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1.
Microsystem technologies are the basis for the realization of miniaturized, intelligent embedded systems. Microsystems are characterized by the optimized application of “microtechnologies” and “systems engineering concepts”. Microtechnologies, e. g microelectronics, micromechanics and microoptics are those fabrication technologies which enable miniaturization. Packaging and interconnect technologies enable the configuration of individual components, innovative concepts for system architectures and signal processing enable the integration and optimization of components into systems and finally the concepts of systems engineering allow for the complex design process by attaching methodologies and computer aided tools for planning, specification, modeling, simulation, design, verification and test. Designing, verifying and testing microsystems and microsystem components will not be feasible without the intensive use of design methodologies and supporting computer aided design tools (CAE, CAD, CASE, CAT, ...)  相似文献   

2.
This paper lays the groundwork for defining the components needed to get clean alternating phase-shifting masks (altPSM) that ensure the manufacturability of subwavelength circuit designs. The authors create an abstract set of rules that can be used to advantage in various IC CAD tool domains. A new methodology and algorithm are presented that can quickly and easily integrate altPSM into existing and future tools earlier in the IC design flow. Finally, experimental results show how the methodology and algorithm is used to debug process-aware designs and make them altPSM-compliant.Pradiptya Ghosh has a M.S. (Computer and System Engg) from Rensselaer Polytechnic Institute, New York and a B.Engg (Computer Engineering) from Delhi University, India. He is currently working on physical syntesis tool for FPGA. Previously he has worked on alternating PSM methodology and developed tools for integrating it into DFM flow. He has worked on timing and routability driven RTL floorplanning for his thesis. He did some work on global routing algorithms and their application to datapaths at SUN Microsystems and have couple of patents on them. He has also been an architect for the CAD framework and datamodel at Sun Microsystems and have couple of patent pending in that domain. He has also worked previously at Cadence at board level tool development and at Intel prototyping a floorplanning tool.  相似文献   

3.
With the rapid evolution of integrated circuit (IC) technology to larger and more complex circuits, new approaches are needed for the design and verification of these very-large-scale integrated (VLSI) circuits. A large number of design methods are currently in use. However, the evolution of these computer aids has occurred in an ad hoc manner. In most cases, computer programs have been written to solve specific problems as they have exist and no truly integrated computer-aided desisn (CAD) systems exist for the design of IC's. A structured approach both to circuit desisn and to circuit verification, as well as the development of integrated design systems, is necessary to produce cost-effective error-free VLSI circuits. This paper presents a review of the CAD techniques which have been used in the design of IC's, as well as a number of design methods to which the application of computer aids has proven most successful. The successful application of design-aids to VLSI circuits requites an evolution from these techniques and design methods.  相似文献   

4.
This survey presents an overview of recent advances in the state of the art for computer-aided design (CAD) tools for analog and mixed-signal integrated circuits (ICs). Analog blocks typically constitute only a small fraction of the components on mixed-signal ICs and emerging systems-on-a-chip (SoC) designs. But due to the increasing levels of integration available in silicon technology and the growing requirement for digital systems to communicate with the continuous-valued external world, there is a growing need for CAD tools that increase the design productivity and improve the quality of analog integrated circuits. This paper describes the motivation and evolution of these tools and outlines progress on the various design problems involved: simulation and modeling, symbolic analysis, synthesis and optimization, layout generation, yield analysis and design centering, and test. This paper summarizes the problems for which viable solutions are emerging and those which are still unsolved  相似文献   

5.
为了有效地对OEMCM 进行设计和封装, 在实际工作中迫切需要一种集成化的CAD 系统。通过对OEMCM 系统设计过程的研究, 提出了一种集成的层次化的OEMCMCAD 软件的系统结构。  相似文献   

