Micro electro discharge machine with an inchworm type of micro feed mechanism

A micro electro discharge machine with an inchworm type of micro feed mechanism has been developed. The prototype of micro electro discharge machine is comprised of a wire electro discharge grinding unit, a rotating unit of electrode, RC circuitry for micro electro discharge generation and a subsystem detecting and controlling machining process, in addition to the inchworm mechanism. In the design of the inchworm mechanism, a novel clamp mechanism with force magnifying structure is devised to increase its thrust capability and a pair of guide sleeves together with the clamps are used to decrease yawing error. The inchworm mechanism prototype has 60 mm stroke only limited by the length of the shaft, less than 2 μm yawing error and reaches to 30N output thrust force. The machining experiments carried out on the micro EDM prototype are also described. The techniques to machine micro electrode, micro holes with high aspect ratio, micro structures on stainless steel and silicon materials are discussed. Micro electrode diameter as small as 25 μm and micro holes with minimum size of less than 50 μm are obtained. And the maximum aspect ratios of micro electrodes and micro holes exceed 20 and 10 respectively.     

The development of an electrodischarge machine for micro-hole boring

This paper describes an electrodischarge machine^† for micro-hole boring capable of improved accuracy and performance in boring precision small diameter holes in components such as ink jet nozzles for printers, electron gun apertures for graphic displays, micro-connectors for high-speed computers, and optical components for telecommunications. Micro-energy discharging permits machining of 15–300 μm diameter micro-holes with a roundness accuracy of 0.5 μm or better and a surface roughness less than 0.1 μm. No bending stress is applied to the tool electrode, therefore high precision machining of cylindrical surfaces, machining with very thin side-walls, and machining of overlapping multiple-holes are all possible, regardless of the hardness of any electrically conductive material. Tool electrodes of any diameter are machinable using reversed-polarity electric discharge and are replaceable in the same way as conventional drills. Travel of the tool electrode is controlled automatically by microprocessor, thus eliminating the need for a skilled operator.     

Micro-structuring of glass with features less than 100 μm by electrochemical discharge machining

Micro-electrochemical discharge machining (ECDM) was studied in order to improve the machining of 3D micro-structures of glass. To minimize structures and obtain good surface microstructures, the effects of the electrolyte, the pulse on/off-time ratio, the voltage, the feedrate, the rotational speed, and the electrolyte concentration in the drilling and milling processes were studied.In ECDM, voltage is applied to generate a gas film and sparks on a tool electrode; however, high voltage produces poor machining resolution. To obtain a stable gas film over the whole surface of the tool at a low voltage, a new mechanical contact detector, based on a loadcell, was used; the immersion depth of the tool electrode in the electrolyte was reduced as much as possible. In this study, various micro-structures less than 100 μm in size, such as Ø 60 μm micro-holes, a 10 μm-thin wall, and a 3D micro-structure were fabricated to demonstrate the potential for micro-machining of glass by ECDM.     

Electro-chemical micro drilling using ultra short pulses

Electro-chemical machining (ECM) has been rarely applied in micro machining because the electric field is not localized. In this work, ultra short pulses with tens of nanosecond duration are used to localize dissolution area. The effects of voltage, pulse duration, and pulse frequency on the localization distance were studied. High quality micro hole with 8 μm diameter was drilled on 304 stainless steel foil with 20 μm thickness. Localization distance can be manipulated by controlling the voltage and pulse duration, and various hole shapes were produced including stepped holes and taper free holes.     

Three-dimensional shaping by dot-matrix electrical discharge machining

This paper deals with a new prototyping method called dot-matrix electrical discharge machining (EDM) with scanning motion. The machining process by the dot-matrix method is similar to printing motion with a dot-impact printer. This method can be applied not only to EDM but also electrochemical machining and forming. A prototype of the machining unit for the dot-matrix method has six feeding devices for thin wire electrodes. The electrodes of 300 μm in diameter are arranged with the pitches of 760 μm. To obtain a smooth surface, a planetary motion in the x-y-plane is added to the feeding of the machining unit in the z-direction, the same area is machined repeatedly, or the machining unit is moved with fine feed. By compensating for the wear of the electrode during the scanning EDM, various shapes with the accuracy of micrometers order can be obtained without a formed tool electrode.     

