燃机压气机导叶轴用钢化学镀Ni–P合金

在导叶轴用钢12Cr12Mo表面化学镀制备Ni-P合金镀层,研究了镀后热处理温度对Ni-P合金镀层组织结构、显微硬度和耐磨性的影响。结果表明,Ni-P合金镀层与基体紧密结合,无裂纹、孔隙等缺陷。在400℃下热处理1h后,Ni-P合金镀层由非晶态结构转变为以Ni₃P稳定相为主的晶体结构,显微硬度高达916 HV,耐磨性良好。     

化学镀Ni-Cu-P合金镀层耐蚀性研究

采用极化曲线和交流阻抗法,与Ni-P合金镀层对比,研究了化学镀Ni-Cu-P合金镀层在3.5%NaCl水溶液中的电化学行为。极化曲线结果表明,化学镀Ni-Cu-P合金镀层的自腐蚀电流密度(4.037μA/cm2)远远小于Ni-P合金镀层,说明Ni-Cu-P合金镀层的耐蚀性能比Ni-P合金镀层好。在交流阻抗谱图中,化学镀Ni-Cu-P合金镀层在整个浸泡过程中仅出现一个时间常数的单容抗弧,镀层电阻不断的增大,表明镀层有钝化膜不断生成。     

磷化法制备Ni x P y 及其复合材料光解水性能

磷化镍具有Ni₃P、Ni₁₂P₅、Ni₂P、Ni₅P₄等多种晶相,深入研究各个晶相的制备规律和稳定存在条件对开发磷化镍基催化材料至关重要。本文系统考察了磷化时间、磷化温度、Ni/P摩尔比、磷化气速和磷源种类对制备晶相的影响。结果发现,以Ni₃P为前体、红磷为磷源时,可以得到Ni₅P₄、Ni₂P、Ni₁₂P₅三种晶相;以次磷酸盐为磷源时只能得到Ni₂P和Ni₁₂P₅晶相。当以红磷为磷源时,反应温度是影响晶相的主要因素,磷化温度为500℃、600℃和800℃时分别得到Ni₅P₄、Ni₂P和Ni₁₂P₅晶相。将制备的Ni₃P、Ni₂P、Ni₁₂P₅和Ni₅P₄作为助剂,与CdS复合制备光催化复合材料,得到的4种Ni _x P _y /CdS复合材料均表现出良好的光解水制氢性能,Ni₅P₄/CdS表现出最优的产氢能力,为CdS的5.4倍。表征结果证明,引入Ni _x P _y 能够有效抑制反应过程中CdS的载流子复合,提升其光解水反应活性。     

黑磷制备磷化镍复合材料及高性能超级电容器应用

黑磷(BP)纳米片在超级电容器电极材料上有潜在的应用前景，然而纯黑磷超级电容器的储能能力不能令人满意。磷化镍(Ni₂P)可以提高黑磷超级电容器的储能性能，但其制备相对困难且容易发生团聚。为了解决这些问题，通过溶剂热法一步在BP表面生长出分散均匀的磷化镍，合成Ni₂P/BP异质结。结果表明，Ni₂P/BP超级电容器的比电容高度依赖于镍的质量浓度及黑磷的形貌。随着合成温度的升高，镍的质量浓度逐渐增加，但黑磷纳米片破碎逐渐严重，导致超级电容器性能出现振荡效应。当Ni₂P/BP的合成温度为100℃时，Ni₂P/BP超级电容器的比电容达到最大，约为纯BP超级电容器的3倍以上。     

电沉积Ni-P合金镀层耐蚀性的研究

研究了不同磷含量的Ni-P合金镀层在NaCl介质中的耐腐蚀性能。通过浸泡实验,得出不同磷含量的Ni-P合金镀层在w（NaCl）=5%和饱和NaCl溶液中的腐蚀数据,同时还与纯镍镀层、化学镀Ni-P合金镀层、1Cr18Ni9Ti不锈钢以及A3钢进行了比较。     

