Y<Subscript>2</Subscript>O<Subscript>3</Subscript> and Nd<Subscript>2</Subscript>O<Subscript>3</Subscript> co-stabilized ZrO<Subscript>2</Subscript>-WC composites

Y₂O₃ + Nd₂O₃ co-stabilized ZrO₂-based composites with 40 vol% WC were fully densified by pulsed electric current sintering (PECS) at 1350 °C and 1450 °C. The influence of the PECS temperature and Nd₂O₃ co-stabilizer content on the densification, hardness, fracture toughness and bending strength of the composites was investigated. The best combination of properties was obtained for a 1 mol% Y₂O₃ and 0.75 mol% Nd₂O₃ co-stabilized composite densified for 2 min at 1450 °C under a pressure of 62 MPa, resulting in a hardness of 15.5 ± 0.2 GPa, an excellent toughness of 9.6 ± 0.4 MPa.m^0.5 and an impressive 3-point bending strength of 2.04 ± 0.08 GPa. The hydrothermal stability of the 1 mol% Y₂O₃ + 1 mol% Nd₂O₃ co-stabilized ZrO₂-WC (60/40) composites was compared with that of the equivalent 2 mol% Y₂O₃ stabilized ceramic. The double stabilized composite did not degrade in 1.5 MPa steam at 200 °C after 4000 min, whereas the yttria stabilized composite degraded after less than 2000 min. Moreover, the (1Y,1Nd) ZrO₂-WC composites have a substantially higher toughness (~9 MPa.m^0.5) than their 2Y stabilized equivalents (~7 MPa.m^0.5).     

The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction

In this work, Sn3.0Ag0.7Cu (SAC) composite solders were produced by mechanically intermixing 0.5 wt% Al₂O₃ nanoparticles into Sn3.0Ag0.7Cu solder. The formation and growth kinetics of the intermetallic compounds (IMC) formed during the liquid–solid reactions between SAC-0.5Al₂O₃ composite solder and Cu substrates at various temperatures ranging from 250 to 325 °C were investigated, and the results were compared to the SAC/Cu system. Scanning electron microscopy (SEM) was used to quantify the interfacial microstructure for each processing condition. The thickness of interfacial intermetallic layers was quantitatively evaluated from SEM micrographs using imaging software. Experimental results showed that IMC could be dramatically affected by a small amount of intermixing 0.5 wt% Al₂O₃ nanoparticles into Sn3.0Ag0.7Cu solder. A continuous elongated scallop-shaped overall IMC layer was found at SAC/Cu interfaces. However, after the addition of Al₂O₃ nanoparticles, a discontinuous rounded scallop-shaped overall IMC layer appeared at SAC-0.5Al₂O₃/Cu interfaces. Kinetics analyses showed that growth of the overall IMC layer in SAC/Cu and SAC-0.5Al₂O₃/Cu soldering was diffusion controlled. The activation energies calculated for the overall IMC layer were 44.2 kJ/mol of SAC/Cu and 59.3 kJ/mol for SAC-0.5Al₂O₃/Cu soldering, respectively. This indicates that the presence of a small amount of Al₂O₃ nanoparticles is effective in suppressing the growth of the overall IMC layer.     

Giant dielectric and electrical properties of sodium yttrium copper titanate: Na<Subscript>1/2</Subscript>Y<Subscript>1/2</Subscript>Cu<Subscript>3</Subscript>Ti<Subscript>4</Subscript>O<Subscript>12</Subscript>

