低介电常数聚酰亚胺的研究进展

现代微电子工业要求层间绝缘材料具有较低的介电常数。该文介绍了几种降低聚酰亚胺介电常数的方法,包括含氟聚酰亚胺、聚酰亚胺无机杂化复合材料和聚酰亚胺多孔材料,其中最为有效的措施是将含氟取代基引入到聚酰亚胺分子结构中。     

Structure–property relationship of polyimides based on pyromellitic dianhydride and short‐chain aliphatic diamines for dielectric material applications

Most polyolefins that are used for dielectric materials exhibit a low dielectric constant and operating temperatures up to 70°C. Polyimides offer a means to a higher dielectric constant material by the introduction of a polar group in the polymer backbone and are thermally stable at temperatures exceeding 250°C. A common dianhydride, pyromellitic dianhydride (PMDA), is reacted with various short‐chain diamines to produce polymers with high imide density. Homopolymers and copolymers synthesized had dielectric constants ranging from 3.96 to 6.57. These materials exhibit a dielectric constant twice that of biaxially oriented polypropylene and therefore a twofold increase in capacitance as well as maintaining low dissipation factors that are acceptable for this application. The experimental dielectric constants of these materials are also compared to density functional theory calculations and exhibit a close relationship. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 1276‐1280, 2013     

Construction of fluorenyl-modified low dielectric constant polyimide films with excellent mechanical properties and optical transparency

In order to meet the requirements of highly integrated and miniaturized electronic components, there is an urgent need for low dielectric materials with high mechanical properties and optical transparency in the field of microelectronics. In this study, a series of novel polyimide films (FPI) containing fluorenyl were prepared, and the effects of the fluorenyl content on the thermal, mechanical, and dielectric properties of the copolymerized films were investigated and discussed. The results demonstrate a significant decrease in the dielectric constant of the FPI films following the introduction of fluorenyl into polyimide (PI) chain segment. The FPI films also exhibited high mechanical properties, including tensile strengths between 92 and 106 MPa and elongation at break in the range of 8.4%–13.0%. Additionally, the introduction of the noncoplanar fluorenyl considerably improved the optical transparency and solubility of the FPI film. It is noteworthy that the FPI-3 has the best dielectric properties, with a low dielectric constant of 2.61 at 10 MHz and shows low water absorption (0.49%). The results show that we have prepared a novel low dielectric PI material film with excellent mechanical properties and optical transparency by introducing fluorenyl into the PI chain segment. These FPI films with satisfactory properties may be good candidates for dielectric materials for electronic components.     

Phosphorus‐containing polyhedral oligomeric silsesquioxane/polyimides hybrid materials with low dielectric constant and low coefficients of thermal expansion

Novel phosphorus‐containing polyhedral oligomeric silsesquioxane (POSS)/polyimides (PI) hybrid materials with low dielectric constant and low linear coefficients of thermal expansion (CTE) were prepared and characterized. The POSS/PI hybrid materials were synthesized with octa(aminopropyl)silsesquioxane (OAPS) and a series of phosphorus‐containing polyamide acids(PAA). The PAAs were synthesized with bis(4‐aminophenoxy) phenyl phosphine oxide (BAPPO), 4,4’‐diaminodiphenyl ether (ODA) and 3,3',4,4'‐biphenyl tetracarboxylic diandhydride (BPDA). The structures and properties of the hybrid materials were characterized. And the effect of the phosphorus‐containing structure on the POSS/PI hybrid materials was discussed. The dielectric constants and CTE of the hybrid materials were remarkably lower than that of the unmodified POSS/PI films. The lowest values of dielectric constant and CTE could achieve as low as 2.64 (1 MHz) and 27.45 ppm/K. Besides, the hybrid materials also had excellent thermal properties. The highest 5% weight loss temperature of the hybrid materials was as high as 580°C under air. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42611.     

