Development of a DOPO‐containing melamine epoxy hardeners and its thermal and flame‐retardant properties of cured products

In this study, a novel Schiff base of melamine used as flame‐retardant curing agent for epoxy resins, was synthesized via condensation reaction of 4‐hydroxybenzaldehyde with melamine, followed by the addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphen‐anthrene 10‐oxide (DOPO) to the resulting imine linkage. The structure of DOPO‐containing melamine Schiff base (P‐MSB) was characterized by Fourier transformed infrared spectroscopy, ¹H‐nuclear magnetic resonance (¹H‐NMR) and ³¹P‐NMR. The compound (P‐MSB) was used as a reactive flame retardant in o‐cresol formaldehyde novolac epoxy resin (CNE) to prepare flame‐retardant epoxy resins for electronic application. The thermal and flame‐retardant properties of the epoxy resins cured by various equivalent ratios phenol formaldehyde novolac (PN) and P‐MSB were investigated by the nonisothermal differential scanning calorimetry, the thermogravimetric analysis, and limiting oxygen index test. The obtained results showed that the cured epoxy resins possessed high T_g (165°C) and good thermal stability (T_5%, 321°C). Moreover, the P‐MSB/CNE systems exhibited higher limiting oxygen index (35) and more char was maintained in P‐MSB/CNE systems than that in PN/CNE system and the effective synergism of phosphorus–nitrogen indicated their excellent flame retardancy. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Low dielectric thermoset. I. Synthesis and properties of novel 2,6‐dimethyl phenol‐dicyclopentadiene epoxy

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant 2,6‐dimethyl phenol‐dicyclopentadiene novolac was epoxidized to 2,6‐dimethyl phenol‐dicyclopentadiene epoxy. The structures of novolac and epoxy were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis, mass spectroscopy (MS), nuclear magnetic resonance spectroscopy (NMR), and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol‐dicyclopentadiene epoxy was then cured with 4,4‐diaminodiphenyl methane (DDM), phenol novolac (PN), 4,4‐diaminodiphenyl sulfone (DDS), and 4,4‐diaminodiphenyl ether (DDE). Thermal properties of cured epoxy resins were studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermal gravimetric analysis (TGA). These data were compared with those of the commercial bisphenol A epoxy system. Compared with the bisphenol A epoxy system, the cured 2,6‐dimethyl phenol‐ dicyclopentadiene epoxy resins exhibited lower dielectric constants (～3.0 at 1 MHz and 2.8 at 1 GHz), dissipation factors (～0.007 at 1 MHz and 0.004 at 1 GHz), glass transition temperatures (140–188°C), thermal stability (5% degradation temperature at 382–404°C), thermal expansion coefficients [50–60 ppm/°C before glass‐transition temperature (T_g)], and moisture absorption (0.9–1.1%), but higher modulus (～2 Gpa at 60°C). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2607–2613, 2003     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Glycidyl Azide Polymer Crosslinked Through Triazoles by Click Chemistry: Curing,Mechanical and Thermal Properties

Glycidyl azide polymer (GAP) was cured through “click chemistry” by reaction of the azide group with bispropargyl succinate (BPS) through a 1,3‐dipolar cycloaddition reaction to form 1,2,3‐triazole network. The properties of GAP‐based triazole networks are compared with the urethane cured GAP‐systems. The glass transition temperature (T_g), tensile strength, and modulus of the system increased with crosslink density, controlled by the azide to propargyl ratio. The triazole incorporation has a higher T_g in comparison to the GAP‐urethane system (T_g−20 °C) and the networks exhibit biphasic transitions at 61 and 88 °C. The triazole curing was studied using Differential Scanning Calorimetry (DSC) and the related kinetic parameters were helpful for predicting the cure profile at a given temperature. Density functional theory (DFT)‐based theoretical calculations implied marginal preference for 1,5‐addition over 1,4‐addition for the cycloaddition between azide and propargyl group. Thermogravimetic analysis (TG) showed better thermal stability for the GAP‐triazole and the mechanism of decomposition was elucidated using pyrolysis GC‐MS studies. The higher heat of exothermic decomposition of triazole adduct (418 kJ ⋅ mol⁻¹) against that of azide (317 kJ ⋅ mol⁻¹) and better mechanical properties of the GAP‐triazole renders it a better propellant binder than the GAP‐urethane system.     

