High resolution channeling contrast microscopy and channeling analysis of SiGe quantum well structures

High resolution channeling contrast microscopy (CCM) and channeling measurements were carried out to characterize SiGe quantum well structures on micron thick graded layers (i.e. virtual substrates). The virtual substrates were grown by gas source molecular beam epitaxy at a pressure of 10⁻⁵ mbar and low pressure chemical vapor deposition at 10⁻² mbar on boron doped Si(0 0 1) substrates respectively. A homoepitaxial silicon buffer layer was grown prior to the deposition. The nominal structure is a 20 nm Si_0.75Ge_0.25 layer at the surface, followed by 10 nm pure Si, 500 nm Si_0.75Ge_0.25 and a 1000 nm thick graded SiGe (0–26%) layer. RBS was used to measure the depth profiles, and angular scans around the (1 0 0) axis were carried out to assess crystal and interface quality. CCM was used to acquire depth resolved images of micron-sized lateral inhomogenities (‘cross-hatch') present on both samples.     

Room temperature migration of ion beam injected point defects in crystalline silicon

We have investigated the room temperature diffusion and trapping phenomena of ion beam generated point defects in crystalline Si by monitoring their interaction with dopants, native contaminants such as C and O, and other defects. Spreading resistance measurements show that a small fraction ( 10⁻⁷–10⁻⁶) of the defects generated at the surface by a 40 keV Si implant is injected into the bulk. These defects undergo trap-limited diffusion and produce dopant deactivation and/or partial annihilation of preexisting deep (several micron) defect markers, produced by MeV He implants. It is found that in highly pure, epitaxial Si layers, these effects extend to several microns from the surface, demonstrating a long range migration of point defects at room temperature. A detailed analysis of the experimental evidences allows us to identify the Si self-interstitials injected into the bulk as the major responsible of both dopant deactivation and partial annealing of vacancy-type defects (divacancies, phosphorus-vacancy and oxygen-vacancy) generated by the implants. Finally, a lower limit of 6 × 10⁻¹¹ cm²/s is obtained for the room temperature diffusivity of Si self-interstitials.     

Mechanism of dynamic strain aging and characterization of its effect on the low-cycle fatigue behavior in type 316L stainless steel

Low-cycle fatigue tests were carried out in air in a wide temperature range from 20 to 650 °C with strain rates of 3.2 × 10⁻⁵–1 × 10⁻² s⁻¹ for type 316L stainless steel to investigate dynamic strain aging (DSA) effect on the fatigue resistance. The regime of DSA was evaluated using the anomalies associated with DSA and was in the temperature range of 250–550 °C at a strain rate of 1 × 10⁻⁴ s⁻¹, in 250–600 °C at 1 × 10⁻³ s⁻¹, and in 250–650 °C at 1 × 10⁻² s⁻¹. The activation energies for each type of serration were about 0.57–0.74 times those for lattice diffusion indicating that a mechanism other than lattice diffusion is involved. It seems to be reasonable to infer that DSA is caused by the pipe diffusion of solute atoms through the dislocation core. Dynamic strain aging reduced the crack initiation and propagation life by way of multiple crack initiation, which comes from the DSA-induced inhomogeneity of deformation, and rapid crack propagation due to the DSA-induced hardening, respectively.     

Surface regrowth of Sb ion implanted Si(100)

Thermal regrowth of a Si(100) surface, damaged by 80 keV Sb implantation, was monitored by angular resolved photoemission (ARUPS), Rutherford backscattering (RBS) and channelling. It was found that regrowth in UHV at 650°C does not result in a well ordered surface. Annealing at higher temperatures (700–1100°C) results in densities of surface defects of (2.5 ± 0.4) × 10¹⁵ at./cm². A well ordered Si(100)2 × 1 reconstructed surface can be formed only after removal of a 10 nm thick layer by Ne ion bombardment, and heat treatment at 600°C. These observations can be explained by the formation of a surface layer with misoriented domains simultaneously with the solid phase epitaxy.     