磨粒辅助EDM与ECM复合加工技术

微机电系统(Micro electromechanical systems,MEMS)的快速发展与产品微型化的发展趋势对微细结构表面(包括微孔、微槽和微棱柱/锥等)的加工质量提出了更高的要求,为了提高微细结构表面的加工质量,提出一种磨粒辅助放电加工(Electrodischarge machining,EDM)与电化学加工(Electro chemical machining,ECM)复合加工新方法,通过建立微加工模型分析了该方法的加工机理,搭建了微加工试验平台,并进行了工艺参数优化研究,采用直径500μm和75μm的钨电极在SUS 304不锈钢上分别进行了微盲孔和微通孔加工试验研究,结果表明,在所用的EDM、EDM与ECM复合加工和磨粒辅助EDM与ECM复合加工三种方法中,磨粒辅助EDM与ECM复合加工方法获得的表面粗糙度(Ra15 nm)最高,因此该方法是微细结构表面高效和高质量加工的最佳方法之一。     

Precision machining of micro tool electrodes in micro EDM for drilling array micro holes

Micro electro discharge machining (micro EDM) is suitable for machining micro holes on metal alloy materials, and the micro holes can be machined even to several microns by use of wire electro discharge grinding (WEDG) of micro electrodes. However, considering practicability of micro holes <Φ100 μm in batch processing, the controllable accuracy of holes’ diameter, the consistency accuracy of repeated machining and the processing efficiency are required to be systematically improved. On the basis of conventional WEDG method, a tangential feed WEDG (TF-WEDG) method combined with on-line measurement using a charge coupled device (CCD) was proposed for improving on-line machining accuracy of micro electrodes. In TF-WEDG, removal resolution of micro-electrode diameter (the minimum thickness to be removed from micro electrode) is greatly improved by feeding the electrode along the tangential direction of wire-guide arc, and the resolution is further improved by employing negative polarity machining. Taking advantage of the high removal resolution, the precise diameter of micro-electrode can be achieved by the tangential feed of electrode to a certain position after diameter feedback of on-line measurement. Furthermore, a hybrid process was presented by combining the TF-WEDG method and a self-drilled holes method to improve the machining efficiency of micro electrodes. A cyclic alternating process of micro-electrode repeated machining and micro holes’ drilling was implemented for array micro holes with high consistency accuracy. Micro-EDM experiments were carried out for verifying the proposed methods and processes, and the experimental results show that the repeated machining accuracy of micro electrodes was less than 2 μm and the consistency accuracy of array micro holes was ±1.1 μm.     

Micro electrical discharge machining using high electric resistance electrodes

In micro electrical discharge machining (EDM), because the material removal per single pulse discharge mainly determines the minimum machinable size of a micro EDM, decreasing the material removal per single pulse discharge is important. In this study, in order to decrease the material removal per single pulse discharge, high electric resistance materials such as single-crystal silicon are used for electrodes. Analytical results show that when the electrode resistance increases, the peak value of the discharge current decreases, whereas the pulse duration increases. In addition, the discharge energy decreases when increasing the resistance. Silicon is used as a tool electrode, and the effect of resistivity of the silicon tool electrode on the diameter of discharge craters generated on the stainless steel workpiece is examined. Experimental results reveal that with increasing silicon electrode resistivity, the diameter of discharge craters decreases. Because the diameter of discharge craters can be decreased to 0.5 μm, improved finished surfaces of R_z 0.03 μm are obtained.     

Micro-drilling of monocrystalline silicon using a cutting tool

The micro-drilling of monocrystalline silicon using a cutting tool was tested with the aim of fabricating three-dimensional and high aspect ratio micro-shapes. Micro-tools with a D-shaped cross-section and cutting edge radius of 0.5 μm were fabricated by wire electrodischarge grinding (WEDG). The results showed that, with a depth of cut of 0.1 μm, ductile-regime cutting was realized, and that a tool clearance angle larger than 0° was necessary to prevent fractures at the hole entrance. The smallest machinable hole was of 6.7 μm diameter, which is the smallest not just in the present study, but of all holes drilled using a cutting tool so far. Furthermore, an aspect ratio of more than four was obtained in the drilling of a 22 μm diameter and 90 μm deep hole.     

Accretion of titanium carbide by electrical discharge machining with powder suspended in working fluid

A surface modification method by electrical discharge machining (EDM) with a green compact electrode has been studied to make thick TiC or WC layer. Titanium alloy powder or tungsten powder is supplied from the green compact electrode and adheres on a workpiece by the heat caused by discharge. To avoid the production process of the green compact electrode, a surface modification method by EDM with powder suspended in working fluid is proposed in this paper. After considering flow of working fluid in EDM process, the use of a thin electrode and a rotating disk electrode are expected to keep powder concentration high in the gap between a workpiece and an electrode and to accrete powder material on the workpiece. The accretion machining is tried under various electrical conditions. Titanium powder is suspended in working oil like kerosene. TiC layer grows a thickness of 150 μm with a hardness of 1600 Hv on carbon steel with an electrode of 1 mm in diameter. When a disk placed near a plate rotates in viscous fluid, the disk drags the fluid into the gap between the disk and the plate. Therefore, the powder concentration in the gap between a workpiece and a rotational disk electrode can be kept high. A wider area of the accretion can be obtained by using the rotational electrode with a gear shape.     

