Integrated circuits for a 200 Mbit/s fiber-optic link

A set of three bipolar integrated circuits for a new fiber-optic link is described. The link operates at data rates of 5-200 Mb/s NRZ. The optical transmitter and receiver modules are compact and fit into standard 16-pin dual-in-line sockets. The power consumption of the transmitter module is 530 mW and the receiver module dissipates 310 mW. The optical loss budget is 20 dB, which is sufficient for link lengths of up to 5 or 6 km. The circuits have been designed in a 3-/spl mu/m bipolar process. The chip sizes are 2 mm/spl times/1.75 mm each.     

40Gbit／s高速并行12信道光接收模块的研制

研究并制作了12信道并行光接收模块,单信道传输速率大于等于3．318Gbit／s,12信道并行总传输速率为40Gbit／s。模块采用工作波长在850nm的高速PIN型光电探测器（PD）列阵作为光接收器件,PD列阵与接收电路芯片直接用Au丝压焊连接,输入光信号直接由12信道的光纤阵列耦合进入PD列阵中。对光接收模块进行眼...     

A 32-channel tunable receiver module for wavelength-division multiple-access networks

We report the realization of a 32-channel tunable optical receiver module for packet-switched multiwavelength computer networks. The tunable receiver consists of a planar array waveguide grating demultiplexer, photodetector array and followed by selectable receivers. The channel selection is based on sequential switching of the received optical signals in stages at the analogue level. Typical receiver sensitivity is -24 dBm at 10/sup -9/, using a 700-Mb/s nonreturn-to-zero (NRZ) pseudorandom binary sequence (PRBS). The channel switching time is /spl sim/40 ns.     

140Mb/s混合集成定时提取及判决再生电路的研制

本文介绍了140Mb/s光通信混合集成定时提取及判决再生模块。它们分别组装在32×22.5×1mm~3的陶瓷基片上,并采用标准的双列直插形式。该模块适用于5B6B及8B1H等NRZ(非归零)码的时钟信号提取及整形再生。     

30Gbit/s并行光接收模块

报道了一种基于CMOS工艺接收电路芯片和GaAs工艺1×12光电探测器阵列的30Gbit/s并行光接收模块.该模块采用并行光通信方案,利用中高速光电子器件实现信号的高速传输.直接使用未经封装的接收电路裸片和光探测器裸片,采用电路板上芯片技术封装制作模块,并通过倒装焊的方式实现了探测器阵列与列阵光纤的精确对准并形成了可插拔的光接口.测试结果表明模块的接收能力可以达到30Gbit/s.误码率小于10-13时,接收模块的灵敏度可以达到-13.6dBm.     

30Gbit/s Parallel Optical Receiver Module

报道了一种基于CMOS工艺接收电路芯片和GaAs工艺1×12光电探测器阵列的30Gbit/s并行光接收模块.该模块采用并行光通信方案,利用中高速光电子器件实现信号的高速传输.直接使用未经封装的接收电路裸片和光探测器裸片,采用电路板上芯片技术封装制作模块,并通过倒装焊的方式实现了探测器阵列与列阵光纤的精确对准并形成了可插拔的光接口.测试结果表明模块的接收能力可以达到30Gbit/s.误码率小于10-13时,接收模块的灵敏度可以达到-13.6dBm.     

120-Gb/s VCSEL-based parallel-optical interconnect and custom 120-Gb/s testing station

A 120-Gb/s optical link (12 channels at 10 Gb/s/ch for both a transmitter and a receiver) has been demonstrated. The link operated at a bit-error rate of less than 10/sup -12/ with all channels operating and with a total fiber length of 316 m, which comprises 300 m of next-generation (OM-3) multimode fiber (MMF) plus 16 m of standard-grade MMF. This is the first time that a parallel link with this bandwidth at this per-channel rate has ever been demonstrated. For the transmitter, an SiGe laser driver was combined with a GaAs vertical-cavity surface-emitting laser (VCSEL) array. For the receiver, the signal from a GaAs photodiode array was amplified by a 12-channel SiGe receiver integrated circuit. Key to the demonstration were several custom testing tools, most notably a 12-channel pattern generator. The package is very similar to the commercial parallel modules that are available today, but the per-channel bit rate is three times higher than that for the commercial modules. The new modules demonstrate the possibility of extending the parallel-optical module technology that is available today into a distance-bandwidth product regime that is unattainable for copper cables.     