Thermally reversible and self‐healing novolac epoxy resins based on Diels–Alder chemistry

The modified novolac epoxy resins with furan pendant groups were prepared by novolac epoxy resin and furfuryl alcohol and then crosslinked by bifunctional maleimide via Diels–Alder (DA) chemistry to obtain the thermally reversible and self‐healing novolac epoxy resins. The as‐prepared crosslinked novolac epoxy resins were characterized by FT‐IR, NMR, TGA, and DMA. The results indicate that the novel crosslinked novolac epoxy resins present higher storage modulus (2.37 GPa at 30°C) and excellent thermal stability (348°C at 5% mass loss). Furthermore, the thermal reversible and self‐healing properties were studied in detail by DSC, SEM, thermal re‐solution, and gel–solution–gel transition experiments. All the results reveal that the crosslinked novolac epoxy resins based on DA reaction can be used as smart material for the practical application of electronic packaging and structural materials. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42167.     

Synthesis and properties of fluorinated biphenyl‐type epoxy resin

A novel fluorinated biphenyl‐type epoxy resin (FBE) was synthesized by epoxidation of a fluorinated biphenyl‐type phenolic resin, which was prepared by the condensation of 3‐trifluoromethylphenol and 4,4′‐bismethoxymethylbiphenyl catalyzed in the presence of strong Lewis acid. Resin blends mixed by FBE with phenolic resin as curing agent showed low melt viscosity (1.3–2.5 Pa s) at 120–122°C. Experimental results indicated that the cured fluorinated epoxy resins possess good thermal stability with 5% weight loss under 409–415°C, high glass‐transition temperature of 139–151°C (determined by dynamic mechanical analysis), and outstanding mechanical properties with flexural strength of 117–121 MPa as well as tensile strength of 71–72 MPa. The thermally cured fluorinated biphenyl‐type epoxy resin also showed good electrical insulation properties with volume resistivity of 0.5–0.8 × 10¹⁷ Ω cm and surface resistivity of 0.8–4.6 × 10¹⁶ Ω. The measured dielectric constants at 1 MHz were in the range of 3.8–4.1 and the measured dielectric dissipation factors (tan δ) were in the range of 3.6–3.8 × 10^?3. It was found that the fluorinated epoxy resins have improved dielectric properties, lower moisture adsorption, as well as better flame‐retardant properties compared with the corresponding commercial biphenyl‐type epoxy resins. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Novel flame retardant thermosets from nitrogen‐containing and phosphorus‐containing epoxy resins cured with dicyandiamide

A novel phosphorus‐containing epoxy resin (EPN‐D) was prepared by addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and epoxy phenol‐ formaldehyde novolac resin (EPN). The reaction was monitored by epoxide equivalent weight (EEW) titration, and its structure was confirmed by FTIR and NMR spectra. Halogen‐free epoxy resins containing EPN‐D resin and a nitrogen‐containing epoxy resin (XT resin) were cured with dicyandiamide (DICY) to give new halogen‐free epoxy thermosets. Thermal properties of these thermosets were studied by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA), thermal mechanical analyzer (TMA) and thermal‐gravimetric analysis (TGA). They exhibited very high glass transition temperatures (T_gs, 139–175°C from DSC, 138–155°C from TMA and 159–193°C from DMA), high thermal stability with T_{d,5 wt %} over 300°C when the weight ratio of XT/EPN‐D is ≥1. The flame‐retardancy of these thermosets was evaluated by limiting oxygen index (LOI) and UL‐94 vertical test. The thermosets containing isocyanurate and DOPO moieties showed high LOI (32.7–43.7) and could achieve UL‐94 V‐0/V‐1 grade. Isocyanurate and DOPO moieties had an obvious synergistic effect on the improvement of the flame retardancy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Synthesis and properties of cardanol‐based epoxidized novolac resins modified with carboxyl‐terminated butadiene–acrylonitrile copolymer

Cardanol‐based, novolac‐type phenolic resins were synthesized with a cardanol‐to‐formaldehyde molar ratio of 1 : 0.7 with different dicarboxylic acid catalysts, including oxalic and succinic acids. These novolac resins were epoxidized with a molar excess of epichlorohydrin at 120°C in a basic medium. The epoxidized novolac resins were separately blended with different weight ratios of carboxyl‐terminated butadiene–acrylonitrile copolymer (CTBN) ranging between 0 and 20 wt % with an interval of 5 wt %. All of the blends were cured at 120°C with a stoichiometric amount of polyamine. The formation of various products during the synthesis of the cardanol‐based novolac resin and epoxidized novolac resin and the blending of the epoxidized novolac resin with CTBN was studied by Fourier transform infrared spectroscopy analysis. Furthermore, the products were also confirmed by proton nuclear magnetic resonance and matrix‐assisted laser desorption/ionization time‐of‐flight mass spectroscopy analysis. The molecular weights of the prepared novolacs and their epoxidized novolac resins were determined by gel permeation chromatography analysis. The blend samples, in both cases, with 15 wt % CTBN concentrations showed the minimum cure times. These blend samples were also the most thermally stable systems. The blend morphology, studied by scanning electron microscopy analysis, was, finally, correlated with the structural and property changes in the blends. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Low-stress encapsulants by vinylsiloxane modification