The electrical properties and dielectric response in Na_1/2Y_1/2Cu₃Ti₄O₁₂ ceramic prepared by conventional solid-state reaction method and sintered at 1,090 °C for 5 h were investigated as functions of frequency and temperature. Main phase of Na_1/2Y_1/2Cu₃Ti₄O₁₂ with CaCu₃Ti₄O₁₂-like crystallographic structure and CuO secondary phase were observed in the X-ray diffraction pattern. Abnormal grain growth was observed just as observed in CaCu₃Ti₄O₁₂ ceramics. The Na_1/2Y_1/2Cu₃Ti₄O₁₂ ceramic exhibits a high ε′ of ~2.04 × 10⁴ at 20 °C and 1 kHz and low tan δ (with the minimum 0.080 at 5 kHz). Impedance spectroscopy analysis reveals that Na_1/2Y_1/2Cu₃Ti₄O₁₂ ceramic is electrically heterogeneous, consisting of semiconducting grains and insulating grain boundaries. Giant ε′ response in Na_1/2Y_1/2Cu₃Ti₄O₁₂ ceramic is therefore attributed to an internal barrier layer capacitor effect.     

Preparation and properties of Y<Subscript>2</Subscript>O<Subscript>3</Subscript> partially stabilized ZrO<Subscript>2</Subscript> crystals

We have studied the effect of composition and growth conditions on the structure and properties of 2.5–5 mol % Y₂O₃ partially stabilized ZrO₂ crystals grown by directional solidification in a cold-wall crucible. The phase composition and density of the crystals have been determined. The crystals are shown to be uniform in composition, with local changes in Y₂O₃ content within ±0.5 mol %. The dimensions and quality of the single crystals are influenced by the growth conditions.     

Effect of Al<Subscript>2</Subscript>O<Subscript>3</Subscript> on the properties of nanocrystalline ZrO<Subscript>2</Subscript> + 3 mol % Y<Subscript>2</Subscript>O<Subscript>3</Subscript> powder

We have studied the properties of nanocrystalline ZrO₂〈3 mol % Y₂O₃〉 and 90 wt % ZrO₂〈3 mol % Y₂O₃〉-10 wt % Al₂O₃ powders prepared via hydrothermal treatment of coprecipitated hydroxides at 210°C. The results demonstrate that Al₂O₃ doping raises the phase transition temperatures of the metastable low-temperature ZrO₂ polymorphs and that the structural transformations of the ZrO₂ and Al₂O₃ in the doped material inhibit each other.     

Strengthening mechanism of nano-Al<Subscript>2</Subscript>O<Subscript>3</Subscript> particles reinforced Sn3.5Ag0.5Cu lead-free solder

To improve the properties of the eutectic Sn3.5Ag0.5Cu lead-free solder, various amounts of mixed nano-Al₂O₃ particles were added. The microstructure, thermal analysis, density, thermal expansion coefficient (CTE), and mechanical behavior were studied. The results of differential scanning calorimetry (DSC) indicate that the melting point of the composite solder doped with nano-Al₂O₃ particles is slightly higher that of the Sn3.5Ag0.5Cu lead-free solder and has a eutectic peak. The Sn3.5Ag0.5Cu composite solders exhibited lower density values and thermal expansion coefficient (CTE) values than did the unreinforced solder matrix. Compared to solder without the addition of nano-Al₂O₃ particles, the formation of dendritic β-Sn grains, the Ag₃Sn phase average size, and the spacing of lamellae decreased significantly in the composite solder matrix. The mechanical properties also improved with increasing weight percentages of nano-Al₂O₃ particles. However, the ductility of the Sn3.5Ag0.5Cu composite solder decreased. For the addition of 1 wt% nano-Al₂O₃ particles, microporosity was observed both at and along the grain boundary regions, coupled with the presence of second-phase particles (i.e. nano-Al₂O₃ and Ag₃Sn).     

Effect of Y<Subscript>2</Subscript>O<Subscript>3</Subscript> stabilizer content and annealing on the structural transformations of ZrO<Subscript>2</Subscript>

The structure of partially stabilized zirconia crystals has been studied by transmission electron microscopy before and after annealing. Structural characterization of Y₂O₃-doped (2.8 to 4 mol %) zirconia before annealing showed that all of the samples consisted of twin domains whose size was dependent on the stabilizer content. Annealing at 2100°C increased the domain size in the composition range 2.8–3.7 mol % Y₂O₃ and reduced it at 4 mol % Y₂O₃. These structural changes allowed us to determine the position of the representative point relative to the phase boundary in the equilibrium phase diagram of the system.     

