Modeling and analysis of the material removal depth for stone polishing

In this paper, a model of predicting the material removal depth of the workpiece surface for the mould polishing by fixed abrasives is developed and an approach to achieve the material removal profile is presented. The effect of the grain size on material removal depth is considered. The distribution of the abrasive grain protrusion heights is taken to be Gaussian distribution. The relationship between the pressure and the depth of indentation is investigated by analyzing interaction of the abrasive grains and the workpiece. It is assumed that the pressure distribution is Hertzian at the contact between the tool and the workpiece surface. The theoretical model of linear removal intensity is presented by calculating the removal volumes of all abrasive grains participating in cutting. The depth of the material removal can be obtained by integrating the linear removal intensity along the polishing contact path formed by the polishing tool passing this position. The predicted results based on the current model are shown to be approximately consistent with the experimental results.     

抛光垫表面微细结构对抛光性能的影响试验

抛光垫是影响抛光加工效率和表面质量的关键因素之一,但影响规律和作用机理尚不清晰。为研究抛光垫表面微细结构对抛光性能的影响规律,制作有、无固结磨料的表面六边形微细结构抛光垫,分别对YG15硬质合金、单晶Si和单晶4H-SiC三种硬度差异较大的工件进行抛光试验。结果表明：各抛光垫对不同硬度工件抛光效果的影响规律一致,随着抛光工件的硬度增大,各抛光垫的材料去除率（MRR）减小,表面粗糙度Ra增大。抛光垫内的固结磨料能将MRR提高5～10倍,但也会导致Ra增大5～20倍。抛光垫表面微细结构会使得抛光过程中有效接触面积Ap和有效磨粒数Ns减小而导致MRR下降,而抛光垫硬度的增加能够部分弥补抛光垫表面微细结构造成的影响,抛光工件硬度越大,弥补效果越好。增加游离磨料能够有效降低抛光后Ra并提高硬度较大工件的MRR（上升约8%）,但对硬度较小工件的MRR有抑制作用（下降约27%）。根据抛光试验结果,建立工件-磨料-抛光垫接触模型,深入分析抛光垫表面微细结构、表面硬度对不同硬度工件抛光MRR和表面质量的作用机理,为不同工件抛光时抛光垫的选择提供了理论基础。     

硬质合金刀具材料化学机械抛光机理研究

目的研究硬质合金刀具材料化学机械抛光(CMP)机理,为改善硬质合金刀具表面质量提供理论支持。方法分析硬质合金刀具材料在酸性抛光液中的化学反应,研究硬质合金刀具材料CMP的化学反应机理。基于接触力学理论计算抛光垫与工件的实际接触面积和单个磨粒的实际切削面积,在运动学分析的基础上,建立硬质合金刀具材料CMP的材料去除率模型,通过实验验证材料去除率模型的有效性。结果在酸性抛光液中,硬质合金被氧化成Co_3O_4。当工件、抛光垫、磨粒类型、工件安装位置确定时,材料去除率与抛光载荷、磨粒浓度和抛光盘转速有关。常用硬质合金抛光条件下,抛光YG8刀具的修正系数Kcm为8.53,抛光后刀具的最低表面粗糙度能达到48nm,材料去除率为62.381nm/min,材料去除率的理论值和实验值的最大相对误差为13.25%,消除了表面缺陷,获得了较好的镜面效果。结论建立的材料去除率模型具有一定的有效性,对硬质合金刀具材料进行化学机械抛光能消除刀具的表面缺陷,改善表面质量。     

Nanometer-scale characteristics of polycrystalline YAG ceramic polishing

Polycrystalline yttrium aluminum garnet (YAG) ceramics used as laser gain media require nanometer-scale surface geometries to minimize light scattering. Generally, uneven material removal between grains and excessive material removal at the grain boundaries retards smoothing of the ceramic surfaces. This paper describes the effects of the mechanical properties and polishing tool structures on the tool contact against the target surface during polishing. This, in addition to the abrasive type and size, influences the polishing characteristics, especially the material removal at the grain boundaries, the grain enhancement, the grain dislodgement, and the resulting nanometer-scale geometries of the polished surfaces.     