Synthesis and characterization of novel adamantane‐based copoly(aryl ether ketone)s with low dielectric constants

A series of novel adamantane‐based copoly(aryl ether ketone)s (PAEK‐CF₃‐Ad) with low dielectric constants were prepared by post‐amidation of copoly(aryl ether ketone)s containing (3‐trifluoromethyl)phenyl and carboxyl groups with 4‐adamantylaniline. Compared with the preparation of adamantane‐containing poly(aryl ether ketone)s by direct polymerization of adamantyl‐substituted monomers, this side‐chain grafting method avoids various problems, such as high polymerization temperature and the difficult polymerization of adamantyl‐substituted monomers. The dielectric, thermal and mechanical properties of the synthesized PAEK‐CF₃‐Ad were characterized using a precision impedance analyzer, differential scanning calorimetry and thermogravimetric analysis, and a universal tester, respectively. The results indicate that PAEK‐CF₃‐Ad films exhibited low dielectric constants ranging from 2.33 to 2.65 at 1 MHz due to the introduction of the adamantyl groups. The synthesized PAEK‐CF₃‐Ad copolymers exhibited good thermal and mechanical properties. © 2013 Society of Chemical Industry     

Silacyclobutane-functionalized cyclosiloxanes as photoactive precursors for high thermal stability,low dielectric constant and low dielectric loss polymers

Low dielectric photoactive materials have significant potential as components in future microelectronics. Although a number of photosensitive groups have been used to construct photopatternable materials, it remains challenging to introduce these groups into polymer chains via facile yet controlled polymerization techniques. The present work demonstrates the synthesis of a new class of photoactive cyclosiloxane monomers having hybrid siloxane-carbosilane main chains. These compounds can be cured by applying ultraviolet radiation and heat to promote the reaction of the silacyclobutene units and form hyper-cross-linked cyclosiloxanes. The cured resins show high thermal stability (with T_5% values in the range of 460–550°C), low dielectric constants (2.36–2.76 at 10 MHz) and low dielectric losses (10⁻³ at 10 MHz). Thus, these polymers could possibly be used as high-performance dielectric materials.     

Functionalized KIT‐6/Terpolyimide composites with ultra‐low dielectric constant

Polyimides with low dielectric constants are important raw materials for the fabrication of flexible printed circuit boards and other microelectronic applications. As creation of voids in polyimide matrix could decrease dielectric constant, in this study mesoporous KIT‐6, synthesized hydrothermally, was functionalized with 3‐aminopropyltriethoxysilane (APTS) and mixed with 4,4′‐oxydianiline (ODA) in the synthesis of terpoly(amic acid) using 3,3′,4,4′‐biphenyldianhydride (BPDA), 3,3′,4,4′‐oxydiphthalic dianhydride (ODPA) and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and subsequently stage‐cured to obtain APTS‐KIT‐6/Terpolyimide composites (APTS‐KIT‐6/TPI). The asymmetric and symmetric vibrations of imide O?C? N? C?O groups of APTS‐KIT‐6/TPI composites showed their peaks at 1772 and 1713 cm^?1. The dielectric constant decreased with the increase in KIT‐6 loading from 2 to 4%, but increased at higher loadings, and at 4% loading it was 1.42. Its tensile strength (103 MPa), tensile modulus (2.5 GPa), and percentage elongation (8.2) and high thermal stability (>540°C) were also adequate for application in microelectronics such as flexible printed circuits. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40508.     

Syntheses and properties of polyimides derived from diamines containing 2,5‐disubstituted pyridine group

