FCBGA封装的CPU芯片散热性能影响因素研究

散热设计是芯片封装设计中非常重要的一环，直接影响芯片运行时的温度和可靠性。芯片内部封装材料的尺寸参数和物理特性对芯片散热有较大影响，可以用芯片热阻或结温的高低来衡量其散热性能的好坏。通过数值模拟(有限体积法)的方法，对某国产FCBGA封装的CPU散热性能进行研究，分析CPU封装内的各层材料尺寸、导热系数及功率密度等因素对CPU温度和热阻的影响。研究结果表明：TIM1导热系数在35 W/(m·K)以内时，TIM1导热系数和厚度对CPU散热有较大影响；晶圆面积(功率密度)对CPU散热有较大影响，晶圆厚度对CPU散热影响不大。     

基于傅里叶级数的小推力航天器快速轨迹设计

为了满足小推力航天器交会轨迹的快速性设计需求,基于形状逼近理论,设计了一种三维轨迹模型.将轨迹设计问题转换为求解傅里叶级数的系数问题,避免了轨迹运动方程非线性强、难以求解的难题,极大地提高了计算效率.考虑到推力加速度的限制,建立了加速度约束方程,并结合轨迹的运动方程,给出了傅里叶级数的求解过程.同时根据边界条件和最大推力加速度值,定性地分析了傅里叶系数的存在条件.仿真验证了该方法的正确性和可行性,并从计算效率上与高斯伪谱法进行了对比,结果表明本文的方法计算耗时仅为高斯伪谱法的0.67%.     

基于热流原理的核心温度传感器在膝关节深部测温的应用研究

人体膝关节处深部体温的监测对于关节患者治疗与康复十分重要.为了能够为热疗中的关节炎患者持续测量皮肤组织不同深部的体温.本文基于传热学原理,通过对核心温度测量技术的改进,创新性的提出了膝关节深部测温的方法.根据膝关节的特点将其划分为6个区域并布置12个位置的传感器探头,基于生物传热模型模拟了人体膝关节和传感器探头的传热实验;首先通过设置膝关节核心温度38℃不变,在稳态条件下根据传感器两侧的温度差,以及膝关节深部不同厚度处的温度,利用传热方程计算对应等厚度层皮肤组织热阻,与等温度层热阻对比分析了不同部位组织深度与热阻得关系.维持核心温度38℃,建立了热疗仿真模型,通过设置点热源,模拟高频热疗仪的深部热疗实验,利用所求热阻计算对应深部的温度与该位置探针显示温度值对比,误差在0.62℃以内.基于仿真实验结果建立膝关节传热理论并进行了热板实验和人体实验.热板实验中传感器热平衡时间约为7.7 min,平均误差为0.15℃,分析了人体实验的误差来源.这种基于仿真实验理论的符合人体工程学的体温传感器有可能对膝关节患者深部体温进行连续测量.     

用于微流控PCR的TEC温控系统结构优化设计

为了实现微流控聚合酶链式反应(PCR)的快速升降温,设计了一种基于半导体制冷片(TEC)的温度控制系统.通过对控温对象微流控PCR芯片的热分析,确定了TEC的参数,并且研究了TEC效率与散热性能之间的关系.在此基础上,设计了一种热管鳍片式高性能散热器,对其传热机理、传热路线及热阻进行了深入分析,建立了有限元模型,并对该热管散热器进行了实验测试.实验结果表明:该温控系统的平均升降温速率达到7.48℃/s,为实现微流控PCR系统的快速精确升降温控制奠定了良好基础.     

基于SFFT的宽带信号互谱法测向算法

在无线电频谱监测中,随着数据采集能力和采样频率的不断提高,对算法的时效性提出了更高要求。对于宽带信号测向系统,提出基于稀疏快速傅里叶变换的互谱法相位测量算法,该算法利用信号频域的稀疏特性,通过频谱重排、滤波、降采样和估值,能快速计算出频谱中K（信号稀疏度）个拥有最大值的傅里叶系数。利用这K个大值点计算平均时延,在保证与传统快速傅里叶变换有相同精度的同时,降低算法的时间复杂度。分析表明,该算法的时间复杂度与信号稀疏度K呈亚线性关系。该方法提高了算法效率。仿真分析对比了基于稀疏快速傅里叶变换的互谱法和基于快速傅里叶变换的互谱法的误差,表明了该算法的有效性。     

