MOSFET热载流子退化/寿命模型参数提取

基于MOSFET热载流子可靠性物理,并结合电应力条件下热载流子退化特征量△Ids/Idso、Isub等实测数据的拟合处理,发展了可表征退化物理意义的衬底电流与退化/寿命参数提取模型;进而由自动测试ATE与CAD技术相结合的监测系统,实现了载流子速度饱和临界电场Ecrit、有效导电长度Lc和寿命因子H、m、n提取.实验研究结果表明,模型及提取参数合理可信,并可进一步应用于MOSFET及其电路的退化/寿命模拟预测.     

动态应力下MOS器件热载流子效应研究

研究了 MOS器件中的热载流子效应 ,在分析了静态应力下 MOSFET寿命模型的基础上 ,提出了动态应力条件下 MOSFET的寿命模型。此外 ,还研究了沟道热载流子的产生和注入与器件偏置条件的关系 ,讨论了热载流子效应对电路性能的影响。通过对这些失效因素的研究和通过一定的再设计手段 ,可以减少热载流子效应导致的器件退化     

热载流子效应对CCD片上放大器寿命的影响

针对CCD片上放大器的寿命进行了研究。通过设计独立的MOSFET,使用衬底电流模型进行热载流子效应分析,研究其特性参数Gm退化量与退化时间关系,由此评价组成CCD片上放大器的寿命。研究结果表明,CCD片上放大器寿命随着栅长的减小而降低,制作LDD结构可提高CCD片上放大器寿命。     

异质栅MOSFET热载流子效应的研究

异质栅MOSFET器件的栅极由具有不同功函数的两种材料拼接而成,能够提高载流子输运速度、抑制阈值电压漂移等.文中比较了异质栅MOSFET和常规MOSFET的热载流子退化特性.通过使用器件数值模拟软件MEDICI,对能有效监测热载流子效应的参数,例如电场、衬底电流和栅电流等参数进行仿真.将仿真结果与常规MOSFET对比,从抑制热载流子效应方面验证了新结构器件的高性能.     

DC应力n-MOSFET热载流子退化的1/f噪声特性

研究了DC应力n.MOSFET热载流子退化的Sfγ噪声参量.提出了用噪声参数和Sfγ表征高、中、低三种栅应力下n-MOSFET抗热载流子损伤能力的方法.进行了高、中、低三种栅压DC应力下热载流子退化实验.实验结果和本文模型符合较好.     

DC应力n-MOSFET热载流子退化的1/f噪声特性

研究了DC应力n.MOSFET热载流子退化的Sfγ噪声参量.提出了用噪声参数和Sfγ表征高、中、低三种栅应力下n-MOSFET抗热载流子损伤能力的方法.进行了高、中、低三种栅压DC应力下热载流子退化实验.实验结果和本文模型符合较好.     

一种深亚微米MOSFET高频噪声模型

基于深亚微米MOSFET的短沟道效应(迁移率退化、热载流子效应、体电荷效应、沟道长度调制效应等),提出了一种高频沟道噪声分析模型.该分析模型不仅具有较高的精确性,而且只包括MOSFET的工艺参数和电学参数,不含有微积分和拟合参数,较大地提高了MOSFET高频噪声模型的易用性.根据MOSFET的高频等效电路,得出了MOSFET的噪声系数模型.实验结果证明,提出的深亚微米MOSFET高频噪声模型的仿真结果与测试结果的平均误差不到0.4 dB,并与其他高频沟道噪声分析模型进行了比较.     

MOSFET的热载流子损伤及其退火

对国内常规54HC工艺制作的PMOSFET进行了F-N热载流子注入损伤实验,研究了MOSFET跨导、阈电压等参数随热载流子注入的退化规律,特别是从微观氧化物电荷和界面态变化对阈电压影响角度,对国内外较少见报道的MOSFET热载流子损伤在室温和高温(100°C)下的退火特性进行了研究,并从该角度探讨了MOSFET热载流子注入产生氧化物电荷和界面态的特性。     

通过直接栅电流测量研究PMOSFET's热载流子损伤

通过直接栅电流测量方法研究了热载流子退化和高栅压退火过程中PMOSFET's热载流子损伤的生长规律.由此,给出了热载流子引起PMOSFET's器件参数退化的准确物理解释.并证明了直接栅电流测量是一种很好的研究器件损伤生长和器件参数退化的实验方法.     

通过直接栅电流测量研究PMOSFET's热载流子损伤

通过直接栅电流测量方法研究了热载流子退化和高栅压退火过程中PMOSFET's热载流子损伤的生长规律.由此,给出了热载流子引起PMOSFET's器件参数退化的准确物理解释.并证明了直接栅电流测量是一种很好的研究器件损伤生长和器件参数退化的实验方法.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.