玻璃纤维/环氧树脂复合材料表面金属化工艺研究

提出一种在玻璃纤维/环氧树脂复合材料表面化学镀镍的简化工艺,首先在复合材料表面引入含有镀镍短纤维的过渡层,复合材料与过渡层共固化成型。通过机械粗化、酸化、化学镀工艺成功地在玻璃纤维/环氧树脂复合材料表面沉积一层连续致密的Ni-P镀层。采用超景深显微镜观察化学镀后镀层的表面形貌,并采用SEM对镀层截面特征进行观测。系统地研究了化学镀时间、装载量对镀层表面形貌、镀层厚度与镀层沉积速度的影响规律,并测量了复合材料/镍镀层界面结合强度。试验结果表明,当化学镀时间为8 h、装载量为1.25 dm2/L时,镀层厚度能达到38.96μm,镀层结合强度达到8.45 MPa。     

新的铝合金表面化学镀镍磷合金前处理工艺及镀层性能的研究续完

3.2 镀层性能的研究 3.2.1 化学镀Ni-P合金层的沉积速度和Ni-P合金层中磷的含量化学镀Ni-P合金层沉积速度平均为28μm/h。Ni-P层中磷的含量平均为10%,镍的含量为90%。 3.2.2 Ni-P合金层与基体间的结合力测试     

镍-铜-磷化学镀层在硫酸溶液中的腐蚀行为

为了提高Ni-P化学镀层的抗腐蚀性能,在由NiSO4·6H2O25 g/L、NaH2PO2·H2O 25 g/L、C6H5O7Na3·2H2O 12 g/L和CH3COONa20 g/L组成的Ni-P镀液中加入不同质量浓度的无水硫酸铜,制备了Ni-Cu-P镀层.通过浸泡、动电位极化和电化学阻抗谱(EIS)考察了Ni-Cu-P和Ni-P镀层在5％(质量分数)H2SO4溶液中的耐蚀性,采用扫描电镜(SEM)观察了镀层的表面形貌.结果表明,加入CuSO4后得到的Ni-Cu-P镀层比Ni-P镀层结晶更细小、致密,在硫酸溶液中表现出更好的抗腐蚀性能.当镀液中硫酸铜质量浓度为0.50 g/L时,得到的Ni-Cu-P镀层晶粒最小、致密性最好,其膜电阻和电荷转移电阻达到最大,分别是Ni-P镀层的4倍和32倍.     

化学镀在换热表面强化滴状凝结、阻垢、耐蚀研究进展

从换热器实际问题出发,分别回顾了化学镀层强化凝结换热、阻垢、耐蚀3个方面的研究进展。在强化凝结换热方面,阐述了以Ni-P化学镀为基础的界面表面能、镀层非晶含量、温度、压力以及添加PTFE等物质对在换热界面形成滴状凝结的影响。在化学镀阻垢方面,介绍了污垢的生长过程,讨论了镀层非晶含量、实验条件、梯度镀层以及添加W、BN、Sn、Cu等元素对镀层阻垢性能的影响。在化学镀耐腐蚀研究方面,阐述了镀层磷含量、梯度镀层、表面活性剂、镀液pH值、温度以及添加Cu、PTFE等元素对镀层抗腐蚀性能的影响。并根据实际生产情况,提出对镀层强化凝结换热、阻垢和耐腐蚀3个方面特性相互间的影响关系进行研究。同时提出,为了推进镀层技术工业化发展,还应解决镀层长效性的问题。     

排球收纳车基材表面化学镀Ni-P/Cr_3C_2复合镀层

在排球收纳车用Q235钢表面制备了化学镀Ni-P/Cr_3C_2复合镀层,并对化学镀Ni-P/Cr_3C_2复合镀层的厚度、表面粗糙度、硬度、耐蚀性及表面形貌进行了分析。结果表明:化学镀NiP/Cr_3C_2复合镀层的厚度和表面粗糙度分别约为8μm和0.835μm,满足中度腐蚀环境的要求。化学镀Ni-P/Cr_3C_2复合镀层呈现出块状颗粒形貌,颗粒之间夹杂着碳化铬,大大提高了化学镀NiP/Cr_3C_2复合镀层的硬度和耐蚀性。     

Electrochemical impedance studies of modified Ni-P and Ni-Cu-P deposits in alkaline medium

