Preparation and properties of polyimide/silica hybrid composites based on polymer‐modified colloidal silica

A new type of polyimide/silica (PI/SiO₂) hybrid composite films was prepared by blending polymer‐modified colloidal silica with the semiflexible polyimide. Polyimide was solution‐imidized at higher temperature than the glass transition temperature (T_g) using 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐diaminodiphenyl ether (ODA). The morphological observation on the prepared hybrid films by scanning electron microscopy (SEM) pointed to the existence of miscible organic–inorganic phase, which resulted in improved mechanical properties compared with pure PI. The incorporation of the silica structures in the PI matrix also increased both T_g and thermal stability of the resulting films. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 2053–2061, 2006     

Polyimide fibers prepared by a dry‐spinning process: Enhanced mechanical properties of fibers containing biphenyl units

Polyimide (PI) fibers with enhanced mechanical properties and high thermal and dimensional stability were prepared via a two‐step dry‐spinning process through the introduction of 3,3′,4,4′‐biphenyl tetracarboxylic dianhydride (BPDA) containing biphenyl units into rigid homopolyimide of pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline. The attenuated total reflectance–Fourier transform infrared spectra results imply that the incorporated BPDA moieties accelerate the imidization process and increase the imidization degree (ID) of the precursor fibers; this was attributed to the increased molecular mobility of the polymer chains. Two‐dimensional wide‐angle X‐ray diffraction spectra indicated that the prepared PI fibers possessed a well‐defined crystal structure and polymer chains in the crystalline region were highly oriented along the fiber axis. The PI fiber, with the molar ratio of PMDA/BPDA being 7/3, showed optimum tensile strength and modulus values of 8.55 and 73.21 cN/dtex, respectively; these were attributed to the high IDs and molecular weights. Meanwhile, the PI fibers showed better dimensional stability than the commercial P84 fiber, and this is beneficial for its security applications. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43727.     

Residual stress and mechanical properties of polyimide thin films

Four different structure polyimide thin films based on 1,4‐phenylene diamine (PDA) and 4,4′‐oxydianiline (ODA) were synthesized by using two different dianhydrides, pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), and their residual stress behavior and mechanical properties were investigated by using a thin film stress analyzer and nanoindentation method. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films. The morphological structure of polyimide thin films was characterized by X‐ray diffraction patterns and refractive indices. The residual stress was in the range of ?5 to 38 MPa and increased in the following order: PMDA‐PDA < BPDA‐PDA < PMDA‐ODA < BPDA‐ODA. The hardness of the polyimide films increased in the following order: PMDA‐ODA < BPDA‐ODA < PMDA‐PDA < BPDA‐PDA. The PDA‐based polyimide films showed relatively lower residual stress and higher hardness than the corresponding ODA‐based polyimide films. The in‐plane orientation and molecularly ordered phase were enhanced with the increasing order as follows: PMDA‐ODA < BPDA‐ODA < BPDA‐PDA ～ PMDA‐PDA. The PDA‐based polyimides, having a rigid structure, showed relatively better‐developed morphological structure than the corresponding ODA‐based polyimides. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

High‐performance fibers based on copolyimides containing benzimidazole and ether moieties: Molecular packing,morphology, hydrogen‐bonding interactions and properties

