Processing of nanocrystalline diamond thin films for thermal management of wide-bandgap semiconductor power electronics

High current densities in wide-bandgap semiconductor electronics operating at high power levels results in significant self-heating of devices, which necessitates the development thermal management technologies to effectively dissipate the generated heat. This paper lays the foundation for the development of such technology by ascertaining process conditions for depositing nanocrystalline diamond (NCD) on AlGaN/GaN High Electron Mobility Transistors (HEMTs) with no visible damage to device metallization. NCD deposition is carried out on Si and GaN HEMTs with Au/Ni metallization. Raman spectroscopy, optical and scanning electron microscopy are used to evaluate the quality of the deposited NCD films. Si device metallization is used as a test bed for developing process conditions for NCD deposition on AlGaN/GaN HEMTs. Results indicate that no visible damage occurs to the device metallization for deposition conditions below 290 °C for Si devices and below 320 °C for the AlGaN/GaN HEMTs. Possible mechanisms for metallization damage above the deposition temperature are enumerated. Electrical testing of the AlGaN/GaN HEMTs indicates that it is indeed possible to deposit NCD on GaN-based devices with no significant degradation in device performance.     

Nanoscale investigation of AlGaN/GaN-on-Si high electron mobility transistors

AlGaN/GaN HEMTs are devices which are strongly influenced by surface properties such as donor states, roughness or any kind of inhomogeneity. The electron gas is only a few nanometers away from the surface and the transistor forward and reverse currents are considerably affected by any variation of surface property within the atomic scale. Consequently, we have used the technique known as conductive AFM (CAFM) to perform electrical characterization at the nanoscale. The AlGaN/GaN HEMT ohmic (drain and source) and Schottky (gate) contacts were investigated by the CAFM technique. The estimated area of these highly conductive pillars (each of them of approximately 20-50?nm radius) represents around 5% of the total contact area. Analogously, the reverse leakage of the gate Schottky contact at the nanoscale seems to correlate somehow with the topography of the narrow AlGaN barrier regions producing larger currents.     

Low-Energy Defectless Dry Etching of the AlGaN/AlN/GaN HEMT Barrier Layer

A method of defectless dry etching of an AlGaN barrier layer is proposed, which consists in repeated plasmachemical oxidation of AlGaN and removal of the oxide layer by means of reactive ion etching in inductively coupled BCl₃ plasma. Using the proposed etching technology, AlGaN/AlN/GaN high-electron-mobility transistors (HEMTs) with a buried gate have been successfully fabricated for the first time. It is shown that the currents of obtained HEMTs are independent of the number of etching cycles, while the gate operating point shifts toward positive voltages up to obtaining transistors operating in the enhancement mode.     

High temperature assessment of nitride-based devices

The high temperature characterization of GaN-based devices, including high electron mobility transistors (HEMTs), p-i-n photodiodes and surface acoustic wave (SAW) filters is reported. Transmission line method (TLM) measurements reveal the reversible behaviour of both the ohmic contact resistance and the two-dimensional electron gas (2DEG) mobility. AlGaN/GaN HEMTs on sapphire and SiC substrates present a reduction of the drain current and the transconductance as temperature increases. The responsivity of InGaN/GaN photodiodes is enhanced and shifted to larger wavelengths with temperature, recovering its original value after the thermal cycle. The temperature coefficient of frequency of SAW filters on AlN epilayers on different substrates has been measured. The influence of temperature on the different surface acoustic modes is compared.     

AlGaN/GaN-heterostructures on (111) 3C-SiC/Si pseudo substrates for high frequency applications

We present the realization of high electron mobility transistors (HEMTs) based on AlGaN/GaN heterostructures, which were grown on silicon substrates using an ultrathin SiC transition layer. The growth of AlGaN/GaN heterostructures on 3C-SiC(111)/Si(111) was performed using metalorganic chemical vapour deposition (MOCVD). The 3C-SiC(111) transition layer was realized by low pressure CVD and prevented Ga-induced meltback etching and Si-outdiffusion in the subsequent MOCVD growth. The two-dimensional electron gas (2DEG) formed at the AlGaN/GaN interface showed an electron sheet density of 1.5 × 10¹³ cm^− 3 and a mobility of 870 cm²/Vs. The HEMTs DC and RF characteristics were analysed and showed a peak cut-off frequency as high as 29 GHz for a 250 nm gate length.     