Ni-P and Ni-Cu-P deposits were supported over the commercial carbon using the electroless plating technique. The formed samples were characterized by applying SEM, XRD and EDX analyses. An amorphous Ni-P surface was obtained with 73.70 wt% Ni and 11.45 wt% P. The addition of copper to the plating bath reduces the deposited amount of nickel and phosphorus. The electrochemical performance of these deposits has been investigated in 0.1 M KOH solution using electrochemical impedance spectroscopy (EIS) measurements. The effect of pH, deposition time and temperature of the plating bath on the impedance characteristics of the two deposits was studied. It was found that the resistance (R_T) and relative thickness (1/C_T) of the two coatings in 0.1 M KOH solution increase with increasing either pH or deposition time or temperature of the plating bath. Our results indicate that Ni-Cu-P deposit has more corrosion resistance and lower corrosion current density (i_corr) value than Ni-P deposit under different conditions. EIS results were well confirmed by potentiodynamic polarization and cyclic voltammetry techniques.     

钢基体的Ni-P和Ni-Cu-P合金镀层的性能研究

对比了Ni-P合金镀层和Ni-Cu-P合金镀层的耐蚀性及硬度。研究了热处理温度及保温时间对两种镀层耐蚀性的影响。结果表明:与Ni-P合金镀层相比,Ni-Cu-P合金镀层表面更加致密,耐蚀性更好;当热处理温度为200~300℃时,Ni-P合金镀层和Ni-Cu-P合金镀层的硬度均随保温时间的延长而增大;当热处理温度为400℃时,Ni-P合金镀层和Ni-Cu-P合金镀层的硬度均随保温时间的延长先增大后减小。     

Electromagnetic shielding and corrosion resistance of electroless Ni‐P and Ni‐P‐Cu coatings on polymer/carbon fiber composites

In order to study electrical properties, especially the electromagnetic interference (EMI) shielding property of ternary Ni‐P‐Cu plated polyether ether ketone/carbon fiber composites (CFs/PEEK) and their dependence on Cu content of the coating, electroless Ni‐P coating was first deposited on CFs/PEEK to obtain the optimum conditions for deposition rate, then a small quantity of CuSO₄•5H₂O (0.1∼0.4 g/L) was added in the electroless nickel‐based alloy plating (ENP) bath to investigate the influence of Cu content on the deposition rate and coating characterizations. The EMI shielding effectiveness (SE) was evaluated and corrosion resistance was characterized by electrochemical polarization measurement. It was found that coating phase change from amorphous to a mixture of amorphous and microcrystalline phases with the increase of Cu²⁺ concentration. Due to the neat morphology and uniform amorphous structure, the optimum coating Ni‐P‐2.2 wt% Cu obtained at the 0.2 g/L Cu²⁺ in the bath owns the best corrosion resistance, EMI SE and the lowest surface resistance. POLYM. COMPOS., 36:923–930, 2015. © 2014 Society of Plastics Engineers     

阴离子对化学镀Ni-Cu-P合金耐蚀性的影响

采用化学镀工艺在铜基体表面沉积Ni-Cu-P镀层,利用扫描电镜(SEM)和电子能谱(EDX)对Ni-Cu-P镀层的形貌和成分进行了分析。同时,采用极化曲线(PC)和交流阻抗(EIS)研究了常温下Ni-Cu-P镀层在0.1 mol/L,0.001 mol/L的NaCl,Na2SO4,NaNO3和NaNO2电解质中的耐蚀性能。结果表明,在较高浓度下,氯离子和硫酸根离子的活性吸附作用能够促进镀层中Ni的溶解,从而也加速了镀层的表面钝化,在较低浓度下,氯离子和硫酸根离子的活性吸附作用减弱,镀层很难钝化;硝酸根离子和亚硝酸根离子在高浓度和低浓度下均很难使镀层钝化。     

镀液组成对刷镀(Ni-P)-SiO2工艺的影响

研究了(Ni-P)-SiO2刷镀液中Ni2 离子、NaH2PO2、SiO2微粒、金属盐的比例、温度等因素对刷镀(Ni-P)-SiO2工艺的影响.结果表明,在刷镀(Ni-P)-SiO2工艺中,选择适当刷镀液组成,刷镀层沉积速率和镀层质量明显提高,并由此得出了刷镀(Ni-P)-SiO2合金工艺的最佳镀液组成.     

