Composite InGaN/GaN/InAlN heterostructures emitting in the yellow-red spectral region

The results of studies of the properties of composite InGaN/GaN/InAlN heterostructures are reported. It is shown that, in the InAlN layer, there is substantial phase separation that brings about the formation of three-dimensional islands consisting of AlN-InAlN-AlN regions. The dimensions of these islands depend on the thickness of the InAlN layer and the conditions of epitaxial growth. Interruptions in the growth of InAlN provide a means for influencing the structural properties of the InAlN islands. The use of composite InGaN/GaN/InAlN heterostructures, in which the InGaN layer with a high In content serves as the active region in light-emitting diode structures, makes it possible to achieve emission in the yellow-red wavelength range 560?C620 nm.     

Formation of composite InGaN/GaN/InAlN quantum dots

Composite InGaN/GaN/InAlN quantum dots (QDs) have been formed and studied. The structural properties of thin InAlN layers overgrown with GaN have been analyzed, and it is shown that 3D islands with lateral sizes of ∼(20–30) nm are formed in structures of this kind. It is demonstrated that deposition of a thin InGaN layer onto the surface of InAlN islands overgrown with a thin GaN layer leads to transformation of the continuous InGaN layer to an array of isolated QDs with lateral sizes of 20–30 nm and heights of 2–3 nm. The position of these QDs in the growth direction correlates with that of InAlN islands.     

Fabrication and characterization of nonalloyed Cr/Au ohmic contacts to n- and p-type In0.53Ga0.47As

Ion implantation and rapid thermal annealing have been used to selectively produce thin high carrier concentration n- and p-type layers on In0.53Ga0.47As, and nonalloyed ohmic contacts with excellent properties have been achieved by depositing layers of Cr and Au on the implanted regions. The Cr/Au metallization is used to produce ohmic contacts on both p-type and n-type material in the same deposition. A series of electrical test patterns based on the transmission line model and four terminal structure were used to characterize the contact resistance of both alloyed and nonalloyed ohmic contact metallizations on In0.53Ga0.47As. The nonalloyed contacts to n-type material are superior to conventional alloyed contacts made in this study, while the nonalloyed contacts to p-type material are a factor of 5 higher resistance.     

Recent Advances in ZnO-Based Light-Emitting Diodes

ZnO has attracted considerable attention for optical device applications because of several potential advantages over GaN, such as commercial availability of bulk single crystals and a larger exciton binding energy (~60 meV compared with ~25 meV for GaN). Recent improvements in the control of background conductivity of ZnO and demonstrations of p-type doping have intensified interest in this material for applications in light-emitting diodes (LEDs). In this paper, we summarize recent progress in ZnO-based LEDs. Physical and electrical properties, bandgap engineering, and growth of n- and p-type ZnO thin films are also reviewed.     

InGaN/GaN light emitting diodes activated in O2 ambient

Mg-doped GaN epitaxial layers were annealed in pure O₂ and pure N₂. It was found that we could achieve a low-resistive p-type GaN by pure O₂ annealing at a temperature as low as 400°C. With a 500°C annealing temperature, it was found that the forward voltage and dynamic resistance of the InGaN/GaN light emitting diode (LED) annealed in pure O₂ were both smaller than those values observed from InGaN/GaN LED annealed in pure N₂. It was also found that an incomplete activation of Mg will result in a shorter LED lifetime     

Epitaxial growth of GaN/AlN/InAlN heterostructures for HEMTs in horizontal MOCVD reactors with different designs

The epitaxial growth of InAlN layers and GaN/AlN/InAlN heterostructures for HEMTs in growth systems with horizontal reactors of the sizes 1 × 2", 3 × 2", and 6 × 2" is investigated. Studies of the structural properties of the grown InAlN layers and electrophysical parameters of the GaN/AlN/InAlN heterostructures show that the optimal quality of epitaxial growth is attained upon a compromise between the growth conditions for InGaN and AlGaN. A comparison of the epitaxial growth in different reactors shows that optimal conditions are realized in small-scale reactors which make possible the suppression of parasitic reactions in the gas phase. In addition, the size of the reactor should be sufficient to provide highly homogeneous heterostructure parameters over area for the subsequent fabrication of devices. The optimal compositions and thicknesses of the InAlN layer for attaining the highest conductance in GaN/AlN/InAlN transistor heterostructures.     

The Use of Spatial Analysis Techniques in Defect and Nanostructure Studies

Spatial analysis techniques were used to investigate defects and nanostructures in the III-nitride system. Dislocations in GaN films were distributed nonrandomly, forming both short-scale and large-scale linear arrays aligned along \( \langle 11\bar{2}0\rangle . \) Both low-density InGaN/GaN quantum dots (QDs) and In droplets on the surface of InAlN films were in spatially random positions and showed no spatial autocorrelation, but high-density InGaN/GaN QDs showed a tendency toward short-range ordering and all features showed a nonrandom size distribution. The spatial arrangements of defects and nanostructures relate to their generation processes and may also affect device properties.     