6.
本文叙述了一种新的集成电路计算机辅助设计框架的设计思想:提出了符合集成电路设计需要的新的四维数据模型,并设计了面向对象的工程数据库;提出了便于在框架中集成已开发完成的IC设计工具的松耦合的集成方式。讨论了用户管理、设计数据的版本管理以及在层次设计、多用户环境下的并发控制等在框架实施中的问题,提出了处理方案。基于上述思想,在HP/800工作站UNIX操作系统下开发了集成电路设计框架EOIDE(Entity-OrientedICIntegratedDevelopmentEnviron-ment),并在框架上装入了单层门阵列设计工具(ENYA),设计了单层门阵列电路,结果良好。  相似文献   

7.
Current trends in the development of electronics systems show that the provision of thin flexible components and semiconductors plays a decisive role in the steadily progressing development of highly integrated systems. A new generation of thin flexible electronic systems arises. At Fraunhofer IZM, inline manufacturing processes for polymer electronic systems are developed on production type equipment. A low-cost process for the fabrication of polymer electronics has been developed performed completely on continuous flexible foil substrates with typical thickness of 50 /spl mu/m, enabling low-functional electronic circuit fabrication with IC complexity up to 30 devices at present (2005). This process opens further possibilities to integrate thin silicon circuits and plastic microelectromechanical systems (MEMS) structures in the same fabrication and process environment. Microsystems incorporating fluidic, mechanical, optical, and electrical components are under research and development at present. Key applications scenarios for the polymer electronics predict fully applicable displays, embedded MEMS, labels for broad-band wireless communication, polymer batteries, and photovoltaic cells.  相似文献   

8.
9.
Configurable Computing Machines (CCMs) are computing machines based on reconfigurable circuit technology such as field programmable gate-arrays. Early researchers recognized CCMs as a new, flexible, and powerful class of computer. The earliest CCMs featured rudimentary but significant integrated design, debug, and deployment (runtime) environments. This paper reviews those environments and the contributions they made and considers the progress made over the past 20 years in providing support for the “3 D’s” of configurable computing application development: design, debug, and deployment. It then introduces an integrated CAD framework for the creation of CCM CAD tools and describes a series of experiments in creating such a CAD tool suite — the JHDL system. The paper reviews lessons learned from that work and concludes by discussing the role integrated design, debug, and runtime environments will play in future CCM-based systems.  相似文献   

10.
协同集成设计环境的通信支持若干问题研究   总被引:3,自引:1,他引:2  
何发智  高曙明 《通信学报》2003,24(9):162-167
首先提出了一种直接建立在现有CAD应用内核之上的进程间通信模型,并通过实验研究对此进行了验证。然后提出了支持协同集成设计的通信协议集的一种基本框架。最后研究了对工程中大规模复杂CAD图形数据进行协议映射和动态传输的基本方法。实践证明,比现有交换数据文件和传输应用界面方法,在网络通信的时间/空间效率上具有显著优势。*  相似文献   

11.
集成电路工艺及器件特性计算机辅助设计系统是微电子CAD系统的重要组成部分。本文介绍了该系统在集成电路工艺设计及器件设计中的部分应用。  相似文献   

12.
The design of a binary-phase shift-keyed (BPSK) spread-spectrum chip set with an integrated CAD environment called VANDA is described. VANDA uses the functional compiler concept to integrate system and physical designs, thus allowing complex high-performance integrated circuit chips to be implemented easily. Three functional compilers have been designed and implemented for the design of a spread-spectrum transceiver: a pseudonoise (PN) generator compiler, a direct digital frequency synthesizer (DDFS) compiler, and a Costas loop compiler. Three test chips for a BPSK digital intermediate frequency (IF) spread-spectrum system generated by these compilers have been fabricated and tested. Details of each of the functional compilers and the test chips are described. In addition, the measurement results for digital IF transceiver test boards constructed using these chips are presented  相似文献   

13.
The paper describes a new control method of integrated circuit (IC) modules activity in a modern processor design. The control method leads to improved frequency ability of integrated systems. The proposed solution, based only on computing flow modification, could be easily integrated into all future designs, ranging from a portable computing to a multi-core computing. A new approach to the thermal control method is described along with simulation results. An example of incorporation in current and future integrated circuits into mainstream designs is presented with exemplary algorithms and final simulation results.  相似文献   