A series of novel homo‐ and copolyimides containing pyridine units were prepared from the heteroaromatic diamines, 2,5‐bis (4‐aminophenyl) pyridine and 2‐(4‐aminophenyl)‐5‐aminopyridine, with pyromelltic dianhydride (PMDA), and 3,3′, 4,4′‐biphenyl tertracarboxylic dianhydride (BPDA) via a conventional two‐step thermal imidizaton method. The poly(amic acid) precursors have inherent viscosities of 1.60–9.64 dL/g (c = 0.5 g/dL in DMAC, 30°C) and all of them can be cast and thermally converted into flexible and tough polyimide films. All of the polyimides show excellent thermal stability and mechanical properties. The polyimides have 10% weight loss temperature in the range of 548–598°C in air. The glass transition temperatures of the PMDA‐based samples are in the range of 395–438°C, while the BPDA‐based polyimides show two glass transition temperatures (T_g1 and T_g2), ranging from 268 to 353°C and from 395 to 418°C, respectively. The flexible films possess tensile modulus in the range of 3.42–6.39 GPa, strength in the range of 112–363 MPa and an elongation at break in the range of 1.2–69%. The strong reflection peaks in the wide‐angle X‐ray diffraction patterns indicate that the polyimides have a high packing density and crystallinity. The polymer films are insoluble in common organic solvents exhibiting high chemical resistance. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1844–1851, 2006     

Hyperbranched-polysiloxane-based hyperbranched polyimide films with low dielectric permittivity and high mechanical and thermal properties

A series of hyperbranched polysiloxane (HBPSi)-based hyperbranched polyimide (HBPI) films with low dielectric permittivity and multiple branched structures are fabricated by copolymerizing 2,4,6-triaminopyrimidine (TAP) with 4,4′-(hexafluoroisopropylidene)diphthalic anhydride, 4,4′-diaminodiphenyl ether, and HBPSi via the two-step polymerization method. The dielectric permittivity of HBPSi hyperbranched polyimide films decreases with increasing TAP fraction, namely, from 3.28 for sample PI-1 to 2.80 for PI-4, mainly owing to the enlarged free volume created by the incorporation of multiple branched structures. Moreover, HBPSi HBPI possesses desirable solubility and good mechanical properties and thermal stability. PI-4 not only has low dielectric permittivity (2.80, 1 MHz), excellent solubility (soluble in several common organic solvents), and remarkable thermal properties (glass-transition temperature of 273 °C, 5% weight loss temperature of 498 °C in N₂ and 486 °C in O₂), but it also demonstrates admirable mechanical properties with a tensile strength of 103 MPa, elongation at break of 7.3%, and a tensile modulus of 2.16 GPa. HBPSi HBPI might have potential applications in interlayer dielectrics and other microelectronics fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47771.     

Organosoluble,low‐dielectric‐constant fluorinated polyimides based on 9,9‐bis[4‐(4‐amino‐2‐trifluoromethyl‐ phenoxy)phenyl]xanthene

A new trifluoromethylated bis(ether amine) monomer, 9,9‐bis[4‐(4‐amino‐2‐trifluoromethylphenoxy)phenyl]xanthene (BATFPX), was prepared through the nucleophilic aromatic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 9,9‐bis(4‐hydroxyphenyl)xanthene in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of novel fluorinated polyimides were synthesized from BATFPX with various commercially available aromatic tetracarboxylic dianhydrides by one‐step polycondensation in m‐cresol. The resulting polyimides were readily soluble in many organic solvents such as N,N‐dimethylacetamide and tetrahydrofuran, and afforded transparent, flexible and strong films with low moisture absorption (0.28–0.51%), low dielectric constant (2.85–3.26 at 1 MHz) and good optical transparency with UV‐visible absorption cut‐off wavelengths at 352–410 nm. All the polyimides were amorphous and exhibited high thermal stability, with glass transition temperatures of 282–330 °C, 5% weight loss temperatures above 520 °C in nitrogen or air and char yields higher than 55% at 800 °C in nitrogen. Also, these polyimides had good mechanical properties with tensile strengths of 93–118 MPa, elongations at break of 9–16% and initial moduli of 2.07–2.58 GPa. Copyright © 2011 Society of Chemical Industry     

Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP

ABSTRACT

The thermoplastic and low dielectric constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4?-(4,4?-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4?-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric analysis, dynamic thermomechanical analysis, dielectric measurement, and tensile test. The dielectric constants were 2.32–2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral methyl groups, made polyimides become thermoplastic. The results of molecular simulations via Materials Studio also proved this conclusion.     

