理均经历了“塑性去除→脆-塑转变→大尺寸脆性断裂”的变化;在磨削速度为1 m/s时,相比于普通磨削,单颗磨粒超声辅助磨削可显著增大SiC陶瓷的脆-塑转变临界切厚及相应的磨削划痕横截面积,并减小切向磨削力与磨削比能;而随着磨削速度的增大,超声辅助磨削与普通磨削在单颗磨粒磨削划痕尺寸、磨削力之间的差异逐渐减弱。  相似文献   

6.
采用有限元分析软件ABAQUS建立反映C/SiC复合材料编织结构的三维仿真模型,模拟单颗金刚石磨粒划擦C/SiC复合材料的去除过程,获得划擦过程中材料上的应力、应变分布与磨削力变化曲线.通过试验获得相同划擦条件下的磨削力值,与模拟值比较,平均轴向力误差值为8.9%,平均切向力误差值为11.2%.仿真结果解释了试验中有、...  相似文献   

7.
电镀金刚石砂轮端面磨削Al2024/SiCp试验研究   总被引:2,自引:2,他引:0  
使用电镀金刚石砂轮对SiC颗粒增强Al2024复合材料进行端面磨削加工试验研究.研究结果表明,端面磨削加工能获得高质量的加工表面,在所采用的试验参数范围内,表面粗糙度在Ra为0.185μm和Ra为0.5121μm之间,已加工表面残余应力表现为压应力;磨削加工参数对切向力和法向力的影响不大,并且在不同的加工条件下均保持较小数值.轴向磨削力大于其他两个方向的磨削力,并且随着磨削深度的增大而明显增大.  相似文献   

8.
为研究2.5D Cf/SiC刹车材料的浮动磨削加工性能,设计单因素试验探究了砂轮转速、工作台调定压力和磨削深度对磨削力、表面粗糙度和表面形貌的影响规律,分析了磨削表面典型加工缺陷及材料去除机理。结果表明:砂轮转速、工作台调定压力和磨削深度对法向磨削力影响显著,对切向磨削力影响不大;工作台调定压力对表面粗糙度的影响程度最大。2.5D Cf/SiC刹车材料以脆性断裂去除方式为主,不同纤维方向上的加工缺陷形式存在差异,其主要加工缺陷为界面脱粘、微裂纹、基体破碎、纤维剥离及破碎。试验通过单因素方法分析得到了较好的表面质量,表面粗糙度Sa可达0.6μm左右。  相似文献   

9.
采用普通磨削方式和超声振动辅助磨削方式对无压烧结SiC材料进行了磨削工艺实验,对不同磨削方式下磨削参数对磨削力比、表面损伤及亚表面损伤的影响进行了对比研究,并分析了超声振动磨削作用机制。实验结果显示,该实验中SiC材料去除主要以脆性去除为主,砂轮磨削力比随着磨削深度和进给速度的增加缓慢增加,随着主轴转速的增加略有减小;普通磨削时SiC工件亚表面损伤深度随着磨削深度、进给速度增加逐渐增加,而超声振动辅助磨削变化较小。与普通磨削相比,在相同的磨削参数下,超声振动辅助磨削的高频冲击使材料破碎断裂情况得到改善,且磨削力比减小近1/3,表面裂纹、SiC晶粒脱落、剥落等表面损伤较少,表面损伤层较浅,亚表面裂纹数量及深度都有较大程度降低,可以获得较为理想的表面质量。  相似文献   

10.
使用单层钎焊金刚石磨头对SiC含量为20%与50%(体积分数)的AlSiC复合材料进行磨削加工,对比了单层钎焊金刚石磨头加工两种AlSiC复合材料的磨削力,分析了复合材料被加工表面微观形貌及材料去除机理,观察了磨屑形貌,并对钎焊金刚石磨粒的磨损形式进行了分析。结果表明,SiC含量为50%的AlSiC复合材料的磨削力小于SiC含量为20%的复合材料,20%SiC复合材料的磨削力波动较50%SiC复合材料的更平稳;钎焊金刚石磨头干式加工AlSiC复合材料时,20%SiC的AlSiC复合材料以塑性去除为主,且Al基体易受热软化而涂覆在被加工材料表面,磨屑为较窄的锯齿状;而50%SiC的AlSiC复合材料在加工中以脆性去除为主,表面缺陷以SiC颗粒的断裂、破碎和粉末化为主要特征,其磨屑呈块状和颗粒状,加工20%SiC的复合材料时金刚石磨粒易形成铝涂覆层,而加工50%SiC的复合材料时金刚石磨粒以磨粒磨损和微破碎为主。  相似文献   

11.
高速正交切削SiCp/Al复合材料切削温度仿真研究   总被引:1,自引:0,他引:1  
使用ABAQUS有限元软件对高体分SiCp/Al复合材料的颗粒和基体进行分别定义,仿真研究了高速切削复合材料时的温度场,分析了切削过程中切削用量和刀具角度对工件切削温度的影响。结果表明:在切削过程中,与刀具接触位置的颗粒温度较高且应力值较高;SiC颗粒的温度较Al基体的温度低;第一变形区发现一条沿着剪切角方向非常明显的温升带。在稳定切削阶段,与刀尖接触位置的工件温度较高,且应力集中现象总是发生在SiC颗粒上。随着切削深度和切削深度的增加,切削过程中工件的最高温度均随之增加;随着刀具前角和后角的增大,切削过程中工件的最高温度均随之降低。  相似文献   

