A compact 3R-receiver module for short-haul SDH STM-16 systems

This paper describes a complete 3R optical receiver module for synchronous digital hierarchy (SDH) STM-16 short-haul systems, housed in a 20-pin dual-in-line (DIL) ceramic package. The module includes an InGaAs p-i-n photodiode, a commercial GaAs transimpedance amplifier, and a custom-made silicon bipolar frequency- and phase-locked loop (FPLL)-based clock and data recovery (CDR) circuit. The fiber pigtail is actively aligned to the photodiode by using a proprietary technology that uses a silicon-based optical submount assembly (OSA). The use of a clock recovery circuit based on an FPLL allows avoiding an external low-frequency reference clock and achieving a root-mean square (rms) jitter of 0.075 UI. The module requires two supply voltages of 5 V and -4.5 V, for a total power dissipation of 930 mW, and has a total volume below 0.75 cm³ (24.7×9.9×3 mm³). Measurements have shown full compatibility with SDH standards     

A 10 Gb/s receiver with half rate period calibration CDR and CTLE/DFE combiner

This paper presents the design of a 10 Gb/s low power wire-line receiver in the 65 nm CMOS process with 1 V supply voltage.The receiver occupies 300×500/μm2.With the novel half rate period calibration clock data recovery(CDR)circuit,the receiver consumes 52 mW power.The receiver can compensate a wide range of channel loss by combining the low power wideband programmable continuous time linear equalizer(CTLE)and decision feedback equalizer(DFE).     

A monolithic GaAs-on-Si receiver front end for optical interconnectsystems

The authors describe a monolithic technology for integrating GaAs with Si bipolar devices and demonstrate that such integration can provide improved system performance without degrading individual devices. The technology has been used to implement a 1-GHz GaAs/Si optical receiver with an equivalent input noise current density of less than 3 pA/√Hz for midband operation, and less than 4.5 pA/√Hz at 1 GHz. In this receiver an interdigitated GaAs metal-semiconductor-metal (MSM) photodetector is combined with a transimpedance preamplifier fabricated in silicon bipolar technology. The measured dark current of the GaAs/Si photodetector is 7 nA. The measured pulse response of an experimental integrated receiver is less than 550 ps FWHM. The integrated front end provides a wideband, low-noise optical receiver for use in local optical interconnections and demonstrates the successful application of integrated GaAs-on-Si technology to optoelectronics     

A 40 Gb/s Clock and Data Recovery Module with Improved Phase‐Locked Loop Circuits

A 40 Gb/s clock and data recovery (CDR) module for a fiber‐optic receiver with improved phase‐locked loop (PLL) circuits has been successfully implemented. The PLL of the CDR module employs an improved D‐type flip‐flop frequency acquisition circuit, which helps to stabilize the CDR performance, to obtain faster frequency acquisition, and to reduce the time of recovering the lock state in the event of losing the lock state. The measured RMS jitter of the clock signal recovered from 40 Gb/s pseudo‐random binary sequence (2³¹‐1) data by the improved PLL clock recovery module is 210 fs. The CDR module also integrates a 40 Gb/s D‐FF decision circuit, demonstrating that it can produce clean retimed data using the recovered clock.     

Monolithic Integration of a Folded Dipole Antenna With a 24-GHz Receiver in SiGe HBT Technology

The integration of an on-chip folded dipole antenna with a monolithic 24-GHz receiver manufactured in a 0.8-mum SiGe HBT process is presented. A high-resistivity silicon substrate (1000 Omega ldr cm) is used for the implemented circuit to improve the efficiency of the integrated antenna. Crosstalk between the antenna and spiral inductors is analyzed and isolation techniques are described. The receiver, including the receive and an optional transmit antenna, requires a chip area of 4.5 mm² and provides 30-dB conversion gain at 24 GHz with a power consumption of 960 mW.     

A Power-Efficient Clock and Data Recovery Circuit in 0.18 μm CMOS Technology for Multi-Channel Short-Haul Optical Data Communication

This paper studies the specifications of gated-oscillator-based clock and data recovery circuits (GO CDRs) designed for short haul optical data communication systems. Jitter tolerance (JTOL) and frequency tolerance (FTOL) are analyzed and modeled as two main design parameters for the proposed topology to explore the main tradeoffs in design of low-power GO CDRs. Based on this approach, a top-down design methodology is presented to implement a low-power CDR unit while the JTOL and FTOL requirements of the system are simultaneously satisfied. Using standard digital 0.18 mum CMOS technology, an 8-channel CDR system has been realized consuming 4.2 mW/Gb/s/channel and occupying a silicon area of 0.045 mm² /channel, with the total aggregate data bit rate of 20 Gb/s. The measured FTOL is plusmn3.5% and no error was detected for a 2³¹-1 pseudo-random bit stream (PRBS) input data for 30 minutes, meaning that the bit error rate (BER) is smaller than 10^-12. Meanwhile, a shared-PLL (phase-locked loop) with a wide tuning range and compensated loop gain has been introduced to tune the center frequency of all CDR channels to the desired value.     