超声复合磨料振动抛光方法有限元分析与实验

为研究超声复合磨料振动抛光方法对工件表面材料去除量与工件表面粗糙度的影响,分析了超声复合磨料振动抛光方法;并利用ANSYS Workbench软件分别分析了超声振动条件下和超声复合磨料振动条件下工件表面结构与应力变化情况,同时在超声复合磨料振动条件下通过实验验证超声复合磨料振动抛光技术对工件表面材料去除量与工件表面粗糙度的影响程度。结果表明:超声复合磨料振动条件下工件表面位移小于超声振动条件下的工件表面位移,超声复合磨料振动条件下工件表面应力大于超声振动条件下的工件表面应力;在超声复合磨料振动条件下,影响工件表面粗糙度最显著的因素是磨料质量分数,影响工件表面材料去除量最显著的因素是抛光时间,且磨料质量分数为30%、抛光时间为4 h时,抛光效果最佳。     

磨粒刻划单晶SiC的SPH与FEM耦合仿真分析

目的 进一步理解金刚石线锯加工硬脆晶体材料的去除特性.方法 采用SPH与FEM耦合算法,分析磨粒刻划单晶碳化硅工件过程中的材料去除动态响应,研究不同磨粒压入深度与几何形状条件对磨粒接触力、工件刻划表面形貌与应力分布的影响规律,分析磨粒恒定深度刻划与变深度刻划两种方式下磨粒刻划工件材料的动态响应.结果 磨粒接触力的各方向分量均随刻划时间发生波动,其中x与z轴方向的磨粒接触力随时间的变化趋势相近,平稳刻划时段的磨粒接触力均值拟合方程分别为fx=3.0956h2.7264,fz=11.3813h2.6214.磨粒压入深度是影响刻划过程中工件刻划截面形貌及应力分布的主要因素.相较于圆锥体磨粒,球体磨粒刻划后的工件材料截面形貌更粗糙,但工件材料的变形及损伤层深度更小.在磨粒变深度刻划方式下,随着磨粒压入深度的增加,刻划过程中的工件材料发生了脆塑转变.结论 在保证材料去除率的条件下,需降低磨粒压入深度,以降低磨粒接触力,获得更平整的工件表面刻划形貌与更低的等效应力.     

基于微元材料去除模型的单摆抛光平面度预测

为探究单摆参数对抛光工件平面度的影响,提出一种基于速度和压强分布耦合的抛光微元材料去除模型,以预测工件表面平面度。从单颗磨粒的材料去除出发,建立工件表面各微元单位时间内材料去除厚度模型,并将工件相对抛光垫速度和工件表面压强分布耦合代入模型;根据工件初始面形提取微元高度值,结合各微元材料去除的厚度,计算抛光后的工件表面平面度;试验验证平面度预测方法。结果表明：仿真与实际抛光后的面形的变化趋势相同,平面度PV₂₀值绝对偏差小于12.0%,平面度预测可靠。     

偏置量对固结磨料小工具头抛光面形收敛效率的影响

目的 解决自由曲面磨抛面形收敛困难的问题,提高抛光小工具头的抛光效率.方法 提出一种偏置式固结磨料小工具头,基于固结磨料小工具头的结构特征参数,建立抛光小工具头的去除函数理论模型,并进行仿真分析,应用定点抛光法建立抛光小工具头去除函数实验模型,并验证抛光小工具头理论去除函数合理性,基于CCOS技术原理建立工件表面定量去除模型,通过虚拟加工实验探索偏置量对固结磨料小工具头抛光钛合金后的面形收敛效率的影响.结果 归一化理论去除函数曲线与实验曲线吻合度较高,定点抛光去除函数仿真模型能够很好地预测定点抛光斑的去除轮廓形状.抛光小工具头抛光钛合金的面形误差随偏置量增加,呈现先减小、后增大的趋势,无偏置的抛光小工具头抛光后,面形数据均方根(RMS)收敛效率为54.56％,波峰值与谷峰值之差(PV)的收敛效率为60.21％,当抛光小工具头偏置量为1.5 mm时,抛光后的RMS收敛效率达到最高,为73.83％,PV收敛效率为69.68％.结论 固结磨料小工具头去除函数理论模型可指导确定性材料去除,偏置量为1.5 mm时的抛光小工具头具有最强的修正误差能力,可以显著提高固结磨料小工具头抛光工艺的面形收敛效率.     

固结磨料抛光垫作用下的材料去除速率模型

在对研磨抛光过程作出适当简化的基础上，推导出了固结磨料研具研磨抛光工件的去除速率模型，并进行了数值模拟。结果表明：固结磨料研磨加工时的去除速率不仅与工件的材质有关，还与固结磨料研磨盘的结构与加工参数相关；去除速率与相对速度V成正比，与压力的3／2次方成正比，与磨料直径成反比，并随着凸起间距的增加而下降。     

机器人恒力磨抛材料去除研究

针对传统机器人-砂带磨抛工件时材料去除量难以定量控制的问题,结合Preston磨削经验公式与赫兹弹性接触理论,将法向磨抛力、砂带速度、工件进给速度3个工艺参数作为变量,建立机器人恒力磨抛的材料去除深度模型;然后进行硬件选型,搭建机器人恒力磨抛实验平台;最后以上述3个工艺参数为变量设计了机器人恒力磨抛单因素实验,实验结果...     

