Effects of rare earth La on the microstructure and melting property of（Ag-Cu28）-30Sn alloys prepared by mechanical alloying

To obtain novel intermediate temperature alloy solders with a melting temperature of 400-600°C,nominal(Ag-Cu28)-30Sn alloys without or with a trace addition(0.5 or 1.0 wt.%) of rare earth(RE) element La were prepared by mechanical alloying.The aim of this research is to investigate the effects of the addition of La on the microstructures,alloying process and melting properties of(Ag-Cu28)-30Sn alloys.The results show that the addition of La produces no new phase.A trace amount of La addition can effectively refine the grain size,but the excessive addition of 1.0 wt.% La inhibits the alloying process.The influence of La on the melting temperatures of solder alloys is negligible.However,the trace addition of 0.5 wt.% La can distinctly reduce the fusion zone and improve the melting property of(Ag-Cu28)-30Sn alloys.     

The effect of nitrogen pressure on cathodic arc deposited NbN thin films

NbN thin films were deposited on non-standard grade high speed steel (HSS) (79.90 wt.% Fe, 0.71 wt.% C, 6.09 wt.% W, 4.52 wt.% Mo, 3.95 wt.% Cr, 1.82 wt.% Co, 1.75 wt.% V and a hardness of 65 HRC) using cathodic arc deposition at 0.125, 0.5, 1.0 and 1.5 Pa nitrogen pressures (P_N2), with a bias voltage of − 150 V. X-ray diffraction (XRD), Scanning Electron Microscope (SEM), Nanoindentation and Rockwell C analysis were used to characterize the thin films in order to identify the NbN phases and to investigate the influence of P_N2 on mechanical properties. Hexagonal β-Nb₂N, ε-NbN and δ′-NbN_0.95 are identified in XRD analysis. Hardness values derived by nanoindentation technique are 20 GPa for β-Nb₂N, ε-NbN and 40 GPa for δ'-NbN_0.95. Due to the complexity of phase system special attention was focused on identification of NbN phases by deconvolating the XRD peaks especially at 0.5 Pa in which both ε-NbN and β-Nb₂N were found. Rockwell C analysis revealed that the film adhesion is found to be poor at lower P_N2, due to the brittle nature of β-Nb₂N.     

Effects of phosphorus addition on the magnetic properties of sintered Fe-50 wt.% Ni alloys

Phosphorus was added to Fe-50 wt.% Ni in the form of a coated composite powder via an electroless plating process. Addition of phosphorus to Fe-50 wt.% Ni facilitated increases in density and grain size, both of which were beneficial to magnetic performance. Because of the homogeneous distribution of phosphorus in the powder, the optimal phosphorus addition was much lower than for those using Fe₃P as the phosphorus precursor. The optimal phosphorus addition was close to its maximum solubility in Fe-50 wt.% Ni (about 0.5 wt.%), above which precipitation of excessive phosphorus in the form of iron nickel phosphide, (Fe,Ni)₃P, effectively degraded the magnetic properties of Fe-50 wt.% Ni. Without the addition of phosphorus, good magnetic properties could be achieved only when the sintering temperature was high enough (>1200 °C) to result in a high sintered density and large grains in the sintered structure.     

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu₆Sn₅, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu₆Sn_5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu₆Sn₅ intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness.     

TiB2-SiC粉末喷雾造粒及其等离子喷涂沉积机理研究

利用喷雾干燥对TiB_2-SiC复合粉末进行造粒,研究了浆料固含量、粘结剂含量及SiC含量对喷雾干燥粉体颗粒形貌等的影响。采用大气等离子喷涂技术,以抛光的石墨为基体,在不同预热温度和不同喷距下对TiB_2-SiC粉末进行粒子收集,研究不同工艺参数对TiB_2-SiC粒子铺展形貌的影响,并制备了TiB_2-SiC涂层。结果表明:当浆料固含量为50%,粘结剂含量为5%,SiC含量为10%时,喷雾造粒获得球形度高、流动性好的TiB_2-SiC粉末;随着基体预热温度的升高,喷距的增大,扁平粒子的溅射逐渐减弱,形成规则的圆盘状粒子;在等离子焰流作用下,TiB_2-SiC粒子熔化加速并与基体发生碰撞,熔融粒子扁平化,急速冷却凝固,不断堆叠、搭接为宏观涂层。     

