Test Scheduling of NoC‐Based SoCs Using Multiple Test Clocks

Network‐on‐chip (NoC) is an emerging design paradigm intended to cope with future systems‐on‐chips (SoCs) containing numerous built‐in cores. Since NoCs have some outstanding features regarding design complexity, timing, scalability, power dissipation and so on, widespread interest in this novel paradigm is likely to grow. The test strategy is a significant factor in the practicality and feasibility of NoC‐based SoCs. Among the existing test issues for NoC‐based SoCs, test access mechanism architecture and test scheduling particularly dominate the overall test performance. In this paper, we propose an efficient NoC‐based SoC test scheduling algorithm based on a rectangle packing approach used for current SoC tests. In order to adopt the rectangle packing solution, we designed specific methods and configurations for testing NoC‐based SoCs, such as test packet routing, test pattern generation, and absorption. Furthermore, we extended and improved the proposed algorithm using multiple test clocks. Experimental results using some ITC’02 benchmark circuits show that the proposed algorithm can reduce the overall test time by up to 55%, and 20% on average compared with previous works. In addition, the computation time of the algorithm is less than one second in most cases. Consequently, we expect the proposed scheduling algorithm to be a promising and competitive method for testing NoC‐based SoCs.     

Design of reconfigurable access wrappers for embedded core based SoC test

Testing of embedded core based system-on-chip (SoC) ICs is a well known problem, and the upcoming IEEE P1500 Standard on Embedded Core Test (SECT) standard proposes DFT solutions to alleviate it. One of the proposals is to provide every core in the SoC with test access wrappers. Previous approaches to the problem of wrapper design have proposed static core wrappers, which are designed for a fixed test access mechanism (TAM) width. We present the first report of a design of reconfigurable core wrappers which allow for a dynamic change in the width of the TAM executing the core test. Analysis of the corresponding scheduling problem indicates that good approximate schedules can be achieved without significant computational effort. Specifically, we derive a O(N/sub C//sup 2/B) time algorithm which can compute near optimal SoC test schedules, where N/sub C/ is the number of cores and B is the number of top level TAMs. Experimental results on benchmark SoCs are presented which improve upon integer programming based methods, not only in the quality of the schedule, but also significantly reduce the computation time.     

SoC测试结构复用技术研究

在设计基于IP模块的SoC同时,必须引入可测性设计以解决SoC的测试问题.为了简化SoC中的可测性设计的工作,本文设计了一种新型测试结构复用技术,通过分析SoC内部的各种测试应用情况,实现了一个兼容IEEE1149.1标准的通用测试访问逻辑IP.在运动视觉SoC中的应用以及仿真结果验证了这种测试复用结构的有效性,并有助于提高SoC的测试覆盖率.     

Low-Area Wrapper Cell Design for Hierarchical SoC Testing

System-on-chip (SoC) integrated circuits are designed and fabricated with multiple levels of hierarchy. However, most previous works on wrapper design, test access mechanism optimization and test scheduling did not take care of the hierarchy properly, thus the corresponding test schedules were often invalid for SoCs with hierarchical cores. We propose a low-area wrapper cell design which can treat SoCs with hierarchy properly and allows simultaneous testing of parent and child cores. The proposed cell uses 13%∼23% less area than a recently proposed cell design in equivalent gate count. As a result we achieve up to 21% area reduction for hierarchical ITC ’02 SoCs compared to the most recently proposed designs.     

Testing for Interconnect Crosstalk Defects Using On-Chip Embedded Processor Cores

In deep-submicron technologies, long interconnects play an ever-important role in determining the performance and reliability of core-based system-on-chips (SoCs). Crosstalk effects degrade the integrity of signals traveling on long interconnects and must be addressed during manufacturing testing. External testing for crosstalk is expensive due to the need for high-speed testers. Built-in self-test, while eliminating the need for a high-speed tester, may lead to excessive test overhead as well as overly aggressive testing. To address this problem, we propose a new software-based self-test methodology for system-on-chips (SoC) based on embedded processors. It enables an on-chip embedded processor core to test for crosstalk in system-level interconnects by executing a self-test program in the normal operational mode of the SoC, thereby allowing at-speed testing of interconnect crosstalk defects, while eliminating the need for test overhead and the possibility of over-testing. We have demonstrated the feasibility of this method by applying it to test the interconnects of a processor-memory system. The defect coverage was evaluated using a system-level crosstalk defect simulation method.     

