Si缓冲层生长温度对SiGe外延层结构的影响

用X射线摇摆曲线和掠入射衍射、透射电镜、原子力显微镜等实验技术研究了MBE方法生长的Si缓冲层生长温度对SiGe／Si异质结结构的影响。结果表明，所研究的SiGe外延层晶格发生完全弛豫，但表面粗糙度和界面失配位错随Si缓冲层的生长温度而变化，最佳生长温度为450℃；缓冲层晶格应变是达到高质量SiGe外延层的主要原因。     

硅上异质外延氧化铝的X射线测试分析

高剂量X射线粉末衍射测试说明升高温度有利于γ－Al2O3/Si外延生长，单晶衍射法证明应用低压CVD和高真空外延技术在我们的实验室生长出γ－Al2O3/Siuj单晶薄膜。它们的结晶关系是（100）γ－Al2O3/／Si，[010]γ－Al2O3//[010]Si。     

MOCVD制备的氮化铪薄膜结构特性研究

以热氧化的p型硅(SiO2/Si)为衬底,运用金属有机化学气相淀积(MOCVD)技术以铪基金属有机源和高纯氨为反应气体在其上淀积HfNx薄膜样品。薄膜结构信息用RBS技术、XRD技术及X射线反射率(XRR)计等来表征。实验结果表明,HfNx薄膜中N与Hf原子组分比为1.15;薄膜为多晶薄膜且沿(111)方向择优生长;薄膜表面平整,与衬底界面粗糙度小。     

低温生长的Ge／Si超晶格界面结构的X射线散射研究

低温下用MBE方法生长了Ge／Si超晶格。X射线近边吸收限精细结构研究表明，Ge与Si再Ge／Si界面处存在化学混合。X射线反射及横向散射研究表明，Ge亚层上下表面的粗糙度呈反对称，下表面大的粗糙度来源于Ge向Si亚层中扩散形成SiGe混合组分结构：这种组分结构可以用一平均成份的SiGe合金层加以拟合，从而使得各亚层均有一个合理的粗糙度。旋转样品进行的X射线散射研究表明，这种SiGe的混合是各向同性的，这与透射电子显微镜的研究结构相一致。     

分子束外延生长ZnO薄膜的XAFS研究

利用同步辐射广延X射线吸收精细结构(EXAFS),研究在不同条件下分子束外延制备的ZnO薄膜,如分别在蓝宝石(0001)、Si(100)衬底上,生长温度为200℃或300℃下得到样品的局域结构。发现这些ZnO薄膜的EXAFS函数(k^2x(k))谱形状相似,说明各个样品都具有较为相近的基本局域结构。对生长温度为200℃的ZnO／Al2O3(0001)和ZnO／Si(100)样品,其Zn-O第一配位峰的无序度仃。分别为0．0054A^2和0．0080A^2,当生长温度从200℃提高到300℃时,ZnO／Al2O3(0001)样品的Zn-O第一配位峰的无序度仃。降为0．0039A^2。结果表明衬底与ZnO的晶格失配度和生长温度对ZnO薄膜的配位数、Zn-O键长影响不大,但较小的晶格失配度和较高的生长温度下得到的ZnO薄膜局域有序性较高;且样品的局域结构越有序,相应的配位峰幅度也越高。     

电子辐照SiGe HBT和Si BJT的直流特性分析

研究了1MeV不同剂量电子辐照前后SiGe异质结晶体管(HBT)的直流特性,并与Si双极晶体管(BJT)进行了比较。结果表明辐照后SiGe HBT的IB基本不变,Ic和β都下降;随电子辐照剂量的增加,Ic和β都减小。对si BJT而言,IB和Ic与在相同辐照剂量辐照后的SiGe HBT相比都增大很多,β下降幅度也很大。这说明SiGe HBT具有比Si BJT更好的抗辐照性能。对电子辐照后器件电学性能的变化机制进行了初步分析。     

The property of Si/SiGe/Si heterostructure during thermal budget characterized by HRXRD

Si/SiGe/Si heterostructures grown by ultra-high-vacuum chemical vapor deposition (UHVCVD) were characterized by Rutherford backscattering/Channeling (RBS/C) together with high resolution X ray diffraction (HRXRD). High quality SiGe base layer was obtained. The Si/SiGe/Si heterostructures were subject to conventional furnace annealing and rapid thermal annealing with temperature between 750℃ and 910℃. Both strain and its relaxation degree in SiGe layer are calculated by HRXRD combined with elastic theory, which are never reported in other literatures. The rapid thermal annealing at elevated temperature between 880℃ and 910℃ for very short time had almost no influence on the strain in Si0.84Ge0.16 epilayer. However, high temperature (900℃@) furnace annealing for 1h prompted the strain in Si0.84Ge0.16 layer to relax.     