Thermoelectric properties of p-type (Bi,Sb)2Te3 alloys fabricated by the hot pressing method

P-type (Bi_0.25Sb_0.75)₂Te₃ powders were fabricated by melting/grinding and mechanical alloying processes. Thermoelectric properties of the hot-pressed (Bi_0.25Sb_0.75)₂Te₃ were characterized with the powder processing method, powder size, hot pressing temperature, and the amount of excess-Te dopant. Specimens fabricated by melting/grinding exhibited lower Seebeck coefficient, lower electrical resistivity and higher thermal conductivity, compared to the specimens prepared by mechanical alloying. 3 wt.% excess Te-doped (Bi_0.25Sb_0.75)₂ Te₃, fabricated by melting/grinding and hot pressing at 550°C, exhibited a figure-merit of 3.2 x 10^-3/K. For 1 wt.% excess Te-doped specimen prepared by mechanical alloying and hot pressing at 550°C, a figure-merit of 3.05 x 10^-3/K was obtained.     

Influence of silver addition on the microstructure and mechanical properties of squeeze cast Mg-6Al-1Sn-0.3Mn-0.3Ti

In this study, the effect of silver (0, 0.2, 0.5, and 1 wt.%) on the microstructure and mechanical properties of a magnesium-based alloy (Mg-Al 6 wt.%-Sn 1 wt.%-Mn 0.3 wt.%-Ti 0.3 wt.%) were investigated. The alloys were produced under a controlled atmosphere by a squeeze-casting process. X-ray diffractometry revealed that the main phases are α-Mg, α-Ti, β-Mg₁₇Al₁₂ and Al₈Mn₅ in the all of alloys. In addition to, Al₈₁Mn₁₉ phase was found with Ag additive. Besides, the amount of β-Mg₁₇Al₁₂ phase was decreased with increasing the amount of Ag. The strength of the base alloy was increased by solid solution mechanism and decreasing the amount of β-Mg₁₇Al₁₂ phase with addition of Ag. Furthermore, existence of Al₈₁Mn₁₉ phase can be acted an important role in the increase on the mechanical properties of the alloys.     

Processing,microstructure and mechanical properties of HfB2-ZrB2-SiC composites: Effect of B4C and carbon nanotube reinforcements

The fully dense HfB₂-ZrB₂-SiC composites were processed using spark plasma sintering (SPS) at 1850 °C. The effect of reinforcements (B₄C and CNT) on the densification as well as mechanical properties were investigated and compared (with monolithic) in the present study. The study showed that the addition of B₄C and CNT were not only beneficial for the densification but also towards enhancing the mechanical properties (hardness, elastic modulus, and fracture toughness) of HfB₂-ZrB₂-SiC composites. The augmentation in the mechanical properties establish the synergy between solid solution formation (with the equimolar composition of HfB₂/ZrB₂) and the reinforcements (SiC, B₄C, and CNT). The highest increase in the indentation fracture toughness with the reinforcements of B₄C as well as CNT is >3 times (~13.8 MPam^0.5 when it is 3–4 MPam^0.5 for monolithic ZrB₂/HfB₂) on HfB₂-ZrB₂-SiC composites, which is attributed to the crack deflection and pull-out mechanisms. An increase in the analytically quantified interfacial compressive residual stresses in the composites during SPS processing with the synergistic addition of reinforcements (SiC, B₄C, and CNT) and its effect on the indentation fracture toughness has also been addressed.     

