非对称Y分叉全内反射型全光开关

基于全内反射原理和光生载流子注入效应,研究了一种Y分叉全内反射型全光开关.当控制光(波长为805nm)的强度达到150W/mm2时,对于1310nm波长,其开关的消光比可以达到18dB,并对光注入开关机理做了简单的探讨.     

载流子注入全内反射型GaAs／GaAIAs光波导开关

研制出利用载流子注入能带填充效应制成的全内反射型（CI－TIR）GaAs/GaAIAs光波导开关。开关工作波长为0．87μm，工作电流70mA，消光比14dB，串话－13dB，该开关具有尺寸小，与偏振无关，无阻塞，易集成的优点。     

载流子注入全内反射型GaAs/GaAlAs光波导开关

研制出利用载流子注入能带填充效应制成的全内反射型(CI-TIR)GaAs/GaAlAs光波导开关。开关工作波长为0.87μm,工作电流70mA,消光比14dB,串话-13dB。该开关具有尺寸小,与偏振无关,无阻塞,易集成的优点。     

宽带偏振不灵敏张应变InGaAs半导体放大器光开关

研制了一种张应变准体In Ga As半导体放大器光开关.该结构具有显著的带填充效应,从而导致在80 m A的注入电流下,器件的3d B光带宽大于85 nm(1 5 2 0～1 6 0 9nm ) .该带宽几乎同时全部覆盖了C带(1 5 2 5～1 5 6 5 nm )和L带(1 5 70～1 6 1 0 nm ) .最为重要的是,在3d B光带范围内,光开关的偏振灵敏度小于0 .7d B;光纤到光纤无损工作电流在70～90 m A之间;消光比大于5 0 d B.通过降低了载流子寿命,开关速度有所提高.在未来密集波分复用通信系统中,这种宽带偏振不灵敏半导体放大器光开关很有实用前景     

以内腔倍频产生黄-红可调谐激光

新西兰奥托戈大学的研究人员发展一种发黄 -红光的可调谐固体激光器 ,实现了 587～ 654nm波长的运转 ,在 62 0 nm峰值能量波长处 ,峰值脉冲能量达到 0 .75 m J。研究人员把 1 1 50～ 1 350 nm波段可调谐的室温工作增益开关掺铬镁橄榄石激光器和二次谐波产生的 型内腔磷酸钛氧钾 (KTP)晶体组合。这种内腔装置使激光基波变成了二次谐波 ,转换效率为 2 8%。镁橄榄石棒用灯抽运的 Q开关 Nd∶ YAG振荡放大器 (1 0 64 nm波长 )纵向抽运 ,该放大器以 2 0 Hz重复率发射激光脉冲 ,脉冲持续时间为 55ns。用焦长 50 0 mm的透镜使抽运光束在腔的高…     

新型大功率双波长半导体激光器的研制

提出了一种新结构半导体双波长激光器 ,即用隧道结把两个发射不同波长的激光器结构通过外延生长的方法连接起来。通过计算和设计 ,制备了性能良好的大功率激射的双波长半导体激光器。双波长器件的实际激射波长分别为 95 1 nm和 987nm,为基模激射。器件在 5 3 0 m A直流工作时输出功率达到 5 0 0 m W,斜率效率为1 .3 3 W/A。在 2 A电流时功率达 2 .4W,斜率效率为 1 .3 8W/A;3 A电流时功率达 3 .1 W,斜率效率为 1 .2 1 W/A。     

基于SOI材料的阵列波导光栅的制作

采用ICP刻蚀的方法,在SOI材料上制作出了中心波长为 1. 5509μm、信道间隔为 200GHz的 5×5阵列波导光栅(AWG).测试中心波长与设计值相差 0. 28nm,测试波长间隔与设计值相差在 0. 02nm之内,相邻信道串扰接近10dB,信道插入损耗均匀性为 0. 7dB,测试结果表明该器件能够初步达到分波功能.     

光注入X结GaAs全光开关的设计

设计了一种基于全内反射原理和光生载流子注入效应的X结全内反射(TIR)全光开关。通过对传统X结的改进提高了器件的性能。模拟结果表明．改进后的X结的消光比可以达到30dB左右。串音小于-30dB。同时分析了该全光开关所具有的速度优势,其开关速度可达10^0～10^2ns。     

全内反射型电调开关的串音特性分析

本文着重分析了影响全内反射型开关串音特性改善的几个因素。当开关效率较高时,势垒穿透、波束展宽和波导间耦合可能成为影响串音特性的主要因素,它们取决于波长和波导尺寸。文中也给出了几组曲线,适用于全内反射型开关的设计。     

850/1550nm智能集成分波光开关的理论设计

理论分析和设计了一种用于850和1550nm两个光通信窗口的、集波长信号分离和光开关功能于一体的智能集成分波光开关,并将弧形结构全内反射面用于该集成结构中.基于Si基半导体SiGe合金材料的等离子体色散效应,对该结构智能集成分波光开关的串音、损耗、消光比等特性进行了分析和模拟计算.计算得到,作为光开关时器件的平均串音、插入损耗和消光比分别为-19,1.3和21dB,作为分波器时平均串音和插入损耗分别为-11和1.1dB.设计结果表明,该集成器件不仅能够实现850和1550nm两种波长光信号的开关,而且还能对这两种波长的光信号进行分离,是一种有前途的智能化集成分波光开关.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.