High‐performance copolyimide (co‐PI) fibers were prepared via the wet spinning process of co‐polyamide acid precursors based on 3,3′,4,4′‐biphenyldianhydride (BPDA) and a mixture of three diamines namely p‐phenylene diamine (p‐PDA), 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (BIA), and 4,4′‐oxidianiline (ODA), followed by drawing and imidization at high temperatures. Effects of the ODA and BIA contents on the molecular packing, morphology, hydrogen‐bonding interactions, mechanical and thermal properties of the prepared fibers were investigated. The mechanical properties of the co‐PI fibers were improved with the addition of ODA and BIA, and they reached the optimum tensile strength of 2.7 GPa and modulus of 94.3 GPa. Wide‐angle X‐ray diffraction results (WAXD) showed that the co‐PI fibers exhibited highly oriented structure along the fiber direction with low degree of lateral packing orders in the transverse direction. Two‐dimensional small‐angle X‐ray scattering (2D‐SAXS) revealed that the incorporation of ODA resulted in the reduction in radius, length, misorientation, and internal surface roughness of the microvoids in the fibers. Fourier transform infrared (FTIR) results indicated that hydrogen‐bonding formed between the BIA and cyclic imide units effectively strengthened the intermolecular interactions. The co‐PI fibers exhibited excellent thermal and thermal‐oxidative stability, with a 5%‐weight‐loss temperature of 578°C under N₂ and 572°C in air. POLYM. ENG. SCI., 55:2615–2625, 2015. © 2015 Society of Plastics Engineers     

Structure and properties of novel PMDA/ODA/PABZ polyimide fibers

A series of random copolyamic acid were synthesized from various ratios of two diamines 4, 4′‐oxydianiline (ODA) and 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (PABZ) by polycondensation with pyromellitic dianhydride (PMDA) in N‐methyl‐2‐pyrrolidone (NMP). Their inherent viscosities were in the range of 1.89–2.91 dl/g. The polyamic acid (PAA) solution drops were spun into fibers by the wet spinning process. The polyimide (PI) fibers were obtained from PAA fibers after drawn and treated in heating tube. The fibers were characterized by fourier transform infrared (FTIR), wide X‐ray diffraction (WAXD), scanning electron microscope (SEM), thermal gravimetry analysis (TGA), dynamic mechanical analysis (DMA), and tensile testing. WAXD showed these PI fibers were basically amorphous. The tensile strength and initial modulus of the PI fiber reached 1.53 and 220.5 GPa when diamine ratio of PABZ/ODA was 7/3, which were almost three times and 30 times over that of the PMDA/ODA PI fibers. TGA showed that the PI fibers were thermally stable with 10% weight losses recorded in the range of 492–564°C under nitrogen atmosphere, and their glass transition temperature (T_g) were found to be 410–440°C by DMA with increasing PABZ content from 30 to 70%. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers     

Thermoplastic character of polyimide blends

Polyimide blends consisting of pyromellitic dianhydride/4,4′-oxydianiline (PMDA/ODA) and biphenyl-tetracarboxylic dianhydride/p-phenylene diamine (BPDA/PDA) show a distinct glass transition behavior at temperatures lower than each component does. Disruption of molecular packing by blending of polymers having dissimilar interaction sites leads to a significant increase in molecular mobility at much lower temperatures. This is examined by laminating two pieces of film cast from the blend and measuring the adhesive strength at the interface. A strong adhesion, 11.5 N/cm (6.6 lbf/in) by 180° peel test, was achieved indicating interpenetration of polyimide molecules. It was also found that the polyimide blends can be converted into highly ordered states by mechanical deformation of the blends above their glass transition temperatures (T_gs).     

Syntheses and properties of polyimides derived from diamines containing 2,5‐disubstituted pyridine group

A series of novel homo‐ and copolyimides containing pyridine units were prepared from the heteroaromatic diamines, 2,5‐bis (4‐aminophenyl) pyridine and 2‐(4‐aminophenyl)‐5‐aminopyridine, with pyromelltic dianhydride (PMDA), and 3,3′, 4,4′‐biphenyl tertracarboxylic dianhydride (BPDA) via a conventional two‐step thermal imidizaton method. The poly(amic acid) precursors have inherent viscosities of 1.60–9.64 dL/g (c = 0.5 g/dL in DMAC, 30°C) and all of them can be cast and thermally converted into flexible and tough polyimide films. All of the polyimides show excellent thermal stability and mechanical properties. The polyimides have 10% weight loss temperature in the range of 548–598°C in air. The glass transition temperatures of the PMDA‐based samples are in the range of 395–438°C, while the BPDA‐based polyimides show two glass transition temperatures (T_g1 and T_g2), ranging from 268 to 353°C and from 395 to 418°C, respectively. The flexible films possess tensile modulus in the range of 3.42–6.39 GPa, strength in the range of 112–363 MPa and an elongation at break in the range of 1.2–69%. The strong reflection peaks in the wide‐angle X‐ray diffraction patterns indicate that the polyimides have a high packing density and crystallinity. The polymer films are insoluble in common organic solvents exhibiting high chemical resistance. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 1844–1851, 2006     