Characterization of a thermoset by thermal analysis techniques: Criterion to assign the value of the α‐transition temperature by dielectric analysis

A cured thermoset composed of diglycidyl ether of bisphenol A and m‐xylylene diamine as the cure agent was studied with different thermal analysis techniques, including differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and dielectric analysis (DEA). DSC was used to measure the glass‐transition temperature and to check the absence of the heat of reaction. DMA and DEA were used to show the existence of two transitions in the temperature range of −100 to 240°C. The transition at a low temperature corresponded to the β transition. The second one, at a higher temperature, was associated with an α transition. The β transition followed Arrhenius behavior, whereas the α transition followed Vogel behavior. For an analysis of the α transition, different equations, such as the Havriliak–Negami, Vogel, and Williams–Landel–Ferry equations, were used. Important differences related to the fitting parameters were found that depended on the type of equation and the operation mode used. For this reason, a new method for calculating the α‐transition temperature was examined. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 2027–2037, 2005     

Organosoluble,low‐dielectric‐constant fluorinated polyimides based on 2,6‐bis(4‐amino‐2‐trifluoromethylphenoxy)naphthalene

A novel fluorinated bis(ether amine) monomer, 2,6‐bis(4‐amino‐2‐trifluoromethylphenoxy) naphthalene, was prepared through the nucleophilic aromatic substitution reaction of 2‐chloro‐5‐nitrobenzotrifluoride and 2,6‐dihydroxynaphthalene in the presence of potassium carbonate, followed by catalytic reduction with hydrazine and Pd/C in ethanol. A series of novel trifluoromethylated polyimides were synthesized from the diamine with various commercially available aromatic tetracarboxylic dianhydrides using a two‐stage process with thermal imidization of poly(amic acid) films. Most of the resulting polyimides were highly soluble in a variety of organic solvents and could afford transparent and tough films via solution casting. These polyimides exhibited moderately high glass transition temperatures (T_gs) of 249–311 °C, high thermal stability and good mechanical properties. Low moisture (0.19–0.85 %), low dielectric constants (2.49–3.59 at 10 kHz), and low color intensity were also observed. For a comparative study, a series of analogous polyimides based on 2,6‐bis(4‐aminophenoxy)naphthalene were also prepared and characterized. Copyright © 2005 Society of Chemical Industry     

Preparation of thermally stable,low dielectric constant,pyridine‐based polyimide and related nanofoams

Reaction of 6‐chloronicotinoyl chloride with p‐phenylene diamine resulted in preparation of a dichloro diamide compound. Subsequently, chloro displacement of this compound with 4‐amino phenoxy groups led to production of a new pyridine‐based ether diamine named as N,N′‐(1,4‐phenylene)bis(6‐(4‐aminophenoxy) nicotinamide). Novel polyimide was prepared through polycondensation reaction of the diamine with hexafluoroisopropylidene diphthalic anhydride (6‐FDA) via two‐step imidization method. In addition, new nanoporous polyimide films were produced through graft copolymerization of polyimide as the continuous phase with a thermally labile poly (propylene glycol) oligomer as the labile phase. The grafted copolymers were synthesized using reaction of the diamine and 6‐FDA in the presence of poly (propylene glycol) 2‐bromoacetate as thermally labile constituent via a poly(amic acid) precursor process. The labile block was decomposed via thermal treatment to release inert molecules that diffused out of the matrix to leave pores with diameters between 30 and 60 nm. The structures and properties of polyimide and polyimide nanofoams were characterized by different techniques including ¹H‐NMR, FTIR, TGA, DMTA, SEM, TEM, dielectric constant, and tensile strength measurement. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Epoxy/benzoxazinyl POSS nanocomposite resin with low dielectric constant and excellent thermal stability