Deposition of diamond/β-SiC nanocomposite films onto a cutting tool material

The motivation behind depositing nanocrystalline diamond/β-SiC composite thin films onto a cutting tool material is not only to obtain films having a whole range of combined properties of the components but also to enhance their fracture toughness without compromising on the hardness aspect. Nanocrystalline diamond composites are expected to behave differently owing to the large volume of grain boundaries. With smooth surface morphology and improved adhesion, diamond/β-SiC nanocomposite film system may not only serve as a separate film system but may also serve as an interlayer for the further deposition of adherent diamond top layers with regard to cutting tool applications. In this paper we report the deposition of nanocrystalline diamond/β-SiC composite thin films onto WC-6 wt.% Co substrates by employing microwave plasma chemical vapor deposition (MWCVD) technique using gas mixtures of H₂ and CH₄ and tetramethylsilane [TMS, Si(CH₃)₄]. Scanning electron microscopy (SEM), glancing angle X-ray diffraction (GIXRD), energy-dispersive X-ray (EDX), micro Raman scattering and Fourier transform infrared (FTIR) spectroscopic analyses have been carried out to characterize the microstructure and composition of the deposited films. The microstructure of the composite films constitutes a phase mixture of nanometer sized diamond and β-SiC grains. By adjusting TMS gas flow during deposition, β-SiC content in the nanocomposite films can be controlled. This aspect was utilized to successfully realize diamond/β-SiC nanocomposite gradient films with diamond top layers on the hard metal substrates in a single process step.     

回转窑内渣成分优化实现锌铅元素的高效回收（英文）

在回转窑内从高硅锌浸出渣中实现高效回收锌铅金属。XRD、SEM、EDS及ICP表征结果表明,浸出渣含12.4%SiO₂、16.1%Zn和7.4%Pb(质量分数)。热力学分析表明,在回转窑内1150～1250℃的冶炼环境下,锌浸出渣中极易产生锌和铅的金属蒸气。通过分析13种冶金渣成分的黏度及熔点,发现3种渣成分(47%SiO₂-23%CaO-30%FeO、40%SiO₂-28%CaO-32%FeO、40%SiO₂-30%CaO-30%FeO,质量分数)具有合适的物理特性,即熔点和黏度分别为1150～1280℃和0.2～0.5 Pa·s。工业实验表明,采用优化的渣成分,锌和铅的回收率分别高达97.3%和94.5%,冶炼后渣内锌和铅的含量分别低至0.51%和0.45%(质量分数)。水淬渣的国标浸出实验表明,浸出液中含1.82 mg/L Zn、～0.01 mg/L Cu、0.0004 mg/L As、～0.01 mg/L Cd、0.08 mg/L Pb和～0.02 mg/L Hg,证实锌浸出渣同步实现无害化...     

Effect of annealing on mechanical properties of silicon carbide sintered with aluminum nitride and scandium oxide

Beta-SiC powder samples containing 1 wt.% α-SiC as a seed and 10 vol.% AlN-Sc₂O₃ as a sintering additive were hot-pressed at 1900 °C for 1 h and subsequently annealed at 2000 °C for 1 h, 3 h and 6 h. When the annealing time was increased, the microstructure changed from equiaxed to elongated grains, which resulted in a self-reinforced microstructure consisting of elongated grains (hexagonal platelet grains in 3-dimensions). The development of a self-reinforced microstructure resulted in significant improvement in toughness. However, the improved toughness was offset by a reduction in strength. The typical fracture toughness and strength of the ceramics annealed for 6 h were 7.3 MPa·m^1/2 and ∼500 MPa, respectively.     

Investigation on addition of talc on sintering behavior and mechanical properties of B4C

The effect of high alumina talc powder as a sintering aid on densification of boron carbide powder was investigated. The in situ reaction of talc with boron carbide generate SiC, MgB₂, and alumina, which all aid the sintering process and permit pressureless sintering at temperatures between 2050 and 2150°C. The microstructure-property relationship has been studied in the B₄C-talc system for talc content between 0 and 30 wt.%. It became clear the addition of talc powder has a significant effect on the sintering behavior of B₄C. B₄C composites along with talc powder additions were sintered up to 98% of theoretical density. The mechanical properties were improved over those of samples without talc addition.     

制造配方和工艺对β-SiC油石物理性能影响的研究

本文通过大量的对比实验,以吸水率、气孔率、体积密度为检测指标,采用单一变量原则得出β-SiC油石配方的最佳原料配比和工艺参数.即当β- SiC为10.0g时,最佳精萘添加量为1.2g,钾长石添加量为1.0g,糊精添加量为0.9g,高岭土添加量为0.6g,玻璃粉添加量为0.5g；最佳成型压力为30MPa,最佳烧结温度为1...     