Dispersed silicone rubbers were used to reduce the stress of cresol–formaldehyde novolac epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The effects of structure, molecular weight, and contents of the vinylsiloxane oligomer on reducing the stress of the encapsulant were investigated. Morphology and dynamic mechanical behavior of rubber-modified epoxy resins were also studied. The dispersed silicone rubbers effectively reduce the stress of cured epoxy resins by reducing flexural modulus and the coefficient of thermal expansion (CTE), whereas the glass transition temperature (T_g) was hardly depressed. Electronic devices encapsulated with the dispersed silicone rubber modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended device use life. © 1994 John Wiley & Sons, Inc.     

Mechanical properties,thermal stability,and flame retardance of novolac‐type phenolic resin blended with poly(dimethylsiloxaneadipamide)

Mechanical properties (flexural strength, flexural modulus, and notched Izod impact strength), thermal stability, and flame retardance of poly(dimethylsiloxane adipamide) (PDMSA)‐toughened novolac type phenolic resin were investigated. Mechanical properties of modified novolac‐type phenolic resin increase with PDMSA contents, because the soft segment of PDMSA absorbs the loads in the network of brittle novolac‐type phenolic resins. TGA results show that the thermal degradation temperatures are higher than 400°C, and the temperature of 10% weight loss increases with increasing the PDMSA content. The char yield increases with novolac‐type phenolic resin content. The morphologies of the fracture surface of the modified novolac‐type phenolic resin were investigated by scanning electron microscopy (SEM). Morphological results agree with those from mechanical properties of the modified novolac‐type phenolic resin. The modified novolac‐type phenolic resin also shows excellent flame retardance that is UL‐94, V‐1, and the limited oxygen index is higher than 35. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 631–637, 2001     

Effect of Phenol/Formaldehyde Stoichiometry on the Modification of Epoxy Resin Using Epoxidized Novolacs

ABSTRACT

Unmodified epoxy resins based on bisphenol A exhibit brittleness and low elongation after cure. This article reports the results of a study for improving the properties of epoxy resin by blending with suitable thermosets. Hybrid polymer networks of diglycidyl ether of bisphenol A (DGEBA) resin with epoxidized phenolic novolac resins (EPN) containing phenol and formaldehyde in different stoichiometric ratios were prepared by physical blending. The modified epoxy resins were found to exhibit improved mechanical and thermal properties compared to the neat resin. DGEBA resins containing 2.5 to 20 wt% of epoxidized novolac resins (EPN) prepared in various stoichiometric ratios (1:0.6, 1:0.7, 1:08, and 1:0.9) between phenol and formaldehyde were cured using a room temperature amine hardener. The cured samples were tested for mechanical properties such as tensile strength, modulus, elongation, and energy absorption at break. All the EPNs are seen to improve tensile strength, elongation, and energy absorption at break of the resin. The blend of DGEBA with 10 wt% of EPN-3 (1:0.8) exhibits maximum improvement in strength, elongation, and energy absorption. EPN loading above 10 wt% is found to lower these properties in a manner similar to the behavior of any filler material. The property profiles of epoxy–EPN blends imply a toughening action by epoxidized novolac resins and the extent of modification is found to depend on the molar ratio between phenol and formaldehyde in the novolac.     

Synthesis of tetrafunctional epoxy resins and their modification with polydimethylsiloxane for electronic application

High-performance tetrafunctional epoxy resins were synthesized by reacting a suitable tetraphenols which were obtained by the condensation of appropriate dialdehyde with phenol followed by epoxidation with a halohydrin. The structure of the synthesized tetraphenols was confirmed by infrared (IR), mass spectra (MS), and nuclear magnetic resonance (NMR) spectroscopy. Dispersed silicone rubbers were used to reduce the stress of the synthesized tetrafunctional epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The dynamic viscoelastic properties and morphologies of neat rubber-modified epoxy networks were investigated. The thermal mechanical properties and moisture absorption of encapsulants formulated from the synthesized tetrafunctional epoxy resins were also studied. The results indicate that a low-stress, high glass transition temperature (T_g), and low-moisture-absorbing epoxy resin system was obtained for semiconductor encapsulation application. © 1996 John Wiley & Sons, Inc.     