3.5-Gb/s×4-ch Si bipolar LSI's for optical interconnections

The 3.5-Gb/s, 4-ch transmitter and receiver LSI's described here include a 5-to-1 multiplexer, a 1-to-5 demultiplexer, and analog PLL circuits that can generate high-speed clock (3.5 GHz) and retimed data. The chips make it possible to connect twenty pairs of 700-Mb/s electrical ports (14-Gb/s throughput) without any external elements even for the PLL. Both the transmitter and receiver LSI are 4.5-mm-square and are fabricated by a 40-GHz 0.5-μm Si bipolar process. The transmitter LSI dissipates 2.5 W, and the receiver LSI dissipates 3.6 W. Both have -4.5- and -2-V supply voltages     

OC-192 transmitter and receiver in standard 0.18-/spl mu/m CMOS

This paper presents the first fully integrated SONET OC-192 transmitter and receiver fabricated in a standard 0.18-/spl mu/m CMOS process. The transmitter consists of an input data register, 16-b-wide first-in-first-out (FIFO) circuit, clock multiplier unit (CMU), and 16:1 multiplexer to give a 10-Gb/s serial output. The receiver integrates an input amplifier for 10-Gb/s data, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. An on-chip LC-type voltage-controlled oscillator (VCO) is employed by both the transmitter and receiver. The chipset operates at multiple data rates (9.95-10.71 Gb/s) with functionality compatible with the multisource agreement (MSA) for 10-Gb transponders. Both chips demonstrate SONET-compliant jitter characteristics. The transmitter 10.66-GHz output clock jitter is 0.065 UI/sub pp/ (unit interval, peak-to-peak) over a 50-kHz-80-MHz bandwidth. The receiver jitter tolerance is more than 0.4 UI/sub pp/ at high frequencies (4-80 MHz). A high level of integration and low-power consumption is achieved by using a standard CMOS process. The transmitter and receiver dissipate a total power of 1.32 W at 1.8 V and are packaged in a plastic ball grid array with a footprint of 11/spl times/11 mm/sup 2/.     

A self-duty-cycled 7.2–8.5 GHz IR-UWB receiver for low power and low data rate applications

A self-duty-cycled non-coherent impulse radio-ultra wideband receiver targeted at low-power and low-data-rate applications is presented. The receiver is implemented in a 130 nm CMOS technology and works in the 7.2–8.5 GHz UWB band, which covers the IEEE 802.15.4a and 802.15.6 mandatories high-band channels. The receiver architecture is based on a non-coherent RF front-end (high gain LNA and pulse detector) followed by a synchronizer block (clock and data recovery or CDR function and window generation block), which enables to shut down the power-hungry LNA between pulses to strongly reduce the receiver power consumption. The main functions of the receiver, i.e. the RF front-end and the CDR block, were measured stand-alone. A maximum gain of 40 dB at 7.2 GHz is measured for the LNA. The RF front-end achieves a very low turn-on time (<1 ns) and an average sensitivity of ?92 dBm for a 10^?3 BER at a 1 Mbps data rate. A root-mean-square (RMS) jitter of 7.9 ns is measured for the CDR for a power consumption of 54 µW. Simulation results of the fully integrated self-duty-cycled 7.2–8.5 GHz IR-UWB receiver (that includes the measured main functions) confirm the expected performances. The synchronizer block consumes only 125 µW and the power consumption of the whole receiver is 1.8 mW for a 3% power duty-cycle (on-window of 30 ns).     

All-Optical Asynchronous Detection for a Compact Integrable Incoherent Optical CDMA System

In this paper, we investigate all-optical truly asynchronous detection without global clocking in an incoherent optical code-division multiple-access (CDMA) system. The implemented system is designed with an integrable optical source consisting of an electro-absorption modulator for pulse carving, compact coders consisting of fiber Bragg grating arrays for encoding and decoding, and receiver consisting of an all-optical thresholder for data and clock recovery. We compare three detection schemes: (1) synchronous detection with data from a photodetector and clock from an external source; (2) asynchronous detection with data and clock from the all-optically thresholded signal received by a clock and data recovery (CDR) unit; and (3) asynchronous detection with data from a photodetector and clock extracted from the all-optically thresholded signal using CDR. Error-free transmission is obtained for detection schemes (1) and (3). A combination of all-optical thresholding and CDR technology is demonstrated in an optical CDMA system for the first time.     