Wafer-Level Modular Testing of Core-Based SoCs

Product cost is a major driver in the consumer electronics market, which is characterized by low profit margins and the use of core-based system-on-chip (SoC) designs. Packaging has been recognized as a significant contributor to the product cost for such SoCs. To reduce packaging cost and the test cost for packaged chips, wafer-level testing (wafer sort) is used in the semiconductor industry to screen defective dies. However, since test time is a major practical constraint for wafer sort, even more so than for package test, not all the scan-based digital tests can be applied to the die under test. We present an optimal test-length selection technique for wafer-level testing of core-based SoCs. This technique, which is based on a combination of statistical yield modeling and integer linear programming, allows us to determine the number of patterns to use for each embedded core during wafer sort such that the probability of screening defective dies is maximized for a given upper limit on the SoC test time. We also present a heuristic method to handle large next-generation SoC designs. Simulation results are presented for five of the ITC'02 SoC Test benchmarks, and the optimal test-length selection approach is compared with the heuristic method.     

Constructing IP cores’ transparency paths for SoC test access using greedy search

Today’s SoC design demands efficient test access mechanism to develop and perform manufacturing test. Transparency based methods have their advantages for IP cores’ test reuse in SoC level. In this paper, an IP core transparency paths construction approach employing greedy search strategy based on gate-level heuristic information is proposed. With these transparency paths, IP cores can consecutively transfer one test per clock cycle from their inputs to outputs, and thus can be used in transparency-based test scheme to benefit at-speed testing and decrease the demand of parallel TAMs. The experimental results show lower extra overhead needed in our approach than conventional boundary scan and previous RT level approaches.     

LI-BIST: A Low-Cost Self-Test Scheme for SoC Logic Cores and Interconnects

For system-on-chips (SoC) using deep submicron (DSM) technologies, interconnects are becoming critical determinants for performance, reliability and power. Buses and long interconnects being susceptible to crosstalk noise, may lead to functional and timing failures. Existing at-speed interconnect crosstalk test methods propose inserting dedicated interconnect self-test structures in the SoC to generate vectors which have high crosstalk defect coverage. However, these methods may have a prohibitively high area overhead. To reduce this overhead, existing logic BIST structures like LFSRs could be reused to deliver interconnect tests. But, as shown by our experiments, use of LFSR tests achieve poor crosstalk defect coverage. Additionally, it has been shown that the power consumed during testing can potentially become a significant concern.In this paper, we present Logic-Interconnect BIST (LI-BIST), a comprehensive self-test solution for both the logic of the cores and the SoC interconnects. LI-BIST reuses existing logic BIST structures but generates high-quality tests for interconnect crosstalk defects, while minimizing the area overhead and interconnect power consumption. The application of the LI-BIST methodology on example SoCs indicates that LI-BIST is a viable, low-cost, yet comprehensive solution for testing SoCs.     

Scan Test Strategy for Asynchronous-Synchronous Interfaces

In the coming years, the well-known synchronous design style will not be able to keep pace with the increase speed and capabilities of integration of advanced processes. New design paradigms, like core reuse of the already designed synchronous modules and asynchronous designs, are considered in order to cope with the ever increasing complexity. The future SoCs will contain multiple synchronous and asynchronous cores. Asynchronous design will become more and more common among digital designers, while synchronous-asynchronous interactions will emerge as a key issue in the future SoC designs.This paper will present test strategies for 2-phase asynchronous-synchronous interfaces and vice versa. It will be shown how test vectors can be automatically generated using commercially available ATPG tools. The generated ATPG vectors will be able to test all stuck-at-faults within the asynchronous-synchronous interfaces.     