Structural characterization of amorphous Fe–Si and its recrystallized layers

We have synthesized amorphous Fe–Si thin layers and investigated their microstructure using transmission electron microscopy (TEM). Si single crystals with (1 1 1) orientation were irradiated with 120 keV Fe⁺ ions to a fluence of 4.0 × 10¹⁷ cm⁻² at cryogenic temperature (120 K), followed by thermal annealing at 1073 K for 2 h. A continuous amorphous layer with a bilayered structure was formed on the topmost layer of the Si substrate in the as-implanted specimen: the upper layer was an amorphous Fe–Si, while the lower one was an amorphous Si. After annealing, the amorphous bilayer crystallized into a continuous β-FeSi₂ thin layer.     

Time scales of transient enhanced diffusion: free and clustered interstitials

Transient enhanced diffusion (TED) and electrical activation after nonamorphizing Si implantations into lightly B-doped Si multilayers shows two distinct timescales, each related to a different class of interstitial defect. At 700°C, ultrafast TED occurs within the first 15 s with a B diffusivity enhancement of > 2 × 10⁵. Immobile clustered B is present at low concentration levels after the ultrafast transient and persists for an extended period ( 10²–10³ s). The later phase of TED exhibits a near-constant diffusivity enhancement of ≈ 1 × 10⁴, consistent with interstitial injection controlled by dissolving {113} interstitial clusters. The relative contributions of the ultrafast and regular TED regimes to the final diffusive broadening of the B profile depends on the proportion of interstitials that escape capture by {113} clusters growing within the implant damage region upon annealing. Our results explain the ultrafast TED recently observed after medium-dose B implantation. In that case there are enough B atoms to trap a large proportion of interstitials in Si---B clusters, and the remaining interstitials contribute to TED without passing through an intermediate {113} defect stage. The data on the ultrafast TED pulse allows us to extract lower limits for the diffusivities of the Si interstitial (D_I > 2 × 10⁻¹⁰ cm²s⁻¹) and the B interstitial(cy) defect (D_Bi > 2 × 10⁻¹³ cm²s⁻¹) at 700°C.     

Structural evolution in Fe ion implanted Si upon thermal annealing

We have performed high-dose Fe ion implantation into Si and characterized ion-beam-induced microstructures as well as annealing-induced ones using transmission electron microscopy (TEM) and grazing-incidence X-ray diffraction (GIXRD). Single crystals of Si(1 0 0) substrate were irradiated at 623 K with 120 keV Fe⁺ ions to a fluence of 4 × 10¹⁷ cm⁻². The irradiated samples were then annealed in a vacuum furnace at temperatures ranging from 773 K to 1073 K. Cross-sectional TEM observations and GIXRD measurements revealed that a layered structure is formed in the as-implanted specimen with ε-FeSi, β-FeSi₂ and damaged Si, as component layers. A continuous β-FeSi₂ layer was formed on the topmost layer of the Si substrate after thermal annealing.     

Elemental dissolution study of Pu-bearing borosilicate glasses

Single-pass flow-through tests were conducted to study the effects of self-radiation damage from alpha decay on dissolution kinetics of three radiation-aged Pu-bearing (1 mass% PuO₂) borosilicate glasses over a pH interval of 9–12 at 80–88 °C. The chemical compositions of the glasses were identical except the ²³⁹Pu/²³⁸Pu isotopic ratio, which was varied to yield accumulated doses of 1.3 × 10¹⁶, 2.9 × 10¹⁷ and 2.6 × 10¹⁸ -decays/g at the time of testing. Release of Al, B, Cs, Na, Si and U to solution increased with increasing pH, whereas Ca, Pu and Sr were invariant over the pH interval. Average dissolution rates, based on B release, were identical within experimental uncertainty for all three glass compositions and increased from 0.17 ± 0.07 at pH(23 °C) 9 to 10.6 ± 2.7 (g/(m² d¹)) at pH(23 °C) 12. Release rates of Pu were 10²- to 10⁵-fold slower compared to all other elements and were not affected by isotopic composition, self-radiation damage sustained by the glass, or pH. These data demonstrate that self-radiation damage does not affect glass dissolution rates, despite exposure to internal radiation doses for >20 years.     