Laser ablated ZnO layers for ALGaN/GaN HEMT passivation

ZnO layer in a role of passivation of the AlGaN/GaN-based high electron mobility transistors (HEMTs) is presented. The thin layer is deposited by pulsed laser deposition technique. It is fully compatible with the process technology of high electron mobility transistors prepared on AlGaN/GaN heterostructures due to its physical properties similar to the GaN. We have succeeded to (1) suppress the gate leakage current; (2) increase the maximum of the drain current and the electron drift mobility, and (3) ensure the threshold voltage to be unaltered by employment of the thin ZnO layer to the channel area of the HEMT.     

AlGaN/GaN-based diodes and gateless HEMTs for gas and chemical sensing

The characteristics of Pt/GaN Schottky diodes and Sc/sub 2/O/sub 3//AlGaN/GaN metal-oxide semiconductor (MOS) diodes as hydrogen and ethylene gas sensors and of gateless AlGaN/GaN high-electron mobility transistors (HEMTs) as polar liquid sensors are reported. At 25/spl deg/C, a change in forward current of /spl sim/6 mA at a bias of 2 V was obtained in the MOS diodes in response to a change in ambient from pure N/sub 2/ to 10% H/sub 2// 90% N/sub 2/. This is approximately double the change in forward current obtained in Pt/GaN Schottky diodes measured under the same conditions. The mechanism appears to be formation of a dipole layer at the oxide/GaN interface that screens some of the piezo-induced channel charge. The MOS-diode response time is limited by the mass transport of gas into the test chamber and not by the diffusion of atomic hydrogen through the metal/oxide stack, even at 25/spl deg/C. Gateless AlGaN/GaN HEMT structures exhibit large changes in source-drain current upon exposing the gate region to various polar liquids, including block co-polymer solutions. The polar nature of some of these polymer chains lead to a change of surface charges in gate region on the HEMT, producing a change in surface potential at the semiconductor/liquid interface. The nitride sensors appear to be promising for a wide range of chemicals, combustion gases and liquids.     

Mechanisms of Self‐Assembly and Energy Harvesting in Tuneable Conjugates of Quantum Dots and Engineered Photovoltaic Proteins

Photoreaction centers facilitate the solar energy transduction at the heart of photosynthesis and there is increasing interest in their incorporation into biohybrid devices for solar energy conversion, sensing, and other applications. In this work, the self‐assembly of conjugates between engineered bacterial reaction centers (RCs) and quantum dots (QDs) that act as a synthetic light harvesting system is described. The interface between protein and QD is provided by a polyhistidine tag that confers a tight and specific binding and defines the geometry of the interaction. Protein engineering that changes the pigment composition of the RC is used to identify Förster resonance energy transfer as the mechanism through which QDs can drive RC photochemistry with a high energy transfer efficiency. A thermodynamic explanation of RC/QD conjugation based on a multiple/independent binding model is provided. It is also demonstrated that the presence of multiple binding sites affects energy coupling not only between RCs and QDs but also among the bound RCs themselves, effects which likely stem from restricted RC dynamics at the QD surface in denser conjugates. These findings are readily transferrable to many other conjugate systems between proteins or combinations of proteins and other nanomaterials.     

Dopant-free GaN/AlN/AlGaN radial nanowire heterostructures as high electron mobility transistors

We report the rational synthesis of dopant-free GaN/AlN/AlGaN radial nanowire heterostructures and their implementation as high electron mobility transistors (HEMTs). The radial nanowire heterostructures were prepared by sequential shell growth immediately following nanowire elongation using metal-organic chemical vapor deposition (MOCVD). Transmission electron microscopy (TEM) studies reveal that the GaN/AlN/AlGaN radial nanowire heterostructures are dislocation-free single crystals. In addition, the thicknesses and compositions of the individual AlN and AlGaN shells were unambiguously identified using cross-sectional high-angle annular darkfield scanning transmission electron microscopy (HAADF-STEM). Transport measurements carried out on GaN/AlN/AlGaN and GaN nanowires prepared using similar conditions demonstrate the existence of electron gas in the undoped GaN/AlN/AlGaN nanowire heterostructures and also yield an intrinsic electron mobility of 3100 cm(2)/Vs and 21,000 cm(2)/Vs at room temperature and 5 K, respectively, for the heterostructure. Field-effect transistors fabricated with ZrO(2) dielectrics and metal top gates showed excellent gate coupling with near ideal subthreshold slopes of 68 mV/dec, an on/off current ratio of 10(7), and scaled on-current and transconductance values of 500 mA/mm and 420 mS/mm. The ability to control synthetically the electronic properties of nanowires using band structure design in III-nitride radial nanowire heterostructures opens up new opportunities for nanoelectronics and provides a new platform to study the physics of low-dimensional electron gases.     