论电子单板散热设计探究

普通SOP封装散热性能很差,影响SOP封装散热的因素分外因和内因,其中内因是影响SOP散热的关键。影响散热的外因是器件管脚与PWB的传热热阻和器件上表面与环境的对流散热热阻。内因源于SOP封装本身很高传热热阻。     

基于随机傅里叶特征空间的高斯核近似模型选择算法

核方法是一种把低维空间的线性不可分问题转化为高维空间中线性可分问题的方法,其广泛应用于多种学习模型。然而现有的核模型选择方法在大规模数据中计算效率较低,时间成本很大。针对这一问题,本文引入随机傅里叶特征变换,将原始核特征空间转换为另一个相对低维的显式随机特征空间,并给出核近似误差上界理论分析以及在核近似的随机特征空间中训练学习模型的误差上界,得到核近似的收敛一致性和误差上界与核近似参数之间的关系。基于随机傅里叶特征空间选择出最优模型参数,避免了对最优原始高斯核模型参数的大规模搜索,从而大幅降低原始高斯核模型选择所需的时间成本。实验表明,本文给出的误差上界确由核近似参数控制,核近似选择的最优模型相较于原始高斯核模型有较高的准确率,并且模型选择时间相对网格搜索法大幅减小。     

IC热阻简化模型的数值分析应用

采用集成电路的热阻简化模型的方法,以DIP封装芯片为例,建立了元件传热的数值模型;分别对两热阻模型和单热阻模型,这两种不同的建模方法在自然对流的情况下进行了稳态分析,并以详细模型的分析结果作为基准进行了对比,获得了使用这两种简化模型进行分析时结果的准确性;对工程师在进行热分析和热设计仿真时,建模方法的选取具有重要的参考价值.     

含水率与孔隙率对粉煤灰传热性能影响

以粉煤灰传热为研究对象,选取不同含水率和孔隙率粉煤灰试样,建立自主研制的两侧恒温差立方体实验台,对阜新市热电厂的漂珠型粉煤灰进行温度实验测试;根据半无限大物体导热原理,采用非稳态法对试样有效导热系数进行计算,研究含水率与孔隙率对粉煤灰传热性能的影响。引入Brinkman-Forchheimer扩展Darcy模型进行修正,考虑流体密度随温度变化,局部热平衡,建立二维粉煤灰传热数值模型,完成试验与模型互相验证。结果表明:孔隙率为0.26时,随着含水率增加,粉煤灰的有效导热系数由0.24增大至0.27,保温隔热性能变弱;孔隙率增大有利于粉煤灰保温隔热性能的提高,其有效导热系数由0.25降低至0.19;含水率变化对压实型粉煤灰内部热传输方式影响不大,热传输方式为热传导;疏松型粉煤灰热传输方式以导热为主,有轻微对流换热迹象,粉煤灰内传热应考虑孔隙率变化对其影响。     

二维各向同性湍流直接数值模拟的六边形谱方法及GPU实现和优化

本文在六边形傅里叶分析及六边形快速傅里叶变换的基础上,提出了二维各向同性湍流直接数值模拟的对偶六边形傅里叶谱方法和六边形傅里叶谱方法,基于二维Navier-Stokes 方程的涡度-速度形式,构造了两种六边形傅里叶谱方法的离散格式,设计了其快速求解算法,并且在GPU高性能平台上研制并优化了相应的数值模拟程序.根据方程的具体形式和六边形傅里叶谱方法的特点,从算法层面对方程的求解过程,尤其是非线性Jacobian项快速计算进行优化,经过优化之后,方程求解算法的计算复杂度减少了约30％;根据GPU的体系结构和数值模拟程序的功能要求,将计算模块全部设计为在GPU上运行的kernel函数,尽量避免内存与显存之间的数据拷贝,并在软件工程层面上对代码进行性能优化.优化后的GPU程序获得了高达50倍的加速比.在此基础上,我们对二维各向同性湍流进行了初步的数值模拟,并考察了在不同初始雷诺数条件下,能量和拟涡能随着时间的演变曲线.计算结果表明六边形傅里叶谱方法与传统的傅里叶谱方法一样高效精确.     