共聚型聚酰亚胺纤维的结构与性能

通过湿法纺丝工艺制备了3,3′,4,4′-聚苯四甲酸酐(BPDA)-均苯四甲酸酐(PMDA)-对苯二胺(PPDA)三元共聚型聚酰亚胺纤维和用4,4′-二氨基二苯醚(ODA)部分代替PPDA的四元共聚型聚酰亚胺纤维,柔性单体ODA的引入有效提高了共聚纤维的断裂伸长率,但引起断裂强度、初始模量和玻璃化转变温度及热分解温度的降低。采用Kissinger和Flynn-Wall-Ozawa两种方法对两种纤维在空气中的热分解表观活化能进行了计算,均是加入ODA单体的共聚纤维的热分解表观活化能较低,由此造成其耐热性下降。     

Structure–property relationship of polyimide fibers containing ether groups

The copolyimide (co‐PI) fibers with outstanding mechanical properties were prepared by a two‐step wet‐spinning method, derived from the design of combining 4,4′‐oxydianiline (ODA) with the rigid 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)/p‐phenylenediamine (p‐PDA) backbone. The mechanical properties of PI fibers were drastically improved with the optimum tensile strength of 2.53 GPa at a p‐PDA/ODA molar ratio of 5/5, which was approximately 3.7 times the tensile strength of BPDA/p‐PDA PI fibers. Two‐dimensional wide‐angle X‐ray diffraction indicated that the highly oriented structures were formed in the fibers. Two‐dimensional small‐angle X‐ray scattering revealed the existence of the needle‐shaped microvoids aligned parallel to the fiber axis, and the introduction of ODA led to the reduction in the size of the microvoids. As a result, the significantly improved mechanical properties of PI fibers were mainly attributed to the gradually formed homogeneous structures. The co‐PI fibers also exhibited excellent thermal stabilities of up to 563°C in nitrogen and 536°C in air for a 5% weight loss and glass transition temperatures above 279°C. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42474.     

Syntheses and properties of novel polyimides derived from 2‐(4‐Aminophenyl)‐5‐aminopyrimidine

2‐(4‐Aminophenyl)‐5‐aminopyrimidine (4) is synthesized via a condensation reaction of vinamidium salts and amidine chloride salts, followed by hydrazine palladium catalyzed reduction. A series of novel homo‐ and copolyimides containing pyrimidine unit are prepared from the diamine and 1,4‐phenylenediamine (PDA) with pyromellitic dianhydride (PMDA) or 3,3′,4,4′‐biphenyl tertracarboxylic dianhydride (BPDA) via a conventional two‐step thermal imidization method. The poly(amic acid) precursors had inherent viscosities of 0.97–4.38 dL/g (c = 0.5 g/dL, in DMAc, 30°C) and all of them could be cast and thermally converted into flexible and tough polyimide films. All of the polyimides showed excellent thermal stability and mechanical properties. The glass transition temperatures of the resulting polyimides are in the range of 307–434°C and the 10% weight loss temperature is in the range of 556–609°C under air. The polyimide films possess strength at break in the range of 185–271 MPa, elongations at break in the range of 6.8–51%, and tensile modulus in the range of 3.5–6.46 GPa. The polymer films are insoluble in common organic solvents, exhibiting high chemical resistance. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 5871–5876, 2006     

Properties of copolyimides prepared from different tetracarboxylic dianhydrides and diamines