Fully differential optical interconnections for high-speed digitalsystems

This work presents the design details and experimental results for a parallel optical link. The link is designed for connections within high-speed digital systems, specifically for board- and backplane-level interconnections. The link can contain as many fibers in parallel as technology permits. The unusual aspects of this interconnection system are that it is DC-coupled and uses fully differential inputs, two optical channels per signal, to achieve self-thresholding and noise immunity. A chip set consisting of a 2.5-Gb/s bipolar differential laser driver, a 800-Mb/s GaAs MSM (metal-semiconductor-metal) preamplifier array, a 800-Mb/s GaAs MSM preamplifier-postamplifier array, and a GaAs MSM preamplifier array in which each preamplifier has a different bandwidth varying from 300 Mb/s to 2 Gb/s has been designed, fabricated, and tested to serve as a vehicle for verifying the concept. Although the experimental testing of the entire interconnect system is not yet complete, the experimental studies presented show a bandwidth in excess of 800 MHz and excellent signal isolation between channels     

Si基单片集成850nm光接收芯片研究

设计并制备了一种Si基单片集成850nm光接收芯片,包括"P+/N-EPI/BN+"结构的光电探测器(PD)、跨阻前置放大电路及其后续处理电路。分析了PD的结构,并对其光谱响应及频率响应进行模拟,在2.0V偏压下,PD在850nm的响应度为0.131A/W,截止频率为400 MHz。采用0.5μm BCD(bipolar、CMOS和DMOS)工艺流片,光接收芯片面积约为900μm×1 100μm。测试结果表明,PD暗电流为pA量级,响应度为0.12A/W。光接收芯片在155 Mb/s速率及误码率(BER)小于10-9情况下,灵敏度为-12.0dBm;在622 Mb/s速率及BER小于10-9情况下,灵敏度为-10.0dBm,并能得到清晰的眼图。将该光接收芯片封装后接入光接收模块,进行点对点光互联实验,获得很好的光信号通路。     

基于垂直腔面发射激光器的高速率并行光发射模块

报道了关于并行光发射模块的设计与制作.优化设计、制作并测试了12信道并行光发射模块,单信道传输速率可达3Gbit/s.采用波长为850nm的垂直腔面发射激光器作光源,激光器与驱动电路芯片直接用金丝连接.输出光束直接耦合进入12信道的光纤阵列中.采用小型化可插拔封装结构以便在应用中实现热插拔.模块的测试结果表明,在8mA的工作电流下,测到3Gbit/s的清晰眼图.     

Line code selection for 155.52 Mb/s data transmission on category 5cable plant

EMI/EMC is a dominant problem encountered in high bit-rate (>100 Mb/s) transmission over unshielded twisted-pair cable (UTP) which leads to a novel set of line-code dependent tradeoffs affecting transceiver and cable plant complexity. To understand the tradeoffs, the authors examined the factors affecting RF emissions and susceptibility in both trellis-configured cable plant models and installed cable plant. An analytical model is presented that describes mode conversion by discontinuities in multi-pair UTP cable plant. Termination of the three dominant propagating modes produces consistently lower radiated emissions than other standard cable termination procedures. Cable plant parameters which predict good transmission do not assure satisfactory EMI performance. Radiated emissions from the trellis model occur in broad bands at 43, 53, 60, 70, and 80 MHz, and show a positive correlation with the transmit signal spectrum. For a given transmit level at 155 Mb/s, the emissions with MLT3 and BPR1 were 8-13 dB (10 dB typ) and 4-20 dB (13 dB typ) below NRZ levels, respectively. The authors also compared the performance of NRZ, MLT3, BPR1, and BPR4 line codes in an experimental 155 Mb/s link with 100 m of UTP5 by measuring the BER sensitivity to both injected noise and pseudo-random data sequence length. When the measured receiver penalty associated with three levels is included, MLT3, BPR1, and BPR4 offer 5-15 dB better performance over NRZ at 155 Mb/s, although implementation complexity is greater     

140Mb/s光接收混合集成AGC主放大模块

本文介绍了140Mb/s光通信系统接收机中所用的AGC主放大模块。此模块采用厚膜电路混合集成形式,将AGC电路、主放大器制作在29.1×13.9mm~2的陶瓷片上,封装在DHM24绝缘子壳内,带宽为200MHz(3dB),增益为50dB,AGC范围大于25dB。在四次群光纤通信系统试验中,接收机灵敏度为-39dBm(误码率10~(-9)),眼图清晰。     

Gigabyte/s parallel fiber-optic links based on edge emitting laserdiode arrays

We present a ten-channel parallel fiber optic link consisting of a transmitter based on an edge emitting laser diode array operating nominally at 1 μm wavelength and a complementary receiver based on an InGaAs pin photodetector array. We demonstrate fiber optic link performance up to data rates of 1 Gb/s per channel with low skew at measurement time limited bit error rates lower than 10^-11 over 100 m of multimode fiber ribbon cable. The transmitter is operational, with very clear eye opening, up to baseplate temperatures of 105°C     

Chip-to-Chip Optical Link System Using an Optical Wiring Method

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx). The optical TRx module consisted of a metal optical bench, a module printed circuit board, a driver/receiver integrated circuit, a vertical-cavity surface-emitting laser/photodiode array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The optical wiring link was constructed with POFs mounted on a v-grooved polymethylmethacrylate bench. The data transfer measurements were presented successfully.     

