A high power active circulator using GaN MMIC power amplifiers

This paper presents a 2.4 GHz hybrid integrated active circulator consisting of three power amplifiers and three PCB-based Wilkinson power dividers.The power amplifiers were designed and fabricated in a standard0.35- m Al Ga N/Ga N HEMT technology,and combined with three traditional power dividers on FR4 using bonding wires.Due to the isolation of power dividers,the isolation between three ports is achieved; meanwhile,due to the unidirectional characteristics of the power amplifiers,the nonreciprocal transfer characteristic of the circulator is realized.The measured insertion gain of the proposed active circulator is about 2–2.7 d B at the center frequency of 2.4 GHz,the isolation between three ports is better than 20 d B over 1.2–3.4 GHz,and the output power of the designed active circulator achieves up to 20.1–21.2 d Bm at the center frequency.     

基于GaN HEMT新型负反馈结构固态宽带功率放大器的研究

The design and fabrication of an ultra-broadband power amplifier based on a Ga N HEMT, which operates in the frequency range from 3 to 8 GHz, is presented in this paper. A TGF2023-02 Ga N HEMT chip from Tri Quint is adopted and modeled. A novel negative feedback structure is applied in the circuit. The measured results show that the amplifier module has a wide range frequency response that is almost consistent with those of simulation at frequencies from 3 to 6.5 GHz. The measured power gain is greater than 7 d B between 3 and 6.5 GHz.The saturated output power is 38.5 d Bm under DC bias of Vds D28 V, Vgs D 3:5 V at the frequency of 5.5 GHz.     

A 77-100 GHz power amplifier using 0.1-μm GaAs PHEMT technology

A wideband MMIC power amplifier at W-band is reported in this letter. The four-stage MMIC, developed using 0.1 μm GaAs pseudomorphic HEMT (PHEMT) technology, demonstrated a flat small signal gain of 12.4±2 dB with a minimum saturated output power (Psat) of 14.2 dBm from 77 to 100 GHz. The typical Psat is better by 16.3 dBm with a flatness of 0.4 dB and the maximum power added efficiency is 6% between 77 and 92 GHz. This result shows that the amplifier delivers output power density of about 470 mW/mm with a total gate output periphery of 100 μm. As far as we know, it is nearly the best power density performance ever published from a single ended GaAs-based PHEMT MMIC at this frequency band.     

X 波段氮化镓合成固态放大器

Based on a self-developed A1GaN/GaN HEMT with 2.5 mm gate width technology on a SiC substrate, an X-band GaN combined solid-state power amplifier module is fabricated. The module consists of an AIGaN/GaN HEMT, Wilkinson power couplers, DC-bias circuit and microstrip line. For each amplifier, we use a bipolar DC power source. Special RC networks at the input and output and a resistor between the DC power source and the gate of the transistor at the input are used for cancellation of self-oscillation and crosstalk of low-frequency of each amplifier. At the same time, branches of length 3λ/4 for Wilkinson power couplers are designed for the elimination of self-oscillation of the two amplifiers. Microstrip stub lines are used for input matching and output matching. Under Vds = 27 V, Vgs = -4.0 V, CW operating conditions at 8 GHz, the amplifier module exhibits a line gain of 5.6 dB with power added efficiency of 23.4%, and output power of 41.46 dBm （14 W）, and the power gain compression is 3 dB. Between 8 and 8.5 GHz, the variation of output power is less than 1.5 dB.     

Design and simulation of optoelectronic oscillator with micro ring resonator and radio frequency amplifier modelling at 110 GHz

There is an increasing need for high performance oscillators as the faster transmission networks demand for high frequency signals. Opto-electronic oscillators (OEO) enable us to make better oscillators in terms of size, weight and power. In this paper, photonic integration is proposed for realizing the OEO with micro ring resonator (MRR) and radio-frequency (RF) amplifiers of monolithic microwave integrated circuit (MMIC), which can be used for generating 110 GHz sine wave. The OEO architecture is proposed and block diagram developed considering Silicon based MRR and three-stage RF amplifier based on GaN high-electron-mobility transistor (HEMT). A simulation model is developed according to the Klein model of MRR and is validated against the calculated performance parameters. MRR dimensions are calculated as with silicon on insulator (SOI) technology and a radius 5.27 μm for the device is derived. Free spectral range (FSR) of 48.52 nm and filter rejection ratio of 16.79 dB are obtained for this device. The proposed RF amplifier is modelled with GaN parameters derived from high frequency pinch-off model and with power amplifier considerations. The gain for this amplifier is obtained as 10.6 dB. The OEO design is developed in this project in such a way that the system can be manufactured with the existing methods.     