分子束外延生长ZnO薄膜及性能研究

用分子束外延（MBE）和氧气氛方法，并改变束源炉和衬底生长温度，在Si(100)衬底上，采用Zn作缓冲层以解决ZnO层与衬底间的晶格失配问题，生长得到ZnO薄膜。在ZnO/Zn/Si(100)薄膜样品的X射线衍射（XRD）谱中，观测到ZnO的（100）、（200）、（101）和（103）等衍射峰；用原子力显微镜（AFM）观测ZnO薄膜的表面形貌，为直径约80－90mm的量子点，表明已得到具有纳米结构的ZnO薄膜。用同步辐射EXAFS技术研究了ZnO薄膜的局域结构，得到有关的几个结构参数。     

硫化法制备FeS2薄膜晶体结构和表面特性的研究

采用磁控溅射方法在Si(100)衬底上淀积纯铁薄膜,在不同温度下(200-400℃)硫化10h得到FeS2薄膜,并对其进行晶体结构和表面成分分析。X射线光电子能谱(XPS)研究表明：低温硫化时易生成硫单质相,随温度的升高,S单质相部分参加反应变为FeS2相,FeS2的S2p峰出现在低能位置,而遗留的单质S的S2p束缚能位置不变。卢瑟福背散射(RBS)测得400℃时薄膜中元素Fe／S接近FeS2的理想化学计量比。     

La2/3Ca1/3MnO3薄膜结构与输运性质

用磁控溅射方法在不同单晶衬底材料上制备了一系列含La2／3Ca1／3MnO3(LCMO)薄膜。当薄膜厚度大于200A,在我们实验条件下可观测到金属．绝缘体转变,且转变温度随厚度和衬底材料而变化。渗流电阻模型被用来解释薄膜材料的电输运特性,结合薄膜外延特性(晶格失配)和薄膜与衬底的相互作用,及薄膜表面、界面粗糙度的测量可知薄膜的剩余电阻、极化子的激活能、金属．绝缘体转变温度等密切与薄膜质量相关。     

Thin relaxed SiGe layer grown on Ar^＋ ion implanted Si substrate by ultra-high vacuum chemical vapor deposition

1 Introduction Relaxed SiGe layers have gained considerable attention due to their applications in strained Si/SiGe high electron mobility transistor, metal-oxide-semi- conductor field-effect transistor (MOSFET) and other devices. High-quality relaxed SiGe templates, espe- cially those with low threading dislocation density and smooth surface, are crucial for the electrical perform- ance of devices.[1,2] In order to realize high-quality relaxed SiGe layer with such good characteristics, …     

Diffusion and strain relaxation in Si/Si1−xGex/Si structures studied with Rutherford backscattering spectrometry

The thermal stability of strained Si/Si_1−xGe_x/Si structures grown by molecular beam epitaxy was investigated by resistive heating and in situ Rutherford backscattering spectrometry. Ge profiles obtained from a 50 nm Si_1−xGe_x layer on a Si(100) substrate capped with 50 nm Si were evaluated for different Ge concentrations after sequential heating periods at a particular temperature between 850 and 1010° C. The diffusion coefficients, calculated from the increase in signal in the tail of the Ge profile, proved to be comparable to the value for Ge in bulk Si. A more pronounced decrease of the signal at the center of the Ge profile indicated a faster diffusion within the SiGe layer which was confirmed by analysis of the FWHM of the Ge profile. Ion channeling measurements were used to characterize tetragonal strain in the buried SiGe layers. Angular scans through the 111 direction were interpreted with Monte Carlo channeling calculations and used to study strain relaxation in dislocation-free and partially relaxed layers.     

Strain relaxation of epitaxial SiGe layers on Si(1 0 0) improved by hydrogen implantation

We propose a new method to fabricate strain relaxed high quality Si_1−xGe_x layers on Si by hydrogen implantation and thermal annealing. Hydrogen implantation is used to form a narrow defect band slightly below the SiGe/Si interface. During subsequent annealing hydrogen platelets and cavities form, giving rise to strongly enhanced strain relaxation in the SiGe epilayer. As compared to thermally induced strain relaxed Si–Ge epilayers, the hydrogen implanted and annealed samples show a greatly reduced threading dislocation density and a much higher degree of strain relaxation (90%). We assume that the hydrogen induced defect band promotes strain relaxation via preferred nucleation of dislocation loops in the defect band which extend to the interface to form misfit segments. The samples have been investigated by X-ray diffraction, Rutherford backscattering spectrometry and transmission electron microscopy.     