A low-voltage 5.1-5.8-GHz image-reject receiver with wide dynamicrange

A monolithic 5-6-GHz band receiver, consisting of a differential preamplifier, dual doubly balanced mixers, cascaded injection-locked frequency doublers, and a quadrature local oscillator generator and prescaler, realizes over 45 dB of image-rejection in a mature 25-GHz silicon bipolar technology. The measured single sideband (50 Ω) noise figure is 5.1 dB with an IIP3 of -4.5 dBm and 17-dB conversion gain at 5.3 GHz. The 1.9×1.2 mm² IC is packaged in a standard 32-pin ceramic quad flatpack and consumes less than 50 mW from a 2.2-V supply     

An integrated 0.35 μm CMOS optical receiver with clock and data recovery circuit

This paper presents an integrated optical receiver that operates at 1 Gb/s in a standard 0.35 μm digital CMOS technology. The receiver consists of an integrated CMOS photodetector, a transimpedance amplifier (TIA) followed by a post-amplification stage and a dual-loop clock and data recovery (CDR) circuit. At a wavelength of 860 nm, the circuit requires an average light input power of −19.7 dBm to obtain a bit-error rate (BER) of 10⁻¹². The complete receiver consumes a total power of approximately 155 mW from a 3.3-V supply. The core circuit area is 0.85×1.32 mm².     

A single-chip dual-band tri-mode CMOS transceiver for IEEE 802.11a/b/g wireless LAN

A single-chip dual-band tri-mode CMOS transceiver that implements the RF and analog front-end for an IEEE 802.11a/b/g wireless LAN is described. The chip is implemented in a 0.25-/spl mu/m CMOS technology and occupies a total silicon area of 23 mm/sup 2/. The IC transmits 9 dBm/8 dBm error vector magnitude (EVM)-compliant output power for a 64-QAM OFDM signal. The overall receiver noise figure is 5.5/4.5 dB at 5 GHz/2.4 GHz. The phase noise is -105 dBc/Hz at a 10-kHz offset and the spurs are below -64 dBc when measured at the 5-GHz transmitter output.     

An Optical Interconnect Transceiver at 1550 nm Using Low-Voltage Electroabsorption Modulators Directly Integrated to CMOS

A low-voltage, 90-nm CMOS optical interconnect transceiver operating at 1550-nm optical wavelength is presented. This is the first demonstration of a novel optoelectronic modulator architecture (the quasi-waveguide angled-facet electroabsorption modulator) in a system. It features a simple electronic packaging via flip-chip bonding to silicon. Devices have a broad optical bandwidth, are arrayed two dimensionally, and feature surface normal, spatially separated, and misalignment-tolerant optical ports. The modulators are driven with a novel pulsed-cascode driver capable of supplying an output-voltage swing of 2 V (twice the nominal 1-V CMOS supply) without overstressing thin-oxide core CMOS devices. At the receiver side, a sensitivity of -15.2 dBm is obtained with an integrating/double-sampling front end. The transceiver includes clock generation and recovery circuitry that enables a data serialization factor of five. At a maximum data rate of 1.8 Gb/s, the optical transmitter, receiver, and clocking circuitry consume 12.6, 4.5, and 6.5 mW, respectively, for a total link electrical power dissipation of 23.6 mW. To the best of our knowledge, this is the first demonstration of an interconnect transceiver operating at 1550 nm with a III-V output device directly integrated to the CMOS.     

A CMOS 10-gb/s SONET transceiver

This paper presents a single-chip SONET OC-192 transceiver (transmitter and receiver) fabricated in a 90-nm mixed-signal CMOS process. The transmitter consists of a 10-GHz clock multiplier unit (CMU), 16:1 multiplexer, and 10-Gb/s output buffer. The receiver consists of a 10-Gb/s limiting input amplifier, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. Both transmit and receive phase-locked loops employ a 10-GHz on-chip LC voltage-controlled oscillator (VCO). This transceiver exceeds all SONET OC-192 specifications with ample margin. Jitter generation at 10.66-Gb/s data rate is 18 mUI/sub pp/ (unit interval, peak-to-peak) and jitter tolerance is 0.6 UI/sub pp/ at 4-MHz jitter frequency. This transceiver requires 1.2V for the core logic and 1.8 V for input/output LVDS buffers. Multiple power supply domains are implemented here to mitigate crosstalk between receiver and transmitter. The overall power dissipation of this chip is 1.65 W.     