基于片上网络的系统芯片测试研究

文章介绍了基于片上网络对系统芯片进行测试的原理和实例，这是一种新的设计方法。首先讨论了未来系统芯片存在的各方面测试挑战，并提出了基于片上网络结构的解决方案。其次，在OSI网络堆栈参考模型的基础上．提出了面向测试的片上网络协议堆栈以及对应的测试服务。最后，介绍了基于片上网络的模块化测试方法。     

Fast algorithms for test optimization of core based 3D SoC

The use of 3D-IC technology has become quite widespread in designing core-based systems-on-chip (SoCs). Concomitantly, testing of cores and inter-layer through-silicon-vias (TSVs) spanning through different layers of 3D chips has become an important problem in the manufacturing cycle. Testing 3D-SoCs is more challenging compared to their 2D counterparts because of the complexity of their design and power management issues. Also, the test procedure demands substantially more power than what is required in the normal functional mode, and hence, stringent thermal constraints during test need to be fulfilled to safeguard future performance and reliability of the chip. Since the overall 3D infrastructure depends on routing layer assignments, core allocation, and the geometry of TSV locations, these parameters should be given due consideration while designing the test-access-mechanism (TAM) that aims for minimizing overall test time satisfying power and TSV constraints. In this paper, we present a three-stage algorithm for reducing the test time in automated post-bond core-based 3D-SoCs, under a set of given constraints on test power, TAM-width, and the number of available TSVs. The proposed algorithm, when run on several ITC-02 SoC benchmarks, outperforms the algorithms presented in earlier work with respect to CPU-time, and additionally, reduces test time in many instances.     

SoC interconnection protection through formal verification

The wide adoption of third-party hardware Intellectual Property (IP) cores including those from untrusted vendors have raised security concerns for system designers and end-users. Existing approaches to ensure the trustworthiness of individual IPs rarely consider the entire SoC design, especially the IP interactions through SoC bus. These methods can hardly identify malicious logic (or design flaws) distributed in multiple IPs whereas individual IPs fulfill security properties and can pass the security testing/verification. One possible solution is to treat the SoC as one IP core and try to verify security properties of the entire design. This method, however, suffers from scalability issues due to the large size of SoC designs with multiple IP cores integrated. In this paper, we present a scalable SoC bus verification framework trying to verify the security properties of SoC bus implementation where the bus protocol plays the role of the golden reference. More specifically, finite state machine (FSM) models will be constructed from the bus implementation and the trustworthiness will be verified based on the property set derived from the bus protocol and potential security threats. Along with IP level formal verification solutions, the proposed framework can help ensure the security of large-scale SoCs. Experimental results on ARM AMBA Bus demonstrate that our approach is applicable and scalable to prevent information leakage and denial-of-service (DoS) attack by verifying security properties.     

Coordinated dual-homing in designing hierarchical wireless access network with a genetic algorithm based approach

With the growth of mobile users and the increasing deployment of wireless access network infrastructures, the issue of fault tolerance is becoming an important component of efficient wireless access network design. In this work, we study a survivable hierarchical network design problem. Given the available capacity, connectivity, and reliability at each level, the problem is to minimize overall connection cost for multiple requests such that the capacity, connectivity, and minimum survivability constraints are not violated. Our study is different than earlier research in regard to the coordination of multiple layers of access networks. The connectivity to the core network may be fully or partially dual-homed paths, or may be single-homed paths. Dual-homing schemes spanning to different levels in the network hierarchy are used if the single-homed connectivity is not enough to guarantee the minimum required survivability. We formulate the problem using mixed integer linear programming and prove the complexity class to be NP-hard. We then propose an off-line genetic algorithm based meta-heuristic. Given the complexity of the problem, simulation results demonstrate that the proposed approach is viable in designing fault-tolerant access networks with dual-homing capability.     

实施系统封装方案以提高系统整体功能和性能

系统集成是实现电子产品高性能,小型化和低成本目标的重要手段。与同芯片上的系统集成(SoC)相比,封装层次上的系统集成(SiP)的开发具有成本低、周期短和灵活性高等优势。本文以典型的无线电子系统为例,提出了有效的系统分割设计方法,介绍了一些用于子系统模块封装的方法,并强调了系统公司与封装、基板及其它主被动元件供应商之间协调合作对成功的模块式电子系统开发的重要性。     

Integrated circuits for communications

Wireless communication standards have progressed greatly over the past decade, from the relative simplicity of Bluetooth, to the much more sophisticated Global System for Mobile Communications (GSM) standards that make up a large part of today's cellular communication networks. Perhaps the most interesting aspect of this progression is the accompanying reduction in cost of the wireless devices themselves, driven by numerous innovations in the fields of complementary metal oxide semiconductor (CMOS) process technology, radio frequency (RF)/analog circuit design, and system-on-chip (SoC) integration. In this issue of the Integrated Circuits for Communications Series, we have selected three articles that highlight the challenges in the design of highly integrated SoCs using standard low-cost CMOS process.     