Interaction of hydrogen with the intermetallic compound Nd<Subscript>2</Subscript>Fe<Subscript>17</Subscript> studied by calorimetry

Interaction of hydrogen with the intermetallic compound Nd₂Fe₁₇ has been studied for the first time by calorimetry using a differential heat conduction calorimeter coupled to a Sieverts apparatus. Hydrogen absorption and desorption reactions were run at 200°C, and two types of data were obtained: p–C–T and ΔH–C–T (where p is the equilibrium hydrogen pressure, C = H/Nd₂Fe₁₇, ΔH is the reaction enthalpy, and T is the measurement temperature). The p–C–T curves obtained for the hydrogen absorption and desorption processes have no plateau or two-phase region, in contrast to what is characteristic of the formation of a hydride phase. At the same time, the ΔH(C) curves have a few portions where the enthalpy of reaction between hydrogen and the intermetallic compound remains constant: 0 < C < 2.0, with ΔH _abs =–85.05 ± 0.65 kJ/mol H ₂; 2.0 < C < 2.7, with ΔH _abs =–80.64 ± 1.00 kJ/mol H₂; and 1.9 < C < 2.7, with ΔH _des = 76.48 ± 0.85 kJ/mol H₂. The data obtained in this study suggest that positions 9e and 18g in the intermetallic compound are occupied by hydrogen in a particular order.     

Effect of Bi content on spalling behavior of Sn–Bi–Zn–Ag/Cu interface

The effect of the Bi content on the formation of intermetallic compounds (IMCs) layers between the Sn-xBi-0.9Zn-0.3Ag lead-free solder (with x = 1, 2, 3 and 4, in weight percent, hereafter) and Cu substrate was investigated. The structure of the IMC layer in the soldered interface varies apparently with increasing the Bi content. When the Bi content is 1 wt%, the interface soldered is consisted of CuZn and Cu₆Sn₅ IMC layers, which are separated by an intermediate solder layer. As the Bi content increases, the spalling phenomenon tends to disappear. Moreover, the layer between the Sn-2Bi-0.9Zn-0.3Ag solder and Cu substrate is thicker than others. The evolution of the soldered interfacial structure could be attributed to the existence of Bi.     

Hydrothermal synthesis and photoluminescence properties of Y<Subscript>2</Subscript>Zr<Subscript>2</Subscript>O<Subscript>7</Subscript>:Tb<Superscript>3+</Superscript> phosphors

This article presents the synthesis and photoluminescence (PL) properties of Y₂Zr₂O₇:Tb³⁺. The Tb³⁺-doped Y₂Zr₂O₇ zirconates were successfully synthesized by a hydrothermal process at 200 °C for 20 h. X-ray diffractometer (XRD) patterns revealed that all of the products were phase-pure with the fluorite structure. PL study showed that the Y₂Zr₂O₇:Tb³⁺ phosphors exhibited obvious PL emission peaks which located at 490, 545, 585, and 623 nm; the dominant emission located at 545 nm is assigned to ⁵D₄ → ⁷F₅ transition. Furthermore, Tb³⁺-doping concentration strongly affected the PL properties, and the quenching concentration is 5 at.%.     

