共查询到20条相似文献,搜索用时 78 毫秒
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数字电视显示器的宽色域技术是显示领域的发展方向.近年来,宽色域显示器件和显示方式有长足进步,以发光二极管为背光源的液晶显示器等已商品化.采用三维色域测量方法,可以比传统测量方法更加准确地衡量产品的色域.提出了利用显示器宽色域色块校准方法,解决三维色域测量的准确性问题. 相似文献
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介绍了三项国际宽色域视频标准:ITU-R BT.1361、IEC61966-2-4(xvYCC)和ITU-R BT.2020,对标准中用于扩展系统色域的核心技术进行了分析,计算并比较五个宽色域视频系统的色域大小,总结了扩展系统色域的可行方案。 相似文献
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针对普通显示液晶系统在色彩表现方面的不足,在现有色域扩展技术的基础上,设计了一种以白和宝石蓝两种颜色发光二极管作为背光源的宽色域液晶显示系统。本文通过分析普通显示系统的色域,以色域覆盖率最大化为准则,选择主波长为501nm的宝石蓝发光二极管作为扩展背光源,扩展普通显示系统未能显示的青绿色区域。从理论上分析该系统的色域范围,并且详细介绍了系统背光源阵列、数据转发等功能模块的电路实现。实验结果表明:本文所设计的宽色域液晶显示系统的色域扩展了青绿色区域且色域覆盖率可达到45.65%。相比与其他多原色显示系统,本文设计的宽色域液晶显示系统不仅简化了硬件设计的复杂度,而且能够重现更多青绿色区域的颜色。 相似文献
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新兴的宽色域显示器,主要是具有LED背光源的直视式LCDs,它能给使用者提供更多的用途和更佳的娱乐体验.但是完全推广它,仍然困难重重.显示器制造商如何确保实现平稳地过滤到宽色域世界呢? 相似文献
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以某汽车电子机箱为例介绍了民用电子设备机箱的薄壁钣金件、注塑件常用的加强、定位、连接的结构特点,同时介绍了部分内部结构的装联。 相似文献
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《III》1997,10(3):32-34
Advanced Refractory Technologies, Inc.'s (ART) family of powder fillers based on III–V material aluminium nitride (AIN) will enhance applications in electronics not through some novel new device but rather through improved thermal management of existing ones. The Buffalo, NY, based company's advanced materials are proving very popular with engineers tackling the ever increasing heat loads of electronics products such as PCs and mobile phones. ART's A500 powders are bringing the thermal conductivity advantages of AIN but with considerable savings thereby enhancing the market for this branch of III–V materials. 相似文献
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With the rapidly increasing penetration of laptop computers, which are primarily used by mobile users to access Internet services, support of Internet services in a mobile environment become an increasing need. The opportunities emerging from these technologies give rise to new paradigms such as mobile computing and ubiquitous networking. However, there are numerous challenges such as reliability and quality of service, infrastructure costs, energy efficiency of mobile devices, among others. This paper analyzes concepts, technologies and challenges related to these paradigms. The major challenges include mobility, disconnection and scale, new information medium and new resource limitations. As a fundamental characteristics of mobile environments, the user can see the same computing environment regardless of his or her current location. The most exciting promises of mobile computing and ubiquitous networking stay an entire new class of applications and potential new massive markets combining personal computing and consumer electronics. 相似文献
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《Circuits and Devices Magazine, IEEE》2001,17(5):9-15
This article describes the implementation of an obstacle detector system based on laser technology (laser pointer) and the associated electronics used for correct and adequate operation. This system is part of a mobile robot that is able to move itself autonomously around an environment where light-colored obstacles are located. The obstacle detector is mainly composed of two functional blocks: a transmitter and a receptor. The idea consists of receiving the reflected power of an emitted laser beam from an obstacle. Using this method, the associated electronics (receptor) are able to estimate the distance from the mobile robot to the obstacle, depending on the received power. The main goal of this work is the implementation and characterization of an obstacle detector system using laser technology to be embedded in an autonomous mobile robot 相似文献
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Singh Mandeep Singh Gurmohan Singh Jaspal Kumar Yadwinder 《Wireless Personal Communications》2021,119(1):441-457
Wireless Personal Communications - Due to technological advancements in electronics industry, wireless sensors in conjunction with mobile phones can be used anytime anywhere for ubiquitous... 相似文献
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《Circuits and Systems Magazine, IEEE》2006,6(2):17-29
Terminals, including traditional cellular phones, have historically been optimized for a small number of services over a specific network. With the convergence of consumer electronics and Internet-based services, voice and video are now being offered on a variety of access networks, and many functions are being combined into single devices. In addition to new sophisticated audio/video coding and graphics capabilities, there is a growing demand for cheap and ubiquitous broadband wireless Internet access. This demand is driving the need for multiradio platforms that include new licensed and unlicensed air interface technologies, such as WLAN, UWB and Wimax. The proliferation of new applications and wireless standards has created the need for a dramatic change in the portable/mobile terminal architecture. This paper presents an overview of the evolution of mobile terminal architectures, from monolithic to flexible, modular, and capable of meeting the increasing demand for an ever larger number of features at the right cost and time to market. 相似文献
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Wondrak W. Held R. Niemann E. Schmid U. 《Industrial Electronics, IEEE Transactions on》2001,48(2):307-308
Silicon carbide (SiC) process technology has made rapid progress, resulting in the realization of very promising electronic devices and sensors, enabling advanced solutions in power industry and mobile systems. In particular, for electronics working under harsh environmental conditions, SiC devices reach unprecedented performance. Transfer to production has already started for some applications 相似文献
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《IEE Review》2003,49(2):34-37
Despite healthy high street sales, extreme competition in consumer electronics has made risk-reduction the new design mantra. The problem is market overcrowding. PC, laptop and games console companies; camera makers; software firms; mobile phone and PDA players; telecom and broadcast service providers; as well as the traditional giants like Sony and Philips, are all jostling for market share. And generic brands-the Coca-Colas of this world-may also soon join the fray in the handheld sector as that fragments into new directions. This article discusses the actions being taken by consumer electronics companies to ensure their share of the market and reduce design risks further. 相似文献
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《Advanced Packaging, IEEE Transactions on》2005,28(3):397-403
As mobile electronics products become more compact and lighter and perform better, the need to decrease the number of large-scale integration (LSI) packages mounted on each board as well as decreasing their mounting area is increasing. This paper describes a newly developed ultrahigh-density three-dimensional (3-D) stacked package called a flexible carrier folded real chip size package (FFCSP). The FFCSP is constructed by stacking very thin single chip packages of real chip size on top of one another. Each single chip package consists of an LSI chip and a small piece of flexible printed circuit (FPC), which has an insulating layer made of thermoplastic resin. The FFCSP's advantages are its ultrasmall size, thinness, highly flexible assembly, and a good test yield compared with conventional 3–D stacked packages. The FFCSP will enable the future miniaturization and raise the functionality of the next wave of mobile electronics products. 相似文献