Benzoxazinyl modified polyhedral oligomeric silsesquioxane (BZPOSS) is successfully synthesized and used to prepare nanocomposites with bisphenol A type epoxy resin (E51). The differential scanning calorimetry results showed the curing peak temperature of E51/BZPOSS blend decrease to 242°C, suggesting the high catalytic activity of BZPOSS to the polymerization of E51. The scanning electron microscope micrographs of poly(E51/BZPOSS)s and silicon element distribution maps given by EDS both demonstrated homogeneous dispersion of BZPOSS. Dielectric properties tests confirmed the dielectric constant can be reduced by the introduction of BZPOSS, which is attributed to the nano-pores from the cage structure of POSS. When 20 wt% BZPOSS was added, the dielectric constant decreased to 2.28 at 1 MHz. Meanwhile, DMA and TGA results indicated the thermal stability and heat resistance of poly(E51/BZPOSS)s at high temperature increased with the increase of BZPOSS, which is due to the increase of the crosslinking density and the change of crosslinking structure of copolymer.     

Bis[4‐(4‐maleimidephen‐oxy)phenyl]propane/N,N‐4,4′‐bismaleimidodiphenylmethyene blend modified with diallyl bisphenol A

In this article, 2,2′‐bis[4‐(4‐maleimidephen‐oxy)phenyl)]propane (BMPP) resin and N,N‐4,4′‐bismaleimidodiphenylmethyene (BDM) resin blends were modified by diallyl bisphenol A (DABPA). The effects of the mole concentration of BMPP on mechanical properties, fracture toughness, and heat resistance of the modified resins were investigated. Scanning electron microscopy was used to study the microstructure of the fractured modified resins. The introduction of BMPP resin improves the fracture toughness and impact strength of the cured resins, whose thermal stabilities are hardly affected. Dynamic mechanical analysis shows that the modified resins can maintain good mechanical properties at 270.0°C, and their glass transition temperatures (T_g) are above 280.0°C. When the mole ratio of BDM : BMPP is 2 : 1(Code 3), the cured resin performs excellent thermal stability and mechanical property. Its T_g is 298°C, and the Charpy impact strength is 20.46 KJ/m². The plane strain critical stress intensity factor (K_IC) is 1.21 MPa·m^0.5 and the plane strain critical strain energy release rate (G_IC) is 295.64 J/m². Compared with that of BDM/DABPA system, the K_IC and G_IC values of Code 3 are improved by 34.07% and 68.10%, respectively, which show that the modified resin presented good fracture toughness. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40395.     

Preparation and properties of melt‐processable polyimides based on fluorinated aromatic diamines and aromatic dianhydrides

Two series of melt‐processable polyimides were prepared from 4,4′‐bis(3‐amino‐5‐trifluoromethylphenoxy)biphenyl (m‐6FBAB) and 4,4′‐bis(4‐amino‐5‐trifluoromethylphenoxy) biphenyl (p‐6FBAB) with various aromatic dianhydrides. The effects of the chemical structures of the polyimides on their properties, especially the melt processability and organic solubility, were investigated. The experimental results demonstrate that some of the fluorinated aromatic polyimides showed good melt processability at elevated temperatures (250–360°C) with relatively low melt viscosities and could be melt‐molded to produce strong and tough polyimide sheets. Meanwhile, the polyimides showed excellent organic solubility in both polar aprotic solvents and common solvents to give stable polyimide solutions with high polymer concentrations and relatively low viscosities. Thus, we prepared high‐quality polyimide films by casting the polyimide solutions on glass plates followed by baking at relatively low temperatures. The polyimides derived from m‐6FBAB showed better melt processability and solubility than the p‐6FBAB based polymers. The melt‐processable polyimides showed a good combination of thermal stability and mechanical properties, with decomposition temperatures of 547–597°C, glass‐transition temperatures in the range 205–264°C, tensile strengths of 81.3–104.9 MPa, and elongations at break as high as 19.6%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Semi‐interpenetrating polymer networks based on polyurethane and polyvinylpyrrolidone. II. Dielectric relaxation and thermal behaviour