Low-Temperature Heat Capacities and Standard Molar Enthalpy of Formation of Potassium Benzoate C<Subscript>7</Subscript>H<Subscript>5</Subscript>O<Subscript>2</Subscript>K(s)

Potassium benzoate C₇H₅O₂K (CAS Registry No. 582-25-2) was synthesized by the method of liquid phase reaction. Chemical and elemental analyses, FTIR, and X-ray powder diffraction (XRD) techniques were applied to characterize the composition and structure of the compound. Low-temperature heat capacities of the compound were measured by a precision automated adiabatic calorimeter over the temperature range from 78 K to 398 K. A polynomial equation of the heat capacities as a function of temperature was fitted by the least-squares method. Smoothed heat capacities and thermodynamic functions of the compound were calculated based on the fitted polynomial. In accordance with Hess’s law, a reasonable thermochemical cycle was designed, and 100 mL of 1 mol · dm⁻³ NaOH solution was chosen as the calorimetric solvent. The standard molar enthalpies of dissolution for the reactants and products of the supposed reaction in the selected solvent were measured by an isoperibol solution-reaction calorimeter. Finally, the standard molar enthalpy of formation of the title compound C₇H₅O₂K (s) was derived to be -(610.94 ± 0.77) kJ · mol⁻¹.     

Crystallization kinetics of an amorphous Al<Subscript>75</Subscript>Ni<Subscript>10</Subscript>Ti<Subscript>10</Subscript>Zr<Subscript>5</Subscript> alloy

The formation and crystallization behaviors of a mechanically alloyed Al₇₅Ni₁₀Ti₁₀Zr₅ amorphous alloy were studied by X-ray diffraction, transmission electron microscopy, and differential scanning calorimetry in the present study. The effective activation energy of the crystallization was determined by the Kissinger and Ozawa equations, respectively. The two equations yield close results and the average activation energy is 252 ± 13 kJ/mol. The resultant crystalline products were Al and Al₃Ni, and the crystallization mechanism is two- or three-dimensional nucleation and growth controlled by the diffusion of atoms. The thermal stability of the alloy was evaluated by a continuous transformation diagram obtained by the extended Kissinger equation.     

High-temperature oxidation of MoSi<Subscript>2</Subscript>

Oxidation behavior of MoSi₂ was investigated in air over the temperature range of 1400–1700 °C. Spallation of the SiO₂ scale did not occur at any temperature, and Mo₅Si₃ formation did not happen below 1700 °C. A change in the rate-controlling mechanism was detected within the temperature range of this study. Activation energy for oxidation of MoSi₂ at high temperatures was determined to be 204 kJ/mol. This value is less than the value of activation energy for oxidation of MoSi₂ controlled by diffusion of O₂ through amorphous SiO₂ layer reported at lower temperatures. The decrease in activation energy is attributed to the increased degree of crystallization of amorphous silica to β-cristobalite at high temperatures resulting in enhanced O₂ diffusion through SiO₄⁻⁴ tetrahedral structure.     

Temperature-stable and low loss Fe-containing dielectrics in BaO-Ln<Subscript>2</Subscript>O<Subscript>3</Subscript>-Fe<Subscript>2</Subscript>O<Subscript>3</Subscript>-Ta<Subscript>2</Subscript>O<Subscript>5</Subscript> system

Polycrystalline samples of Ba₄Ln₂Fe₂Ta₈O₃₀ (Ln = La and Nd) were prepared by a high temperature solid-state reaction technique. The formation, structure, dielectric and ferroelectric properties of the compounds were studied. Both compounds are found to be paraelectrics with filled tetragonal tungsten bronze (TB) structure at room temperature. Dielectric measurements revealed that the present ceramics have exceptional temperature stability, a relatively small temperature coefficient of dielectric constant (τ _ε ) of −25 and −58 ppm/°C, with a high dielectric constant of 118 and 96 together with a low dielectric loss of 1.2 × 10⁻³ and 2.8 × 10⁻³ (at 1 MHz) for Ba₄La₂Fe₂Ta₈O₃₀ and Ba₄Nd₂Fe₂Ta₈O₃₀, respectively. The measured dielectric properties indicate that both materials are possible candidates for the fabrication of discrete multilayer capacitors in microelectronic technology.     