A 40-Gb/s integrated clock and data recovery circuit in a 50-GHz fT silicon bipolar technology

Clock and data recovery (CDR) circuits are key electronic components in future optical broadband communication systems. In this paper, we present a 40-Gb/s integrated CDR circuit applying a phase-locked loop technique. The IC has been fabricated in a 50-GHz f _T self-aligned double-polysilicon bipolar technology using only production-like process steps. The achieved data rate is a record value for silicon and comparable with the best results for this type of circuit realized in SiGe and III-V technologies     

A 14-mW 6.25-Gb/s Transceiver in 90-nm CMOS

This paper describes a 6.25-Gb/s 14-mW transceiver in 90-nm CMOS for chip-to-chip applications. The transceiver employs a number of features for reducing power consumption, including a shared LC-PLL clock multiplier, an inductor-loaded resonant clock distribution network, a low- and programmable-swing voltage-mode transmitter, software-controlled clock and data recovery (CDR) and adaptive equalization within the receiver, and a novel PLL-based phase rotator for the CDR. The design can operate with channel attenuation of -15 dB or greater at a bit-error rate of 10^-15 or less, while consuming less than 2.25 mW/Gb/s per transceiver.     

A 40 Gb/s CMOS Serial-Link Receiver With Adaptive Equalization and Clock/Data Recovery

This paper presents a 40 Gb/s serial-link receiver including an adaptive equalizer and a CDR circuit. A parallel-path equalizing filter is used to compensate the high-frequency loss in copper cables. The adaptation is performed by only varying the gain in the high-pass path, which allows a single loop for proper control and completely removes the RC filters used for separately extracting the high- and low-frequency contents of the signal. A full-rate bang-bang phase detector with only five latches is proposed in the following CDR circuit. Minimizing the number of latches saves the power consumption and the area occupied by inductors. The performance is also improved by avoiding complicated routing of high-frequency signals. The receiver is able to recover 40 Gb/s data passing through a 4 m cable with 10 dB loss at 20 GHz. For an input PRBS of 2 $^{7}-$1, the recovered clock jitter is 0.3 ps$_{rm rms}$ and 4.3 ps$_{rm pp}$. The retimed data exhibits 500 mV $_{rm pp}$ output swing and 9.6 ps$_{rm pp}$ jitter with ${hbox{BER}}≪ 10^{-12}$ . Fabricated in 90 nm CMOS technology, the receiver consumes 115 mW , of which 58 mW is dissipated in the equalizer and 57 mW in the CDR.      

InP DHBT-Based Monolithically Integrated CDR/DEMUX IC Operating at 80 Gbit/s

In this paper, a monolithically integrated clock and data recovery (CDR) circuit with 1:2 demultiplexer (DEMUX), which is intended for use in 80 Gbit/s optical fiber links, is presented. The integrated circuit (IC) is manufactured using an in-house InP double heterostructure bipolar transistor (DHBT) technology, exhibiting cut-off frequency values of more than 220 GHz for both$f_T$and$f_max $. The CDR circuit in the topology of a phase-locked loop (PLL) is mainly composed of a half-rate linear phase detector including a 1:2 demultiplexer (DEMUX), a loop filter, and a voltage-controlled oscillator (VCO). Hence, the corresponding architecture of each of these components as well as the applied circuit design technique are extensively addressed. Concerning the performance achieved by the CDR/DEMUX IC, the recovered and demultiplexed 40 Gbit/s data from an 80 Gbit/s input signal feature clear eye opening with a signal swing as high as 600$hboxmV_ pp$. The extracted 40 GHz clock signal shows a phase noise as low as$- hbox98~dBc/hboxHz$at 100 kHz offset frequency. The corresponding rms jitter amounts to 0.37 ps while the peak-to-peak jitter is as low as 1.66 ps. At a single supply voltage of$-hbox4.8~V$, the power consumption of the full CDR/DEMUX IC amounts to 1.65 W. To the authors' best knowledge, this work demonstrates the first CDR circuit at the achieved data rate, regardless of all the competing semiconductor technologies.     

A 2.5-3.125-Gb/s quad transceiver with second-order analog DLL-based CDRs

This paper describes a 2.5-3.125-Gb/s quad transceiver with second-order analog delay-locked loop (DLL)-based clock and data recovery (CDR) circuits. A phase-locked loop (PLL) is shared between receive (RX) and transmit (TX) chains. On each RX channel, an amplifier with user-programmable input equalization precedes the CDR. Retimed data then goes to an 1:8/1:10 deserializer. On the TX side, parallel data is serialized into a high-speed bitstream with an 8:1/10:1 multiplexer. The serial data is introduced off-chip through a high-speed CML buffer having single-tap pre-emphasis. Proposed DLL-based CDR can tolerate large frequency offsets with no jitter tolerance degradation due to its second-order PLL-like nature. Also, this study introduces an improved charge-pump and an improved phase-interpolator. Fabricated in a 0.15-/spl mu/m CMOS process, the 1.9-mm/sup 2/ transceiver front-end operates from a single 1.2-V supply and consumes 65-mW/channel of which 32 mW is due to the CDR. CDR jitter generation and high-frequency jitter tolerance are 5.9 ps-rms and 0.5 UI, respectively, for 3.125 Gb/s, 2/sup 23/-1 PRBS input data with 800-ppm frequency offset.