Adhesive and thermal characteristics of maleimide-functional novolac resins

A novel, addition-curable maleimide-functional novolac phenolic resin was evaluated for adhesive properties such as lap shear strength and T-peel strength using aluminium adherends, when thermally self-cured and cocured with epoxy resins. The adhesive properties of the self-cured resin, although inferior at ambient temperature, improved at high temperature and were found to depend on the cure conditions. When cocured with epoxy resin, the adhesive properties improved significantly and showed a strong dependence on the nature of the epoxy resin used, on the stoichiometry of the reactants, on the concentration of imide groups in the phenolic resin, and on the extent of polymerization of the maleimide groups. Optimum adhesive properties were obtained for novolac resins with a moderate concentration of maleimide groups, taken on a 1 : 1 hydroxyl–epoxy stoichiometry with a novolac epoxy resin. In comparison to the conventional novolac, the imide–novolac contributed to improved adhesion and better adhesive property retention at higher temperature when cured with the novolac–epoxy resin. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 695–705, 1999     

Synthesis and properties of novel phosphorus‐containing hardener for epoxy resins

A novel phosphorus‐containing curing agent, 2‐(6‐oxid‐6H‐dibenz〈c,e〉〈1,2〉oxa‐phosphorin‐6‐yl) phenol formaldehyde novolac [OD‐PN], was prepared from phenol formaldehyde novolac resin (PN) and a reactive 2‐(6‐oxid‐6H‐dibenz〈c,e〉〈1,2〉oxa‐phosphorin‐6‐yl)chloride (ODC) while ODC was synthesized through reaction between o‐phenylphenol and phosphoryl trichloride. The compound (OD‐PN) was used as a reactive flame‐retardant in o‐cresol formaldehyde novolac epoxy resin (CNE) for electronic application. Owing to the rigid structure of ODC and pendant P group, the resulted phosphorus containing epoxy resin exhibited better flame retardancy, higher glass transition temperature, and thermal stability than the noncyclic P‐containing curing agent or the bromine containing flame‐retardant epoxy resin. UL 94‐VO rating could be achieved with a phosphorus content of as low as 1.21% (comparable to bromine content of 6%) in the cured resin, and no fumes and toxic gas emission were observed. The relationship between the structure and flammability for both phosphorus containing curing agents OD‐PN and TP‐PN (triphenyl phosphate‐phenol formaldehyde novolac reaction product) are also examined. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 1636–1644, 2000     

Preparation and properties of biocomposites composed of sorbitol‐based epoxy resin,pyrogallol–vanillin calixarene,and wood flour

The reaction of pyrogallol (PG) and vanillin (VN), both of which are derived from plant resources, in the presence of p‐toluenesulfonic acid gave PG–VN calixarene (PGVNC) mainly composed of guaiacyl pyrogallol[4]arene. After sorbitol polyglycidyl ether (SPE) was mixed with PGVNC in tetrahydrofuran at an optimized epoxy/hydroxy ratio 1/2.65, the obtained SPE/PGVNC solution was mixed with wood flour (WF), prepolymerized at 150°C, and subsequently compressed at 190°C for 3 h to give SPE–PGVNC/WF biocomposites with WF content 0–20 wt%. The tan δ peak temperature of SPE–PGVNC was 148.1°C, which was much higher than that of the SPE cured with petroleum‐based phenol novolac (SPE–PN) at an optimized epoxy/hydroxy ratio 1/1. Although tan δ peak temperature slightly decreased with increasing WF content, the storage moduli of the SPE–PGVNC/WF biocomposites in the rubbery state at more than 150°C were much higher than those of SPE–PGVNC and SPE–PN. Also, the tensile modulus and strength for SPE–PGVNC/WF increased with increasing WF content. Field emission‐scanning electron microscopy analysis of the biocomposites revealed that WF is tightly incorporated into the crosslinked epoxy resins. POLYM. COMPOS., 2012. © 2012 Society of Plastics Engineers     

Curing of epoxy/novolac system modified with reactive liquid rubber and carbon filler

The curing behaviour of epoxy resins modified with reactive liquid rubber, using a novolac resin as a hardner was studied by means of differential scanning calorimetry in isothermal (100, 130 and 150 °C) and non-isothermal conditions (2, 5, 10 and 15 °C min^-1). The influence of carboxyl- (CTBN) and epoxy- (ETBN) terminated butadiene-acrylonitrile copolymers on the kinetic parameters and glass transition temperature (T_g) of cured epoxy systems was determined. The effect of grinded bituminous coal as an organic filler into epoxy network was also investigated. The carboxyl-end groups strongly enhanced the curing rate, in contrast to the epoxy-terminated rubber (ETBN) that had only a minor effect on the curing reactions. The presence of coal accelerated curing in its early stage. The T_g of completely cured epoxy was practically unaffected by the presence of carbon filler and reactive rubbers and was equal about 132 °C. The apparent curing activation energies were determined. A smaller activation energy was observed only for CTBN/epoxy/novolac system. The effect of reactive rubber and coal on the Charpy impact resistance of cured epoxy systems was also discussed.     