Semi‐interpenetrating polymer networks (semi‐IPNs) based on crosslinked polyurethane (PU) and linear polyvinylpyrrolidone (PVP) were synthezised, and their thermal and dynamic mechanical properties and dielectric relaxation behavior were studied to provide insight into their structure, especially according to their composition. The differential scanning calorimetry results showed the glass transitions of the pure components: one glass‐transition temperature (T_g) for PU and two transitions for PVP. Such glass transitions were also present in the semi‐IPNs, whatever their composition. The viscoelastic properties of the semi‐IPNs reflected their thermal behavior; it was shown that the semi‐IPNs presented three distinct dynamic mechanical relaxations related to these three T_g values. Although the temperature position of the PU maximum tan δ of the α‐relaxation was invariable, on the contrary the situation for the two maxima observed for PVP was more complex. Only the maximum of the highest temperature relaxation was shifted to lower temperatures with decreasing PVP content in the semi‐IPNs. In this study, we investigated the molecular mobility of the IPNs by means of dielectric relaxation spectroscopy; six relaxation processes were observed and indexed according the increase in the temperature range: the secondary β‐relaxations related to PU and PVP chains, an α‐relaxation due to the glass–rubber transition of the PU component, two α‐relaxations associated to the glass–rubber transitions of the PVP material, and an ionic conductivity relaxation due to the space charge polarization of PU. The temperature position of the α‐relaxation of PU was invariable in semi‐IPNs, as observed dynamic mechanical analysis measurements. However, the upper α‐relaxation process of PVP shifted to higher temperatures with increasing PVP content in the semi‐IPNs. We concluded that the investigated semi‐IPNs were two‐phase systems with incomplete phase separation and that the content of PVP in the IPNs governed the structure and corresponding properties of such systems through physical interactions. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1191–1201, 2003     

Soluble and light‐colored polyimides from 2,3,2′,3′‐oxydiphthalic anhydride and aromatic diamines

A series of polyimides were prepared from 2,3,2′,3′‐oxydiphthalic anhydride (3,3′‐ODPA) with various aromatic diamines via three different synthetic procedures. The one‐step and two‐step methods with the thermal imidization of poly(amic acids) (PAAs) yielded polyimides with a relatively low inherent viscosity; these produced brittle films. The polyimides prepared by the two‐step method via the chemical imidization of PAA precursors exhibited a higher inherent viscosity and afforded tough and creaseable films. All the 3,3′‐ODPA based polyimides had a significantly higher solubility than the corresponding polyimides from 3,4,3′,4′‐oxydiphthalic anhydride. The films cast from 3,3′‐ODPA polyimides also showed high optical transparencies and less color, with an ultraviolet–visible absorption edge of 370–397 nm and low yellowness index values of 11.3–29.8. These polyimides exhibited glass‐transition temperatures in the range 211–289°C and showed no significant decomposition below 500°C under nitrogen or air atmospheres. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 1352–1360, 2005     

Synthesis and characterization of melt‐processable polyimides derived from 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene

A series of molecular‐weight‐controlled imide resins end‐capped with phenylethynyl groups were prepared through the polycondensation of a mixture of 1,4‐bis(4‐amino‐2‐trifluoromethylphenoxy)benzene and 1,3‐bis(4‐aminophenoxy)benzene with 4,4′‐oxydiphthalic anhydride in the presence of 4‐phenylethynylphthalic anhydride as an end‐capping agent. The effects of the resin chemical structures and molecular weights on their melt processability and thermal properties were systematically investigated. The experimental results demonstrated that the molecular‐weight‐controlled imide resins exhibited not only meltability and melt stability but also low melt viscosity and high fluidability at temperatures lower than 280°C. The molecular‐weight‐controlled imide resins could be thermally cured at 371°C to yield thermoset polyimides by polymer chain extension and crosslinking. The neat thermoset polyimides showed excellent thermal stability, with an initial thermal decomposition temperature of more than 500°C and high glass‐transition temperatures greater than 290°C, and good mechanical properties, with flexural strengths in the range of 140.1–163.6 MPa, flexural moduli of 3.0–3.6 GPa, tensile strengths of 60.7–93.8 MPa, and elongations at break as high as 14.7%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2008