On optimizing system energy of voltage–frequency island based 3-D multi-core SoCs under thermal constraints

Three dimensional (3-D) multi-core SoC has been recognized as a promising solution for implementing complex applications with lower system energy. Recently, voltage–frequency island (VFI)-based design paradigm was widely adopted for energy optimization. However, the existing work commonly targeted 2-D platform, which cannot handle the exacerbated thermal issues and the increased solution space from 3-D integration. In this paper, we propose an optimization framework targeting VFI-based 3-D multi-core SoCs to minimize system energy meanwhile still meeting task deadline and thermal constraints. Our framework conducts at an earlier design phase in which designers have the freedom to determine the core stacks and map them into the hardware platform. Besides energy-aware task scheduling, we also conduct core stacking and task adjusting to balance the powers across the chip for thermal optimization. Moreover, by treating each core stack as a unity, the complicated problem of core mapping and VFI partitioning in 3-D platform can be simplified as a 2-D one. Experimental results demonstrate that on average our framework can achieve an energy reduction of 15.8% over the prior thermal balancing algorithm [17] (X. Zhou, J. Yang, Y. Xu, et al. Thermal-aware task scheduling for 3D multicore processors, IEEE Trans. Parallel Distrib. Syst. (TPDS), 21(1) (2010), 60–71.). Moreover, on average a reduction of 4.8 °C in peak temperature is achieved by our framework, compared with the state-of-the-art energy optimization scheme [8] (U.Y. Ogras, R. Marculescu, P. Choudhary, et al. Voltage–frequency island partitioning for GALS-based networks-on-chip, in: ACM/IEEE Design Automation Conference (DAC), 2007, pp. 110–115.).     

An Efficient Block Entropy Based Compression Scheme for Systems-on-a-Chip Test Data

The emergence of the nanometer scale integration technology made it possible for systems-on-a-chip, SoC, design to contain many reusable cores from multiple resources. This resulted in higher complexity SoC testing than the conventional VLSI. To address this increase in design complexity in terms of data-volume and test-time, several compression methods have been developed, employed and proposed in the literature. In this paper, we present a new efficient test vector compression scheme based on block entropy in conjunction with our improved row-column reduction routine to reduce test data significantly. Our results show that the proposed method produces much higher compression ratio than all previously published methods. On average, our scheme scores nearly 13% higher than the best reported results. In addition, our scheme outperformed all results for each of the tested circuits. The proposed scheme is very fast and has considerable low complexity.     

RF Built-in Self Test of a Wireless Transmitter

RF frequency synthesizers and transmitters for wireless system-on-chips have recently migrated to low-cost deep-submicrometer CMOS processes that facilitate all-digital implementations. In addition to all the benefits of lower power, lower silicon cost, reduced board area, and improved performance that the scaled CMOS integration entails, the testing costs for RF performance and wireless standard compliance could also be drastically reduced. In this brief, we propose a built-in self test (BIST) method, which is based on the premise that the internal frequency synthesizer and transmitter signals are in digital format allowing for digital signal processing to ascertain the RF performance without external test equipment. With the RF BIST capability, millions of SoCs can be calibrated and tested in a production environment using a low cost digital tester while benefiting from increased test coverage and reduced test time and cost. The presented techniques have been successfully implemented in two generations of commercial digital RF processors: 130-nm Bluetooth and 90-nm GSM single-chip radios     

Wafer-Level Defect Screening for “Big-D/Small-A” Mixed-Signal SoCs

Product cost is a key driver in the consumer electronics market, which is characterized by low profit margins and the use of a variety of “big-D/small-A” mixed-signal system-on-chip (SoC) designs. Packaging cost has recently emerged as a major contributor to the product cost for such SoCs. Wafer-level testing can be used to screen defective dies, thereby reducing packaging cost. We propose a new correlation-based signature analysis technique that is especially suitable for mixed-signal test at the wafer-level using low-cost digital testers. The proposed method overcomes the limitations of measurement inaccuracies at the wafer-level. A generic cost model is used to evaluate the effectiveness of wafer-level testing of analog and digital cores in a mixed-signal SoC, and to study its impact on test escapes, yield loss, and packaging costs. Experimental results are presented for a typical mixed-signal “big-D/small-A” SoC, which contains a large section of flattened digital logic and several large mixed-signal cores.