Characterization of extended defects in SiGe alloys formed by high dose Ge implantation into Si

The synthesis of SiGe/Si heterostructures by Ge⁺ ion implantation is reported. 400 keV Ge⁺ ions were implanted at doses ranging from 3 × 10¹⁶ to 10 × 10¹⁶ ions/cm² into (001) Si wafers, followed by Si⁺ amorphisation and low temperature Solid Phase Epitaxial Regrowth (SPER). TEM investigations show that strained alloys can be fabricated if the elastic strain energy (E_el) of the SiGe layer does not exceed a critical value (E′_el) of about 300 mJ/m², which is independent of the implantation energy. Our analysis also suggests that “hairpin” dislocations are formed as strain relieving defects in relaxed structures. A “strain relaxation” model is proposed to explain their formation.     

Thermal solid phase epitaxial growth and ion-beam induced crystallisation of Ge ion implanted layers in silicon

Solid phase epitaxial growth (SPEG) of amorphous SiGe layers in Si has been investigated. The amorphous layers were formed by 40 keV ⁷⁴Ge⁺ ion implantation in Si(100) single crystals with doses giving 22 at.% Ge at the maximum of the ion implanted distribution of Ge. SPEG of the amorphous layers was achieved by either thermal SPEG or a combination of thermal SPEG and ion-beam induced crystallisation (IBIC). The crystal quality of the layers was investigated by Rutherford backscattering spectrometry and transmission electron microscopy. Fully crystallised SiGe alloy layers were obtained by annealing in a furnace at 550°C for 60 min or at 850°C for 20 min. However, the SiGe alloy layers contain extended defects formed at the relaxation of the built-in strain in the alloy layer. When the combination of thermal SPEG and IBIC was used for the SPEG very few of these defects were formed.     

Structure and Magnetic Properties of Fe-N Films Prepared by Dual Ion Beam Sputtering

1. Introduction.. Much attention has recently been fOcused on Fe-Nfilms, because of their excellent magnetic propertiesin combination with their significant improvement ofcorrosion and wear resi$tance, compared with that ofpure iron. In Fe-N system alloys, many iron nitridesare well known such as a'-feamartensite, cr"-Fe16N2 57-austenite, 7'-Fe4 N j E -Fe2-3N, C-Fe2N. In particu-lar, Fe16N2 is of considerable interest due to its highsaturation magnetization of 2.8-3.0 T [1,2]. Thereare…     

低能Ar离子束辅助沉积Ag(111)薄膜

采用低能Ar离子束辅助沉积方法,在Mo/Si(100)基底上制备Ag膜。实验发现,用Ar离子束溅射沉积的Ag膜呈(111)择优取向。若在溅射沉积Ag膜的同时,用能量为500eV的Ar离子束沿衬底法线方向对Ag膜进行辅助轰击,当离子/原子到达比为0.06时,Ag膜呈(111)择优取向;当离子/原子到达比增大到0.18时,Ag膜呈(111)和(100)混合晶向。若Ar离子的入射角为35.26°,离子/原子到达比为0.06时,Ag膜呈(111)择优取向;当离子/原子比增大到0.18时,Ag膜呈(111)和微弱的(100)混合晶向。若Ar离子的入射角为54.7°,离子/原子到达比为0.06时,沉积的Ag膜呈很强的(111)择优取向。     

Damage creation in ion irradiated Si1−xGex/Si structures

Strained SiGe/Si structures have been proposed as substrates for fabrication of high speed metal oxide semiconductor transistors. However, influence of strain and/or presence of Ge atoms on damage creation during ion irradiation have not been explored to a significant extent. In this study, Rutherford backscattering spectrometry (RBS) was used to characterize Si_1−xGe_x/Si structures irradiated by 140 keV He⁺ ions at room temperature. When compared with pure Si, strained samples show enhanced damage accumulation as a function of He fluence. Channeling angular scans did not reveal any specific configuration of displacements. Possible mechanisms for enhanced damage in strained Si are discussed.     

Effects of Annealing on Luminescence of ZnO Films Deposited on Si Substrates by RF Magnetron Sputtering

Effects of growth ambience, annealing ambience and temperature on the photoluminescence (PL) emission properties of ZnO films deposited on Si (100) substrates by RF magnetron sputtering have been investigated. After annealing, the crystal quality of ZnO films was markedly improved, and the intensity of UV emission peak increased obviously. By varying the flow rate ratio of O2/Ar, annealing atmosphere in oxygen-deficient or oxygen-rich ambience and heating temperature during deposition, the evolution of peak intensities and positions for blue and green emission is formed. This is attributed to the deposition and annealing parameters that control the desorptions and adsorptions of oxygen atoms on the films, and leads to the changes of concentrations of Zinc and oxygen vacancies in the films.