Inducing multiferroic behaviour in the diamagnetic Y<Subscript>2</Subscript>O<Subscript>3</Subscript> system

The synthesis and characterization of Y_2−xFe_xO₃ (where x = 0–0.3) compounds has been carried out for their importance in the field of multiferroic materials. The powder X-ray diffraction reveal that the compounds Y_1.95Fe_0.05O₃, Y_1.9Fe_0.1O₃, Y_1.85Fe_0.15O₃ and Y_1.8Fe_0.2O₃ crystallize in tetragonal structure whereas Y_1.75Fe_0.25O₃ and Y_1.7Fe_0.3O₃ compounds crystallize in orthorhombic structure. The change in crystal system with respect to the concentration of Fe may be attributed to the variation in occupancy position of Fe³⁺ into the Y³⁺ site of Y₂O₃ system. Variation in crystal structure, surface morphology and composition was studied by micro-Raman analysis, SEM and EDX analysis. The shift in intense Raman signals from 426 to 385 cm⁻¹ confirms the change in the crystal structure of the prepared compounds. Further it is also identified that the E_g mode of vibration is the dominant in the Fe substituted compounds. The substitution of Fe in the Y₂O₃ system leads to the increase in the intensity of resonance band, which indicates a large polarisability variation in the Y_2−xFe_xO₃ compounds. Diffused reflectance studies show a red shift in energy gap values while increasing the concentration of Fe. The room temperature magnetization and electron paramagnetic resonance studies reveal that the incorporation of Fe in the Y₂O₃ system leads to magnetic phase change from diamagnetic to ferromagnetic. The electric polarization studies imply that the substitution of lower ionic radii element Fe³⁺ in the Y³⁺ site leads to distortion in the lattice and show the way to spontaneous dipole moment and it was found that the Y_1.8Fe_0.2O₃ compound exhibits the possibility of multiferroic behaviour. Therefore this paper explores the possibility of inducing ferromagnetic and ferroelectric behaviour in the Fe substituted yttrium oxide system.     

Effect of nano-TiO<Subscript>2</Subscript> addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

The effects of nano-TiO₂ particles on the interfacial microstructures and bonding strength of Sn3.5Ag0.5Cu composite solder joints in ball grid array packages with immersion Sn surface finishes have been investigated. Metallography reveals that addition of nano-TiO₂ particle retarded wicker-Cu₆Sn₅ IMC formed in the Sn3.5Ag0.5Cu composite solder joints. The thickness of the interfacial intermetallic compounds of the solder joint was reduced with increased additions of nano-TiO₂ particles (0.25–1.0 wt%), but further additions up to 1.25 wt% decreased the beneficial influence. This indicates that the presence of a small amount of nano-TiO₂ particles is effective in suppressing the growth of the intermetallic compounds layer. In addition, the shear strength of the soldered joints was improved by larger nano-TiO₂ particle additions, with the peak shear strength occurring at 1.0 wt% of nano-TiO₂ particles into the Sn3.5Ag0.5Cu solder. The fracture mode also changed with increased amounts of nano-TiO₂ particles.     

Spindlelike Y<Subscript>2</Subscript>O<Subscript>3</Subscript>:Eu<Superscript>3+</Superscript> nanorod bundles: hydrothermal synthesis and photoluminescence properties

Uniform spindlelike Y(OH)₃ nanorod bundles were successfully prepared for the first time via a simple hydrothermal method at 200 °C for 12 h with the presence of Na₂H₂EDTA · 2H₂O (EDTA). Scanning electron microscope (SEM) images show that the obtained Y(OH)₃ spindlelike nanorod bundles have a length of about 11 μm and a diameter of about 2 μm in the middle part. The nanorod bundles are composed of numerous nanorods, and all these nanorods are orientationally aligned and grow uniformly along the bundles. The individual nanorod is with typical width of about 100 nm, thickness of about 40 nm, and length longer than 1 μm. The effects of reaction temperature, reaction time, and the concentration of NaOH and EDTA on the sizes and morphologies of the products have been investigated. The possible formation mechanism of the nanorod bundles was suggested. Spindlelike Y₂O₃ nanorod bundles were obtained after thermal treatment of the as-obtained Y(OH)₃ nanorod bundles at 700 °C for 4 h. X-ray powder diffraction (XRD) results demonstrate that the as-prepared Y(OH)₃ and Y₂O₃ are attributed to hexagonal phase and cubic phase, respectively. Eu³⁺ doped Y₂O₃ nanorod bundles were also prepared and their photoluminescence (PL) properties were investigated.     