An 8-18 GHz broadband high power amplifier

An 8-18 GHz broadband high power amplifier(HPA) with a hybrid integrated circuit(HIC) is designed and fabricated.This HPA is achieved with the use of a 4-fingered micro-strip Lange coupler in a GaAs MMIC process.In order to decrease electromagnetic interference,a multilayer AlN material with good heat dissipation is adopted as the carrier of the power amplifier.When the input power is 25 dBm,the saturated power of the continuous wave(CW) outputted by the power amplifier is more than 39 dBm within the frequency range of 8-13 GHz,while it is more than 38.6 dBm within other frequency ranges.We obtain the peak power output,39.4 dBm,at the frequency of 11.9 GHz.In the whole frequency band,the power-added efficiency is more than 18%.When the input power is 18 dBm,the small signal gain is 15.7±0.7 dB.The dimensions of the HPA are 25×15×1.5 mm~3.     

Field plated 0.15μm GaN HEMTs for millimeter-wave application

SiN dielectrically-defined 0.15μm field plated GaN HEMTs for millimeter-wave application have been presented.The AlGaN/GaN hetero-structure epitaxial material for HEMTs fabrication was grown on a 3-inch SiC substrate with an Fe doped GaN buffer layer by metal-organic chemical deposition.Electron beam lithography was used to define both the gate footprint and the cap of the gate with an integrated field plate.Gate recessing was performed to control the threshold voltage of the devices.The fabricated GaN HEMTs exhibited a unit current gain cut-off frequency of 39 GHz and a maximum frequency of oscillation of 63 GHz.Load-pull measurements carried out at 35 GHz showed a power density of 4 W/mm with associated power gain and power added efficiency of 5.3 dB and 35%,respectively,for a 0.15 mm gate width device operated at a 24 V drain bias.The developed 0.15μm gate length GaN HEMT technology is suitable for Ka band applications and is ready for millimeter-wave power MMICs development.     

Design of 20-44 GHz broadband doubler MMIC

This paper presents the design and performance of a broadband millimeter-wave frequency doubler MMIC using active 0.15μm GaAs PHEMT and operating at output frequencies from 20 to 44 GHz.This chip is composed of a single ended-into differential-out active Balun,balanced FETs in push-push configuration,and a distributed amplifier. The MMIC doubler exhibits more than 4 dB conversion gain with 12 dBm of output power,and the fundamental frequency suppression is typically -20 dBc up to 44 GHz.The MMIC works at...     

A Ka-band 22 dBm GaN amplifier MMIC

A Ka-band GaN amplifier MMIC has been designed in CPW technology,and fabricated with a domestic GaN epitaxial wafer and process.This is,to the best of our knowledge,the first demonstration of domestic Kaband GaN amplifier MMICs.The single stage CPW MMIC utilizes an AlGaN/GaN HEMT with a gate-length of 0.25μm and a gate-width of 2×75μm.Under V_ds=10 V,continuous-wave operating conditions,the amplifier has a 1.5 GHz operating bandwidth.It exhibits a linear gain of 6.3 dB,a maximum output power of 22 dBm and a peak PAE of 9.5%at 26.5 GHz.The output power density of the AlGaN/GaN HEMT in the MMIC reaches 1 W/mm at Ka-band under the condition of V_ds=10 V.     

A Ka-band low-noise amplifier with a coplanar waveguide(CPW)structure with 0.15-μm GaAs pHEMT technology

This investigation explores a low-noise amplifier(LNA) with a coplanar waveguide(CPW) structure,in which a two-stage amplifier is associated with a cascade schematic circuit,implemented in 0.15-μm GaAs pseudomorphic high electron mobility transistor(pHEMT) technology in a Ka-band(26.5-40.0 GHz) microwave monolithic integrated circuit(MMIC).The experimental results demonstrate that the proposed LNA has a peak gain of 12.53 dB at 30 GHz and a minimum noise figure of 3.3 dB at 29.5 GHz,when biased at a V_(d...     

S波段35W GaN功率MMIC

报道了一款采用两级拓扑结构的2～4 GHz宽带高功率单片微波功率放大器芯片.放大器采用了微带结构,并使用电抗匹配进行设计,重点在于宽带功率效率平坦化设计.经匹配优化后放大器在2～4 GHz整个频带内脉冲输出功率大于35 W,小信号增益达到22 dB,在2.4 GHz频点处峰值输出功率达到40 W,对应的功率附加效率为3...     

Ku波段宽带氮化镓功率放大器MMIC

基于0.25μm栅长GaN HEMT工艺,采用三级放大拓扑结构设计了一款Ku波段GaN功率放大器.放大器设计从建立大信号模型出发,输出匹配网络和级间匹配网络均采用电抗匹配减小电路的损耗,从而提高整体放大器的功率效率.测试结果表明,该放大器在14.6~18GHz频带内,小信号增益30dB,脉冲饱和输出功率达15W,功率附加效率(PAE)大于32%;在14.8GHz频点处,放大器的峰值功率达19.5W,PAE达39%.该结果表明GaN MMIC具有高频高功率高效率的优势,具有广阔的应用前景.     