Various copolymides were prepared from two acid dianhydrides (BPDA, 3,3′,4,4′-biphenyl tetracarboxylic dianhydride; PMDA, pyromelitic dianhydride) and two diamines (PPD, p-phenylene diamine; ODA, 4,4′-oxydianiline). The thermal and mechanical properties of these polyimides were examined in detail. By appropriately selecting the ratios of the acid dianhydride component and the diamine component, polyimide films having desirable mechanical and thermal characteristics can be obtained. Further, it was proved that there is a correlation between the properties and the compositions of the copolyimides and that the properties could be estimated from the compositions by the use of multiple regression analysis. © 1996 John Wiley & Sons, Inc.     

Preparation and properties of polyimide/carbon nanotube composite films with electromagnetic wave absorption performance

The polyimide (PI)/carbon nanotube (CNT) films including 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), p-phenylenediamine (p-PDA), and CNTs were prepared, which have prominent electromagnetic (EM) wave absorption performance. Experimental analyses of the mechanical properties, thermal stabilities, coefficient of thermal expansion (CTE), the glass transition temperature (T_g), and EM parameter revealed the beneficial effects of the CNTs on the resulting composite films. In particular, when the content of CNTs is 6 wt%, the film shows the highest EM wave absorption performance, which exhibits the effective absorption bandwidth of 2.72 GHz with the matching thickness of only 2.0 mm. These results indicate that PI-based films have a certain potential application in the area of EM wave-absorbing materials.     

Preparation and characterization of high‐temperature resistance polyimide foams

A new high‐temperature resistance polyimide foam was synthesized from 2,3,3′,4′‐biphenyltetracarboxylic dianhydride (α‐BPDA) and p‐phenylenediamine (p‐PDA). The structures and foaming process of polyimide precursor powders were characterized by wide‐angle X‐ray diffractometer (WXRD) and the self‐made visualization device, respectively. The imidization degree, thermal mechanical properties and thermal stability of the polyimide foams with different post‐treatment temperatures were also measured by fourier transform infrared spectrometer spectrum (FTIR), dynamic thermal mechanical anaylsis (DMTA), and thermogravimetric analysis (TGA). Results showed that the inflation onset temperatures of polyimide precursor powders ranged from 122 to 135°C with varying the heating rate. And the increase in the imidization degree, glass transition temperatures (T_g) and temperatures for 5 wt% mass loss of high‐temperature resistance polyimide foams can be achieved with increasing post‐treatment temperature. It was quite surprising to find that T_g of high‐temperature resistance polyimide foam post‐treated at 420°C was up to above 450°C, and the char yield at 800°C was more than 60%. POLYM. ENG. SCI., 2010. © 2010 Society of Plastics Engineers     

Morphology and structure changes of aromatic copolysulfonamide fibers heat‐drawn at various temperatures

Pre‐drawn aromatic copolysulfonamide (co‐PSA) fibers were prepared by wet spinning and then heat drawing at temperatures varying from 350 to 390 °C, which are below the decomposition temperature. The fibers were then characterized using tensile testing, dynamic mechanical analysis, wide‐angle X‐ray diffraction and small‐angle X‐ray scattering. The relationship between structure and properties of the co‐PSA fibers drawn at different temperatures was investigated. The heat‐drawn co‐PSA fibers displayed similar glass transition temperature of about 355 °C, which was higher than that of pre‐drawn co‐PSA fibers of 345 °C. The crystal orientation was high as a crystalline structure formed during heat drawing and the crystallinity increased with the heat‐drawing temperature. However, the tenacity of the co‐PSA fibers did not increase linearly with the draw temperature. When the drawing temperature was higher than the glass transition temperature, a decrease in tenacity was observed, which could be attributed to an increase of crystallite size of the (100) plane and a decrease of the long period of the lamellar structure. © 2014 Society of Chemical Industry     