Influence of SHI irradiation on the formation of buried SiC

Silicon carbide (SiC) precipitates buried in Si(1 0 0) substrates were synthesized by ion implantation of 50 keV and 150 keV C⁺ ions at different fluences. Two sets of samples were subsequently annealed at 850 °C and 1000 °C for 30 min. Fourier transform infrared (FTIR) spectroscopy studies and X-ray diffraction (XRD) analysis confirmed formation of β-SiC precipitates in the samples. Ion irradiation with 100 MeV Ag⁷⁺ ions at room temperature does not induce significant change in the precipitates. It could be interpreted from the FTIR observations that ion irradiation may induce nucleation in Si + C solution created by ion implantation of C in Si. Modifications induced by swift heavy ion irradiation are found to be dependent on implantation energy of C⁺ ions.     

Irradiation effects of swift heavy ions in actinide oxides and actinide nitrides: Structure and optical properties

Actinide oxides have been used as nuclear fuels in the majority of power reactors working in the world and actinide nitrides are under investigation for the fuels of the future fast neutron fission reactors developed in Forum Generation IV. Radiation damage in actinide oxides UO₂, (U_0.92Ce_0.08)O₂, and actinide nitride UN has been characterized after irradiation with swift heavy ions. Fluences up to 3 × 10¹³ ions/cm² of heavy ions (Kr 740 Mev, Cd 1 GeV) available at the CIRIL/GANIL facility were used to simulate irradiation in reactors by fission products and by neutrons. The macroscopic effects of irradiation remains very weak compared with those seen in other ceramic oxides irradiated in the same conditions: practically no swelling can be measured and no change in colour can be observed on the irradiated part of a polished face of sintered disks. The point defects in irradiated actinide compounds have been characterized by optical absorption spectroscopy in the UV–Vis–NIR wavelength range. The absorption spectra before and after irradiation are compared, and unexpected stability of optical properties during irradiation is shown. This result confirms the low rate of formation of point defects in actinide oxides and actinide nitrides under irradiation. Actinide oxides and nitrides studied are >40% ionic, and oxidation state of the actinides seems to be stable during irradiation. The small amount of point defects produced by radiation (<10¹⁶ cm⁻²) has been identified from differences between the absorption spectrum before irradiation and the one after irradiation: point defects in oxygen or nitrogen lattices can be observed respectively in oxides and nitrides (F centres), and small amounts of U⁵⁺ would be present in all compounds.     

Defect evolution in MeV ion-implanted silicon

Lightly doped silicon samples of both n- and p-type have been implanted with low doses of H, B and Si ions using energies between 1 and 6 MeV. The resulting electrically active point defects were characterized by deep level transient spectroscopy (DLTS) and several of these defects involve oxygen and/or carbon, two major impurities in as-grown crystalline silicon. Both interstitial- and vacancy-type defects are observed; in particular, interstitial carbon is found to migrate at room temperature with a diffusion constant of 1 × 10⁻¹⁵ cm² s⁻¹ and is effectively trapped by interstitial oxygen atoms. The concentration of implantation-induced defects increases linearly with dose but the defect production decreases at high enough dose rates. This dose rate effect depends on the ion mass and is qualitatively predicted by computer simulations of the defect reaction kinetics.     

Radiation enhanced diffusion of implanted platinum in silicon guided by helium co-implantation for arbitrary control of platinum profile

The in-diffusion of platinum into a low-doped n-type float zone silicon guided and enhanced by radiation damage produced by co-implantation of helium ions was investigated. The implantation of 1 MeV platinum ions at different doses ranging from 5 × 10¹¹ to 5 × 10¹² cm⁻² was used to produce a finite source for platinum diffusion. Single and multiple energy implantation of helium ions with energies 7, 9, 11 and 13 MeV introducing different profiles of radiation defects were applied to enhance and shape the diffusion of platinum atoms performed by 20 min annealing at 725 °C in vacuum. The distribution of in-diffused platinum was studied by monitoring the acceptor level of substitutional platinum (E_C − E_T = 0.23 eV) by deep level transient spectroscopy. Results show that the helium co-implantation significantly enhances platinum diffusion and allows its control up to the depths of hundreds of micrometers. The resulting Pt_s distribution is given by the profile of radiation damage produced by helium ions while the amount of in-diffused Pt_s can be controlled by the dose of platinum implantation. It is also shown that an extra annealing at 685 °C performed prior to helium implantation substantially increases the amount of in-diffused platinum.     