Impact of SF6 plasma treatment on performance of AlGaN/GaN HEMT

Selective plasma treatment of an AlGaN/GaN heterostructure in the RF discharge of the electronegative SF₆ gas was studied. Shallow recess-gate etching of AlGaN (∼5 nm) was performed in CCl₄ plasma through a photoresist mask. Subsequently, recess-gate etching followed in situ by SF₆ plasma. The plasma treatment provides the following advantages in the technology of AlGaN/GaN high-electron mobility transistors (HEMT): It (1) simplifies their technology; (2) ensures sufficient selectivity; and (3) enables the technologist to set the threshold voltage of the HEMTs controllably. At the same time, the treatment can (1) provide the AlGaN/GaN heterostructure with surface passivation; (2) modify the 2DEG in any area of a HEMT channel; and (3) make it possible to convert a HEMT operation from depletion mode to enhancement mode. The treatment also improved significantly the DC and RF parameters of HEMTs studied.     

The influence of gate length on the electron injection of velocity in an AlGaN/AlN/GaN НЕМТ channel

Field-effect high-electron-mobility transistors (HEMTs) based on AlGaN/AlN/GaN heterostructures with various gate lengths L _g have been studied. The maximum values of current and power gaincutoff frequencies (f _T and f _max, respectively) amounted to 88 and 155 GHz for HEMTs with L _g = 125 nm, while those for the transistors with L _g = 360 nm were 26 and 82 GHz, respectively. Based on the measured S-parameters, the values of elements in small-signal equivalent schemes of AlGaN/AlN/GaN HEMTs were extracted and the dependence of electron-injection velocity v_inj on the gate–drain voltage was determined. The influence of L _g and the drain–source voltage on v_inj has been studied.     

Electrical and structural characterizations of non-polar AlGaN/GaN heterostructures

A non-polar AlGaN/GaN structure is a strong candidate for the high-voltage device that can operate in enhancement-mode compared to the depletion-mode operation that is practically unavoidable for a standard polar AlGaN/GaN structure. Growth of non-polar GaN is non-trivial and a two-step nucleation scheme was developed to produce high-quality non-polar a-plane AlGaN/GaN structures on r-plane sapphire. The anisotropic nature of non-polar GaN requires a modification to a typical polar GaN-based transistor fabrication process. A KOH wet etch proceeded by a dramatically different mechanism compared to the standard polar c-face AlGaN/GaN structure. This device with Pt/Au Schottky gate displayed a barrier height of 0.76 eV and an ideality factor of 4 at 20 °C.     

Wireless Detection System for Glucose and pH Sensing in Exhaled Breath Condensate Using AlGaN/GaN High Electron Mobility Transistors

Peltier element cooling of ungated AlGaN/GaN high electron mobility transistors (HEMTs) is shown to be an effective method for condensing exhaled breath, enabling the measurement of the pH and glucose of the exhaled breath condensate (EBC). By comparison with standard solutions, the current change measured in the HEMTs with EBC shows that the sensitivity of the glucose detection is lower than the glucose concentration in the EBC of healthy human subjects and the pH of the condensate from the exhaled breath is within the range of 7–8, typical of that for human blood. The HEMT sensors can be integrated into a wireless data transmission system that allows for remote monitoring. Details of the transmitter and receiver design for the transmission system are given. Our work demonstrates the possibility of using AlGaN/GaN HEMTs for extended investigations of airway pathology without the need for clinical visits.      