Novel heat dissipation design for light emitting diode applications

The authors offer a new design in support of efficient heat dissipation for light emitting diodes (LEDs). In the first part of this paper we discuss improvements in LED packaging materials and layer assembly, and then describe the addition of a thin layer of electroplated copper to the LED base assembly to reduce thermal resistance and increase thermal diffusion efficiency. Also described is a three-dimensional finite element simulation that we performed to verify the proposed design (0.75, 1, and 3 W LED chip temperatures) and a LED heat transfer behavior analysis. The results indicate that the addition of a 9 mm² electroplated copper layer to the LED base assembly improved LED thermal dissipation by reducing chip temperature by 5°C compared to LEDs without the copper layer packaging. In the second part of this paper we describe (a) our heat pipe system/heat sink design for LED illumination, and (b) experiments in which we changed both working fluid mass and rotation angle to determine their effects on heat pipe cooling. Our results indicate that the most efficient heat dissipation occurred when an added heat pipe was arranged horizontally. Good heat dissipation was observed for heat pipes containing 2.52 g of water (temperature reduced by 50°C). Larger water volumes failed to dissipate additional heat due to the presence of steam inside the pipe.     

Anti-diffusive methods for hyperbolic heat transfer

The hyperbolic heat transfer equation is a model used to replace the Fourier heat conduction for heat transfer of extremely short time duration or at very low temperature. Unlike the Fourier heat conduction, in which heat energy is transferred by diffusion, thermal energy is transferred as wave propagation at a finite speed in the hyperbolic heat transfer model. Therefore methods accurate for Fourier heat conduction may not be suitable for hyperbolic heat transfer. In this paper, we present two anti-diffusive methods, a second-order TVD-based scheme and a fifth-order WENO-based scheme, to solve the hyperbolic heat transfer equation and extend them to two-dimension, including a nonlinear application caused by temperature-dependent thermal conductivity. Several numerical examples are applied to validate the methods. The current solution is compared in one-dimension with the analytical one as well as the one obtained from a high-resolution TVD scheme. Numerical results indicate that the fifth-order anti-diffusive method is more accurate than the high-resolution TVD scheme and the second-order anti-diffusive method in solving the hyperbolic heat transfer equation.     

金刚石热沉与半导体器件连接技术研究现状与发展趋势

半导体器件的集成化和小型化不可避免地导致散热问题发生。热量的持续累积威胁着电子的性能、稳定性和寿命。因此,提高电子器件的散热能力对其稳定运行至关重要。金刚石作为一种高效的散热衬底,具有众多无可比拟的优势,越来越受到人们关注。该文综述了金刚石作为半导体高功率器件热沉的研究进展,简要介绍了金刚石与半导体器件的连接方式,总结了金刚石基半导体器件面临的技术挑战,展望了其未来发展方向。     

Computer simulation of the temperature and electromagnetic field in an inductively heated semiconductor

The electromagnetic and temperature fields in an inductively heated semiconductor interact with each other in a sophisticated way through the heat dependence of the material parameters and the heat source density determined by the eddy currents. The paper deals with a computer analysis of the interacting fields taking into account the nonlinear temperature dependence of the material parameters. The basic electromagnetic and heat conduction equations are discussed, and a transformation will be introduced for the calculation of the electromagnetic field outside the material. The nonlinear equation system resulting from discretization is solved by an iterative method, whose relaxation factor is optimized during the iteration. Experiences gained in the course of the numerical calculations are reported, and results of a calculation performed with specific physical data are described.     

Simulation of a high-power LED lamp for the evaluation and design of heat dissipation mechanisms

High-power LED lamps have been under intense development in recent years. However, issues related to heat dissipation on the LED chip continue to plague research efforts. Heat generation increases with the power of the LED chip and heat accumulation is exacerbated by the plastic casinge of the lamp. Accumulated heat can seriously shorten the lifespan of an LED device. Consequently, manufacturers are constantly seeking ways to improve heat dissipation via heat transfer mechanisms. Little analysis has been performed on coupling the fluid field and heat dissipation inside LED lamps. Using FLUENT software, this study developed a simulation method for LED lamps in order to investigate thermal and fluid fields inside a lamp. The simulation results of an 8 W LED lamp predicted a chip temperature of 75.1 °C and maximum air velocity of 97.3 mm/s within the lamp with two sets of air circulation. The proposed model facilitates new fin designs and the determination of the optimal inner-shell thickness with the proposed design of a LED lamp having 36 fins and an inner-shell thickness of 1 mm for increased heat dissipation.     