Low dielectric constant polyimide mixtures fabricated by polyimide matrix and polyimide microsphere fillers

Polyimide microspheres were prepared via non‐aqueous emulsion polymerization by using pyromellitic dianhydride (PMDA) as anhydride monomer and 2,2‐bis(4‐(4‐aminophenoxy)phenyl)propane as amine monomer. The polyimide microspheres were well characterized by Fourier transform infrared spectroscopy, SEM and laser particle size analyzer. They were spherical in shape and monodisperse and their size was 31–33 μm. Polyimide mixtures formed by polyimide microspheres as fillers and polyimide composed of pyromellitic and dianhydride 4,4′‐oxydianiline (ODA) as matrix were investigated with regard to thermal properties, dielectric properties and mechanical properties. With 10%–50% polyimide microspheres in the polyimide mixtures, the dielectric constants were 2.26–2.48 (1 MHz) and the loss tangents were 0.00663–0.00857 (1 MHz), which were both significantly lower than the values for ODA‐PMDA polyimide. The decomposition temperature and glass transition temperature were above 440 and 290 °C. The polyimide mixtures possessed excellent thermal resistance. When the percentage of polyimide microsphere addition was 30%, the polyimide mixtures had the largest tensile strength (128.50 MPa) and elongation at break (9.01%). These results indicate that the polyimide microspheres were used as both low dielectric fillers and reinforcing fillers. © 2020 Society of Chemical Industry     

Adhesion of polyimide to silicon and polyimide

The characteristics of the adhesions of polyimide to silicon and to polyimide and the autohesion of a polyimide blend have been investigated. As found, the peel strength of pyromellitic dianhydride–4,4′-oxydianiline (PMDA–ODA) on silicon can be greatly improved by blending with 20 or 40% benzophenone tetracarboxylic dianhydride–p-phenylene diamine (BPDA–PDA). Exposing in air for a 2 day period resulted in a serious deterioration in adhesion for the pure PMDA–ODA system, while in no deterioration for the blend systems. Regardless of adhesion or autohesion, the resulting peel strength decreased markedly with the increase of the curing temperature. It was also found that based on the same curing temperature the diffusion of NMP is much faster in the film of PMDA–ODA than in the blend containing 20% BPDA–PDA. Beside curing temperature, imide-to-imide compatibility seems to play an important role in affecting the adhesion characteristics. © 1993 John Wiley & Sons, Inc.     

Synthesis of polyimides with low viscosity and good thermal properties via copolymerization

Novel polyimides were successfully synthesized through copolymerization of diamine monomers p‐phenylenediamine (p‐PDA) and 4,4'‐diaminodiphenylmethane (MDA) with different proportions and 2,3,3',4'‐biphenyltetracarboxylic dianhydride (a‐BPDA) using 4‐phenylethynylphthalic anhydride (4‐PEPA) as an end‐capping agent. The melt rheological properties, thermal properties, and crystallinity of PI oligomers were investigated via rheometer, dynamic mechanical analysis (DMA), thermal gravimetric analysis (TGA), differential scanning calorimetry (DSC), and X‐ray diffraction (XRD). The results indicate that melt viscosity and solubility of the PI oligomers were improved, but the glass transition temperature (T_g) and crystallinity decreased with the increasing molar ratio of MDA. PI oligomer 3 with the molar ratio of MDA/p‐PDA = 2/1 shows a lower minimum melt viscosity (66 Pa.s) at 313°C and better solubility in aprotic solvents. The corresponding PI‐3 exhibits a high glass transition temperature of 406°C and excellent thermal stability. This copolyimide shows good processability and thermal properties, and could become a good candidate of matrix resins for high performance composites in aerospace field. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41303.     