The excitation power density effect on the Si nanocrystals photoluminescence

In the present work we have studied the photoluminescence (PL) behavior from Si nanocrystals (NCs) as a function of the excitation power density and annealing time. The NCs were produced in a SiO₂ matrix by Si implantations from room temperature (RT) up to 700 °C, followed by post-annealing in N₂ atmosphere at high temperature. With this aim we have changed the excitation power density (from 2 × 10⁻³ W/cm² up to 15 W/cm²) and the annealing time (from 10 min up to 15 h). The strong PL signal, which at 15 W/cm² is composed by a single-peak structure (650–1000 nm) centered at around 780 nm, expands up to 1200 nm showing a two-peak structure when measured at 20 × 10⁻³ W/cm². The peak structure located at the short wavelength side is kept at 780 nm, while the second peak, starting at around 900 nm, redshifts and increases its intensity with the implantation temperature and annealing time. The effect of the annealing time on the PL spectra behavior measured at low excitation power agrees by the first time with the Si NC growth according to quantum confinement effects.     

Effect of electric charge accumulation on low energy ion implantation in insulators

Charge accumulation at the surface of insulators during low energy ion implantation is related to two processes: ion impinging on the sample and secondary electron emission. Samples composed of a piece of Si (having the size of the ion beam) fixed on the centre of polyethylene (PE) coupons have been implanted with 2.2 keV H₂ ions to a fluence of 2 × 10¹⁶ H/cm². ERD (Elastic Recoil Detection) depth profiles of the implanted ions are shallower with an increase of the PE coupon size. The relative critical Si/PE size to repel all the incident ions is around 1.1 × 1.1 cm²/2.5 × 2.5 cm². The potential of the secondary electron suppressor has been varied from −500 V to +500 V. It changes the secondary electron distribution around the implanted area and, consequently, affects the accumulation of charges at the sample surface. When the potential is 0 V, a uniform ion implantation with little effect of charge accumulation for all sizes of PE coupons is obtained. A two-dimension model has been performed and gives a good explanation for the mechanism of the electric charge neutralisation.     

Magnetic force microscopy studies on the magnetic ordering in organic materials induced by high-energy proton irradiation

In this study, ferromagnetic microstructures in highly oriented pyrolytic graphite and superparamagnetic spots in polyimide foils were created by 2.25 MeV proton microbeam irradiation and characterized using atomic and magnetic force microscopy. For this purpose, graphite samples were irradiated with cross-like patterns of 15 μm × 15 μm size using ion fluences in the range of (0.003–2.5) × 10¹⁸ cm⁻². The irradiated crosses showed strong magnetic signals and a complex domain structure in the magnetic images depending on the geometrical dimensions of the crosses. Furthermore, polyimide foils were irradiated with microspots and fluences in the range of (0.016–3.1) × 10¹⁹ cm⁻². Magnetic force microscopy shows very strong phase shifts in these irradiated areas.     

Defect evolution during ion bombardment of amorphous Si probed by in situ conductivity measurements

In this work we use in-situ conductivity measurements during ion irradiation as a sensitive probe of the defect structure of amorphous Si. Electronic transport in amorphous Si occurs by hopping at the high density ( 10²⁰ cm⁻³ eV⁻¹) of deep lying localized states introduced by the defects in the band gap. In-situ conductivity measurements allow to follow directly the defect generation and annihilation kinetics during and after ion bombardment of the material. Amorphous Si layers, patterned to perform conductivity measurements, were annealed at 500°C in order to reduce the defect density by about a factor of 5. Defects were subsequently reintroduced by high energy ion irradiation at different temperatures (77–300 K). During irradiation the conductivity of the layer increases by several orders of magnitude and eventually saturates. Turning off the beam results in a decrease of the conductivity by a factor of 2 in times as long as a few hours even at 77 K. The effects of different ions (He, C, Si, Cu, and Au) and different ion fluxes (10⁹–10¹² ions/cm² s) on these phenomena have been explored. These data give a hint on the mechanisms of defect production and annihilation and demonstrate a strong correlation between electrical and structural defects in amorphous silicon.     