Isoparametric line and transition finite elements with temperature and temperature gradients as primary variables for two dimensional heat conduction

This paper presents isoparametric line and transition finite element formulation for two dimensional heat conduction. The element properties are derived using weak formulation of the Fourier heat conduction equation and the element approximation where nodal temperatures and the nodal temperature gradients are retained as primary variables. The formulation permits linear temperature distribution through the element thickness. Distributed heat flux as well as convective boundaries are permitted on all four faces of the elements. Furthermore, the elements can have internal heat generation as well as orthotropic material properties. The superiority of the formulation in terms of efficiency and accuracy is demonstrated. Numerical examples are presented to illustrate their applications, and a comparison is made with theoretical results.     

基于TDC-GP22的超声波热量表设计

超声波热量表的关键问题是测量数据的高度精确性。设计选取了TDC—GP22测量芯片,配合低功耗MSP430系列芯片作为 MCU,配合超声波换能器和 Pt1000温度传感器来测量流速和水温。通过TDC—GP22增加的3个重要功能来实现精确的脉冲间隔测量、检测管内异常和简化的多脉冲结果计算。通过在行业标准环境下测试热量表具有较低的功耗、较高的准确度和良好的稳定性。     

A system-level model for a silicon thermal flow sensor

A system-level model with lumped parameters for a thermal flow sensor is presented. The model is built with 13 circuit cells consisting of thermal resistors and thermal capacitors in SPICE. The circuit cell originates from the heat conduction equation using the Finite Differential Method, including the 2-D thermal conduction cell, the convection cell, and the thermal capacity in the chip. Based on the thermal model of the flow sensor, the 2-D temperature distribution of the chip can be calculated with SPICE in both the constant power mode (CP) and constant temperature difference mode (CTD). As an example, the system level model of the thermal anemometer in the CTD mode was established in PSPICE. Wind tunnel test was carried out to verify the system model, and show a reasonable agreement with the simulation results, with an error less than 8%.     

Analytical solution of micro-/nanoscale convective liquid flows in tubes and slits

Analytical solutions examining heat transport in micro-/nanoscale liquid flows were developed. Using the energy equation coupled with fully developed velocity, we solved developing temperature profiles with axial conduction and viscous dissipation terms. A comprehensive literature review provided the published range of velocity slip and temperature jump conditions. While molecular simulations and experiments present constant slip and jump values for a specific liquid/surface couple independent of confinement size, non-dimensional forms of these boundary conditions were found appropriate to calculate non-equilibrium as a function of flow height. Although slip and jump conditions are specific for each liquid/surface couple and hard to obtain, we proposed modeling of the slip and jump as a function of the surface wetting, in order to create a general, easy to measure methodology. We further developed possible correlations to calculate jump using the slip value of the corresponding surface and tested in the results. Fully developed Nu showed strong dependence on slip and jump. Heat transfer stopped when slip and jump coefficients became higher than a certain value. Strong variation of Nu in the thermal development length was observed for low slip and jump cases, while an almost constant Nu in the flow direction was found for high slip and jump coefficients. Variation of temperature profiles was found to dominate the heat transfer through the constant temperature surface while surface and liquid temperatures became equal at heat transfer lengths comparable with confinement sizes for no-dissipation cases. In case of non-negligible heat dissipation, viscous heating dominated the Nu value by enhancing the heating while decreasing the heat removal in cooling cases. Implementation of proposed procedure on a micro-channel convection problem from a micro-fluidics application showed the dominant effect of the model defining the slip and jump relationship. Direct use of kinetic gas theory resulted in an increase of Nu by an increase in non-equilibrium, while models developed from published liquid slip and jump values produced an opposite behavior.     

电动汽车锂离子电池组散热优化设计

针对电动汽车锂离子电池组散热不均匀会影响电池组使用性能、可靠性和安全性的问题,对电池组散热方案进行优化设计.描述锂离子电池的产热模型,建立锂离子电池组三维模型,介绍计算流体力学（Computational Fluid Dynamics,CFD）计算涉及到的固体热传导和流体热传导控制方程;通过进风口角度的选择、进风口流速的选择、鼓风冷却和抽风冷却的对比以及锂离子电池局部倒角的选择确定几种散热方案,使用FLUENT进行数值仿真并得出各方案的总体流场特性、局部流速和温度分布情况.通过对各散热方案的对比和评估,发现当进风角度达到3°时,温度最高点和均匀性有明显改善;在一定的速度范围内,提高进风口流速可以很好地改善系统的散热效果,但是当进风口流速超过某一范围（30 m/s）时,散热效果递增不明显;对于相同的散热结构,鼓风冷却效果明显优于抽风冷却效果;通过电池组局部倒角等局部微小结构可以实现温度场优化.