富银的Ag—Au合金再结晶

用示差扫描量热（ＤＳＣ）硬度测量等方法研究了无限互溶系统的Ａｇ－Ａｕ合金在Ａｕ含量小于５ｗｔ．％，溶质Ａｕ及不同变形量对该合金再结晶温度Ｔｒ的影响，并与有限固溶系统Ａｇ－Ｃｕ合金进行了比较，结果表明：Ａｕ对基体Ａｇ的再结晶有一定障碍作用，但与Ｃｕ相比，这种作用小得多，变形量越大，Ａｇ－Ａｕ合金的再结晶温度越低，讨论了Ａｇ－Ａｕ合金的再结晶表现激活能，激活能随Ａｕ含量的变化与Ａｕ含量对再结晶温度的影     

高纯Ag和Ag—RE合金的回复与再结晶

研究了随不同冷变形量的高纯Ａｇ（９９．９９９％）和含有痕量稀土元素Ｃｅ（２１ｐｐｍ）,Ｅｕ（１６ｐｐｍ）,Ｇｄ（２０ｐｐｍ）的Ａｇ－ＲＥ合金在２３℃和５０℃的回复过程中力学性能,电学性能,晶格畸变等性能的变化。Ｃｅ,Ｆｕ具有明显抑制纯Ａｇ回复软化的作用并提高再结晶温度１５－３０℃;Ｇｄ和Ａｇ再结晶温度的影响及对抑制回复软化的作用甚小。痕量稀土Ｃｅ,Ｅｕ添加剂降低回复速率常数和提高回复激活能。     

Ag—Cu纳米合金的微观结构

利用高分辨电镜（ＨＲＥＭ）对气相凝聚法制备的Ａｇ１－ｘＣｕｘ（０．０５≤ｘ≤０．４０）纳米合金样品中的微观结构进行了研究．结果表明，在所有合金样品中，都没有观察到明显的界面亚稳相的形成，且晶界具有有序的原子结构样品中两组元的等轴纳米晶粒分布均匀，但随着Ｃｕ含量的增加，Ｃｕ颗粒出现明显的偏聚和粗化；与稳定相相比，富Ａｇ和富Ｃｕ相的点阵常数没有发生显著的变化．     

Ag-Cu-Si合金的熔化特性

用ＤＴＡ 法测定Ａｇ － Ｃｕ － Ｓｉ 合金中（ＣｕＡｇｘ）１００ － ｙ － Ｓｉｙ（ｘ ＝ １０ ， ２０ ， ３０ ， ４０ ， ５０ ，７２） 及（ＣｕＳｉ５） － Ａｇ ７ 个特定成份伪二元系的固相线、液相线。结果表明， Ｓｉ 含量对Ａｇ － Ｃｕ合金液相线温度及熔化间隔Δｔ 的影响是显著的。在研究的Ｓｉ 名誉含量０ ～１０ｗｔ％ ， 其液相线呈“Ｖ”型变化。Δｔ 值小对于钎料合金选择和降低Ａｇ 含量是有利的     

AgCu合金的内氧化行为

用ＴＧＡ，ＯＭ、ＳＥＭ和ＨＲＥＭ等方法研究了Ｃｕ含量不同的几种ＡｇＣｕ合金在７５０℃及８５０℃的内氧化行为。发现氧化１２ｈ后，Ａｇ－０．８ａｔ％Ｃｕ合金中的Ｃｕ已完全以ＣｕＯ颗粒析出；     

微量硅对Ag—Cu—Pd合金钎焊特性的改进

研究了０．３０￣１．０ｗｔ％Ｓｉ对Ａｇ－２０Ｃｕ－１５Ｐｄ钎料合金钎焊特性之影响，指出：微量Ｓｉ降低其固相线，液相线温度并使其固－液相线间隔变窄。Ｓｉ的添加还提高了Ａｇ－Ｃｕ－Ｐｄ合金在母材Ｆｅ－Ｎｉ－Ｃｏ上的铺展性。     

Ag-P-Cu钎料中Ag的作用分析

普遍认为Ａｇ－Ｐ－Ｃｕ钎料中Ａｇ元素的添入在使钎焊工艺性能提高的同时，可以直接改善钎料和钎焊接头的塑性，然而，本文的研究分析表明：Ａｇ元素的作用是在保持Ａｇ－Ｐ－Ｃｕ钎料钎焊工艺性能良好的条件下，须通过降低Ｐ的含量，减少脆性相Ｃｕ３Ｐ的数量，才能达到改善塑性的目的。     