基于叶序仿生抛光垫的化学机械抛光的运动分析

为了改善化学机械抛光的接触状态和被加工工件的表面形态,基于生物学的叶序理论设计了仿生结构的抛光垫。从单颗磨粒切削理论出发,建立了抛光运动方程和材料去除率分布模型。利用所建立的运动方程和材料去除率分布模型进行了晶片表面材料去除率分布的计算分析,得到抛光机的运动参数及抛光垫的叶序参数对材料去除率的影响规律。结果表明:当抛光盘的转速较大、工件转速适中、摆臂摆动频率较小、摆臂中心角较小及叶序参数取值较小时可以获得更好的材料去除分布。     

固结磨料抛光垫的凸起图案对其加工性能的影响

抛光垫是化学机械抛光中的重要组成部分,其磨损均匀性能是影响加工后工件平面度的重要因素。本文比较了具有优化凸起图案的固结磨料抛光垫、凸起均布的固结磨料抛光垫和聚氨酯抛光垫的研磨抛光性能,结果表明:利用优化凸起图案的固结磨料抛光垫加工,可以得到更加优异且稳定的表面质量,材料去除效率远高于聚氨脂抛光垫游离磨料的加工方式。     

双磨粒抛光单晶Si的分子动力学模拟

目的 通过分子动力学(MD)模拟,获得双金刚石磨粒抛光单晶Si的去除机理.方法 采用一种新的单晶硅三体磨粒抛光方法,测试双磨粒的抛光深度和横向/纵向间距对三体磨粒抛光的影响,从而获得相变、表面/亚表面损伤等情况,并获得抛光过程中温度及势能的变化情况.结果 对比抛光深度为1、3 nm时配位数的情况,发现抛光深度为1 nm时,抛光完成时相变的原子数是4319,而抛光深度为3 nm时,相变原子数为12516.随着磨粒在Si工件表面抛光深度的加深,抛光和磨蚀引起的相变原子和损伤原子的数目增加.仿真结果还表明,单晶Si相变原子的种类和数目随磨粒横向间距的增加而增加,随着纵向间距的增加反而减少.系统的初始温度设为298 K,抛光深度为1 nm时,抛光完成时的温度是456 K,而抛光深度为3 nm时,温度是733 K.抛光完成时,纵向组和横向组的温度仅相差30～40 K.在抛光深度、横向间距和纵向间距3个对照组中,抛光深度对亚表面损伤的影响最大.抛光深度为3 nm时,亚表面的损伤深度最大,从而导致更多的材料从单晶Si工件表面去除.结论 双磨粒的抛光深度和间距不仅对硅的表面微观结构产生影响,还对相变产生影响.模拟参数相同时,较大的抛光深度和横向间距下会产生更多的相变原子,因此相变受抛光深度的影响最大,受纵向间距的影响最小.     

Modeling of contact behavior between polishing pad and workpiece surface

The polishing pad is one of the most significant components within a polishing system. It influences both the material removal rate and the surface finish. Furthermore, the wear behavior of the polishing pad is responsible for the shape accuracy. Nevertheless despite extensive research activity in recent years, there are still gaps of knowledge in terms of the working principle of a polishing pad. In this paper, the contact behavior of a polishing pad (polyurethane foam) with the workpiece surface is examined. For this, the polishing pad is modeled using a finite-element modeling (FEM) program and the deformation by pressing it against the rigid workpiece surface is investigated. Consequently, the local tensions are calculated, which are the basis for the penetration depth and therefore also for the material removal rate. The investigations presented in this paper were carried out within the research project SFB TR/4 funded by the German Research Association, Deutsche Forschungsgemeinschaft (DFG).     

Proposal of New Polishing Technology without Using a Polishing Pad

A polishing method that uses no polishing pad is proposed, in which fine polymer particles are supplied together with abrasives onto a hard tool plate. The polymer particles prevent direct contact between workpiece and tool plate and serve as countless micro pads rubbing the abrasives against the workpiece for polishing action, so that not only slurry supply to and removal of polishing by-products from the work-plate gap are kept good and constant, but also excessive frictional resistance may be suppressed. Polishing experiments with silicon wafers have shown that the method is feasible and characterized with higher material removal rates and less polishing resistance than conventional polishing.     