Effect of chromium and carbon contents on the sintering of WC-Fe-Ni-Co-Cr multicomponent alloys

WC-Fe-Ni-Co-Cr cemented carbides have been obtained by liquid phase sintering from WC-Fe-Ni-Co-Cr₃C₂ powder mixtures. Taking the 40wt%Fe-40wt%Ni-20wt.%Co alloy as a reference, new binder phases has been prepared by introducing controlled amounts of Cr and C, via Cr₃C₂ and C black powders respectively. As described for WC-Co-Cr materials, Cr additions are observed to reduce the eutectic temperatures of the WC-Fe-Ni-Co system. First liquids detected on heating exhibit wide temperature melting ranges, which become narrower and are displaced to higher temperatures on repeated heating and cooling cycles. Apart from the decarburization associated to the carbothermal reduction of powder oxides, this phenomenon could be also associated to the homogeneization of the chemical composition of these multicomponent binder phases, which is faster as C content decreases. Correlation between experimental melting and solidification temperature ranges and those predicted by Thermocalc® is better as Cr content increases. Experimental C windows, defined in this work by the absence of free C or η phases, are located at C contents higher than those estimated by Thermocalc®. Although the 40wt.%Fe-40wt.%Ni-20wt.%Co alloy is austenitc, BCC phases are partially stabilized at low C and high Cr contents. Although these compositions are free from η phases or free C, a precipitation of Cr-rich carbides is found at the WC-metal interface. These precipitates are not observed in the alloy with 0.75 wt% Cr (i.e. 5 wt% of the nominal metal content) and 5.39 wt%C. This C content is 0.17 wt% higher than that predicted for precipitation of M₇C₃.     

Slurry based multilayer environmental barrier coatings for silicon carbide and silicon nitride ceramics — II. Oxidation resistance

In part I of this study, the dip-coat processing of mullite/gadolinium silicate (Gd₂SiO₅) environmental barrier coatings (EBCs) applied on α-SiC and SN282™ Si₃N₄ through alcohol based and sol based slurries was presented. Here, the performance of selected EBCs by evaluating their oxidation resistances during thermal cycling in simulated combustion (90% H₂O-balance O₂) environment between 1350 °C and RT for up to 400 cycles is being reported. Oxidation of un-coated α-SiC was severe, leading to aligned and layered porous silica scale formation (~ 17 μm thick) on its surface with frequent scale spallation when exposed to 100 cycles. Mullite/Gd₂SiO₅/B₂O₃ (83.5/11.5/5 wt.%) EBCs remained adherent to α-SiC substrate with an underlying porous silica layer formed at substrate/coating interface, which was ~ 12 μm after 100 cycles, ~ 16 μm after 200 cycles, and ~ 25 μm after 400 cycles. In contrast, α-SiC substrate coated with mullite/Gd₂SiO₅ (88/12 wt.%) EBC had only limited oxidation of ~ 10 μm even after 1350 °C/400 cycles. The sol based mullite/Gd₂SiO₅ (88/12 wt.%) EBC on α-SiC substrate after 400 cycles was adherent, but showed more interfacial damages (~ 20 μm after 400 cycles) though it had increased coating density. However, the mullite/Gd₂SiO₅ (88/12 wt.%) EBC (alcohol based) delaminated from the SN282™ Si₃N₄ substrate after 1350 °C/100 cycles, because of the formation of interconnected interfacial voids and hairline cracks. Parabolic growth kinetics for the underlying silica was observed for both the alcohol and sol based coated samples.     

Effect of molybdenum and chromium on hardenability of low-carbon boron-added steels

The hardenability of low-carbon boron-added steels containing molybdenum or chromium was studied using dilatometry, thermodynamic calculations, and secondary ion mass spectroscopy (SIMS). The combined addition of boron and molybdenum was found to be more effective than that of boron and chromium in enhancing the hardenability of boron-added steels. In particular, the addition of 0.5 wt.% molybdenum to the boron-added steel almost completely suppressed the formation of polygonal ferrite even at a slow cooling rate of 0.5°C/s. The synergistic effect of the combined addition of molybdenum and boron is thought to be due to both the suppression of M₂₃(C,B)₆ precipitation resulting from the deterioration of phase stability and the reduction of carbon diffusivity by the molybdenum addition.     