Research of micro EDM/ECM method in same electrolyte with running wire tool electrode

A micro rod machining method which can switch between electrical discharge machining (EDM) and electrochemical machining (ECM) by attaching/detaching a diode to/from a bipolar pulse generator in parallel to the working gap was newly developed using a wire electrode made of tungsten. The problem of the wire electrode wear was eliminated by the use of the wire electrochemical turning (WECT) method in which the tungsten wire electrode is continuously running. The ultra-short bipolar pulse current was generated by the electrostatic induction feeding method where a pulse voltage is coupled to the working gap through a feeding capacitance. The machining characteristics of three types of wire guide; disk-shaped WC guide, laminated wire guide and cylindrical acrylic guide, were studied. The experimental results showed that the cylindrical acrylic guide has the best machining characteristics without the influence of guide wear and with less stray current flowing through the working gap. Using the cylindrical acrylic guide, the influences of the feeding capacitance C₁, and the total amplitude of the pulse voltage on the machining characteristics were studied. Finally, a stainless steel SUS 304 micro-rod with a high aspect ratio of 14 was fabricated efficiently by using the EDM and ECM modes for rough and finish machining in sequence with the same setup, pulse generator, and neutral electrolyte.     

Drilling of microholes down to 10 μm in diameter using ultrasonic grinding

Drilling by grinding is useful for fabricating holes in hard and brittle materials with high dimensional accuracy and low machining cost. However, its application to microholes has been limited to those with a diameter on the submillimeter order. The drilling of microholes less than 0.1 mm in diameter by grinding was therefore attempted on crown glass. Cemented tungsten carbide micropins were fabricated by electrical discharge machining and used as micro-grinding tools. They can be employed because the convex parts of discharge craters formed on the tool surfaces serve as cutting edges of abrasive grains of grinding wheels. In order to reduce grinding force and thus prevent tool breakage, ultrasonic grinding was employed with the workpieces ultrasonically oscillated. As a result, microholes down to 10 μm in diameter were successfully drilled. They are the smallest-diameter holes drilled by grinding, to the best of our knowledge. The effect of helical feeding, in which the tool not only rotates around its axis but also moves in planetary motion, on drilling properties was also investigated.     

Micro ECM with ultrasonic vibrations using a semi-cylindrical tool

In recent years, there has been a growing demand for micro holes. However, electrochemical machining has rarely been employed in drilling these holes because of problems with electrolyte diffusion. In this research, a semi-cylindrical tool was used as a tool electrode to increase the flow space of the electrolyte, and electrolyte diffusion was improved via the application of ultrasonic vibrations. Micro holes with a specified diameter of 76 μm were drilled on a 304 stainless steel plate of 300μm thickness. The proposed technique reduced both the machining time and the machining gap.     

半导体硅电极多通道放电机理研究

为了实现电火花加工同一时刻形成多个放电通道蚀除工件,克服现有放电加工理论中同一时刻仅有一个放电通道蚀除工件的限制,提出了采用半导体材料作为电极进行放电加工的新方法。首先,通过试验证明以半导体硅为电极加工金属可以形成多通道放电;其次,建立了半导体电极单通道放电等效电路模型,发现半导体电极在放电加工时不是一个等势体,并进行了电势差分布试验,验证了多通道放电形成的原因是远离放电点处的电势较高,可以同时形成击穿产生放电;最后,进行了半导体硅电极单脉冲放电试验及成型加工试验。试验结果显示,半导体硅电极通过1次脉冲放电同时形成多个放电通道,有效地分散放电能量,相较于金属电极,每个放电坑的直径和深度都显著减小。在相同放电参数下,对比钢电极,用硅电极进行电火花加工的表面粗糙度值下降71.7%。     

Micro-hole Maching of Copper Using the Electro-discharge Machining Process with a Tungsten Carbide Electrode Compared with a Copper Electrode

This paper describes micro-hole machining of a copper plate using the electro-discharge machining (EDM) process. Tungsten carbide was selected as the material for the electrode and compared with a copper-electrode. A precision centreless grinding process was employed to grind the electrode down to the desired diameter. A series of experiments were performed on a traditional EDM machine to investigate the effects of electrode material polarity setting and of a rotating electrode. Results have shown that electrode wear and hole enlargement are both smaller when positive polarity machining is selected; whereas electrode wear is larger and machining speed is higher when negative polarity machining is selected. High-quality micro-hole machining in copper can be achieved by the proposed method.     