Thermal mechanical and dynamic mechanical property of biphenyl polyimide fibers

High‐performance polyimide fibers possess many excellent properties, e.g., outstanding thermal stability and mechanical properties and excellent radiation resistant and electrical properties. However, the preparation of fibers with good mechanical properties is very difficult. In this report, a biphenyl polyimide from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride and 4,4′‐oxydianiline is synthesized in p‐chlorophenol by one‐step polymerization. The solution is spun into a coagulation bath of water and alcohol via dry‐jet wet‐spinning technology. Then, the fibers are drawn in two heating tubes. Thermal gravimetric analysis, thermal mechanical analysis, and dynamic mechanical analysis (DMA) are performed to study the properties of the fibers. The results show that the fibers have a good thermal stability at a temperature of more than 400°C. The linear coefficient of thermal expansion is negative in the solid state and the glass transition temperature is about 265°C. DMA spectra indicate that the tanδ of the fibers has three transition peaks, namely, α, β, and γ transition. The α and γ transition temperature, corresponding to the end‐group motion and glass transition, respectively, extensively depends on the applied frequency, while the β transition does not. The activation energy of α and γ transition is calculated using the Arrhenius equation and is 38.7 and 853 kJ/mol, respectively. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 1653–1657, 2004     

Effect of monomer composition on properties of copolyimides derived from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride/4,4′‐oxydianiline/1,3‐bis (4‐aminophenoxy)benzene

A series of uncontrolled molecular weight homopolyimides and copolyimides based on 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (s‐BPDA)/4,4′‐oxydianiline (4,4′‐ODA)/1,3‐bis(4‐aminophenoxy)benzene (TPER) were synthesized. All the polyimides displayed excellent thermal stability and mechanical properties, as evidenced by dynamic thermogravimetric analysis and tensile properties testing. A singular glass transition temperature (T_g) was found for each composite from either differential scanning calorimetry (DSC) or dynamic mechanical analysis (DMA), but the values determined from tan δ of DMA were much different from those determined from DSC and storage modulus (E′) of DMA. The Fox equation was used to estimate the random T_g values. Some composites exhibited re‐crystallization after quenching from the melt; upon heating, multi‐melting behavior was observed after isothermal crystallization at different temperatures. The equilibrium melting temperature was estimated using the Hoffman‐Weeks method. Additionally, DMA was conducted to obtain E′ and tan δ. Optical properties were strongly dependent on the monomer composition as evidenced by UV‐visible spectra. X‐ray diffraction was used to interpret the crystal structure. All the results indicated that composites with TPER composition ≥ 70% were dominated by the TPER/s‐BPDA polyimide phase, and ≤40% by the 4,4′‐ODA/s‐BPDA polyimide phase. When the ratio between the two diamines was close to 1:1, the properties of the copolyimides were very irregular, which means a complicated internal structure. Copyright © 2011 Society of Chemical Industry     

Effect of montmorillonite on thermal and moisture absorption properties of polyimide of different chemical structures

The thermal properties and the moisture absorption of three types of polyimide/montmorillonite nanocomposite were investigated: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride‐4,4′‐oxydianiline (BPDA‐ODA); pyromellitic dianhydride‐ODA (PMDA‐ODA); and 3,3′,4,′‐benzophenone tetracarboxylic dianhydride‐ODA (BTDA‐ODA). The inhibition effect on in‐plane coefficients of thermal expansion (CTE) and moisture absorption of these polyimide nanocomposites by layered silicates from montmorillonite was found to decrease with the crystallinity in the pristine polyimides. The largest reduction, 30% in in‐plane CTE occurred in the case of amorphous BTDA‐ODA containing 5 wt % montmorillonite as compared with that of pure BTDA‐ODA, while the reduction in in‐plane CTE was 20% for the case of semicrystalline BPDA‐ODA. The maximum reduction in moisture absorption, 43%, also took place for the case of 3/97 ODA‐Mont/BTDA‐ODA as compared with that of pure BTDA‐ODA, whereas the semicrystalline 1/99 PPD‐Mont/BPDA‐ODA showed a 30% reduction as compared with that of pure BPDA‐ODA. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 1742–1747, 2001