丁二酸钠对化学镀Ni-P合金镀层的影响

采用化学镀方法在Q235钢表面施镀Ni-P合金镀层,研究丁二酸钠对Ni-P合金镀层沉积速率、组织和P含量的影响,探究镀液中丁二酸钠的最佳浓度。结果发现,当Ni-P合金镀液中丁二酸钠质量浓度达到18 g/L时,镀层连续致密,表面平整,胞状组织尺寸较小,镀层的质量最好;随着丁二酸钠用量的增加,沉积速率呈现先增大后减小的趋势,当丁二酸钠质量浓度达到18 g/L时,沉积速率达到最大值12.785μm/h;镀层中P的质量分数为10.87%。     

氮化硼微粒化学镀镍-磷合金工艺研究

通过化学镀的方法在立方氮化硼微粒表面镀覆一层连续、均匀的Ni-P合金镀层.运用扫描电子显微镜结合X-射线能谱仪和X-射线衍射仪对镀层的形貌和结构进行了分析.结果表明,表面镀覆的是非晶态Ni-P合金镀层,镀层P的质量分数在13.09%,属于高磷Ni-P合金镀层.     

Failure mechanism of a (Ni,Pt)Al/EB-PVD 8YSZ deposited on substrate with different curvature signs in thermal shock test

A thermal shock test was conducted on an 8 wt% Y₂O₃ stabilized ZrO₂ electron beam-physical vapor deposited (EB-PVD 8YSZ) thermal barrier coating with a (Ni, Pt)Al bond coating on the substrate with different curvature signs. The microstructural evolution and durability have been characterized. The microstructure of the top ceramic layer is strongly dependent on the substrate geometry. The results of the thermal shock test indicated that the sample with a positive curvature exhibits mixed mode spalling by the linking of cracks at TBC/TGO interface and TGO/BC interface. Spallation occurs primarily at the TGO/BC interface and inside the bond coats near to the surface of bond coats in planar samples. The spalling occurs principally at the TGO/BC interface in specimens with a negative curvature. The failure mechanism is elucidated integrate with stress analysis.     

纳米CeO2搀杂对Ni-P化学镀层微观结构与耐蚀性能的影响

Ni-P and its nano-CeO₂ doped coating were electrolessly prepared in acidic condition,and their microstructure and anti-corrosion property were studied and compared.Scanning electronic microscopy（SEM）,transmission electronic microscopy（TEM）,X-ray diffraction spectrometer（XRD）and differential scanning calorimeter（DSC）were used to examine surface morphology and microstructure of coatings.The results showed that Ni-P coating had partial amorphous structure mixed with nano-crystals,while the Ni-P/CeO₂ coating had perfect amorphous structure.Upon heating,Ni₃P precipitation and Ni crystallization took place in both coatings but at different temperatures of phase change.In addition,the Ni-P/CeO₂ coating had sintered phase of NiCe₂O₄ spinels.The anti-corrosion property and passivity were improved in the CeO₂-doped coating because it was less liable to undergo localized corrosion and had a slower corroding rate than its CeO₂-free counterpart.During the co-deposition process,some Ceⁿ⁺（n=3,4）ions might be adsorbed to the metal/solution electrical double layer and hinder nickel deposition.Ni-P/CeO₂ coating’s perfect amorphous structure was probably due to the hindered crystal-typed deposition of nickel and the promoted deposition of phosphorous.     

Effect of surface preparation on electroless Ni‐P plating on carbon fiber‐Reinforced Cyanate Ester Resin Laminate

The effect of surface preparation on electroless Ni‐P plating on carbon fiber reinforced cyanate ester resin laminate has been investigated. Three different surface chemical etching ways were performed, namely: (i) hexanediamine etching, (ii) hexanediamine followed by aniline etching, and (iii) aniline etching. The results indicated that Ni‐P coating on hexanediamine etching or hexanediamine followed by aniline etching pretreated carbon fiber reinforced cyanate ester resin laminates usually tended to be cracked, veined, and low adhesion, while aniline etched laminates showed a homogenous roughing surface which is suitable for subsequently uniform, cellular, and good adhesion Ni‐P plating. POLYM. COMPOS., 37:1161–1166, 2016. © 2014 Society of Plastics Engineers