A parallel link end effector for scanning electrical discharge machining process

Because a parallel mechanism has a high-frequency response, multiple degrees of freedom (DOF), and high stiffness, it can be applied to an end effector for electrical discharge machining (EDM) with a scanning motion. A prototype has 3 DOF: two tilting angles around the x- and y-axes, and the movement in the z-direction. It consists of, a base plate, a stage, a constraint link, and three inchworm devices that act as links. The inchworm devices are connected with the stage and the base plate. The z-position and inclination of the stage are changed by adjusting the length of the inchworm devices. The electrode feeding is controlled by the combination of the steplike movement with the inchworm devices and continuous extension of piezos. The frequency response of the stage by the continuous extension of the piezos is up to 200 Hz. The positioning accuracy of the end effector is less than 30 μm in height and 0.04° in inclination. Some examples of EDM by the scanning motion are demonstrated.     

Approaches for improvement of EDM cutting performance of SiC with foil electrode

Electrical discharge machining by foil electrode serves as an alternative method for SiC slicing. This technology uses a highly tensioned thin foil as the tool electrode. The main advantages over wire EDM are that the foil thickness can be made smaller than the wire diameter, vibrations can be avoided by applying high tension, and higher current can be supplied since there is less risk of tool breakage. However, due to the large side surface area of the foil electrode, there is a high occurrence probability of side surface discharges and high concentration of debris, which affects kerf width accuracy and machining stability. In the aim to overcome both problems, this study proposes two foil electrode designs: a foil electrode in which holes are machined and the insulation of the side surface areas by a resin coating layer of 5 μm thickness. The influences of both foil electrodes were tested with three different slicing strategies: no strategy, applying jump motion of the tool electrode, and applying reciprocating motion. From machining experiments and comparative studies of the discharge delay time, it was found that with both foil tools, the occurrence probability of side surface discharges can be reduced. In addition, the chip pocketing effect of the holes enhance the flushing conditions, resulting in a higher cutting speed.     

High efficiency fine boring of monocrystalline silicon ingot by electrical discharge machining

This article deals with high efficiency and high accuracy fine boring in a monocrystalline silicon ingot by electrical discharge machining (EDM). In manufacturing process of integrated circuits, a plasma-etching process is used for removing oxidation films. This process has recently been examined for use of monocrystalline silicon as the electrode to minimize the contamination. However, it is difficult to machine silicon accurately by the conventional diamond drilling method, because the material removal is due to brittle fracture. The machining force in the EDM process is very small compared with that in conventional machining, therefore, the possibility of high efficiency and high accuracy boring holes in silicon ingot by EDM is experimentally investigated. The removal rate of monocrystalline silicon by EDM is much higher than that of steel, while the electrode wear is extremely small. The improvement method leads to a better hole without chipping at the exit of hole or sticking of the insulator on the wall of hole. Furthermore, it is proved that even a high aspect ratio of about 200 boring is possible.     

Focused ion beam-shaped microtools for ultra-precision machining of cylindrical components

Focused ion beam (FIB) sputtering is used to shape a variety of cutting tools with dimensions in the 15–100 μm range and cutting edge radii of curvature of 40 nm. The shape of each microtool is controlled to a pre-specified geometry that includes rake and relief features. We demonstrate tools having rectangular, triangular, and other complex-shaped face designs. A double-triangle tip on one tool is unique and demonstrates the versatility of the fabrication process. The FIB technique allows observation of the tool during fabrication, and, thus, reproducible features are generated with sub-micron precision. Tools are made from tungsten carbide, high-speed tool steel, and single crystal diamond. Application of FIB-shaped tools in ultra-precision microgrooving tests shows that the cross-section of a machined groove is an excellent replication of the microtool face. Microgrooves on 40–150 μm pitch are cut into 3 mm diameter polymer rods, for groove arc lengths greater than 12 cm. The surface finish of machined features is also reported; groove roughness (R_a) is typically less than 0.2 μm. Ultra-precision machining of cylindrical substrates is extended to make bound metal microcoils having feature sizes of 20–40 μm.     

Fabrication of micro-end mill tool by EDM and its performance evaluation

Abstract

Micro-milling is a fast, cheap and controlled process compared to other micro-fabrication processes such as lithography, laser/electron/ion beam machining, etc. However, scarcity of cutting tools of very small dimensions often results in limited application of micro-milling. In the present study, electro discharge machining (EDM) is used for fabrication of micro-end mill tool. To ensure high dimensional accuracy of the tool, a parametric study is conducted by replicating the a tungsten carbide block to a tungsten carbide (WC) block. The relationships between the drilled cavities on the block and the features on the micro-tool are established. The influence of machining parameters (voltage, capacitance and spindle speed) on the response variables (entrance diameter, hole depth, material removal rate (MRR) and surface roughness) is reported. Capacitance is found more dominant as compared to other selected process parameters. Using optimized parameters from the parametric study, a WC micro-end mill tool of 100?µm diameter is fabricated. Channel of around 110 µm width, 40?µm depth and surface roughness of 70?nm is successfully fabricated on aluminum. The performance of the fabricated tool is compared with a commercial end mill tool by milling micro channels on stainless steel.