超音速大气等离子喷涂TiB2-SiC涂层的抗氧化性及耐熔盐腐蚀性能

采用超音速大气等离子喷涂制备全包覆TiB₂-SiC涂层,研究了TiB₂-SiC涂层在400和800 ℃的氧化性能,并探究其氧化机理。对TiB₂-SiC涂层在900 ℃下的抗铝熔盐腐蚀性能进行研究,并探讨其耐熔盐腐蚀机理。结果表明,超音速大气等离子喷涂制备的TiB₂-SiC涂层具有良好的抗氧化性,在400 ℃的氧化速率常数为1.92×10^-5 mg²·cm^-4·s^-1,在800 ℃的氧化速率常数为1.82×10^-4 mg²·cm^-4·s^-1。超音速大气等离子喷涂制备的TiB₂-SiC涂层在900 ℃下具有良好的抗熔盐腐蚀性能,熔盐腐蚀后TiB₂-SiC涂层都保持致密结构,未发生涂层的开裂及剥落。     

Effect of Ca on microstructure and high temperature creep properties of AM60-1Ce alloy

A series of AM60-1Ce-xCa(x=0, 0.5, 1.5, 2.5) magnesium alloys were prepared by gravity casting method and analyzed by means of XRD, DSC and SEM. The effects of Ca on normal temperature mechanical properties and high temperature creep behavior of alloys were characterized by tensile and constant creep test.Microstructure analysis indicated that Ca was preferentially combined with Al in the alloy to form the high melting point Al_2Ca phase at the grain boundary. The addition of Ca can refine the crystal grains and reduces the content of β-Mg_(17)Al_(12) phase. With the increase of Ca content in the alloy, Al_2Ca phases at the grain boundary gradually changed to the network of lamellar structure, and replaced the β-Mg_(17)Al_(12) phase as the main strengthening phase gradually. The creep resistance of the alloy continuously increases because the high-temperature stable phase Al_2Ca firmly nailed at grain boundaries impedes the sliding of grain boundaries. However, when the addition of Ca was more than 1.5%, mechanical properties of the alloy started to decrease, which was probably due to the large amount of irregularly shaped Al_2Ca phases at the grain boundary. Experimental results show that the optimal addition amount of Ca is 1.5 wt.%.     

Improving the surface hardness and wear resistance of Ti3SiC2 by boronizing treatment

In order to modify surface properties of Ti₃SiC₂, boronizing was carried out through powder pack cementation in the 1100-1400 °C temperature range. After boronizing treatment, one mixture layer, composed of TiB₂ and β-SiC, forms on the surface of Ti₃SiC₂. The growth of the coating is processed by inward diffusion of boron and obeys a linear rule. The boronizing increases the hardness of Ti₃SiC₂ from 3.7 GPa to a maximal 9.3 GPa and also significantly improves its wear resistance.     

Minor Ga addition to effectively inhibit PdSn4 growth between Sn solder and Pd substrate

PdSn₄ is the major reaction phase in the Sn-based or Sn–Ag–Cu solder joints with Pd substrate and it exhibits an extremely high growth rate. Ga is considered as a candidate alloying element in the Sn–Ag–Cu solders. This paper investigates the effects of Ga addition on the interfacial reactions between Pd and Sn–Ga (0.1wt.%–1wt.%Ga) solders by solid-state aging at 160, 180, and 200 °C and liquid-state aging at 250 °C. The most important finding is that minor Ga addition can effectively inhibit the fast PdSn₄ growth. In the solid-state reaction, with only 0.1wt.%Ga addition, the PdSn₄ growth was suppressed by ∼50%, compared with the pure Sn/Pd reaction. When the Ga content increased to 0.5wt.%, the PdSn₄ growth was further reduced by over 90%. In addition, a thin PdGa phase layer was formed at the interface between PdSn₄ and Pd, which was the main cause for the inhibition of PdSn₄ growth. The growth kinetics was systematically explored. The PdSn₄ growth had a higher activation energy for the higher Ga addition (>0.5wt.%). Furthermore, a similar reduction in the PdSn₄ growth was observed in the liquid-state reaction, but it was not as strong as in the solid-state reactions. The PdGa phase was not formed in the liquid-state reaction and the growth inhibition could be attributed to the Ga doping in the PdSn₄ lattice to retard the Sn diffusion.