Effect of Si implantation on the microstructure of silicon nanocrystals and surrounding SiO2 layer

Si nanocrystals (Si-nc) embedded in a SiO₂ layer have been characterized by means of transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). For local Si concentration in excess  8 × 10²¹ Si⁺/cm³, the size of the Si-nc was found to be 3 nm and comparatively homogeneous throughout the whole implanted layer. For local Si concentration in excess of 2.4 × 10²² Si⁺/cm³, the Si-nc diameter ranges from 2 to 12 nm in the sample, the Si-nc in the middle region of the implanted layer being bigger than those near the surface and the bottom of the layer. Also, Si-nc are visible deeper than the implanted depth. Characterization by XPS shows that a large quantity of oxygen was depleted from the first 25 nm in this sample (also visible on TEM image) and most of the SiO₂ bonds have been replaced by Si–O bonds. Experimental and simulation results suggest that a local Si concentration in excess of 3 × 10²¹ Si/cm³ is required for the production of Si-nc.     

Interface mixing induced by swift heavy ions at metal-oxide/silicon interfaces

It was observed previously that ceramic/ceramic bilayers were very sensitive with respect to the electronic stopping power S_e, i.e. strong interface mixing, scaling with , occurred if a threshold S_ec was exceeded. The threshold seemed to be determined by the higher track formation threshold of two constituents forming the bilayer. Although no track formation has been observed in crystalline Si even for Uranium projectiles, interface mixing was observed previously for some Si-multilayers.

In this paper we report on the interface mixing of NiO, Fe₂O₃, TiO₂ on Si due to irradiation with 90–350 MeV Ar-, Kr-, Xe- and Au-ions at 80 K at fluences up to 9E15 ions/cm². Interface mixing, analyzed by means of Rutherford Backscattering Spectrometry (RBS), is found for these bilayers, too. But the threshold for intermixing is significantly higher compared to the ceramic/ceramic bilayers. This observation could be an evidence for the threshold being determined by the Si-layer. In contrast to NiO/Si and Fe₂O₃/Si, where an usual random walk mixing Δσ² = kΦ was observed, the interface broadening Δσ² for TiO₂/Si is found to scale nonlinearly with the ion fluence, which indicates that mixing is driven by a chemical solid-state reaction. At higher fluences plateaus form at the low energy Ni-edge of the RBS spectra. The plateaus indicate phase formation. X-Ray diffraction spectra does not show any evidence for new crystalline phases.     

Optical behaviour of Er doped rutile by ion implantation

Rutile single crystals were implanted at room temperature with fluences of 5 × 10¹⁵ Er⁺/cm² ions with 150 keV energy. Rutherford backscattering/channeling along the 0 0 1 axis reveals complete amorphization of the implanted region. Photoluminescence reveals the presence of an optical centre close to the intra-ionic emission of Er³⁺ in the as-implanted samples. After annealing at 800 °C in air no changes were observed in the aligned RBS spectrum. On the contrary, annealing in reducing atmosphere (vacuum) induces the epitaxy of the damage layer. These results are unexpected, since for implantations of other ions under the same conditions, epitaxial recrystallization of the damage region occurs at this temperature. On the other hand, photoluminescence studies show the presence of new Er-related optical centres with high thermal stability in the samples annealed under oxidizing conditions. Annealing at 1000 °C in vacuum leads to the complete recrystallization of the damaged region. At this temperature a large fraction of Er segregates to the surface.     

Ion-induced electron emission – monitoring the structure transitions in graphite

The temperature dependence of ion-induced electron emission yield γ under 30 keV Ar⁺ ion impacts at incidence angles θ = 0−80° under dynamically steady-state conditions has been measured for polygranular graphite POCO-AXF-5Q. The fluencies were 10¹⁸–10¹⁹ ion/cm², the temperatures varied from the room temperature (RT) to 400 °C. The RHEED has shown that same diffraction patterns correspond to a high degree of disorder at RT. At high temperature (HT), some patterns have been found similar to those for the initial graphite surfaces. The dependence γ(T) has been found to be non-monotonic and for normal and near normal ion incidence manifests a step-like increase typical for a radiation induced phase transition. At oblique and grazing incidence (θ > 30°), a broad peak was found at T_p = 100 °C. An analysis based on the theory of kinetic ion-induced electron emission connects the behavior of γ(θ,T) to the dependence of both secondary electron path length λ and primary ion ionizing path length R_e on lattice structure that drastically changes due to damage annealing.