Blue lasing at room temperature in an optically pumped lattice-matched AlInN=GaN VCSEL structure

Laser action with low threshold average pump power density (~50 W - cm^-2 ) at room temperature is reported for a crack-free planar vertical cavity surface emitting laser (VCSEL) structure based on a bottom lattice-matched AllnN/GaN distributed Bragg reflector (DBR) and a top dielectric DBR. The cavity region, formed by n- and p-type GaN layers surrounding only three InGaN/GaN quantum wells, corresponds to a typical active region suitable for an electrically driven VCSEL. In addition to low threshold, a spontaneous emission coupling factor beta ~ 2 x 10^-10 is derived for this ready-to-be-processed laser structure.     

Numerical simulation of InGaN Schottky solar cell

The Indium Gallium Nitride (InGaN) III-Nitride ternary alloy has the potentiality to allow achieving high efficiency solar cells through the tuning of its band gap by changing the Indium composition. It also counts among its advantages a relatively low effective mass, high carriers' mobility, a high absorption coefficient along with good radiation tolerance. However, the main drawback of InGaN is linked to its p-type doping, which is difficult to grow in good quality and on which ohmic contacts are difficult to realize. The Schottky solar cell is a good alternative to avoid the p-type doping of InGaN. In this report, a comprehensive numerical simulation, using mathematically rigorous optimization approach based on state-of-the-art optimization algorithms, is used to find the optimum geometrical and physical parameters that yield the best efficiency of a Schottky solar cell within the achievable device fabrication range. A 18.2% efficiency is predicted for this new InGaN solar cell design.     

GaN p–n junction diode formed by Si ion implantation into p-GaN

²⁸Si⁺ implantation into Mg-doped GaN, followed by thermal annealing in N₂ was performed to achieve n⁺-GaN layers. The carrier concentrations of the films changed from 3×10¹⁷ (p-type) to 5×10¹⁹ cm⁻³ (n-type) when the Si-implanted p-type GaN was properly annealed. Specific contact resistance (ρ_c) of Ti/Al/Pt/Au Ohmic contact to n-GaN, formed by ²⁸Si⁺ implantation into p-type GaN, was also evaluated by transmission line model. It was found that we could achieve a ρ_c value as low as 1.5×10⁻⁶ Ω cm² when the metal contact was alloyed in N₂ ambience at 600 °C. Si-implanted GaN p–n junction light-emitting diodes were also fabricated. Electroluminescence measurements showed that two emission peaks at around 385 and 420 nm were observed, which could be attributed to the near band-edge transition and donor-to-acceptor transition, respectively.     

热退火对Mg掺杂InGaN/GaN异质结特性的影响

系统地研究了氧气氛围中退火温度对Mg掺杂InGaN/GaN异质结电学特性及光学性能的影响.电流电压特性和表面方块电阻的测试表明,与p-GaN相比,p-InGaN/GaN异质结的最佳退火温度较低,而且容易与非合金化的Ni/Au电极形成欧姆接触.分析认为InGaN具有的较小带隙能量和p-InGaN/GaN异质结中存在强烈的极化效应以及InN较高的平衡蒸汽压是引起以上结果的主要原因.p-InGaN/GaN异质结10 K的光致荧光光谱中存在两个分别位于2.95 eV和2.25 eV的发光峰,随着材料退火温度的提高,这两个发光峰的强度逐渐降低.提出了类施主补偿中心参与的与H相关的络合物与Mg受主的复合发光机制,对退火前后光致荧光光谱的变化进行了解释.     

Arsenic-implanted thin film PECVD semi-insulating polysilicon (SIPOS) resistors

Thin film (2000Å) PECVD SIPOS resistors were fabricated using arsenic implantation and rapid thermal annealing. The current-voltage characteristics are symmetrical and field-dependent. The resistivity (as low as 0.2 ohm-cm) is shown to be a function of the oxygen content of the as-deposited material, the implant dose, and the annealing temperature. The variation of resistance with operating temperature also decreases with increasing dose and annealing temperature. As expected, the lowest resistivity is obtained for films with high refractive indices or alternatively, low oxygen content. *This work was supported by a research contract from Sandia National Lab.     

Si离子注入和退火温度对GaN黄光的影响

对光致发光谱中无黄光和有强黄光的两组GaN样品作了Si离子注入 ,研究了Si离子注入及退火温度对其黄光的影响 .当退火温度升高时 ,不管是哪一组样品 ,其黄光强度和黄光强度与带边发光带强度之比都是增强的 .无黄光的GaN样品在注入Si离子并经退火后出现明显的黄光 ;而有强黄光的GaN样品经相同处理后 ,其黄光强度较原生样品大大降低 .实验结果表明离子注入加上适当退火会在GaN中引入与黄光有关的深受主缺陷从而使黄光强度增加 ,此外 ,在离子注入过程中GaN表面不仅可以吸附离子注入引入的点缺陷 ,而且还能够吸附GaN中原有的与黄光有关的点缺陷 ,这种吸附作用随离子注入剂量增加而变强 .     