钴对Ag—Cu—Pd合金钎料性能的影响

研究结果表明,在Ａｇ－Ｃｕ－Ｐｄ合金钎料中添加０．２－１．０ｗｔ％Ｃｏ后,对钎料的物理性能,电学性能以及力学性能无明显影响,但对ＢＡｇ６５ＣｕＰｄ钎料在某些母材上过度的铺展性确有显著地抑制作用,Ａｇ６５Ｃｕ２０Ｐｄ１５－ｘＣｏｘ钎料可以部分地取代电子器件中的金基纤料。     

Ag－Cu纳米合金的微观结构

利用高分辨电镜（ＨＲＥＭ）对气相凝聚法制备的Ａｇ１－ｘＣｕｘ（０．０５≤ｘ≤０．４０）纳米合金样品中的微观结构进行了研究．结果表明，在所有合金样品中，都没有观察到明显的界面亚稳相的形成，且晶界具有有序的原子结构样品中两组元的等轴纳米晶粒分布均匀，但随着Ｃｕ含量的增加，Ｃｕ颗粒出现明显的偏聚和粗化；与稳定相相比，富Ａｇ和富Ｃｕ相的点阵常数没有发生显著的变化．     

Ni对Sn96.5Ag3.5/Cu之间扩散行为的阻挡作用

研究了电镀Ｎｉ层和化学镀Ｎｉ－Ｐ合金层对Ｓｎ－Ａｇ／Ｃｕ焊点扩散行为的影响,电子探针分析表明,化学镀Ｎｉ－Ｐ合金层能很好地阻止Ｓｎ－Ａｇ／Ｃｕ焊点在焊接过程中的ＣｕＳｎ互扩散和相互反应;而电镀Ｎｉ层则不能阻止Ｓｎ－Ａｇ／Ｃｕ焊点过程中的Ｃｕ,Ｓｎ互搁工用和相互反应,界面反应产物以Ｃｕ６Ｓｎ５为主。应用化学镀Ｎｉ－Ｐ合金作为Ｓｎ－Ａｇ／Ｃｕ之间的扩散阻挡层可大大减少Ｓｎ／Ｃｕ金属间化合物的生成,有得     

Yb微合金化对Al-Zn-Mg-Cu-Zr合金再结晶行为和性能的影响

采用铸锭冶金法制备了含Yb的Al-Zn-Mg-Cu-Zr合金.通过对硬度、电阻率、强度、应力腐蚀性能的测试和用金相显微镜和透射电镜的观察,分析了Yb微合金化对Al-Zn-Mg-Cu-Zr合金再结晶行为和性能的影响.结果表明,在Al-Zn-Mg-Cu-Zr合金中添加微量Yb能形成含Yb的细小弥散相,因此提高T6态合金的再结晶温度,显著提高合金的应力腐蚀抗力和断裂韧性,并略微提高合金的强度和塑性.这些均匀分布于基体上的弥散相能强烈钉扎位错和亚晶界,抑制了再结晶形核,显著抑制了基体再结晶,保持形变回复组织.     

经形变热处理铜基形状记忆合金的晶粒生长、形状记忆和腐蚀行为

比较研究了Cu-11．8％Al-3．7％Ni-1％Mn和Cu-11％A1—5．6％Mn形状记忆合金（SMAS）的形状记忆、腐蚀性能。采用光学显微镜（0M）、扫描电子显微镜（SEM）、差示扫描量热法（DSC）、动电位极化、弯曲和拉伸试验,研究了晶粒细化对这些性能的影响。在800。C退火时,在首先的15S内静态再结晶和动态晶粒长达显示出一个快速的再结晶过程,随后才是晶粒生长。退火15S后得到的Cu—A1—Ni-Mn和Cu-Al—Mn合金的最小晶粒尺寸分别为90gm和260pm。拉伸试验表明2种合金呈现典型的三阶段曲线,由此可以看出,晶粒细化后合金具有高的断裂应力和应变。显微组织表明,Cu—Al-Ni—Mn合金中存在锯齿状的所马氏体形态,通过差示扫描量热法也证实了所和rf共存于Cu—A1-Mn合金中。评估了形变热处理前、后及800℃退火15min,随后进行水淬的合金的形状记忆性能。另外,采用动电位极化法分析了晶粒细化后合金的腐蚀行为。结果表明,铜溶解过程中主要为阳极反应,Cu—Al—Ni—Mn合金比Cu—A1-Mn合金具有更好的耐腐蚀性。     

稀土元素对Pd的再结晶特性之影响

用半硬度法和金相观察测定了Pd与若干Pd-RE合金的再结晶温度,用图象法测定了上述合金的再结晶晶粒度。试验结果表明,所有稀土元素明显提高Pd的再结晶温度和细化晶粒,并计论相关的机制。     