Synthesis and characterization of epoxy film cured with phosphorous‐containing phenolic resin

Through the electrophilic addition reaction of ? P(O)? H and C?C, a series of novel phosphorus‐containing phenolic resins bearing maleimide (P‐PMFs) were synthesized and used as curing agent for preparing high performance and flame retardancy epoxy resins. The structure of the resin was confirmed with FTIR and elemental analysis. Thermal properties and thermal degradation behaviors of the thermosetted resin was investigated by using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The epoxy resins exhibited high glass transition temperature (143–156°C), goof thermal stability (>330°C) and retardation on thermal degradation rates. High char yields (700°C, 52.9%) and high limited oxygen indices (30.6–34.8) were observed, indicating the resins' good flame retardance for the P‐PMFs/CNE cured resins. The developed resin may be used potentially as environmentally preferable products in electronic fields. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 3813–3817, 2007     

Study on a parameter to express glass‐forming relationship of phenolic–novolac resin

Chemoviscosity and glass‐forming ability of commercial phenolic–novolac resin are investigated at hexamethylenetramine (HMTA) curing agent content weight from 6 to 9%. We propose a parameter, M_k, which is based on chemoviscosity change rate and T_g0 of uncured liquid resin, to predict glass‐forming ability of the fully cured phenolic–novolac resin. It is found that M_k has a negative linear relationship with T_g∞, and the lower M_k represents the better glass‐forming ability of initial phenolic–novolac uncured liquid resin while the higher T_g∞ represents the better glass‐forming ability of fully cured resin. Further more, M_k establishes a kinetic glass‐forming relationship between liquid uncured and fully cured phenolic–novolac resin in terms of comparing with T_g∞. POLYM. COMPOS., 2012. © 2011 Society of Plastics Engineers     

Novel cycloaliphatic epoxy resins. II. Curing reaction with BF3MEA and its cured properties

The BF₃MEA curing reaction and the cured properties of novel cycloaliphatic epoxy resins (CE-resins), which were derived from an octadienyl compound, were studied. Gelation time and the DSC scan of the CE resins, with BF₃MEA hardener, proved that the reactivity of the CE resins is intermediate among the reactivities of the conventional resins; it was found that the CE resins react faster than DGEBA, but slower than the conventional cycloaliphatic epoxy resins. The pot life of the CE- (III) resin with BF₃MEA hardener proved to be over 30 days at a temperature of 20°C. The thermal properties are affected by the amount of BF₃MEA used and the curing conditions. CE-(III) showed the highest HDT of over 200°C with 2–3 phr of BF₃MEA. The flexural properties of CE-(I) proved to be flexible and tough. CE-(II) exhibited the highest strength and elongation, while CE-(III) had the same flexural properties as DGEBA. Furthermore, the blending of CE-(II) with DGEBA produced greater flexural strength and greater elongation than each original resin had. The thermal stability at elevated temperature and the water resistance of the cured CE resins proved to be inferior to those of DGEBA and novolac epoxy resin, probably due to the use of BF₃MEA. These results suggest the CE resin will provide a new application for a one-component curing system for composites. © 1993 John Wiley & Sons, Inc.     

Synthesis of a novel epoxy resin containing pyrene moiety and thermal properties of its cured polymer with phenol novolac

A new epoxy resin containing the pyrene moiety in the backbone (3) was synthesized and confirmed by gel permeation chromatography and field‐desorption mass spectroscopy and infrared spectroscopy. In addition, to evaluate the influence of the pyrene moiety on the structure, epoxy resins having an anthrylene moiety (5) and having a phenylene moiety (7) were synthesized. The cured polymer obtained through the curing reaction between 3 and phenol novolac was used for making a comparison of its thermal properties with those obtained from 5, 7, and bisphenol‐A (4,4′‐isopropylidenediphenyl)‐type epoxy resin (Bis‐EA). The cured polymer obtained from 3 showed a higher glass transition temperature, lower coefficient of linear thermal expansion, lower moisture absorption, and markedly higher anaerobic char yield at 700°C of 37.6 wt %, which might be attributed to the higher aromaticity of 3 containing the pyrene moiety. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 528–535, 2000