12.
Acoustic emission (AE) spectra were recorded during microgrinding of brittle materials. It was found that the specific AE energy (i.e., the measured AE energy divided by the material removal rate) was lower for fracture-dominated grinding than for plastic flow-dominated grinding. Two subsequent experiments were performed to measure AE energy while holding the material-removal rate constant. By controlling either the critical depth of cut (for ductile-brittle transition) of the workpiece material, or the actual depth of cut of the grinding machine, the sensitivity of AE energy to grinding regime was investigated for grinding with a constant material-removal rate. Contrary to conventional thinking about the relative contributions of plastic flow and fracture in generation of AE activity, it was found that the AE energy was larger in ductile-regime grinding than in brittle-regime grinding, for identical material removal rates. As a result of the experiments described in this paper, it can be concluded that AE energy measured during microgrinding is sensitive to changes in the mechanism of material removal. For a given volume of material removed, there is more AE energy in a plastic flow-dominated process than in a fracture-dominated process. The relationship found between AE energy and material removal regime could lead to an in-process sensing strategy for controlling grinding ductility.  相似文献   

13.

The grind-hardening process utilizes the heat generated to induce martensitic phase transformation. However, the maximum achievable harden layer depth is limited due to high grinding forces, and the tensile residual stress appears on the ground surface in the grind-hardening process. This paper proposes a new grind-hardening technology using thermal compensation. The workpiece of AISI5140 steel is preheated by electric resistance heating, and ground under the condition of the workpiece temperature 25°C, 120°C, 180°C and 240°C. The grinding force, harden layer depth and surface quality including residual stress on ground surface, surface roughness and micro-hardness are investigated. The experimental results show that a deep harden layer with a fine grain martensite can be obtained with the thermal compensation. The ground workpiece surface produces a certain compressive residual stress, and the residual compressive stress value increases with preheating temperature. As the preheating temperature increases, grinding force slightly decreases, while there is slightly increment of surface roughness. Compared with the conventional grind-hardening process, both the harden layer depth and residual stress distribution are significantly improved.

  相似文献   

14.
In this paper, a two-dimensional orthogonal cutting experiments and simulation analysis on the machining of SiCp/Al composites with a polycrystalline diamond tool have been carried out. By using two kinds of finite element models, the cutting force and von Mises equivalent stress at different cutting conditions were studied in detail. The results indicate that the cutting speed and depth have significant effects on the cutting force, and the predicted cutting force is in agreement with that of the experiment. The von Mises equivalent stress distributions of particle and matrix at three typical cases can explain the removal mechanism of SiC particle very well, which is also consistent with that of the experimental observation.  相似文献   

15.
This article addresses the problem of monitoring the material removal regime (ductile versus brittle) that occurs during the grinding of brittle materials. Often a ductile grinding regime is desired, but currently there is no way to measure the grinding ductility “in process.” A model is developed to describe the dependence of the specific grinding energy on the material removal regime. It is found that the specific grinding energy will remain relatively constant for ductile-regime grinding but will decrease in a power-law relationship with an increasing material removal rate for brittle-regime grinding. Experimental confirmation of the proposed model is presented. The potential for using measurements of specific grinding energy to control the grinding ductility is established, and the benefits of such a closed-loop feedback system in ductile-regime grinding are explained.  相似文献   

16.
3D-C/SiC复合材料的高温拉伸性能   总被引:7,自引:0,他引:7  
研究了 3D C/SiC复合材料从室温到 15 0 0℃真空条件的拉伸性能。试验材料用T30 0碳纤维编织为三维四向编织体 ,编织角为 2 2° ,用CVI法在 95 0℃~ 10 0 0℃沉积热解碳界面层、SiC基体。最终得到纤维体积分数约为4 0vol%、热解碳界面层厚度约 0 .2 μm和空隙率为 17vol%的复合材料 ,表面SiC涂层厚度为 5 0 μm。试验在超高温拉伸试验机上进行 ,真空度为 10 -3 Pa ,夹头位移速率为 0 .5 95mm/min。结果表明 ,拉伸应力 应变曲线是非线性的 ,大部分拉伸曲线基本由三段折线组成 ,对应着三段模量。第一阶段的模量和基体裂纹饱和应力对应的应变εsa 基本不随温度的升高而改变 ;第二和第三阶段的模量、损伤开始应力σmc、基体裂纹饱和应力σsa、断裂应力σf 和损伤开始应变εmc随温度有相似的变化规律 ,即随温度升高而增加 ,在 110 0℃ ~ 130 0℃范围内出现最大值 ,尔后随温度增加而下降 ;但是断裂应变的变化规律正好与此相反。试样机械加工后 ,由于残余应力部分得到松弛 ,并去除了表面SiC涂层开裂后引起的应力集中 ,因此材料断裂强度和断裂应变明显升高。高温和室温的拉伸断裂应变小于0 .6 % ,不能有效地松弛材料切口处的应力集中。测量了拉伸过程中试样的电阻相对变化率 ,它与载荷的关系曲线总的走势与拉  相似文献   

17.
王珉  Lau W S 《机械工程学报》1992,28(3):104-109,
本文提出了利用预张应力磨削来提高磨削加工的表面质量问题。建立了预应力磨削的理论分析模型,较透彻地阐述了预应力磨削对表面残余应力的影响。还就各种磨削条件和装恶化条件对磨削加工中表面残余应力的存在与分布,以及对工件几何精度的影响进行了试验研究。并探讨了这种对金属表面改性有利的新磨削工艺的可行性与实用性。  相似文献   

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