Centrifugal and hydroplaning phenomena in high-speed polishing

Super fine polishing with compliant tools can achieve nanoscale roughness, but has limited productivity due to low material removal rate (MRR). Increased spindle speed in high-speed polishing (HSP) might increase MRR, but significant challenges appear above 10,000 rpm because of centrifugal deformation of the tool and pad lifting due to hydroplaning phenomenon. Here, a tool offset compensation strategy is proposed for centrifugal deformation and novel pad patterning design that mitigates hydroplaning. Through this new approach, linear increase in MRR for spindle speed up to 24,000 rpm is demonstrated. This work lays the foundation for future developments of HSP in fabrication of ultraprecision optics.     

On the mechanism and mechanics of material removal in ultrasonic machining

Precision abrasive machining processes such as ultrasonic machining are commonly employed to machine glasses, single crystals and ceramic materials for various industrial applications. Until now, precision machining of hard and brittle materials are poorly investigated from the fundamental and applied point of views. Taking into account the major technological importance of this subject to the production of functional and structural components used in high performance systems, it is often desired to estimate the machining rate for productivity while maintaining the desired surface integrity. The success of this approach, however, requires not only the fundamental understanding of the material removal on the microstructural scale but also the relationship between the machining characteristics and material removal rate in ultrasonic machining. In this study, the ultrasonic machining of glass was investigated with respect to mechanism of material removal and material removal rate (with basic machining parameters) with a mild steel tool using boron carbide abrasive in water as slurry. The analysis indicates that the material removal was primarily due to the micro-brittle fracture caused on the surface of the workpiece. For micro-brittle fracture mode, the relationship for the material removal rate, considering direct impact of abrasive grains on the workpiece, based on a simple fracture mechanics analysis has been established. The effect of machining conditions on material removal rate has been discussed. This research provides valuable insights into the material removal mechanism and the dependence of material removal rate on machining conditions and mechanical properties of workpiece material in ultrasonic machining.     

单晶硅磨抛协同加工的分子动力学

磨削与抛光是实现单晶硅材料超精密表面加工的重要工艺方法,磨抛协同加工过程中由磨粒运动状态主导的二体与三体磨损机制对材料去除效率以及表面加工质量具有重要影响。采用分子动力学方法,建立固结与游离运动状态双磨粒协同作用下的单晶硅表面超精密磨抛加工过程仿真模型,分析磨粒切入深度、横向与纵向间距干涉等因素对磨削力、材料相变、表面损伤及材料去除行为的影响规律,阐释单晶硅磨抛协同超精密加工表面形貌演化规律。研究表明：受磨粒运动状态驱动的单晶硅材料表层损伤原子数量随固结及游离磨粒切入深度增大而增加,磨粒切入深度对工件的材料去除、裂纹生长及损伤行为影响显著;法向和切向磨削力随磨粒切入深度增加而增大,且在同等切入深度变化时法向磨削力增加幅度大于切向磨削力; 通过单晶硅金刚石结构分析磨粒间干涉区域的损伤情况可知,随着磨粒间纵向间距增加时,工件所受干涉作用减小,六角金刚石晶体结构减少;相比较固结磨粒,游离磨粒对工件的损伤区域更深,产生瞬态缺陷原子更多。研究结果可为实现超精密磨抛协同加工工艺高材料去除效率和高表面质量提供理论基础。     

化学机械抛光中的接触状态研究概述

化学机械抛光是获取高表面平整度的有效关键技术,获得了广泛的研究和应用,其表面材料的去除作用依赖于所处的真实接触状态。归纳了抛光垫/晶圆相互作用的形式,即相互滑过而没有直接接触、混合润滑和直接接触。分析了接触状态及其转变过程中的影响因素,包括抛光垫的变形、釉化和磨损,抛光液中磨粒的影响及表面活性剂对钝化层厚度的改变等。重点总结了化学机械抛光中接触状态问题的研究进展,包括光学显微镜测量计算接触面积比、薄膜传感器测量接触面积比、利用双发射激光诱导荧光技术测量抛光液厚度、抛光垫表面形貌演变对材料去除速率的建模等方法的特点及存在的问题。最后提出了纳米间隙测量技术测量化学机械抛光中接触率动态变化,从而得到真实接触状态和接触状态转变规律的新思路。     

磨粒尺寸和基体硬度对固结磨料抛光YAG晶体的影响

钇铝石榴石(YAG)是一种应用广泛的硬脆难加工材料,其抛光过程工艺复杂、效率低。固结磨料抛光技术具有平坦化能力优、对工件形貌选择性高、磨料利用率高等优点。试验采用固结磨料抛光YAG晶体,研究固结磨料垫的基体硬度和金刚石磨粒尺寸对YAG晶体的材料去除率和表面质量的影响。结果表明:当基体硬度适中为Ⅱ、金刚石磨粒尺寸3～5 μm时,固结磨料抛光YAG晶体效果最优,其材料去除率为255 nm/min,表面粗糙度S_a值为1.79 nm。