Wet chemical etching survey of III-nitrides

Wet chemical etching of GaN, InN, AlN, InAlN and InGaN was investigated in various acid and base solutions at temperatures up to 75°C. Only KOH-based solutions were found to etch AlN and InAlN. No enchants were found for the other nitrides, emphasizing their extreme lack of chemical reactivity. The native oxide on most of the nitrides could be removed in potassium tetraborate at 75°C, or HCl/H₂O at 25°C.     

n型和p型4H-SiC的二级喇曼谱

给出了n型和p型4H-SiC的二级喇曼谱的实验结果.指认了所观察到的一些光谱结构对应的特定声子支及其在布里渊区中相应的对称点.发现在4H-SiC的二级喇曼谱中存在能量差约为10cm-1的双谱线结构,这一结构与六方相GaN,ZnO和AlN的双谱线结构具有相同的能量差.二级喇曼谱的截止频率对于不同掺杂情况的4H-SiC具有相同的值.它并不等于n型掺杂4H-SiC的A1(LO)声子的倍频,而是等于未掺杂样品的A1(LO)声子的倍频.掺杂类型和杂质浓度对4H-SiC的二级喇曼谱几乎没有影响.     

n型和p型4H-SiC的二级喇曼谱

给出了n型和p型4H-SiC的二级喇曼谱的实验结果.指认了所观察到的一些光谱结构对应的特定声子支及其在布里渊区中相应的对称点.发现在4H-SiC的二级喇曼谱中存在能量差约为10cm-1 的双谱线结构,这一结构与六方相GaN,ZnO和AlN的双谱线结构具有相同的能量差.二级喇曼谱的截止频率对于不同掺杂情况的4H-SiC具有相同的值.它并不等于n型掺杂4H-SiC的A1(LO)声子的倍频,而是等于未掺杂样品的A1(LO)声子的倍频.掺杂类型和杂质浓度对4H-SiC的二级喇曼谱几乎没有影响.     

100 nm超浅结制作工艺研究

在对深亚微米技术的探索中,通过实践,得到了100 nm以下N型高掺杂浓度超浅结的工艺流程。介绍了采用低能量离子注入技术结合快速热退火技术制作超浅结的方法,并对需要考虑的沟道效应及瞬态增强扩散效应进行了机理分析。     

氮化物半导体电子器件的若干研究进展

近年来,氮化物半导体电子器件和材料研究有了重大的进展。在国家自然科学基金资助下,西安电子科技大学、北京大学和中科院微电子所完成了国家自然科学基金重点项目《GaN宽禁带微电子材料和器件重大基础问题研究》。致力于通过氮化物电子材料和器件的基础物理机理研究提高GaN电子材料的结晶质量和电学性能、发展新结构GaN异质结材料研究,获得高性能的GaN HEMT微波功率器件。本文主要介绍该项目在GaN微波功率HEMT和新型高k栅介质MOS-HEMT、InAlN/GaN材料的生长和物性缺陷分析以及HEMT器件研制、GaN异质结的量子输运和自旋性质研究以及GaN材料高场输运性质和耿氏器件等几个方面取得的研究进展。     

高浓度Mg掺杂GaN的电学和退火特性研究

对高浓度Mg掺杂GaN在常规热退火和快速热退火前后的材料质量和电学特性进行了研究。X 射线衍射测量表明 ,重掺杂导致了GaN质量的下降 ,退火后略有恢复。霍尔测量表明 ,Cp2 Mg :TMGa的流量比小于 1:2 6.3时 ,退火后空穴浓度可达到 2× 10 18cm- 3;当Cp2 Mg :TM Ga的流量比为 1:2 1.9时 ,得到的高阻GaN在常规热退火和快速热退火后均只为弱 p型 ,存在明显的施主补偿现象。这被认为是重掺杂导致晶格缺陷增多 ,引入了施主能级 ,补偿了被激活的Mg原子的结果     

Progress in Group Ⅲ nitride semiconductor electronic devices

Recently there has been a rapid domestic development in groupⅢnitride semiconductor electronic materials and devices.This paper reviews the important progress in GaN-based wide bandgap microelectronic materials and devices in the Key Program of the National Natural Science Foundation of China,which focuses on the research of the fundamental physical mechanisms of group III nitride semiconductor electronic materials and devices with the aim to enhance the crystal quality and electric performance of GaN-based electronic materials, develop new GaN heterostructures,and eventually achieve high performance GaN microwave power devices.Some remarkable progresses achieved in the program will be introduced,including those in GaN high electron mobility transistors(HEMTs) and metal-oxide-semiconductor high electron mobility transistors(MOSHEMTs) with novel high-k gate insulators,and material growth,defect analysis and material properties of InAlN/GaN heterostructures and HEMT fabrication,and quantum transport and spintronic properties of GaN-based heterostructures,and highelectric -field electron transport properties of GaN material and GaN Gunn devices used in terahertz sources.