140Mb/s混合集成光发射机

研制了一种混合集成140Mb/s单模半导体激光器发射机。该发射机由高速缓冲整形放大、LD驱动功能模块、LDAPC——LD自动功率控制功能模块、LDATC——LD自动温度控制功能模块,LD保护及寿命,信号终断告警功能模块和调顶功能模块所构成。发射机调制出纤光功率为-6dBm～-3dBm、消光比≤10％,在0～45℃范围内光功率变化在±1dB以内。该发射机和本所同时研制的混合集成光接收机配套,构成了目前140Mb/sPCM数字光端机的全新产品。     

Packaging technology for 40-Gb/s optical receiver module with anMU-connector interface

A compact 40-Gb/s optical receiver module with an MU-connector interface has been developed. Its packaging has three main technical features. (1) Coplanar waveguide (CPW) patterns of the waveguide photodiode (WG-PD) and of the preamplifier IC in the facing area of the flip-chip structure are optimized for impedance matching. (2) A film carrier is used to connect the preamplifier IC to an electrical coaxial connector for electrical signal output. (3) An MU-connector is used as the optical interface to reduce the module size. Optimum design enabled a module size of 14.0 mm wide, 40.4 mm long, and 9.65 mm high. Measurements showed a 3-dB down bandwidth of the optical/electrical response of at least 50 GHz and a clear open eye pattern for a 40-Gb/s nonreturn-to-zero (NRZ) signal input. This optical receiver module is suitable for large-capacity communication network systems     

基于石墨烯的光缆监测和追踪方案研究

本文介绍了一种基于石墨烯监测、追踪的新型光缆接头盒,在传统光缆接头盒中仅增加了由光耦合部分和电处理部分组成的集成芯片：光耦合部分通过石墨烯与D形光纤的强相互作用实现每根光纤的信号耦合与转换,电处理部分通过电信号接收模块、中心控制模块、信息处理与存储模块、鉴权模块、收发天线模块和传感模块等对电信号进行处理和监控,最终达到对传输线路(包括管道、杆塔等)光缆中光纤的精细监测、上报和追踪。     

Simultaneous time- and wavelength-domain optical demultiplexing ofNRZ signals by using a side-injection-light-controlled bistable laserdiode

The authors have demonstrated direct optical demultiplexing of NRZ signals with simultaneous wavelength conversion by using a side-injection-light-controlled bistable laser diode module. The 250 Mbit/s demultiplexed output signals are each selected once every four bits from 1 Gbit/s NRZ optical input signals. Then each signal is regenerated and its bit width and wavelength are converted on one chip     

A gigabit-rate five-highway GaAs OE-LSI chipset for high-speedoptical interconnections between modules or VLSIs

A gigabit-rate five highway interface GaAs optoelectronic LSI chipset has been fabricated for the 0.85 μm wavelength range optical interconnections between modules or VLSIs. The optical sender consists of a high-speed laser driver array LSI having 2 Gb/s maximum operation speed and a tiny laser array. The optical receiver in a GsAs high-speed optical receiver array LSI with a monolithically integrated metal-semiconductor-metal (MSM) photodetector, a high-speed preamplifier, and a decision circuit that has a maximum operation speed of 1.8 Gb/s. The receiver LSI is provided with a new bit-synchronizing circuit and an automatic threshold determination circuit     

光纤通信端机中用的混合集成AGC信号放大模块

本文报导了140Mb/s混合集成光接收机中所使用的AGC信号放大模块研制结果。此模块为二、三、四次群光通信接收机中的功能模块。它包括主放大器输出信号的平均值检波器、控制二极管衰减器的AGC信号放大器、接收机所接收到的光电平的指示器以及PIN-FET前置放大器过载指示器。该模块采用厚膜混合集成方法将电路密封在DHM24型24引线标准膜电路绝缘子壳内。外形尺寸32.9×20.2mm~2。它体积小,可靠性高,与PIN-FET前放。AGC主放大模块连接后,在实用化的586B线路码型四次群光纤通信系统中,在误码率为10~(-9)下,接收灵敏度为-39dBm,并得到较好的眼图。