One-step thermal synthesis of binary manganese iron cyclotetraphosphate MnFeP<Subscript>4</Subscript>O<Subscript>12</Subscript>

The manganese iron cyclotetraphosphate (MnFeP₄O₁₂) was synthesized through one-step thermal synthesis at 700 °C using the mixing of manganese and iron metals and phosphoric acid in the presence of water–acetone media. Both FTIR and XRD results indicate the cyclotetraphosphate (P₄O₁₂ ⁴⁻) structure and a pure monoclinic phase with space group C2/c (Z = 4). The morphology and crystallite size for the MnFeP₄O₁₂ obtained from SEM data and X-ray line broadening show non-uniform particles and 30 ± 9 nm, respectively. The magnetic study of the synthesized MnFeP₄O₁₂ shows superparamagnetic behavior, which is important for specific application. Some physical properties of the synthesized MnFeP₄O₁₂ powder presented for the first time are comparable with those from individual M₂P₄O₁₂ (M = Mn and Fe) and a binary metal compound as CoFeP₄O₁₂.     

Preparation and Properties of MPMG YBCO Bulk with Y<Subscript>2</Subscript>O<Subscript>3</Subscript> Layer

In this study, four kinds of melt-processed YBCO samples were fabricated with the MPMG procedure. The compacted powders were located on a crucible with a buffer layer of Y₂O₃ to avoid liquid to spread on the furnace plate. Their microstructures were defined by XRD analysis and polarized light optical microscopy. The microstructure investigations indicated that the 123 grains were very big and fine and dispersed 211 particles remained in the samples. Resistivities of the samples were measured by a standard continuous dc four-probe method. Magnetization measurements were made and flux jumps were observed at a relatively higher temperature for Y1060. The critical current density, J _c , values of the samples, measured by VSM in 5 T magnetic field, exceeded 0.6×10³ A⋅cm⁻² at 77 K and 4 T.     

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

The electromigration behavior of low-melting temperature Sn-58Bi (in wt%) solder joints was investigated with a high current density between 3 and 4.5 × 10³ A/cm² between 80 and 110 °C. In order to analyze the impact of various substrate metallizations on the electromigration performance of the Sn-58Bi joint, we used representative substrate metallizations including electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), and organic solderability preservatives (OSP). As the applied current density increased, the time to failure (TTF) for electromigration decreased regardless of the temperature or substrate metallizations. In addition, the TTF slightly decreased with increasing temperature. The substrate metallization significantly affected the TTF for the electromigration behavior of the Sn-58Bi solder joints. The substrate metallizations for electromigration performance of the Sn-58Bi solder are ranked in the following order: OSP-Cu, ENEPIG, and ENIG. Due to the polarity effect, current stressing enhanced the fast growth of intermetallic compounds (IMCs) at the anode interface. Cracks occurred at the Ni₃Sn₄ + Ni₃P IMC/Cu interfaces on the cathode sides in the Sn-58Bi/ENIG joint and the Sn-58Bi/ENEPIG joint; this was caused by the complete consumption of the Ni(P) layer. Alternatively, failure occurred via deformation of the bulk solder in the Sn-58Bi/OSP-Cu joint. The experimental results confirmed that the electromigration reliability of the Sn-58Bi/OSP-Cu joint was superior to those of the Sn-58Bi/ENIG or Sn-58Bi/ENEPIG joints.