微量Zr对Cu—13Zn合金组织和性能的影响

制备了Ｚｒ 含量不同的三种ＣｕＺｎ 合金, 通过拉伸力学性能测试、金相和电镜观察, 研究了微量Ｚｒ 对合金组织和性能的影响。结果表明, 微量Ｚｒ 对合金有明显的强化和提高退火过程中抗软化温度的作用; 微量Ｚｒ 引起的强化来源于再结晶晶粒细化强化, 含Ｚｒ 的第二相析出强化和亚结构强化３个方面。     

工业7N01合金的显微组织、力学性能及腐蚀性能

通过透射电子显微镜(TEM)和配备电子背散射衍射(EBSD)的扫描电子显微镜(SEM)研究晶粒形貌和析出相对两种工业7N01合金的力学性能和腐蚀行为的影响.7N01-I合金外表面再结晶度低于7N01-II合金.两种合金的强化相均为η'相.7N01-I合金的晶界析出相(GBPs)断续分布,而7N01-II合金的晶界析出相...     

Effect of Yb additions on microstructures and properties of 7A60 aluminum alloy

Al-Zn-Mg-Cu-Zr alloys containing Yb were prepared by cast metallurgy. Effect of 0.30% Yb additions on the microstructure and properties of 7A60 aluminum alloys with T6 and T77 aging treatments was investigated by TEM, optical microscopy, hardness and electric conductivity measurement, tensile test and stress corrosion cracking test. The results show that the Yb additions to high strength Al-Zn-Mg-Cu-Zr aluminum alloys can produce fine coherent dispersoids. Those dispersoids can strongly pin dislocation and subgrain boundaries, which can significantly retard the recrystallization by inhibiting the nucleation of recrystallization and the growth of subgrains and keeping low-angle subgrain boundaries. Yb additions can obviously enhance the resistance to stress corrosion cracking and the fracture toughness property, and mildly increase the strength and ductility with T6 and T77 treatments.     

Study of the recrystallization process of AlMgSi alloys containing transition elements

The addition of small amounts of the transition elements such as Zr, Mn and Cr, which have a low solubility in the α-aluminium solid solution and thus form dispersoids, to AlMgSi alloys showed that these elements inhibit recrystallization when the alloys are pre-heated prior to deformation. The formation of coarse particles during casting is mainly due to the presence of Fe. This type of particles found, even, in solution treated samples. The particles, with a diameter exceeding 3 μm, accelerate the recrystallization as they provide good sites for nucleation of recrystallization. Precipitate free zones (PFZ's) developed around the coarse particles favour nucleation of recrystallization by subgrain growth. The presence of dispersoid particles is found to shift the recrystallization energy peak towards higher temperatures. Intermediate annealing before deformation allowed to achieve a high rate of deformation by cold rolling due to the removal of the solute from the matrix by the formation of the hardening phases. Optical and transmission electron microscopy, hardness measurements and differential scanning calorimetry (DSC) were used to study the kinetics of precipitation and recrystallization of the AlMgSi alloys.     

Filiform corrosion of AA3005 aluminium analogue model alloys

The effect of the metal substrate microstructure on filiform corrosion (FFC) susceptibility was investigated for super purity based model alloys with compositions based on the specifications of AA3005. Variations in alloying levels of the elements iron, silicon and copper were investigated. Alloys with high silicon content were more susceptible to FFC than alloys with low silicon content. The iron content, at the levels investigated, did not strongly affect FFC properties. The apparent detrimental effect of a high silicon content is attributed to the influence of silicon on secondary intermetallic particle precipitation. Given the same thermo-mechanical treatment, alloys with high silicon content underwent more extensive secondary precipitation of manganese containing intermetallic particles than those alloys with a low silicon content. The resulting microstructure is characterised by a higher density of finely dispersed intermetallic particles and a lower content of manganese in the adjacent supersaturated solid solution. These conditions provide a large number of potential corrosion initiation sites on the surface and also enhance microgalvanic coupling between intermetallic particles and the surrounding aluminium rich matrix, thus promoting the propagation of filamental corrosion attacks. Additions of copper had a detrimental effect on the FFC resistance. The role of copper in promoting FFC is attributed to preferential dissolution phenomena during the corrosion process, whereby copper is locally enriched on the corroding surface. This copper enrichment provides additional area for cathodic reaction, thus enhancing the corrosion process.     

Effects of annealing process on electrical conductivity and mechanical property of Cu-Te alloys

1 Introduction Pure copper and copper alloys are widely used due to the high electrical conductivity, high heat transfer, corrosion resistance and excellent formability[1-5]. But the strength of pure copper is low and the strength gained during cold worki…