14.
通用宽带换能器(含低频到高频)一般是将不同类型的换能器进行组合使用,单个换能器独立设计再组合成阵,其综合体积及质量均大,且安装后其性能指标受影响(如换能器开角变小等)。该文在分析当前国内外宽带换能器研究现状基础上,结合小型遥控无人潜水器(ROV)搭载探测需求,提出具体设计指标要求。将复合棒换能器与数个压电陶瓷圆环进行开放式一体化组合设计,在满足小型ROV安装要求的基础上,实现了发射3~100 kHz、接收1~100 kHz的超宽频带覆盖范围,且开角不小于70°。水池及湖上实航实验结果表明,研制的换能器与仿真设计相符,实航测量结果与国内外相关结论一致性较好,具有广泛的工程实用价值。  相似文献   

15.
Embedded system architectures comprising of software programmable components (e.g. DSP, ASIP, and micro-controller cores) and customized hardware co-processors, integrated into a single cost-efficient VLSI chip, are emerging as a key solution to todays microelectronics design problems. This trend is being driven by new emerging applications in the areas of wireless communication, high-speed optical networking, and multimedia computing, fueled by increasing levels of integration. These applications are often subject to stringent requirements in terms of processing performance, power dissipation, and flexibility. A key problem confronted by embedded system designers today is the rapid prototyping of an application-specific embedded system architecture where different combinations of programmable processor components, library hardware components, and customized hardware components must be integrated together, while ensuring that the hardware and software parts communicate correctly. Designers often spend an enormous time on this highly error proned task. In this paper, we present a solution to this embedded architecture co-synthesis and system integration problem based on an orchestrated combination of architectural strategies, parameterized libraries, and software CAD tools.  相似文献   

16.
17.
Design and simulation of component-based manufacturing machine systems   总被引:2,自引:0,他引:2  
This paper presents the modular machine design environment (MMDE), a software environment that enables the ‘virtual design/engineering' of component-based manufacturing machine systems. It consists of a suite of highly integrated tools supporting the visualisation, design, programming, verification and evaluation of machine systems built from mechanical, electronic and software components/modules in a virtual environment. Using three-dimensional (3-D) graphical simulation with a number of add-on tools, MMDE supports visualisation, design, simulation and verification of both the physical model and control logic for design and/or re-configuring machine systems to satisfy new or changed application/customer requirements before any real implementation is made. System design, implementation techniques, and evaluation of MMDE in a real industrial test case are covered in detail.  相似文献   

18.
A common job design model of the integrated factory is outlined, and the extent to which international experiences in computer-aided design (CAD) use conform to the model is assessed. With particular focus on experiences in Australia, it is argued that the variety of types and uses of CAD undermine any simple unlinear theory of necessary or appropriate work organization for CAD. It is concluded, however, that work on the design of so-called human-centered manufacturing systems provides an important opportunity for reassessing the most desirable direction for the future of CAD development and use  相似文献   

19.
Technology computer-aided design (TCAD) is the software tool set that allows integrated circuit (IC) technologists to develop new processes and devices without having to build costly test lots. TCAD can potentially provide process engineers the same benefits that electronic circuit CAD (ECAD) has provided to circuit designers. Circuit designers can design, lay out, and test new circuits without fabricating them, and still largely be assured that the circuit will work when manufactured. Will the day come when an engineer can use software to develop a new manufacturing process and predict its performance and yield accurately?  相似文献   

20.
The emergence of static memory-based field programmable gate arrays (FPGAs) that are capable of being dynamically reconfigured, i.e., partially reconfigured while active, has initiated research into new methods of digital systems synthesis. At present, however, there are virtually no specific CAD tools to support the design and investigation of digital systems using dynamic reconfiguration. This paper reports on an investigation of new CAD tools and the development of a new simulation technique, called dynamic circuit switching (DCS), for dynamically reconfigurable systems. The principles of DCS are presented and examples of its application are described  相似文献   

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