AlGaN/GaN high electron mobility transistors with implanted ohmic contacts

Selective area silicon implantation for source/drain regions was integrated into the fabrication of molecular beam epitaxy-grown AlGaN/GaN HEMTs. Dopant activation was achieved by rapid thermal annealing at 1100 °C in flowing N₂ ambient for 120 s with an AlN encapsulation. Linear transmission line measurements showed that the resistance of the overlay Ti/Al/Ni/Au ohmic contacts was reduced by 61% compared to the control sample. After the Schottky Ni/Au gate formation, the typical DC characteristics displayed a higher current drive, smaller knee voltage and better gate control properties for HEMTs with implanted source and drain regions.     

GaN Electronics

An overview is presented of progress in GaN electronic devices for high‐power, high‐temperature applications. The wide bandgaps of the nitride materials, their excellent transport properties, and the availability of heterostructures (e.g., GaN/AlGaN) make them ideal candidates for these applications. In the past few years a wide range of devices have been reported, including heterostructure field effect transistors (HFETs), heterojunction bipolar transistors (HBTs), bipolar junction transistors (BJTs), Schottky and p–i–n rectifiers, and metal–oxide–semiconductor field effect transistors (MOSFETs). Some of the unexpected features of GaN‐based electronics include the ability to use piezoelectrically induced carriers for current transport in heterostructures and the sensitivity of the GaN surface to preferential loss of nitrogen during device processing.     

Performance of AlGaN/GaN high electron mobility transistors at nanoscale gate lengths

The DC and RF performance of AlGaN/GaN high electron mobility transistors with nanoscale gate lengths is presented. The layer structures were grown by either metal organic chemical vapor deposition or rf plasma-assisted molecular beam epitaxy. Excellent scaling properties were observed as a function of both gate length and width and confirm that these devices are well suited to both high speed switching and power microwave applications.     

AlInN/GaN高电子迁移率晶体管的研究与进展

由于GaN基材料的高温性能好,AlInN/GaN异质界面具有更高的二维电子气密度,因而AlInN/GaN高电子迁移率晶体管(HEMT)具有更高的工作频率和饱和漏电流,以及更强的抗辐射能力,近年来成为微波功率器件和放大电路的研究热点。首先总结了AlInN材料的基本性质,分析了AlInN/GaNHEMT的材料生长和器件结构设计,最后总结了其在高频、大功率方面的最新进展。     

Impact of Device Technology Processes on the Surface Properties and Biocompatibility of Group III Nitride Based Sensors

In this work we have investigated the impact of typical device processing steps on the surface properties (roughness, chemical composition, contact angle to water) of group III‐nitride based chemical sensors with emphasis on the electrical performance of the sensor and the biocompatibility. Basic sensing device is an AlGaN/GaN high electron mobility transistor. The widely distributed mammalian cell cultures HEK 293FT and CHO‐K1 served as biological model systems. The processing of the devices had only little influence on the cell growth onto the sensor. In all cases it was superior to silicon surfaces. Fluorine dry etching smoothes the surface and forms an oxide, which improves the electrical properties of the AlGaN/GaN sensor. In contrast, autoclave treatment enhances the carbon contamination with negative impact on the sensor properties and increased the contact angle to water. For all other treatments the contact angle recaptures a value of about 50 ± 5° after exposure to air or water droplets for some hours due to the contamination by hydrocarbons.     

AlGaN/GaN HEMT栅槽低损伤刻蚀技术

对AlGaN/GaN HEMT栅槽低损伤刻蚀技术进行研究,通过加入小流量的具有钝化缓冲作用的C2H4,对Cl2/Ar/C2H4的工艺条件进行了优化,有效地降低了栅槽刻蚀造成的AlGaN表面损伤和器件退化,同时防止反应生成物淀积在栅槽表面,改善了肖特基结特性,提高了栅极调控能力,实现凹栅槽的低损伤刻蚀.     

氧气等离子体处理对AlGaN肖特基接触的影响

研究了不同的干法刻蚀以及氧气等离子体处理条件对AlGaN表面特性的影响。在合适的条件下,氧气等离子体处理可以使AlGaN表面发生氧化,并使肖特基接触的反向漏电流降低两个数量级,反向击穿电压也有显著提高。该方法简单易行,可应用于制备高性能的AlGaN／GaN HEMT器件。