基于GaAs PHEMT工艺的60~90GHz功率放大器MMIC

研制了一款60~90 GHz功率放大器单片微波集成电路(MMIC),该MMIC采用平衡式放大结构,在较宽的频带内获得了平坦的增益、较高的输出功率及良好的输入输出驻波比(VSWR)。采用GaAs赝配高电子迁移率晶体管(PHEMT)标准工艺进行了流片,在片测试结果表明,在栅极电压为-0.3 V、漏极电压为+3 V、频率为60~90 GHz时,功率放大器MMIC的小信号增益大于13 dB,在71~76 GHz和81~86 GHz典型应用频段,功率放大器的小信号增益均大于15 dB。载体测试结果表明,栅极电压为-0.3 V、漏极电压为+3 V、频率为60~90 GHz时,该功率放大器MMIC饱和输出功率大于17.5 dBm,在71~76 GHz和81~86 GHz典型应用频段,其饱和输出功率可达到20 dBm。该功率放大器MMIC尺寸为5.25 mm×2.10 mm。     

6～18 GHz宽带GaN功率放大器MMIC

报道了一款采用三级拓扑结构的6～18 GHz宽带单片微波功率放大器芯片.放大器采用了微带结构,并使用电抗匹配进行设计,减小输出匹配电路的损耗和提高效率.经匹配优化后放大器在6～18 GHz整个频带内脉冲输出功率大于6 W,小信号增益达到25 dB,在14 GHz频点处峰值输出功率达到10 w,对应的功率附加效率为21%...     

A coplanar X-band AlGaN/GaN power amplifier MMIC on s.i. SiC substrate

This work presents a two-stage high-power amplifier monolithic microwave integrated circuit (MMIC) operating between 9 GHz and 11 GHz based on a fully integrated AlGaN/GaN high electron mobility transistor (HEMT) technology on s.i. SiC substrate and is suitable for radar applications. The MMIC device with a chip size of 4.5/spl times/3 mm/sup 2/ yields a linear gain of 20 dB and a maximum pulsed saturated output power of 13.4 W at 10 GHz equivalent to 3.3 W/mm at V/sub DS/=35V, 10% duty cycle, and a gain compression level of 5 dB. Further, dc reliability data are given for the MMIC HEMT technology.     

A Wideband Power Amplifier MMIC Utilizing GaN on SiC HEMT Technology

The design and performance of a wideband power amplifier MMIC suitable for electronic warfare (EW) systems and other wide bandwidth applications is presented. The amplifier utilizes dual field plate 0.25- mum GaN on SiC device technology integrated into the three metal interconnect (3 MI) process flow. Experimental results for the MMIC at 30 V power supply operation demonstrate greater than 10 dB of small signal gain, 9 W to 15 W saturated output power and 20% to 38% peak power-added efficiency over a 1.5 GHz to 17 GHz bandwidth.     

86.5GHz下输出功率257mW的 W波段GaN MMIC放大器

我们报道了一个三级W波段GaN MMIC功率放大器。考虑到W波段MMIC的耦合效应,所有的匹配电路和偏置电路都是先进行电路仿真以后,再用3D电磁场仿真软件进行系统的仿真。此MMIC功率放大器在频率为86.5GHz下输出功率能达到257mW,相应的功率附加效率(PAE)为5.4%,相应的功率增益为6.1dB。功率密度为459 mW/mm。另外,此MMIC功率放大器在83 GHz到90 GHz带宽下有100mW以上的输出功率。以上特性都是在漏极电压为12V时测试得到。     

An X-band four-way combined GaN solid-state power amplifier

An X-band four-way combined GaN solid-state power amplifier module is fabricated based on a self-developed AlGaN/GaN HEMT with 2.5-mm gate width technology on SiC substrate. The module consists of an Al-GaN/GaN HEMT, Wilkinson power hybrids, a DC-bias circuit and microstrip matching circuits. For the stability of the amplifier module, special RC networks at the input and output, a resistor between the DC power supply and a transistor gate at the input and 3λ/4 Wilkinson power hybrids are used for the cancellation of low frequency self-oscillation and crosstalk of each amplifier. Under V_(ds)= 27 V, V_(gs) = -4.0 V, CW operating conditions at 8 GHz, the amplifier module exhibits a line gain of 5 dB with a power added efficiency of 17.9%, and an output power of 42.93 dBm; the power gain compression is 2 dB. For a four-way combined solid-state amplifier, the power combining efficiency is 67.5%. It is concluded that the reduction in combining efficiency results from the non-identical GaN HMET, the loss of the hybrid coupler and the circuit fabricating errors of each one-way amplifier.     

工作在1.8-3 GHz内的高效率GaAs pHEMT功率单片

本文报道了一款基于南京电子器件研究所GaAs pHEMT单片集成电路工艺的S波段宽带高效率功率放大器。为了提高芯片效率,该放大器采用驱动比为1:8的两级级联方式,并采用低通/高通滤波器相结合的拓扑结构设计每级的匹配电路。这种匹配电路在有效降低芯片面积的同时,在较宽的频带范围内实现对应于高效率的阻抗匹配。在5V漏压AB类偏置条件下,该功率放大器在1.8到3GHz频率范围内连续波输出饱和功率为33~34 dBm,相应的附加效率达到35%~45%,以及非常平坦的功率增益25~26 dB。芯片面积紧凑,尺寸仅为2.7mm×2.75mm。